WO2009025190A1 - Reactive carboxylate compound, active-energy-ray-curable resin composition utilizing the same, and use of the same - Google Patents

Reactive carboxylate compound, active-energy-ray-curable resin composition utilizing the same, and use of the same Download PDF

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Publication number
WO2009025190A1
WO2009025190A1 PCT/JP2008/064283 JP2008064283W WO2009025190A1 WO 2009025190 A1 WO2009025190 A1 WO 2009025190A1 JP 2008064283 W JP2008064283 W JP 2008064283W WO 2009025190 A1 WO2009025190 A1 WO 2009025190A1
Authority
WO
WIPO (PCT)
Prior art keywords
same
resin composition
curable resin
ray
compound
Prior art date
Application number
PCT/JP2008/064283
Other languages
French (fr)
Japanese (ja)
Inventor
Kazuyoshi Yamamoto
Toru Kurihashi
Naofumi Horiguchi
Original Assignee
Nippon Kayaku Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007214733A external-priority patent/JP5279214B2/en
Priority claimed from JP2007274912A external-priority patent/JP5473208B2/en
Priority claimed from JP2008129547A external-priority patent/JP2009275167A/en
Application filed by Nippon Kayaku Kabushiki Kaisha filed Critical Nippon Kayaku Kabushiki Kaisha
Priority to KR1020107001101A priority Critical patent/KR101482028B1/en
Priority to CN2008801035867A priority patent/CN101784578B/en
Priority to KR1020137010162A priority patent/KR101484661B1/en
Publication of WO2009025190A1 publication Critical patent/WO2009025190A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461—Unsaturated monoacids
    • C08G59/1466—Acrylic or methacrylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/186—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Materials For Photolithography (AREA)

Abstract

[PROBLEMS] To provide a resin composition which can be cured with an active energy ray such as ultraviolet ray or the like and enables to produce a rigid film or a molding material. [MEANS FOR SOLVING PROBLEMS] Disclosed is a reactive compound derived from a phenolic epoxy resin containing a specific structure in the molecule, a compound having both of at least one polymerizable ethylenically unsaturated group and at least one carboxyl group in the molecule, and a compound having both of at least one hydroxyl group and at least one carboxyl group in the molecule. Also disclosed is a curable resin composition utilizing the reactive compound. A rigid cured article can be produced from the curable resin composition. The reactive compound has a good pigment-dispersing property.
PCT/JP2008/064283 2007-08-21 2008-08-08 Reactive carboxylate compound, active-energy-ray-curable resin composition utilizing the same, and use of the same WO2009025190A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020107001101A KR101482028B1 (en) 2007-08-21 2008-08-08 Reactive Carboxylate Compound, Active-energy-ray-curable Resin Composition Utilizing the Same and Use of the Same
CN2008801035867A CN101784578B (en) 2007-08-21 2008-08-08 Reactive carboxylate compound, active-energy-ray-curable resin composition utilizing the same, and use of the same
KR1020137010162A KR101484661B1 (en) 2007-08-21 2008-08-08 Reactive Carboxylate Compound, Active-energy-ray-curable Resin Composition Utilizing the Same and Use of the Same

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007214733A JP5279214B2 (en) 2007-08-21 2007-08-21 Reactive carboxylate compound, active energy ray-curable resin composition using the same, and use thereof
JP2007-214733 2007-08-21
JP2007-274912 2007-10-23
JP2007274912A JP5473208B2 (en) 2007-10-23 2007-10-23 Novel epoxy carboxylate compound, derivative thereof, active energy ray-curable resin composition containing the same, and cured product thereof
JP2008-129547 2008-05-16
JP2008129547A JP2009275167A (en) 2008-05-16 2008-05-16 Reactive carboxylate compound, active energy ray-curable resin composition utilizing the same, and use of the same

Publications (1)

Publication Number Publication Date
WO2009025190A1 true WO2009025190A1 (en) 2009-02-26

Family

ID=40378096

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/064283 WO2009025190A1 (en) 2007-08-21 2008-08-08 Reactive carboxylate compound, active-energy-ray-curable resin composition utilizing the same, and use of the same

Country Status (4)

Country Link
KR (2) KR101482028B1 (en)
CN (2) CN103224609B (en)
TW (2) TWI421270B (en)
WO (1) WO2009025190A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013172009A1 (en) * 2012-05-15 2013-11-21 日本化薬株式会社 Reactive polyester compound and active energy ray-curable resin composition
CN105968001A (en) * 2015-03-13 2016-09-28 日本化药株式会社 Carboxyl-containing reactive compound, hardened resin composition using same, and hardened substance
JP2017128671A (en) * 2016-01-14 2017-07-27 日本化薬株式会社 Epoxy resin, reactive carboxylate compound, curable resin composition using the same, and use of the composition
WO2018173679A1 (en) * 2017-03-22 2018-09-27 Dic株式会社 Acid-group-containing (meth)acrylate resin and resin material for solder resist
WO2023218876A1 (en) * 2022-05-13 2023-11-16 株式会社日本触媒 Alkali-soluble resin, photosensitive resin composition, and cured product thereof

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6021621B2 (en) * 2012-12-07 2016-11-09 日本化薬株式会社 Active energy ray curable resin composition, and display element spacer and / or color filter protective film using the same
JP6184087B2 (en) * 2012-12-07 2017-08-23 日本化薬株式会社 Active energy ray curable resin composition, and display element spacer and / or color filter protective film using the same
JP6095104B2 (en) * 2012-12-26 2017-03-15 日本化薬株式会社 Active energy ray-curable resin composition, colored spacer for display element, and black matrix
CN105408367B (en) * 2013-07-19 2017-07-11 Dic株式会社 Actinic-radiation curable composition, active energy ray-curable printer's ink and printed article using it
KR102327347B1 (en) * 2014-08-22 2021-11-16 닛뽄 가야쿠 가부시키가이샤 Epoxy(meth)acrylate compound, resin composition containing the same and cured product thereof, color filter and display device
KR102286273B1 (en) * 2014-08-25 2021-08-04 닛뽄 가야쿠 가부시키가이샤 Novel reactive epoxy carboxylate compound, derivative thereof, resin composition containing them, cured product thereof, and article
JP6556735B2 (en) * 2014-08-26 2019-08-07 日本化薬株式会社 Reactive polyester compound and active energy ray-curable resin composition using the same
JP6275620B2 (en) * 2014-10-17 2018-02-07 日本化薬株式会社 Photosensitive resin composition and cured product thereof
JP6685813B2 (en) * 2016-04-14 2020-04-22 日本化薬株式会社 Epoxy resin, reactive carboxylate compound, curable resin composition using the same, and use thereof
JP6939784B2 (en) * 2016-06-29 2021-09-22 三菱瓦斯化学株式会社 Resin composition, resin sheet, multilayer printed wiring board and semiconductor device
JP6798811B2 (en) * 2016-07-22 2020-12-09 日本化薬株式会社 Epoxy carboxylate compound, polycarboxylic acid compound, energy ray-curable resin composition containing it, and cured product thereof
JP7236813B2 (en) * 2017-04-28 2023-03-10 日本化薬株式会社 Reactive polycarboxylic acid compound, active energy ray-curable resin composition using the same, cured product thereof, and use thereof
JP7236817B2 (en) * 2017-06-19 2023-03-10 日本化薬株式会社 Reactive polycarboxylic acid compound, active energy ray-curable resin composition using the same, cured product thereof, and use thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11140145A (en) * 1997-11-07 1999-05-25 Nippon Kayaku Co Ltd Resin composition, permanent resist resin composition, and cured product thereof
JPH11242332A (en) * 1998-02-24 1999-09-07 Nippon Kayaku Co Ltd Resin composition, its hardened body and printed circuit board
JP2004151456A (en) * 2002-10-31 2004-05-27 Dainippon Ink & Chem Inc Alkaline development type photosensitive resin composition
JP2005352472A (en) * 2004-05-14 2005-12-22 Mitsubishi Chemicals Corp Resin composition for liquid crystal panel, cured product, liquid crystal panel and liquid crystal display
JP2007161878A (en) * 2005-12-14 2007-06-28 Nippon Kayaku Co Ltd Polycarboxylic acid resin, photosensitive resin composition and its cured product

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003038526A1 (en) * 2001-10-30 2003-05-08 Kaneka Corporation Photosensitive resin composition and photosensitive films and laminates made by using the same
JP4986059B2 (en) * 2005-04-07 2012-07-25 日本化薬株式会社 Reactive epoxycarboxylate compound and active energy ray-curable resin composition using the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11140145A (en) * 1997-11-07 1999-05-25 Nippon Kayaku Co Ltd Resin composition, permanent resist resin composition, and cured product thereof
JPH11242332A (en) * 1998-02-24 1999-09-07 Nippon Kayaku Co Ltd Resin composition, its hardened body and printed circuit board
JP2004151456A (en) * 2002-10-31 2004-05-27 Dainippon Ink & Chem Inc Alkaline development type photosensitive resin composition
JP2005352472A (en) * 2004-05-14 2005-12-22 Mitsubishi Chemicals Corp Resin composition for liquid crystal panel, cured product, liquid crystal panel and liquid crystal display
JP2007161878A (en) * 2005-12-14 2007-06-28 Nippon Kayaku Co Ltd Polycarboxylic acid resin, photosensitive resin composition and its cured product

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013172009A1 (en) * 2012-05-15 2013-11-21 日本化薬株式会社 Reactive polyester compound and active energy ray-curable resin composition
CN105968001A (en) * 2015-03-13 2016-09-28 日本化药株式会社 Carboxyl-containing reactive compound, hardened resin composition using same, and hardened substance
CN105968001B (en) * 2015-03-13 2020-05-08 日本化药株式会社 Carboxyl group-containing reactive compound, curable resin composition using same, and cured product
JP2017128671A (en) * 2016-01-14 2017-07-27 日本化薬株式会社 Epoxy resin, reactive carboxylate compound, curable resin composition using the same, and use of the composition
WO2018173679A1 (en) * 2017-03-22 2018-09-27 Dic株式会社 Acid-group-containing (meth)acrylate resin and resin material for solder resist
JPWO2018173679A1 (en) * 2017-03-22 2019-06-27 Dic株式会社 Acid group-containing (meth) acrylate resin and resin material for solder resist
WO2023218876A1 (en) * 2022-05-13 2023-11-16 株式会社日本触媒 Alkali-soluble resin, photosensitive resin composition, and cured product thereof

Also Published As

Publication number Publication date
CN101784578B (en) 2013-04-17
KR101482028B1 (en) 2015-01-13
CN103224609A (en) 2013-07-31
TWI421270B (en) 2014-01-01
TWI468430B (en) 2015-01-11
TW201333065A (en) 2013-08-16
KR20100044177A (en) 2010-04-29
KR20130059445A (en) 2013-06-05
TW200920760A (en) 2009-05-16
CN101784578A (en) 2010-07-21
CN103224609B (en) 2016-03-09
KR101484661B1 (en) 2015-01-20

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