TW201612634A - Photosensitive resin composition for touch panel, cured film using the same, and touch panel including such cured film as a component - Google Patents

Photosensitive resin composition for touch panel, cured film using the same, and touch panel including such cured film as a component

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Publication number
TW201612634A
TW201612634A TW104132016A TW104132016A TW201612634A TW 201612634 A TW201612634 A TW 201612634A TW 104132016 A TW104132016 A TW 104132016A TW 104132016 A TW104132016 A TW 104132016A TW 201612634 A TW201612634 A TW 201612634A
Authority
TW
Taiwan
Prior art keywords
touch panel
cured film
acid
resin composition
photosensitive resin
Prior art date
Application number
TW104132016A
Other languages
Chinese (zh)
Other versions
TWI696888B (en
Inventor
Yuki Ono
Original Assignee
Nippon Steel & Sumikin Chem Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel & Sumikin Chem Co filed Critical Nippon Steel & Sumikin Chem Co
Publication of TW201612634A publication Critical patent/TW201612634A/en
Application granted granted Critical
Publication of TWI696888B publication Critical patent/TWI696888B/en

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  • Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

Disclosed photosensitive resin composition for touch panel comprises: (A-1) an alkali-soluble resin that is derived from a reaction of an unsaturated group-containing monocarboxylic acid and an epoxy compound (a) having two epoxycycloalkyl groups in each molecule is reacted with a dicarboxylic acid or tricarboxylic acid or an acid monoanhydride thereof (b) and a tetracarboxylic acid or an acid dianhydride thereof; (B) a polymerizable monomer comprising at least one ethylenic unsaturated bond; (C) a photopolymerization initiator; (D) metallic oxide particles selecting at least one from Al, Zr, Ti, Zn, In, Sn, Sb or Ce; (E) a surfactant; and (F) silane.
TW104132016A 2014-09-30 2015-09-30 Photosensitive resin composition for touch panel, cured film using the same, and touch panel including such cured film as a component TWI696888B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014201845 2014-09-30
JP2014-201845 2014-09-30

Publications (2)

Publication Number Publication Date
TW201612634A true TW201612634A (en) 2016-04-01
TWI696888B TWI696888B (en) 2020-06-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW104132016A TWI696888B (en) 2014-09-30 2015-09-30 Photosensitive resin composition for touch panel, cured film using the same, and touch panel including such cured film as a component

Country Status (4)

Country Link
JP (2) JP6822758B2 (en)
KR (1) KR102470292B1 (en)
CN (2) CN112162462A (en)
TW (1) TWI696888B (en)

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TWI793289B (en) * 2018-03-28 2023-02-21 日商日鐵化學材料股份有限公司 Process for producing alkali-soluble resin containing polymerizable unsaturated group, alkali-soluble resin containing polymerizable unsaturated group, photosensitive resin composition containing it as an essential component, and cured film thereof

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JP2016193984A (en) * 2015-03-31 2016-11-17 株式会社Adeka Resin and composition using resin
KR102539889B1 (en) * 2016-08-11 2023-06-05 동우 화인켐 주식회사 Chemically amplified photosensitive resist composition and insulation layer prepared from the same
JPWO2018079245A1 (en) * 2016-10-25 2019-09-12 富士フイルム株式会社 Conductive sheet for touch sensor, method for producing conductive sheet for touch sensor, touch sensor, touch panel laminate, touch panel, and transparent insulating layer forming composition
JP2018070724A (en) * 2016-10-27 2018-05-10 ナガセケムテックス株式会社 Unsaturated group-containing alkali-soluble resin and alkali-soluble radiation-sensitive resin composition
KR101989457B1 (en) 2017-02-28 2019-06-14 동우 화인켐 주식회사 High performance touch sensor and manufacturing method thereof
CN109976092B (en) * 2017-12-27 2022-04-01 太阳油墨（苏州）有限公司 Curable resin composition, dry film, cured product, and printed wiring board
JP7493301B2 (en) * 2017-12-28 2024-05-31 日鉄ケミカル＆マテリアル株式会社 Thermosetting composition, cured film and display device
JP7056371B2 (en) * 2018-05-21 2022-04-19 三菱ケミカル株式会社 Photosensitive resin composition, cured product, image display device, and lighting
JP7294804B2 (en) * 2018-12-27 2023-06-20 大阪有機化学工業株式会社 Curable resin composition, cured product, and method for producing patterned substrate
JP7478553B2 (en) * 2020-03-02 2024-05-07 日鉄ケミカル＆マテリアル株式会社 Hydrogenated compound and its manufacturing method, polymerizable unsaturated group-containing alkali-soluble resin, photosensitive resin composition containing same, cured product obtained by curing the same, and touch panel and color filter containing the cured product as a constituent component
JP7368162B2 (en) * 2019-09-30 2023-10-24 日鉄ケミカル＆マテリアル株式会社 Polymerizable unsaturated group-containing alkali-soluble resin, method for producing the same, photosensitive resin composition, and cured film thereof.
CN110951047B (en) * 2019-11-22 2022-06-10 张家港康得新光电材料有限公司 Modified epoxy acrylate resin and preparation method thereof
KR20230007429A (en) * 2020-05-19 2023-01-12 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 Alkali-soluble resin containing a polymerizable unsaturated group, method for producing the same, and photosensitive resin composition and cured product thereof
KR20240028496A (en) * 2021-08-19 2024-03-05 후지필름 가부시키가이샤 Compositions, membranes, optical filters, optical sensors, image display devices and structures
WO2023074804A1 (en) 2021-10-29 2023-05-04 ダウ・東レ株式会社 Alkali-soluble uv-curable organopolysiloxane, uv-curable composition including same, and use therefor
TW202336171A (en) * 2021-11-30 2023-09-16 日商大阪有機化學工業股份有限公司 Polymer, curable resin composition, cured object, solid state imaging element, and image display apparatus

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JP2009221475A (en) * 2008-02-21 2009-10-01 Nippon Shokubai Co Ltd Curable resin composition and cured product
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EP2725423B1 (en) * 2011-06-24 2021-09-01 Tokyo Ohka Kogyo Co., Ltd. Negative-type photosensitive resin composition, pattern forming method, cured film, insulating film, and color filter
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TWI428698B (en) * 2011-11-25 2014-03-01 Chi Mei Corp Photosensitive resin composition, black matrix, color filter and liquid crystal display element
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JP2014002374A (en) * 2012-05-25 2014-01-09 Nippon Steel & Sumikin Chemical Co Ltd Photosensitive resin composition containing silica sol and cured product using the same
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI793289B (en) * 2018-03-28 2023-02-21 日商日鐵化學材料股份有限公司 Process for producing alkali-soluble resin containing polymerizable unsaturated group, alkali-soluble resin containing polymerizable unsaturated group, photosensitive resin composition containing it as an essential component, and cured film thereof

Also Published As

Publication number Publication date
TWI696888B (en) 2020-06-21
CN105467761A (en) 2016-04-06
CN112162462A (en) 2021-01-01
JP6822758B2 (en) 2021-01-27
JP2021061056A (en) 2021-04-15
CN105467761B (en) 2020-11-06
KR102470292B1 (en) 2022-11-23
JP7168696B2 (en) 2022-11-09
JP2016071359A (en) 2016-05-09
KR20160038797A (en) 2016-04-07

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