TW200608139A - Photocurable/thermosetting resin composition and cured product thereof - Google Patents

Photocurable/thermosetting resin composition and cured product thereof

Info

Publication number
TW200608139A
TW200608139A TW094123785A TW94123785A TW200608139A TW 200608139 A TW200608139 A TW 200608139A TW 094123785 A TW094123785 A TW 094123785A TW 94123785 A TW94123785 A TW 94123785A TW 200608139 A TW200608139 A TW 200608139A
Authority
TW
Taiwan
Prior art keywords
photocurable
thermosetting resin
resin composition
cured product
group
Prior art date
Application number
TW094123785A
Other languages
Chinese (zh)
Other versions
TWI366740B (en
Inventor
Shouji Minegishi
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW200608139A publication Critical patent/TW200608139A/en
Application granted granted Critical
Publication of TWI366740B publication Critical patent/TWI366740B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Abstract

Disclosed is a photocurable/thermosetting resin composition wherein the volatile component is reduced by using no or less photopolymerization initiator. This photocurable/thermosetting resin composition can be cured by relatively small amount of ultraviolet irradiation and can be developed with an aqueous alkaline solution. This composition contains a carboxyl group-containing photosensitive resin (A), a maleimide derivative (B), a compound c having two or more epoxy groups and/or oxetanyl groups in one molecule, and a radically polymerizable compound (D) having a cyclic ether group or a morpholino group.
TW094123785A 2004-07-15 2005-07-13 Photocurable/thermosetting resin composition and cured product thereof TW200608139A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004208058 2004-07-15

Publications (2)

Publication Number Publication Date
TW200608139A true TW200608139A (en) 2006-03-01
TWI366740B TWI366740B (en) 2012-06-21

Family

ID=35785111

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094123785A TW200608139A (en) 2004-07-15 2005-07-13 Photocurable/thermosetting resin composition and cured product thereof

Country Status (4)

Country Link
JP (1) JP4994036B2 (en)
CN (1) CN100569825C (en)
TW (1) TW200608139A (en)
WO (1) WO2006008995A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI740931B (en) * 2016-04-25 2021-10-01 日商鐘化股份有限公司 Thermosetting resin composition, cured film and manufacturing method thereof, and flexible printed circuit board with cured film and manufacturing method thereof

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JP4683182B2 (en) * 2004-09-28 2011-05-11 山栄化学株式会社 Photosensitive thermosetting resin composition, resist-coated printed wiring board and method for producing the same
JP4635935B2 (en) * 2006-03-29 2011-02-23 Ｊｓｒ株式会社 Radiation-sensitive composition for forming colored layer, color filter, and color liquid crystal display element
WO2008029816A1 (en) * 2006-09-04 2008-03-13 Nec Corporation Photosensitive resin composition, method for control of refractive index, and optical waveguide and optical component using the same
JP4939301B2 (en) * 2007-05-17 2012-05-23 日東電工株式会社 Optical waveguide
JP5298653B2 (en) * 2007-07-06 2013-09-25 Ｊｓｒ株式会社 Radiation-sensitive composition for forming colored layer, color filter, and color liquid crystal display element
JP4849362B2 (en) * 2008-03-14 2012-01-11 ナガセケムテックス株式会社 Radiation sensitive resin composition
JP5542360B2 (en) * 2009-03-30 2014-07-09 太陽ホールディングス株式会社 Printed wiring board
JPWO2011001713A1 (en) * 2009-06-29 2012-12-13 積水化学工業株式会社 Plating protective tape
JP5537864B2 (en) * 2009-08-19 2014-07-02 太陽ホールディングス株式会社 Photocurable resin composition
JP5575436B2 (en) * 2009-09-01 2014-08-20 太陽ホールディングス株式会社 Alkali-developable photocurable resin composition, dry film and cured product thereof, and printed wiring board using them
JP5526740B2 (en) * 2009-11-30 2014-06-18 日立化成株式会社 Optical waveguide forming resin composition, optical waveguide forming resin film using the same, and optical waveguide using the same
JP5724298B2 (en) * 2010-10-29 2015-05-27 大日本印刷株式会社 Method for producing gas barrier film and method for forming gas barrier layer
CN102746785B (en) * 2011-04-19 2014-12-17 比亚迪股份有限公司 Dual-cured coating composition and curing method thereof
JP2013165164A (en) * 2012-02-10 2013-08-22 Taiyo Ink Mfg Ltd Wiring circuit, wiring board, and manufacturing method of wiring board
JP6090655B2 (en) * 2013-02-12 2017-03-08 パナソニックＩｐマネジメント株式会社 Dry film for optical waveguide, optical waveguide and photoelectric composite wiring board using the same, and method for producing optical composite wiring board
WO2016047691A1 (en) * 2014-09-24 2016-03-31 旭化成イーマテリアルズ株式会社 Photosensitive resin composition, photosensitive resin laminate, resin pattern production method, cured film, and display device
JP6815750B2 (en) * 2016-05-17 2021-01-20 株式会社カネカ Manufacturing method of thermosetting resin composition and its use
JP7348177B2 (en) 2018-06-29 2023-09-20 株式会社カネカ Resist composition for pattern printing and pattern forming method
JP2019204974A (en) * 2019-08-21 2019-11-28 住友ベークライト株式会社 Method of manufacturing organic resin substrate, organic resin substrate, and semiconductor device
CN113174040B (en) * 2021-04-27 2022-05-17 杭州福斯特电子材料有限公司 Photopolymerizable monomer and high-resolution high-adhesion LDI dry film resist composed of photopolymerizable monomer
CN115955791A (en) * 2023-03-15 2023-04-11 深圳明阳电路科技股份有限公司 Preparation method for mini-LED PCB

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US5446073A (en) * 1993-03-31 1995-08-29 Fusion Systems Corporation Photopolymerization process employing a charge transfer complex without a photoinitiator
JPH07188383A (en) * 1993-12-27 1995-07-25 Hitachi Chem Co Ltd Epoxy resin composition and resin composition for color filter protection film produced by using the composition
US5789757A (en) * 1996-09-10 1998-08-04 The Dexter Corporation Malemide containing formulations and uses therefor
JP2002502056A (en) * 1998-01-30 2002-01-22 ファースト・ケミカル・コーポレイション Photopolymerizable composition containing maleimide and method of using same
WO2001073510A1 (en) * 2000-03-29 2001-10-04 Kanagawa University Photocurable/thermosetting resin composition, photosensitive dry film formed therefrom, and method of forming pattern with the same
JP2003195501A (en) * 2001-12-26 2003-07-09 Fujifilm Arch Co Ltd Positive photosensitive resin composition
JP4087650B2 (en) * 2002-07-12 2008-05-21 太陽インキ製造株式会社 Photocurable / thermosetting resin composition and cured product thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI740931B (en) * 2016-04-25 2021-10-01 日商鐘化股份有限公司 Thermosetting resin composition, cured film and manufacturing method thereof, and flexible printed circuit board with cured film and manufacturing method thereof

Also Published As

Publication number Publication date
CN100569825C (en) 2009-12-16
CN1984938A (en) 2007-06-20
JP4994036B2 (en) 2012-08-08
WO2006008995A1 (en) 2006-01-26
TWI366740B (en) 2012-06-21
JPWO2006008995A1 (en) 2008-05-01

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