WO2009008448A1 - Adhesive for circuit member connection - Google Patents

Adhesive for circuit member connection Download PDF

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Publication number
WO2009008448A1
WO2009008448A1 PCT/JP2008/062402 JP2008062402W WO2009008448A1 WO 2009008448 A1 WO2009008448 A1 WO 2009008448A1 JP 2008062402 W JP2008062402 W JP 2008062402W WO 2009008448 A1 WO2009008448 A1 WO 2009008448A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit member
member connection
adhesive
thermally crosslinkable
resin composition
Prior art date
Application number
PCT/JP2008/062402
Other languages
French (fr)
Japanese (ja)
Inventor
Akira Nagai
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to JP2009522658A priority Critical patent/JP5557526B2/en
Priority to KR1020127016495A priority patent/KR20120089347A/en
Priority to CN200880023514A priority patent/CN101689518A/en
Publication of WO2009008448A1 publication Critical patent/WO2009008448A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
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    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29075—Plural core members
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    • H01L2224/29082—Two-layer arrangements
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    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
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    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
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    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Adhesive Tapes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

Disclosed is a thermosetting adhesive for circuit member connection, which is composed of a resin composition containing a thermally crosslinkable resin and a curing agent reactive with the thermally crosslinkable resin and complex oxide particles dispersed in the resin composition.
PCT/JP2008/062402 2007-07-11 2008-07-09 Adhesive for circuit member connection WO2009008448A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009522658A JP5557526B2 (en) 2007-07-11 2008-07-09 Circuit member connecting adhesive and semiconductor device
KR1020127016495A KR20120089347A (en) 2007-07-11 2008-07-09 Adhesive for circuit member connection
CN200880023514A CN101689518A (en) 2007-07-11 2008-07-09 Adhesive for circuit member connection

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007182110 2007-07-11
JP2007-182110 2007-07-11

Publications (1)

Publication Number Publication Date
WO2009008448A1 true WO2009008448A1 (en) 2009-01-15

Family

ID=40228619

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062402 WO2009008448A1 (en) 2007-07-11 2008-07-09 Adhesive for circuit member connection

Country Status (5)

Country Link
JP (2) JP5557526B2 (en)
KR (2) KR20100033527A (en)
CN (2) CN102157407B (en)
TW (1) TWI425598B (en)
WO (1) WO2009008448A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010131575A1 (en) * 2009-05-13 2010-11-18 日立化成工業株式会社 Adhesive composition, adhesive sheet for connecting circuit member, and method for manufacturing semiconductor device
JP2010278324A (en) * 2009-05-29 2010-12-09 Hitachi Chem Co Ltd Adhesive composition, adhesive sheet and semiconductor device
JP2012007007A (en) * 2010-06-22 2012-01-12 Shin-Etsu Chemical Co Ltd Die bond agent composition and semiconductor device
JP2012520387A (en) * 2009-03-16 2012-09-06 ロックタイト （アール アンド ディー） リミテッド Bonding elastomer to substrate
CN103740309A (en) * 2013-12-10 2014-04-23 江苏瑞德新能源科技有限公司 Repairable conductive adhesive and preparation method thereof

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011102404A (en) * 2011-02-17 2011-05-26 Sony Chemical & Information Device Corp Anisotropic conductive film
CN102408679B (en) * 2011-08-29 2012-12-26 天威新能源控股有限公司 Epoxy resin composite material
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TW200919657A (en) 2009-05-01
CN101689518A (en) 2010-03-31

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