TW201144938A - Radiation-sensitive resin composition for display element, interlayer insulation film, protective film, spacer and method for producing thereof - Google Patents

Radiation-sensitive resin composition for display element, interlayer insulation film, protective film, spacer and method for producing thereof

Info

Publication number
TW201144938A
TW201144938A TW100114861A TW100114861A TW201144938A TW 201144938 A TW201144938 A TW 201144938A TW 100114861 A TW100114861 A TW 100114861A TW 100114861 A TW100114861 A TW 100114861A TW 201144938 A TW201144938 A TW 201144938A
Authority
TW
Taiwan
Prior art keywords
radiation
resin composition
sensitive resin
display element
interlayer insulation
Prior art date
Application number
TW100114861A
Other languages
Chinese (zh)
Other versions
TWI493287B (en
Inventor
Eiji Yoneda
Nobuhiro Nishi
Seiichirou Kodama
Katsumi Inomata
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW201144938A publication Critical patent/TW201144938A/en
Application granted granted Critical
Publication of TWI493287B publication Critical patent/TWI493287B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/0275—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with dithiol or polysulfide compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Liquid Crystal (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

The present invention provides a radiation-sensitive resin composition that not only can be heated and burned at low temperature in a short time but also has high radiation sensitivity and show low coefficient of linear thermal expansion. The radiation-sensitive resin composition can be preferably used for producing spacer of flexible display, protective film and interlayer insulation film. The solving method is completed by a radiation-sensitive resin composition for display element that is characterized by containing (A) copolymer having (a1) structure unit comprising carboxy groups and (a2) structure unit comprising epoxy groups, (B) polymerizable compound having unsaturated ethylene bonds, (C) radiation-sensitive polymerization initiator and (D) at least one compound selected from compounds represented by formula (1) and (2).
TW100114861A 2010-04-28 2011-04-28 Radiation-sensitive resin composition for display element, coating film, and method for producing thereof TWI493287B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010104583A JP5505066B2 (en) 2010-04-28 2010-04-28 Radiation-sensitive resin composition, interlayer insulating film of display element, protective film and spacer, and method for forming them

Publications (2)

Publication Number Publication Date
TW201144938A true TW201144938A (en) 2011-12-16
TWI493287B TWI493287B (en) 2015-07-21

Family

ID=44887042

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100114861A TWI493287B (en) 2010-04-28 2011-04-28 Radiation-sensitive resin composition for display element, coating film, and method for producing thereof

Country Status (4)

Country Link
JP (1) JP5505066B2 (en)
KR (1) KR101815116B1 (en)
CN (1) CN102236259A (en)
TW (1) TWI493287B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI581064B (en) * 2012-04-27 2017-05-01 富士軟片股份有限公司 Chemically-amplified type positive photo sensitive resin composition, method for manufacturing cured film, cured film, organic el display device and liquid crystal display device

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201214033A (en) * 2010-06-17 2012-04-01 Sumitomo Chemical Co Photosensitive resin composition
KR101688464B1 (en) * 2011-10-02 2016-12-22 코오롱인더스트리 주식회사 Photopolymerizable Resin Composition
JP5966328B2 (en) * 2011-11-16 2016-08-10 Jsr株式会社 Array substrate, liquid crystal display element, and method of manufacturing array substrate
KR20150039551A (en) * 2013-10-02 2015-04-10 제이에스알 가부시끼가이샤 Curable composition, cured film and process for forming the same, and compound
JP2015166840A (en) * 2013-10-02 2015-09-24 Jsr株式会社 Curable composition, cured film and method for forming the same, and compound
JP6237084B2 (en) * 2013-10-07 2017-11-29 Jsr株式会社 Curable composition, cured film and method for forming the same, and base generator
KR20160106595A (en) * 2014-01-10 2016-09-12 미쓰비시 가가꾸 가부시키가이샤 Thermosetting resin composition, cured member and overcoat layer formed using same, polarizing element provided with said overcoat layer, and image display device
JP6390125B2 (en) * 2014-03-13 2018-09-19 Jsr株式会社 Curable resin composition, cured film for display element, method for forming the same, and display element
JP6318260B2 (en) * 2014-09-24 2018-04-25 旭化成株式会社 Photosensitive resin laminate, resin pattern manufacturing method, cured film manufacturing method, and display device manufacturing method
CN105467765B (en) * 2014-09-30 2020-04-24 富士胶片株式会社 Photosensitive composition, method for producing cured film, and use thereof
CN110790903A (en) * 2019-12-05 2020-02-14 江南大学 Single-component epoxy resin composition containing intramolecular hydrogen bond type imidazole curing accelerator and preparation method thereof
JP2021167906A (en) * 2020-04-10 2021-10-21 東京応化工業株式会社 Photosensitive composition, method for producing patterned cured film and patterned cured film
CN112321513B (en) * 2020-11-06 2022-12-23 药康众拓(江苏)医药科技有限公司 Heterocyclic compound and preparation method and application thereof

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03191352A (en) * 1989-12-15 1991-08-21 W R Grace & Co Photosensitive resin composite
JP2001064357A (en) * 1999-08-25 2001-03-13 Hitachi Chem Co Ltd Curable composition, insutating film using the same, color filter protective film, color filter, and liquid crystal display element
JP4650638B2 (en) * 2004-05-06 2011-03-16 Ｊｓｒ株式会社 Radiation-sensitive resin composition, spacer, and formation method thereof
JP2007078889A (en) * 2005-09-12 2007-03-29 Fujifilm Corp Photosensitive composition, pattern forming material, photosensitive laminate, pattern forming apparatus and pattern forming method
JP4711886B2 (en) * 2006-05-26 2011-06-29 富士フイルム株式会社 Photosensitive composition, photosensitive film and printed circuit board
JP5013831B2 (en) * 2006-06-23 2012-08-29 富士フイルム株式会社 Curable composition for color filter, color filter, and method for producing the same
CN101611353B (en) * 2007-02-16 2012-04-04 太阳控股株式会社 Composition for forming cured film pattern, and method for producing cured film pattern by using the same
KR20100014419A (en) * 2007-03-12 2010-02-10 후지필름 가부시키가이샤 Photosensitive composition, photosensitive film, method for formation of permanent pattern, and print substrate
WO2009041400A1 (en) * 2007-09-26 2009-04-02 Fujifilm Corporation Negative resist composition and resist pattern-forming method using the same
JP2009258506A (en) * 2008-04-18 2009-11-05 Fujifilm Corp Negative resist composition and resist pattern-forming method
JP2010054632A (en) * 2008-08-26 2010-03-11 Fujifilm Corp Negative resist composition and pattern forming method
JP2011095715A (en) * 2009-09-30 2011-05-12 Fujifilm Corp Colored photosensitive resin composition for ultraviolet ray laser, pattern forming method, method for manufacturing color filter, color filter, and display device including the color filter
JP5517860B2 (en) * 2009-10-16 2014-06-11 富士フイルム株式会社 Photosensitive resin composition, method for forming cured film, cured film, organic EL display device, and liquid crystal display device
JP5451570B2 (en) * 2009-10-16 2014-03-26 富士フイルム株式会社 Photosensitive resin composition, method for forming cured film, cured film, organic EL display device, and liquid crystal display device
JP5623896B2 (en) * 2010-01-15 2014-11-12 富士フイルム株式会社 Photosensitive resin composition, method for forming cured film, cured film, organic EL display device, and liquid crystal display device
JP5524037B2 (en) * 2010-01-19 2014-06-18 富士フイルム株式会社 Photosensitive resin composition, cured film, method for forming cured film, organic EL display device, and liquid crystal display device
JP5492812B2 (en) * 2010-03-11 2014-05-14 富士フイルム株式会社 Photosensitive resin composition, cured film, method for forming cured film, organic EL display device, and liquid crystal display device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI581064B (en) * 2012-04-27 2017-05-01 富士軟片股份有限公司 Chemically-amplified type positive photo sensitive resin composition, method for manufacturing cured film, cured film, organic el display device and liquid crystal display device

Also Published As

Publication number Publication date
TWI493287B (en) 2015-07-21
JP2011232659A (en) 2011-11-17
JP5505066B2 (en) 2014-05-28
KR101815116B1 (en) 2018-01-04
KR20110120229A (en) 2011-11-03
CN102236259A (en) 2011-11-09

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