TW200738770A - Active energy ray-curable resin composition and use thereof - Google Patents

Active energy ray-curable resin composition and use thereof

Info

Publication number
TW200738770A
TW200738770A TW096102129A TW96102129A TW200738770A TW 200738770 A TW200738770 A TW 200738770A TW 096102129 A TW096102129 A TW 096102129A TW 96102129 A TW96102129 A TW 96102129A TW 200738770 A TW200738770 A TW 200738770A
Authority
TW
Taiwan
Prior art keywords
active energy
energy ray
epoxy resin
resin composition
curable resin
Prior art date
Application number
TW096102129A
Other languages
Chinese (zh)
Other versions
TWI414535B (en
Inventor
Toru Kurihashi
Masataka Nakanishi
Kazuyoshi Yamamoto
Original Assignee
Nippon Kayaku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Kk filed Critical Nippon Kayaku Kk
Publication of TW200738770A publication Critical patent/TW200738770A/en
Application granted granted Critical
Publication of TWI414535B publication Critical patent/TWI414535B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/0804—Manufacture of polymers containing ionic or ionogenic groups
    • C08G18/0819—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups
    • C08G18/0823—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups containing carboxylate salt groups or groups forming them
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/68—Unsaturated polyesters
    • C08G18/683—Unsaturated polyesters containing cyclic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C08L75/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Materials For Photolithography (AREA)
  • Paints Or Removers (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

To provide a resin composition which can be cured with an active energy ray such as ultraviolet ray or the like to form a stiff film or molded material. Disclosed is an active energy ray-curable resin composition which is a phenol-aralkyl type epoxy resin having a structure to which at least a glycidoxybenzene or a glycidoxynaphthalene is bound through an aralkyl group as a bond and a structure of the formula (1): (1) and comprises an epoxy resin (A) satisfying the requirement shown by the formula (a) below and a compound (B) having an unsaturated double bond that can react by irradiation with an active energy ray: 100 = (X/Y)xZ ≤ 1100 (a) wherein X (g/eq.) represents a hydroxyl equivalent of the phenol-aralkyl type epoxy resin; Y (g/eq.) represents an epoxy equivalent of the epoxy resin; and Z ( C) represents a softening point of the epoxy resin.
TW96102129A 2006-01-19 2007-01-19 Active energy ray hardening type resin composition and use thereof TWI414535B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006011377A JP5062714B2 (en) 2006-01-19 2006-01-19 Active energy ray-curable resin composition and use thereof

Publications (2)

Publication Number Publication Date
TW200738770A true TW200738770A (en) 2007-10-16
TWI414535B TWI414535B (en) 2013-11-11

Family

ID=38287642

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96102129A TWI414535B (en) 2006-01-19 2007-01-19 Active energy ray hardening type resin composition and use thereof

Country Status (5)

Country Link
JP (1) JP5062714B2 (en)
KR (1) KR101307886B1 (en)
CN (1) CN101370837B (en)
TW (1) TWI414535B (en)
WO (1) WO2007083690A1 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5269449B2 (en) * 2007-03-24 2013-08-21 株式会社ダイセル Curable resin composition for nanoimprint
KR101456516B1 (en) * 2007-08-28 2014-11-03 니폰 가야꾸 가부시끼가이샤 Reactive carboxylate compound, curable resin composition using the same, and use of the same
CN102516497B (en) * 2008-12-19 2013-08-28 比亚迪股份有限公司 Fluorine-containing resin, preparation method thereof, conformal coating and printed circuit board
WO2011074469A1 (en) * 2009-12-14 2011-06-23 太陽ホールディングス株式会社 Solder resist ink composition, and cured product thereof
JP5415923B2 (en) * 2009-12-14 2014-02-12 太陽ホールディングス株式会社 Photosensitive resin composition, dry film thereof, and printed wiring board using them
WO2013077307A1 (en) * 2011-11-22 2013-05-30 日本ペイント株式会社 Hard coating composition
JP5904362B2 (en) * 2011-12-08 2016-04-13 日立化成株式会社 Resin composition for optical material, resin film for optical material, and optical waveguide
WO2013146483A1 (en) * 2012-03-30 2013-10-03 帝人株式会社 Transparent electroconductive laminate
JP6025245B2 (en) * 2012-07-04 2016-11-16 日本化薬株式会社 Novel epoxy carboxylate compound, derivative thereof, active energy ray-curable resin composition containing the same, and cured product thereof
WO2015177915A1 (en) * 2014-05-23 2015-11-26 株式会社日立製作所 Epoxy compound and epoxy resin cured product using same
JP6812091B2 (en) * 2014-05-29 2021-01-13 日東電工株式会社 Soft magnetic resin composition and soft magnetic film
CN106462063A (en) * 2014-06-12 2017-02-22 Dic株式会社 Photosensitive composition for permanent films, resist material and coating film
KR102286273B1 (en) * 2014-08-25 2021-08-04 닛뽄 가야쿠 가부시키가이샤 Novel reactive epoxy carboxylate compound, derivative thereof, resin composition containing them, cured product thereof, and article
CN105400383A (en) * 2014-09-11 2016-03-16 洋紫荆油墨（浙江）有限公司 Flexible ultraviolet-light-curable varnishing oil and preparation method thereof
KR102541614B1 (en) * 2015-03-04 2023-06-09 다이요 홀딩스 가부시키가이샤 Etching resist composition and dry film
JP6813267B2 (en) * 2015-06-03 2021-01-13 太陽インキ製造株式会社 Etching resist composition and dry film
CN106338887A (en) * 2016-09-20 2017-01-18 深圳市容大感光科技股份有限公司 Photoresist composition and application thereof
CN108373531B (en) * 2018-04-08 2020-11-06 江苏扬农锦湖化工有限公司 Preparation method of solvent type epoxy resin

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2570923B2 (en) * 1991-06-07 1997-01-16 信越化学工業株式会社 Thermosetting resin composition
JPH05331263A (en) * 1992-06-02 1993-12-14 Mitsui Toatsu Chem Inc Resin composition
JP2002037859A (en) * 2000-07-19 2002-02-06 Sumitomo Chem Co Ltd Epoxy resin composition for encapsulating semiconductor and resin-sealed semiconductor device
JP2002212268A (en) * 2001-01-19 2002-07-31 Japan Epoxy Resin Kk Semiconductor sealing epoxy resin composition
JP2003082025A (en) * 2001-09-13 2003-03-19 Nippon Kayaku Co Ltd Resin composition, solder resist resin composition and cured material thereof
TWI320421B (en) * 2003-02-18 2010-02-11 Sumitomo Bakelite Co Epoxy resin composition and semiconductor device
JP2004269615A (en) * 2003-03-06 2004-09-30 Nippon Kayaku Co Ltd Epoxy resin composition and its cured matter
JP4837243B2 (en) * 2003-05-20 2011-12-14 日本化薬株式会社 Epoxy resin composition and cured product thereof

Also Published As

Publication number Publication date
CN101370837B (en) 2013-01-02
KR101307886B1 (en) 2013-09-13
WO2007083690A1 (en) 2007-07-26
JP5062714B2 (en) 2012-10-31
KR20080091333A (en) 2008-10-10
CN101370837A (en) 2009-02-18
TWI414535B (en) 2013-11-11
JP2007191587A (en) 2007-08-02

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