TW200615693A - Photosensitive insulating resin composition, cured production thereof and the use - Google Patents

Photosensitive insulating resin composition, cured production thereof and the use

Info

Publication number
TW200615693A
TW200615693A TW094123946A TW94123946A TW200615693A TW 200615693 A TW200615693 A TW 200615693A TW 094123946 A TW094123946 A TW 094123946A TW 94123946 A TW94123946 A TW 94123946A TW 200615693 A TW200615693 A TW 200615693A
Authority
TW
Taiwan
Prior art keywords
resin composition
insulating resin
photosensitive insulating
cured
photosensitive
Prior art date
Application number
TW094123946A
Other languages
Chinese (zh)
Inventor
Hirofumi Gotou
Katsumi Inomata
Shin-Ichirou Iwanaga
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200615693A publication Critical patent/TW200615693A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

Abstract

The present invention relates to a photosensitive insulating resin composition which can be cured at low temperatures and enables to obtain a cured production in various characteristics such as resolution, electrical insulation, thermal impact resistance and chemical resistance. Such photosensitive insulating resin composition, the cured production thereof and the use are suitable for the use as surface protective films and interlayer insulating films. The photosensitive insulating resin composition contains a copolymer obtained by copolymerizing a (meth)acrylate having an oxetanyl group and a specific hydroxy- or alkoxy-styrene derivative, preferably a copolymer (A) obtained by copolymerizing a (meth)acrylate having an oxetanyl group, a specific hydroxy- or alkoxy-styrene derivative and an additional vinyl monomer, a photosensitive acid generator (B), a crosslinking agent and an adhesion assistant (D).
TW094123946A 2004-07-14 2005-07-14 Photosensitive insulating resin composition, cured production thereof and the use TW200615693A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004207157 2004-07-14

Publications (1)

Publication Number Publication Date
TW200615693A true TW200615693A (en) 2006-05-16

Family

ID=35783922

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094123946A TW200615693A (en) 2004-07-14 2005-07-14 Photosensitive insulating resin composition, cured production thereof and the use

Country Status (3)

Country Link
JP (1) JPWO2006006581A1 (en)
TW (1) TW200615693A (en)
WO (1) WO2006006581A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI486091B (en) * 2007-07-27 2015-05-21 Dongjin Semichem Co Ltd A sealing method for display element

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008117619A1 (en) * 2007-03-26 2008-10-02 Jsr Corporation Photosensitive insulating resin composition
JP5040432B2 (en) * 2007-05-15 2012-10-03 住友ベークライト株式会社 Photosensitive resin composition
WO2011001823A1 (en) * 2009-06-30 2011-01-06 Jsr株式会社 Composition, cured object, and electronic device
JP2011059531A (en) * 2009-09-11 2011-03-24 Jsr Corp Radiation-sensitive resin composition and method for forming pattern
CN101974201B (en) * 2010-09-30 2012-10-31 昆山西迪光电材料有限公司 Ultraviolet thick-film photoresist and film-forming resin thereof
JP5621755B2 (en) * 2011-11-17 2014-11-12 信越化学工業株式会社 Chemically amplified positive resist material and pattern forming method
JP5546568B2 (en) * 2012-03-13 2014-07-09 富士フイルム株式会社 Positive photosensitive resin composition, method for producing cured film, cured film, organic EL display device and liquid crystal display device
WO2014061062A1 (en) * 2012-10-18 2014-04-24 サンアプロ株式会社 Sulfonium salt, photoacid generator, curable composition, and resist composition
JP6017301B2 (en) * 2012-12-20 2016-10-26 富士フイルム株式会社 Photosensitive resin composition, method for producing cured film, cured film, liquid crystal display device, and organic EL display device
KR102138141B1 (en) * 2013-02-19 2020-07-27 제이에스알 가부시끼가이샤 Nagative radiation-sensitive resin composition, cured film, forming method of the cured film, and display device
JP6303549B2 (en) * 2013-02-19 2018-04-04 Jsr株式会社 Negative radiation sensitive resin composition, cured film for display element, method for forming cured film for display element, and display element
JP6136727B2 (en) * 2013-08-02 2017-05-31 Jsr株式会社 Radiation sensitive resin composition, cured film, method for forming the same, and display element

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1165116A (en) * 1997-06-09 1999-03-05 Jsr Corp Radiation sensitive resin composition
JP3674937B2 (en) * 1997-09-30 2005-07-27 Ｊｓｒ株式会社 Radiation sensitive resin composition
JP2002229204A (en) * 2001-02-02 2002-08-14 Toppan Printing Co Ltd Photosensitive resin composition
JP2004126159A (en) * 2002-10-01 2004-04-22 Ngk Spark Plug Co Ltd Photosensitive resin composition and printed wiring board using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI486091B (en) * 2007-07-27 2015-05-21 Dongjin Semichem Co Ltd A sealing method for display element

Also Published As

Publication number Publication date
WO2006006581A1 (en) 2006-01-19
JPWO2006006581A1 (en) 2008-04-24

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