WO2009028479A1 - 反応性カルボキシレート化合物、それを用いた硬化型樹脂組成物、およびその用途 - Google Patents

反応性カルボキシレート化合物、それを用いた硬化型樹脂組成物、およびその用途 Download PDF

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Publication number
WO2009028479A1
WO2009028479A1 PCT/JP2008/065150 JP2008065150W WO2009028479A1 WO 2009028479 A1 WO2009028479 A1 WO 2009028479A1 JP 2008065150 W JP2008065150 W JP 2008065150W WO 2009028479 A1 WO2009028479 A1 WO 2009028479A1
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WO
WIPO (PCT)
Prior art keywords
same
resin composition
curable resin
reactive compound
carboxylate compound
Prior art date
Application number
PCT/JP2008/065150
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English (en)
French (fr)
Inventor
Toru Kurihashi
Kazuyoshi Yamamoto
Masataka Nakanishi
Original Assignee
Nippon Kayaku Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Kabushiki Kaisha filed Critical Nippon Kayaku Kabushiki Kaisha
Priority to CN200880104394.8A priority Critical patent/CN101784577B/zh
Priority to KR1020107001570A priority patent/KR101456516B1/ko
Priority to JP2009530116A priority patent/JP5604106B2/ja
Publication of WO2009028479A1 publication Critical patent/WO2009028479A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Emergency Medicine (AREA)
  • Epoxy Resins (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

　本発明は、紫外線等の活性エネルギー線等により硬化し、強靭な皮膜、若しくは成形材料を得ることが出来る樹脂組成物を提供することを目的とする。水酸基、エポキシ基のバランスに優れた特定構造を有するフェノールアラルキル型エポキシ樹脂から誘導される反応性化合物、及びそれを用いた硬化型樹脂組成物から強靭な硬化物が得られる。さらに、この反応性化合物は良好な顔料分散性を発揮する。
PCT/JP2008/065150 2007-08-28 2008-08-26 反応性カルボキシレート化合物、それを用いた硬化型樹脂組成物、およびその用途 WO2009028479A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880104394.8A CN101784577B (zh) 2007-08-28 2008-08-26 反应性羧酸酯化合物、使用该反应性羧酸酯化合物的固化型树脂组合物及其用途
KR1020107001570A KR101456516B1 (ko) 2007-08-28 2008-08-26 반응성 카르복실레이트 화합물, 그것을 사용한 경화형 수지 조성물 및 그의 용도
JP2009530116A JP5604106B2 (ja) 2007-08-28 2008-08-26 反応性カルボキシレート化合物、それを用いた硬化型樹脂組成物、およびその用途

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-220850 2007-08-28
JP2007220850 2007-08-28

Publications (1)

Publication Number Publication Date
WO2009028479A1 true WO2009028479A1 (ja) 2009-03-05

Family

ID=40387199

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PCT/JP2008/065150 WO2009028479A1 (ja) 2007-08-28 2008-08-26 反応性カルボキシレート化合物、それを用いた硬化型樹脂組成物、およびその用途

Country Status (5)

Country Link
JP (1) JP5604106B2 (ja)
KR (1) KR101456516B1 (ja)
CN (1) CN101784577B (ja)
TW (1) TWI422608B (ja)
WO (1) WO2009028479A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012029585A1 (ja) * 2010-09-01 2012-03-08 日本化薬株式会社 不飽和基含有ポリカルボン酸樹脂を含む分散剤
KR20170085439A (ko) 2016-01-14 2017-07-24 닛뽄 가야쿠 가부시키가이샤 에폭시 수지, 반응성 에폭시카복실레이트 화합물, 반응성 폴리카본산 화합물, 및 활성 에너지선 경화형 수지 조성물 및 그의 용도

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102344547B (zh) * 2011-07-11 2013-03-06 山东圣泉化工股份有限公司 浅色苯酚芳烷基树脂及其制备方法
JP6025245B2 (ja) * 2012-07-04 2016-11-16 日本化薬株式会社 新規エポキシカルボキシレート化合物、その誘導体、それを含有する活性エネルギー線硬化型樹脂組成物及びその硬化物
KR102286273B1 (ko) * 2014-08-25 2021-08-04 닛뽄 가야쿠 가부시키가이샤 신규 반응성 에폭시카복실레이트 화합물, 그의 유도체, 그것을 함유하는 수지 조성물, 그의 경화물, 및 물품
JP6224188B1 (ja) * 2016-08-08 2017-11-01 太陽インキ製造株式会社 半導体封止材

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11140144A (ja) * 1997-11-04 1999-05-25 Nippon Kayaku Co Ltd 樹脂組成物及びその硬化物
JP2004339381A (ja) * 2003-05-16 2004-12-02 Nippon Kayaku Co Ltd エポキシ樹脂、エポキシ樹脂の製法、エポキシ樹脂組成物及びその硬化物
JP2005055814A (ja) * 2003-08-07 2005-03-03 Mitsubishi Chemicals Corp カラーフィルタ用感光性着色樹脂組成物、カラーフィルタ、及び液晶表示装置
WO2006109890A1 (ja) * 2005-04-13 2006-10-19 Tamura Kaken Corporation 感光性樹脂組成物、プリント配線板、および半導体パッケージ基板
JP2007191587A (ja) * 2006-01-19 2007-08-02 Nippon Kayaku Co Ltd 活性エネルギー線硬化型樹脂組成物、及びその用途
WO2007132724A1 (ja) * 2006-05-11 2007-11-22 Nippon Kayaku Kabushiki Kaisha 反応性カルボキシレート化合物、それを用いた硬化型樹脂組成物、およびその用途

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7749720B2 (en) * 2004-06-17 2010-07-06 The Regents Of The University Of California Methods of identifying compounds for producing insulin sensitization
CN101291972B (zh) * 2005-10-21 2012-04-04 日本化药株式会社 环氧树脂、可固化树脂组合物及其固化物

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11140144A (ja) * 1997-11-04 1999-05-25 Nippon Kayaku Co Ltd 樹脂組成物及びその硬化物
JP2004339381A (ja) * 2003-05-16 2004-12-02 Nippon Kayaku Co Ltd エポキシ樹脂、エポキシ樹脂の製法、エポキシ樹脂組成物及びその硬化物
JP2005055814A (ja) * 2003-08-07 2005-03-03 Mitsubishi Chemicals Corp カラーフィルタ用感光性着色樹脂組成物、カラーフィルタ、及び液晶表示装置
WO2006109890A1 (ja) * 2005-04-13 2006-10-19 Tamura Kaken Corporation 感光性樹脂組成物、プリント配線板、および半導体パッケージ基板
JP2007191587A (ja) * 2006-01-19 2007-08-02 Nippon Kayaku Co Ltd 活性エネルギー線硬化型樹脂組成物、及びその用途
WO2007132724A1 (ja) * 2006-05-11 2007-11-22 Nippon Kayaku Kabushiki Kaisha 反応性カルボキシレート化合物、それを用いた硬化型樹脂組成物、およびその用途

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012029585A1 (ja) * 2010-09-01 2012-03-08 日本化薬株式会社 不飽和基含有ポリカルボン酸樹脂を含む分散剤
KR20170085439A (ko) 2016-01-14 2017-07-24 닛뽄 가야쿠 가부시키가이샤 에폭시 수지, 반응성 에폭시카복실레이트 화합물, 반응성 폴리카본산 화합물, 및 활성 에너지선 경화형 수지 조성물 및 그의 용도
JP2017128671A (ja) * 2016-01-14 2017-07-27 日本化薬株式会社 エポキシ樹脂、反応性カルボキシレート化合物、それを用いた硬化型樹脂組成物、およびその用途

Also Published As

Publication number Publication date
KR101456516B1 (ko) 2014-11-03
JPWO2009028479A1 (ja) 2010-12-02
TW200927780A (en) 2009-07-01
CN101784577B (zh) 2015-11-25
JP5604106B2 (ja) 2014-10-08
KR20100058450A (ko) 2010-06-03
CN101784577A (zh) 2010-07-21
TWI422608B (zh) 2014-01-11

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