WO2009066759A1 - 多層プリント配線板の製造方法 - Google Patents

多層プリント配線板の製造方法 Download PDF

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Publication number
WO2009066759A1
WO2009066759A1 PCT/JP2008/071219 JP2008071219W WO2009066759A1 WO 2009066759 A1 WO2009066759 A1 WO 2009066759A1 JP 2008071219 W JP2008071219 W JP 2008071219W WO 2009066759 A1 WO2009066759 A1 WO 2009066759A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
printed wiring
multilayered printed
insulating layer
producing
Prior art date
Application number
PCT/JP2008/071219
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Shigeo Nakamura
Tadahiko Yokota
Original Assignee
Ajinomoto Co., Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co., Inc. filed Critical Ajinomoto Co., Inc.
Priority to KR1020187007458A priority Critical patent/KR101960247B1/ko
Priority to KR1020167002041A priority patent/KR101841523B1/ko
Priority to JP2009542598A priority patent/JP5588683B2/ja
Publication of WO2009066759A1 publication Critical patent/WO2009066759A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1383—Temporary protective insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laser Beam Processing (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Laminated Bodies (AREA)
PCT/JP2008/071219 2007-11-22 2008-11-21 多層プリント配線板の製造方法 WO2009066759A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020187007458A KR101960247B1 (ko) 2007-11-22 2008-11-21 다층 프린트 배선판의 제조 방법
KR1020167002041A KR101841523B1 (ko) 2007-11-22 2008-11-21 다층 프린트 배선판의 제조 방법
JP2009542598A JP5588683B2 (ja) 2007-11-22 2008-11-21 多層プリント配線板の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007302831 2007-11-22
JP2007-302831 2007-11-22

Publications (1)

Publication Number Publication Date
WO2009066759A1 true WO2009066759A1 (ja) 2009-05-28

Family

ID=40667581

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/071219 WO2009066759A1 (ja) 2007-11-22 2008-11-21 多層プリント配線板の製造方法

Country Status (4)

Country Link
JP (4) JP5588683B2 (ko)
KR (3) KR101601645B1 (ko)
TW (1) TWI432122B (ko)
WO (1) WO2009066759A1 (ko)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013161527A1 (ja) * 2012-04-26 2013-10-31 日本特殊陶業株式会社 多層配線基板及びその製造方法
KR20130135106A (ko) * 2012-05-31 2013-12-10 아지노모토 가부시키가이샤 다층 프린트 배선판의 제조방법
JP2014017301A (ja) * 2012-07-06 2014-01-30 Ajinomoto Co Inc 絶縁樹脂シート
KR20170012228A (ko) 2014-06-03 2017-02-02 미츠비시 가스 가가쿠 가부시키가이샤 미세 비아홀 형성을 위한 프린트 배선판용 수지 적층체, 그리고, 수지 절연층에 미세 비아홀을 갖는 다층 프린트 배선판 및 그 제조 방법
JP2017050561A (ja) * 2016-11-16 2017-03-09 味の素株式会社 絶縁樹脂シート
CN107027246A (zh) * 2015-10-20 2017-08-08 日本航空电子工业株式会社 固定结构和固定方法
JPWO2016084375A1 (ja) * 2014-11-28 2017-09-07 日本ゼオン株式会社 多層プリント配線板の製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7288321B2 (ja) * 2018-03-22 2023-06-07 積水化学工業株式会社 積層フィルム
KR20220074373A (ko) * 2020-11-27 2022-06-03 엘지이노텍 주식회사 회로기판 및 이의 제조 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10200264A (ja) * 1997-01-06 1998-07-31 Ibiden Co Ltd 多層プリント配線板およびその製造方法
JP2000349437A (ja) * 1999-03-30 2000-12-15 Kyocera Corp 多層配線基板とその製造方法
JP2001308536A (ja) * 2000-04-27 2001-11-02 Kyocera Corp 多層配線基板およびその製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3899544B2 (ja) 1996-03-06 2007-03-28 日立化成工業株式会社 多層配線板の製造方法
JPH11145626A (ja) * 1997-11-12 1999-05-28 Kansai Paint Co Ltd 多層プリント配線板
WO1999059761A1 (fr) * 1998-05-21 1999-11-25 Mitsubishi Denki Kabushiki Kaisha Procede d'usinage laser
JP3670487B2 (ja) * 1998-06-30 2005-07-13 京セラ株式会社 配線基板の製造方法
JP2000232268A (ja) * 1999-02-09 2000-08-22 Ibiden Co Ltd 片面回路基板およびその製造方法
JP4300687B2 (ja) 1999-10-28 2009-07-22 味の素株式会社 接着フィルムを用いた多層プリント配線板の製造法
JP4683758B2 (ja) * 2001-04-26 2011-05-18 京セラ株式会社 配線基板の製造方法
JP2005088401A (ja) * 2003-09-18 2005-04-07 Du Pont Toray Co Ltd フィルムキャリア、その製造方法および金属張り板
JP4470499B2 (ja) * 2004-01-21 2010-06-02 凸版印刷株式会社 多層配線基板の製造方法及び多層配線基板
JP4501492B2 (ja) * 2004-03-30 2010-07-14 住友ベークライト株式会社 多層プリント配線板の製造方法
JP2005298670A (ja) * 2004-04-12 2005-10-27 Kaneka Corp 絶縁接着フィルム、プリント配線板
JP2007273165A (ja) * 2006-03-30 2007-10-18 Mitsubishi Electric Corp 円形ランプ保持装置及び照明器具
JP5029093B2 (ja) * 2006-03-30 2012-09-19 味の素株式会社 樹脂組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10200264A (ja) * 1997-01-06 1998-07-31 Ibiden Co Ltd 多層プリント配線板およびその製造方法
JP2000349437A (ja) * 1999-03-30 2000-12-15 Kyocera Corp 多層配線基板とその製造方法
JP2001308536A (ja) * 2000-04-27 2001-11-02 Kyocera Corp 多層配線基板およびその製造方法

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013161527A1 (ja) * 2012-04-26 2013-10-31 日本特殊陶業株式会社 多層配線基板及びその製造方法
JPWO2013161527A1 (ja) * 2012-04-26 2015-12-24 日本特殊陶業株式会社 多層配線基板及びその製造方法
KR20130135106A (ko) * 2012-05-31 2013-12-10 아지노모토 가부시키가이샤 다층 프린트 배선판의 제조방법
JP2014007403A (ja) * 2012-05-31 2014-01-16 Ajinomoto Co Inc 多層プリント配線板の製造方法
KR102039193B1 (ko) * 2012-05-31 2019-10-31 아지노모토 가부시키가이샤 다층 프린트 배선판의 제조방법
JP2014017301A (ja) * 2012-07-06 2014-01-30 Ajinomoto Co Inc 絶縁樹脂シート
KR20170012228A (ko) 2014-06-03 2017-02-02 미츠비시 가스 가가쿠 가부시키가이샤 미세 비아홀 형성을 위한 프린트 배선판용 수지 적층체, 그리고, 수지 절연층에 미세 비아홀을 갖는 다층 프린트 배선판 및 그 제조 방법
CN107251667A (zh) * 2014-11-28 2017-10-13 英特尔公司 多层印刷布线板的制造方法
JPWO2016084375A1 (ja) * 2014-11-28 2017-09-07 日本ゼオン株式会社 多層プリント配線板の製造方法
US10568212B2 (en) 2014-11-28 2020-02-18 Intel Corporation Manufacturing method for multi-layer printed circuit board
CN107027246A (zh) * 2015-10-20 2017-08-08 日本航空电子工业株式会社 固定结构和固定方法
CN107027246B (zh) * 2015-10-20 2019-12-17 日本航空电子工业株式会社 固定结构和固定方法
JP2017050561A (ja) * 2016-11-16 2017-03-09 味の素株式会社 絶縁樹脂シート

Also Published As

Publication number Publication date
JP2018129548A (ja) 2018-08-16
KR101960247B1 (ko) 2019-03-21
KR101841523B1 (ko) 2018-03-23
JP2016181731A (ja) 2016-10-13
JPWO2009066759A1 (ja) 2011-04-07
JP2014039068A (ja) 2014-02-27
KR20100094995A (ko) 2010-08-27
JP6337927B2 (ja) 2018-06-06
JP5975011B2 (ja) 2016-08-23
JP5588683B2 (ja) 2014-09-10
TWI432122B (zh) 2014-03-21
KR20160015398A (ko) 2016-02-12
KR20180030946A (ko) 2018-03-26
TW200934348A (en) 2009-08-01
KR101601645B1 (ko) 2016-03-09

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