WO2008117619A1 - 感光性絶縁樹脂組成物 - Google Patents

感光性絶縁樹脂組成物 Download PDF

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Publication number
WO2008117619A1
WO2008117619A1 PCT/JP2008/053491 JP2008053491W WO2008117619A1 WO 2008117619 A1 WO2008117619 A1 WO 2008117619A1 JP 2008053491 W JP2008053491 W JP 2008053491W WO 2008117619 A1 WO2008117619 A1 WO 2008117619A1
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WO
WIPO (PCT)
Prior art keywords
compound
crosslinking agent
mass
resin composition
insulating resin
Prior art date
Application number
PCT/JP2008/053491
Other languages
English (en)
French (fr)
Inventor
Atsushi Ito
Nami Onimaru
Hirofumi Goto
Original Assignee
Jsr Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corporation filed Critical Jsr Corporation
Priority to JP2009506255A priority Critical patent/JPWO2008117619A1/ja
Publication of WO2008117619A1 publication Critical patent/WO2008117619A1/ja

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing

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  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyethers (AREA)
  • Epoxy Resins (AREA)

Abstract

　本発明の感光性絶縁樹脂組成物は、（Ａ）フェノール性水酸基を有する構造単位を含有する樹脂と、（Ｂ）光感応性酸発生剤と、（Ｃ）オキセタニル基含有化合物（Ｃ１）およびエポキシ基含有化合物（Ｃ２）からなる群より選ばれる少なくとも１種を含む架橋剤と、（Ｄ）溶剤と、（Ｅ）架橋微粒子とを含有し、該架橋剤（Ｃ）に含まれるオキセタニル基含有化合物（Ｃ１）およびエポキシ基含有化合物（Ｃ２）の合計量が、該架橋剤（Ｃ）の全量１００質量％に対して７０～１００質量％であることを特徴とする。本発明の組成物は、解像度、電気絶縁性、密着性、接着性等に優れた硬化物を形成することができ、半導体素子の層間絶縁膜、表面保護膜などの用途に適している。
PCT/JP2008/053491 2007-03-26 2008-02-28 感光性絶縁樹脂組成物 WO2008117619A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009506255A JPWO2008117619A1 (ja) 2007-03-26 2008-02-28 感光性絶縁樹脂組成物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-079086 2007-03-26
JP2007079086 2007-03-26

Publications (1)

Publication Number Publication Date
WO2008117619A1 true WO2008117619A1 (ja) 2008-10-02

Family

ID=39788358

Family Applications (1)

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PCT/JP2008/053491 WO2008117619A1 (ja) 2007-03-26 2008-02-28 感光性絶縁樹脂組成物

Country Status (3)

Country Link
JP (1) JPWO2008117619A1 (ja)
TW (1) TW200905383A (ja)
WO (1) WO2008117619A1 (ja)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010122654A (ja) * 2008-10-24 2010-06-03 Jsr Corp 感放射線性樹脂組成物およびその硬化物
WO2010095385A1 (ja) 2009-02-20 2010-08-26 サンアプロ株式会社 スルホニウム塩，光酸発生剤及び感光性樹脂組成物
JP2013190698A (ja) * 2012-03-14 2013-09-26 Asahi Kasei E-Materials Corp 感光性樹脂組成物、硬化レリーフパターンの製造方法、及び半導体装置
WO2014103516A1 (ja) * 2012-12-27 2014-07-03 日立化成株式会社 感光性樹脂組成物、感光性フィルム及びレジストパターンの形成方法
JP2015040236A (ja) * 2013-08-21 2015-03-02 ナミックス株式会社 エポキシ樹脂組成物、感光性樹脂および半導体装置
WO2015033901A1 (ja) * 2013-09-06 2015-03-12 日本ゼオン株式会社 感放射線樹脂組成物および電子部品
KR20150071026A (ko) 2012-10-18 2015-06-25 산아프로 가부시키가이샤 술포늄염, 광산 발생제, 경화성 조성물 및 레지스트 조성물
JP2017111455A (ja) * 2011-12-09 2017-06-22 旭化成株式会社 感光性樹脂組成物、硬化レリーフパターンの製造方法、半導体装置及び表示体装置
JP2017181557A (ja) * 2016-03-28 2017-10-05 日本ゼオン株式会社 感放射線樹脂組成物及び電子部品
JP2018173466A (ja) * 2017-03-31 2018-11-08 日立化成株式会社 感光性樹脂組成物及び回路基板の製造方法
KR20190017757A (ko) 2016-06-09 2019-02-20 산아프로 가부시키가이샤 술포늄염, 광산 발생제, 경화성 조성물 및 레지스트 조성물
US11926581B2 (en) 2018-05-25 2024-03-12 San-Apro Limited Sulfonium salt, photoacid generator, curable composition, and resist composition

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11106606A (ja) * 1997-09-30 1999-04-20 Jsr Corp 感放射線性樹脂組成物
JP2002139835A (ja) * 2000-11-01 2002-05-17 Jsr Corp 感光性絶縁樹脂組成物およびその硬化物
JP2003215802A (ja) * 2002-01-23 2003-07-30 Jsr Corp 感光性絶縁樹脂組成物およびその硬化物
WO2006006581A1 (ja) * 2004-07-14 2006-01-19 Jsr Corporation 感光性絶縁樹脂組成物、その硬化物およびその用途

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006259268A (ja) * 2005-03-17 2006-09-28 Hitachi Chem Co Ltd 感光性樹脂組成物ならびにこれを用いた多層プリント配線板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11106606A (ja) * 1997-09-30 1999-04-20 Jsr Corp 感放射線性樹脂組成物
JP2002139835A (ja) * 2000-11-01 2002-05-17 Jsr Corp 感光性絶縁樹脂組成物およびその硬化物
JP2003215802A (ja) * 2002-01-23 2003-07-30 Jsr Corp 感光性絶縁樹脂組成物およびその硬化物
WO2006006581A1 (ja) * 2004-07-14 2006-01-19 Jsr Corporation 感光性絶縁樹脂組成物、その硬化物およびその用途

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010122654A (ja) * 2008-10-24 2010-06-03 Jsr Corp 感放射線性樹脂組成物およびその硬化物
WO2010095385A1 (ja) 2009-02-20 2010-08-26 サンアプロ株式会社 スルホニウム塩，光酸発生剤及び感光性樹脂組成物
KR20110118821A (ko) 2009-02-20 2011-11-01 산아프로 가부시키가이샤 술포늄염, 광산 발생제 및 감광성 수지 조성물
US8617787B2 (en) 2009-02-20 2013-12-31 San-Apro, Ltd. Sulfonium salt, photo-acid generator, and photosensitive resin composition
JP2017111455A (ja) * 2011-12-09 2017-06-22 旭化成株式会社 感光性樹脂組成物、硬化レリーフパターンの製造方法、半導体装置及び表示体装置
JP2013190698A (ja) * 2012-03-14 2013-09-26 Asahi Kasei E-Materials Corp 感光性樹脂組成物、硬化レリーフパターンの製造方法、及び半導体装置
KR20150071026A (ko) 2012-10-18 2015-06-25 산아프로 가부시키가이샤 술포늄염, 광산 발생제, 경화성 조성물 및 레지스트 조성물
JPWO2014103516A1 (ja) * 2012-12-27 2017-01-12 日立化成株式会社 感光性樹脂組成物、感光性フィルム及びレジストパターンの形成方法
JP2018151644A (ja) * 2012-12-27 2018-09-27 日立化成株式会社 感光性樹脂組成物、感光性フィルム及びレジストパターンの形成方法
KR102306021B1 (ko) * 2012-12-27 2021-09-27 쇼와덴코머티리얼즈가부시끼가이샤 감광성 수지 조성물, 감광성 필름 및 레지스트 패턴의 형성 방법
KR20200108510A (ko) * 2012-12-27 2020-09-18 히타치가세이가부시끼가이샤 감광성 수지 조성물, 감광성 필름 및 레지스트 패턴의 형성 방법
WO2014103516A1 (ja) * 2012-12-27 2014-07-03 日立化成株式会社 感光性樹脂組成物、感光性フィルム及びレジストパターンの形成方法
JP2020095279A (ja) * 2012-12-27 2020-06-18 日立化成株式会社 感光性樹脂組成物、感光性フィルム及びレジストパターンの形成方法
US10324375B2 (en) 2012-12-27 2019-06-18 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive film, and method for forming resist pattern
JP2015040236A (ja) * 2013-08-21 2015-03-02 ナミックス株式会社 エポキシ樹脂組成物、感光性樹脂および半導体装置
US9798233B2 (en) 2013-09-06 2017-10-24 Zeon Corporation Radiation-sensitive resin composition and electronic device
WO2015033901A1 (ja) * 2013-09-06 2015-03-12 日本ゼオン株式会社 感放射線樹脂組成物および電子部品
JPWO2015033901A1 (ja) * 2013-09-06 2017-03-02 日本ゼオン株式会社 感放射線樹脂組成物および電子部品
CN105474095A (zh) * 2013-09-06 2016-04-06 日本瑞翁株式会社 辐射敏感树脂组合物及电子部件
JP2017181557A (ja) * 2016-03-28 2017-10-05 日本ゼオン株式会社 感放射線樹脂組成物及び電子部品
KR20190017757A (ko) 2016-06-09 2019-02-20 산아프로 가부시키가이샤 술포늄염, 광산 발생제, 경화성 조성물 및 레지스트 조성물
JP2018173466A (ja) * 2017-03-31 2018-11-08 日立化成株式会社 感光性樹脂組成物及び回路基板の製造方法
US11926581B2 (en) 2018-05-25 2024-03-12 San-Apro Limited Sulfonium salt, photoacid generator, curable composition, and resist composition

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Publication number Publication date
TW200905383A (en) 2009-02-01
JPWO2008117619A1 (ja) 2010-07-15

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