WO2008143128A1 - 樹脂組成物及びそれを含む被膜形成材料 - Google Patents
樹脂組成物及びそれを含む被膜形成材料 Download PDFInfo
- Publication number
- WO2008143128A1 WO2008143128A1 PCT/JP2008/058931 JP2008058931W WO2008143128A1 WO 2008143128 A1 WO2008143128 A1 WO 2008143128A1 JP 2008058931 W JP2008058931 W JP 2008058931W WO 2008143128 A1 WO2008143128 A1 WO 2008143128A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin composition
- component
- film
- independently represent
- forming material
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/02—Polyamines
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Wood Science & Technology (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Epoxy Resins (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008800123911A CN101657507B (zh) | 2007-05-18 | 2008-05-15 | 树脂组合物以及含有该组合物的成膜材料 |
JP2009515186A JP5526778B2 (ja) | 2007-05-18 | 2008-05-15 | 樹脂組成物及びそれを含む被膜形成材料 |
KR1020097020593A KR101140937B1 (ko) | 2007-05-18 | 2008-05-15 | 수지 조성물 및 그것을 포함하는 피막 형성 재료 |
TW97118135A TWI468466B (zh) | 2007-05-18 | 2008-05-16 | A resin composition and a film-forming material containing the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-133283 | 2007-05-18 | ||
JP2007133283 | 2007-05-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008143128A1 true WO2008143128A1 (ja) | 2008-11-27 |
Family
ID=40031836
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/058931 WO2008143128A1 (ja) | 2007-05-18 | 2008-05-15 | 樹脂組成物及びそれを含む被膜形成材料 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5526778B2 (ja) |
KR (1) | KR101140937B1 (ja) |
CN (1) | CN101657507B (ja) |
TW (1) | TWI468466B (ja) |
WO (1) | WO2008143128A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2015045056A1 (ja) * | 2013-09-26 | 2017-03-02 | 株式会社イオックス | 無電解めっき用塗料組成物 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2782103B1 (de) * | 2013-03-18 | 2019-06-19 | Schwering & Hasse Elektrodraht GmbH | Lackdraht |
CN108699408B (zh) * | 2016-02-19 | 2021-11-05 | 昭和电工材料株式会社 | 多层印刷线路板用的粘接膜 |
CN105838035A (zh) * | 2016-05-31 | 2016-08-10 | 刘雷 | 一种计算机用显示屏保护膜及其制备方法 |
CN116496623A (zh) * | 2023-04-06 | 2023-07-28 | 瑞声科技(南京)有限公司 | 树脂组合物、聚酰亚胺的制备方法及相关产品 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000150588A (ja) * | 1998-11-10 | 2000-05-30 | Toray Ind Inc | 半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置 |
JP2003138015A (ja) * | 2001-11-07 | 2003-05-14 | Hitachi Chem Co Ltd | ポリアミドイミド樹脂ペースト及びそれを含む被膜形成材料 |
JP2003198105A (ja) * | 2001-12-28 | 2003-07-11 | Hitachi Chem Co Ltd | 樹脂ペースト及びこれを用いたフレキシブル配線板 |
JP2003213083A (ja) * | 2002-01-24 | 2003-07-30 | Nippon Kayaku Co Ltd | エポキシ樹脂組成物及びそれを用いたフレキシブル印刷配線板材料。 |
JP2004137370A (ja) * | 2002-10-17 | 2004-05-13 | Hitachi Chem Co Ltd | ポリアミドイミド樹脂ペースト及びそれを含む被膜形成材料 |
JP2005036126A (ja) * | 2003-07-16 | 2005-02-10 | Nippon Kayaku Co Ltd | エポキシ樹脂組成物及びそれを用いたフレキシブル印刷配線板材料。 |
JP2008133418A (ja) * | 2006-10-24 | 2008-06-12 | Hitachi Chem Co Ltd | 樹脂組成物及びこれらを用いたフレキシブル配線板 |
-
2008
- 2008-05-15 CN CN2008800123911A patent/CN101657507B/zh active Active
- 2008-05-15 JP JP2009515186A patent/JP5526778B2/ja active Active
- 2008-05-15 KR KR1020097020593A patent/KR101140937B1/ko active IP Right Grant
- 2008-05-15 WO PCT/JP2008/058931 patent/WO2008143128A1/ja active Application Filing
- 2008-05-16 TW TW97118135A patent/TWI468466B/zh active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000150588A (ja) * | 1998-11-10 | 2000-05-30 | Toray Ind Inc | 半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置 |
JP2003138015A (ja) * | 2001-11-07 | 2003-05-14 | Hitachi Chem Co Ltd | ポリアミドイミド樹脂ペースト及びそれを含む被膜形成材料 |
JP2003198105A (ja) * | 2001-12-28 | 2003-07-11 | Hitachi Chem Co Ltd | 樹脂ペースト及びこれを用いたフレキシブル配線板 |
JP2003213083A (ja) * | 2002-01-24 | 2003-07-30 | Nippon Kayaku Co Ltd | エポキシ樹脂組成物及びそれを用いたフレキシブル印刷配線板材料。 |
JP2004137370A (ja) * | 2002-10-17 | 2004-05-13 | Hitachi Chem Co Ltd | ポリアミドイミド樹脂ペースト及びそれを含む被膜形成材料 |
JP2005036126A (ja) * | 2003-07-16 | 2005-02-10 | Nippon Kayaku Co Ltd | エポキシ樹脂組成物及びそれを用いたフレキシブル印刷配線板材料。 |
JP2008133418A (ja) * | 2006-10-24 | 2008-06-12 | Hitachi Chem Co Ltd | 樹脂組成物及びこれらを用いたフレキシブル配線板 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2015045056A1 (ja) * | 2013-09-26 | 2017-03-02 | 株式会社イオックス | 無電解めっき用塗料組成物 |
Also Published As
Publication number | Publication date |
---|---|
KR20090122467A (ko) | 2009-11-30 |
TW200911922A (en) | 2009-03-16 |
JP5526778B2 (ja) | 2014-06-18 |
JPWO2008143128A1 (ja) | 2010-08-05 |
CN101657507A (zh) | 2010-02-24 |
TWI468466B (zh) | 2015-01-11 |
KR101140937B1 (ko) | 2012-05-03 |
CN101657507B (zh) | 2012-07-04 |
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