WO2009008448A1 - Adhésif pour la connexion d'éléments de circuit - Google Patents

Adhésif pour la connexion d'éléments de circuit Download PDF

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Publication number
WO2009008448A1
WO2009008448A1 PCT/JP2008/062402 JP2008062402W WO2009008448A1 WO 2009008448 A1 WO2009008448 A1 WO 2009008448A1 JP 2008062402 W JP2008062402 W JP 2008062402W WO 2009008448 A1 WO2009008448 A1 WO 2009008448A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit member
member connection
adhesive
thermally crosslinkable
resin composition
Prior art date
Application number
PCT/JP2008/062402
Other languages
English (en)
Japanese (ja)
Inventor
Akira Nagai
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to CN200880023514A priority Critical patent/CN101689518A/zh
Priority to KR1020127016495A priority patent/KR20120089347A/ko
Priority to JP2009522658A priority patent/JP5557526B2/ja
Publication of WO2009008448A1 publication Critical patent/WO2009008448A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
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    • C08K3/22—Oxides; Hydroxides of metals
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    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
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    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Adhesive Tapes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L'invention concerne un adhésif thermodurcissable pour la connexion d'éléments de circuit, qui est composé d'une composition résineuse contenant une résine thermiquement réticulable et un agent de durcissement qui réagit avec la résine thermiquement réticulable et les particules d'oxydes complexes dispersées dans la composition résineuse.
PCT/JP2008/062402 2007-07-11 2008-07-09 Adhésif pour la connexion d'éléments de circuit WO2009008448A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880023514A CN101689518A (zh) 2007-07-11 2008-07-09 电路部件连接用粘接剂
KR1020127016495A KR20120089347A (ko) 2007-07-11 2008-07-09 회로 부재 접속용 접착제
JP2009522658A JP5557526B2 (ja) 2007-07-11 2008-07-09 回路部材接続用接着剤及び半導体装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-182110 2007-07-11
JP2007182110 2007-07-11

Publications (1)

Publication Number Publication Date
WO2009008448A1 true WO2009008448A1 (fr) 2009-01-15

Family

ID=40228619

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062402 WO2009008448A1 (fr) 2007-07-11 2008-07-09 Adhésif pour la connexion d'éléments de circuit

Country Status (5)

Country Link
JP (2) JP5557526B2 (fr)
KR (2) KR20120089347A (fr)
CN (2) CN101689518A (fr)
TW (1) TWI425598B (fr)
WO (1) WO2009008448A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010131575A1 (fr) * 2009-05-13 2010-11-18 日立化成工業株式会社 Composition d'adhésif, feuille adhésive pour élément de connexion d'un circuit et procédé pour la fabrication d'un dispositif à semi-conducteur
JP2010278324A (ja) * 2009-05-29 2010-12-09 Hitachi Chem Co Ltd 接着剤組成物、接着シート及び半導体装置
JP2012007007A (ja) * 2010-06-22 2012-01-12 Shin-Etsu Chemical Co Ltd ダイボンド剤組成物及び半導体装置。
JP2012520387A (ja) * 2009-03-16 2012-09-06 ロックタイト （アール アンド ディー） リミテッド 基体へのエラストマーの接合
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CN103740309A (zh) * 2013-12-10 2014-04-23 江苏瑞德新能源科技有限公司 一种可修复导电胶及其制备方法
CN103740309B (zh) * 2013-12-10 2015-01-21 江苏瑞德新能源科技有限公司 一种可修复导电胶及其制备方法

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CN102157407B (zh) 2014-01-08
TW200919657A (en) 2009-05-01
JPWO2009008448A1 (ja) 2010-09-09
KR20100033527A (ko) 2010-03-30
KR20120089347A (ko) 2012-08-09
TWI425598B (zh) 2014-02-01

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