WO2009069562A1 - Resin composition - Google Patents

Resin composition Download PDF

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Publication number
WO2009069562A1
WO2009069562A1 PCT/JP2008/071264 JP2008071264W WO2009069562A1 WO 2009069562 A1 WO2009069562 A1 WO 2009069562A1 JP 2008071264 W JP2008071264 W JP 2008071264W WO 2009069562 A1 WO2009069562 A1 WO 2009069562A1
Authority
WO
WIPO (PCT)
Prior art keywords
energy ray
resin composition
active
radical generator
compound
Prior art date
Application number
PCT/JP2008/071264
Other languages
French (fr)
Japanese (ja)
Inventor
Manabu Kirino
Katsuhiko Kishi
Original Assignee
Three Bond Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Three Bond Co., Ltd. filed Critical Three Bond Co., Ltd.
Publication of WO2009069562A1 publication Critical patent/WO2009069562A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/66—Mercaptans
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)

Abstract

A resin composition active to an energy ray which comprises: (1) a compound having two or more epoxy groups in its molecule; (2) a compound having two or more thiol groups in its molecule; (3) a compound capable of generating an amidine or a guanidine when irradiated with an active energy ray; and (4) a radical generator of the active energy ray-cleavage type. Owing to the above-described constitution, this resin composition easily cures when irradiated with an energy ray such as light. By using the component (4) that is a radical generator of the active energy ray-cleavage type, in particular, the resin composition becomes more active than one using a radical generator of the hydrogen-drawing type and, therefore, quick curing (i.e., curing having completed immediately after the irradiation) can be achieved in practice even at a low irradiation dose of the energy ray.
PCT/JP2008/071264 2007-11-26 2008-11-21 Resin composition WO2009069562A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007304891A JP2009126974A (en) 2007-11-26 2007-11-26 Resin composition
JP2007-304891 2007-11-26

Publications (1)

Publication Number Publication Date
WO2009069562A1 true WO2009069562A1 (en) 2009-06-04

Family

ID=40678460

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/071264 WO2009069562A1 (en) 2007-11-26 2008-11-21 Resin composition

Country Status (2)

Country Link
JP (1) JP2009126974A (en)
WO (1) WO2009069562A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011236416A (en) * 2010-04-14 2011-11-24 Tokyo Univ Of Science Photosensitive resin composition
WO2013005471A1 (en) * 2011-07-07 2013-01-10 ナミックス株式会社 Resin composition
WO2016176548A1 (en) 2015-04-29 2016-11-03 3M Innovative Properties Company Composition including a polythiol and a polyepoxide and methods relating to the composition
WO2017077928A1 (en) * 2015-11-04 2017-05-11 三菱レイヨン株式会社 Curable composition, adhesive, article having coating layer, fiber-reinforced composite material, potting agent and curable composition kit
WO2018085546A1 (en) * 2016-11-03 2018-05-11 3M Innovative Properties Company Composition including a polythiol, a polyepoxide, a photolatent base, and an amine and methods relating to the composition
CN114276770A (en) * 2021-12-29 2022-04-05 江苏钛得新材料技术有限公司 Ultraviolet light-cured adhesive and preparation method thereof
JP2023024361A (en) * 2021-08-06 2023-02-16 イノックス・アドバンスト・マテリアルズ・カンパニー・リミテッド Thermosetting liquid composition for sealing material of organic light emitting element

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5521999B2 (en) * 2009-11-26 2014-06-18 住友化学株式会社 Chemically amplified photoresist composition and method for producing resist pattern
CN102762660A (en) * 2010-02-16 2012-10-31 株式会社大赛璐 Curable composition and cured material
JP5675230B2 (en) * 2010-09-03 2015-02-25 株式会社ダイセル Thermosetting epoxy resin composition and use thereof
JP2012168526A (en) * 2011-01-26 2012-09-06 Sanyo Chem Ind Ltd Photosensitive composition
DE102014202609B4 (en) * 2014-02-13 2020-06-04 tooz technologies GmbH Amine-catalyzed thiol curing of epoxy resins
CA3042861A1 (en) 2016-11-03 2018-05-11 3M Innovative Properties Company Compositions including a photolatent amine, camphorquinone, and a coumarin and related methods

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005511536A (en) * 2001-10-17 2005-04-28 チバ　スペシャルティ　ケミカルズ　ホールディング　インコーポレーテッド Photoactivated nitrogen base
WO2005052021A1 (en) * 2003-11-26 2005-06-09 Mitsui Chemicals, Inc. One-pack-type resin composition curable with combination of light and heat and use of the same
WO2006008251A2 (en) * 2004-07-21 2006-01-26 Ciba Specialty Chemicals Holding Inc. Process for the photoactivation and use of a catalyst by an inverted two-stage procedure
JP2006070151A (en) * 2004-09-02 2006-03-16 Three Bond Co Ltd Photocurable composition
JP2006070152A (en) * 2004-09-02 2006-03-16 Three Bond Co Ltd Photocurable composition
JP2006225490A (en) * 2005-02-17 2006-08-31 Three Bond Co Ltd Heat-curing type one-pack resin composition
JP2007321120A (en) * 2006-06-05 2007-12-13 Three Bond Co Ltd Curable composition
WO2008001637A1 (en) * 2006-06-26 2008-01-03 Three Bond Co., Ltd. Amine imide compound to be activated by irradiation of active energy ray, composition using the same, and method for curing the same
JP2008001867A (en) * 2006-06-26 2008-01-10 Three Bond Co Ltd Curable resin composition

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005511536A (en) * 2001-10-17 2005-04-28 チバ　スペシャルティ　ケミカルズ　ホールディング　インコーポレーテッド Photoactivated nitrogen base
WO2005052021A1 (en) * 2003-11-26 2005-06-09 Mitsui Chemicals, Inc. One-pack-type resin composition curable with combination of light and heat and use of the same
WO2006008251A2 (en) * 2004-07-21 2006-01-26 Ciba Specialty Chemicals Holding Inc. Process for the photoactivation and use of a catalyst by an inverted two-stage procedure
JP2006070151A (en) * 2004-09-02 2006-03-16 Three Bond Co Ltd Photocurable composition
JP2006070152A (en) * 2004-09-02 2006-03-16 Three Bond Co Ltd Photocurable composition
JP2006225490A (en) * 2005-02-17 2006-08-31 Three Bond Co Ltd Heat-curing type one-pack resin composition
JP2007321120A (en) * 2006-06-05 2007-12-13 Three Bond Co Ltd Curable composition
WO2008001637A1 (en) * 2006-06-26 2008-01-03 Three Bond Co., Ltd. Amine imide compound to be activated by irradiation of active energy ray, composition using the same, and method for curing the same
JP2008001867A (en) * 2006-06-26 2008-01-10 Three Bond Co Ltd Curable resin composition

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011236416A (en) * 2010-04-14 2011-11-24 Tokyo Univ Of Science Photosensitive resin composition
WO2013005471A1 (en) * 2011-07-07 2013-01-10 ナミックス株式会社 Resin composition
EP3288998A4 (en) * 2015-04-29 2018-09-12 3M Innovative Properties Company Method of making a polymer network from a polythiol and a polyepoxide
WO2016176548A1 (en) 2015-04-29 2016-11-03 3M Innovative Properties Company Composition including a polythiol and a polyepoxide and methods relating to the composition
US10526440B2 (en) 2015-04-29 2020-01-07 3M Innovative Properties Company Method of making a polymer network from a polythiol and a polyepoxide
EP3288999A4 (en) * 2015-04-29 2018-09-26 3M Innovative Properties Company Composition including a polythiol and a polyepoxide and methods relating to the composition
WO2017077928A1 (en) * 2015-11-04 2017-05-11 三菱レイヨン株式会社 Curable composition, adhesive, article having coating layer, fiber-reinforced composite material, potting agent and curable composition kit
CN108350147A (en) * 2015-11-04 2018-07-31 三菱化学株式会社 Solidification compound, adhesive, the cated article of tool, fiber reinforced composite material, pouring agent and solidification compound external member
JPWO2017077928A1 (en) * 2015-11-04 2017-11-02 三菱ケミカル株式会社 Curable composition, adhesive, article having coating layer, fiber reinforced composite material, potting agent, and curable composition kit
WO2018085546A1 (en) * 2016-11-03 2018-05-11 3M Innovative Properties Company Composition including a polythiol, a polyepoxide, a photolatent base, and an amine and methods relating to the composition
JP2023024361A (en) * 2021-08-06 2023-02-16 イノックス・アドバンスト・マテリアルズ・カンパニー・リミテッド Thermosetting liquid composition for sealing material of organic light emitting element
JP7445714B2 (en) 2021-08-06 2024-03-07 イノックス・アドバンスト・マテリアルズ・カンパニー・リミテッド Thermosetting liquid composition for encapsulant of organic light emitting devices
CN114276770A (en) * 2021-12-29 2022-04-05 江苏钛得新材料技术有限公司 Ultraviolet light-cured adhesive and preparation method thereof
CN114276770B (en) * 2021-12-29 2023-04-07 江苏钛得新材料技术有限公司 Ultraviolet light-cured adhesive and preparation method thereof

Also Published As

Publication number Publication date
JP2009126974A (en) 2009-06-11

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