CN101689518A - 电路部件连接用粘接剂 - Google Patents

电路部件连接用粘接剂 Download PDF

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Publication number
CN101689518A
CN101689518A CN200880023514A CN200880023514A CN101689518A CN 101689518 A CN101689518 A CN 101689518A CN 200880023514 A CN200880023514 A CN 200880023514A CN 200880023514 A CN200880023514 A CN 200880023514A CN 101689518 A CN101689518 A CN 101689518A
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CN
China
Prior art keywords
adhesive
circuit member
member connection
resin
composite oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200880023514A
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English (en)
Chinese (zh)
Inventor
永井朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
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Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of CN101689518A publication Critical patent/CN101689518A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H—ELECTRICITY
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesive Tapes (AREA)
CN200880023514A 2007-07-11 2008-07-09 电路部件连接用粘接剂 Pending CN101689518A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP182110/2007 2007-07-11
JP2007182110 2007-07-11
PCT/JP2008/062402 WO2009008448A1 (fr) 2007-07-11 2008-07-09 Adhésif pour la connexion d'éléments de circuit

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201110026643.XA Division CN102157407B (zh) 2007-07-11 2008-07-09 电路部件连接用粘接剂的使用方法

Publications (1)

Publication Number Publication Date
CN101689518A true CN101689518A (zh) 2010-03-31

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Family Applications (2)

Application Number Title Priority Date Filing Date
CN200880023514A Pending CN101689518A (zh) 2007-07-11 2008-07-09 电路部件连接用粘接剂
CN201110026643.XA Expired - Fee Related CN102157407B (zh) 2007-07-11 2008-07-09 电路部件连接用粘接剂的使用方法

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Application Number Title Priority Date Filing Date
CN201110026643.XA Expired - Fee Related CN102157407B (zh) 2007-07-11 2008-07-09 电路部件连接用粘接剂的使用方法

Country Status (5)

Country Link
JP (2) JP5557526B2 (fr)
KR (2) KR20120089347A (fr)
CN (2) CN101689518A (fr)
TW (1) TWI425598B (fr)
WO (1) WO2009008448A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103384904A (zh) * 2011-02-17 2013-11-06 迪睿合电子材料有限公司 各向异性导电膜
CN104952702A (zh) * 2015-05-15 2015-09-30 张家港康得新光电材料有限公司 半导体器件及其制作方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2755835A1 (fr) * 2009-03-16 2010-09-23 Loctite (R&D) Limited Liaison d'un elastomere a un substrat
JP4766180B2 (ja) * 2009-05-13 2011-09-07 日立化成工業株式会社 接着剤組成物
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CN102157407B (zh) 2014-01-08
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JP5557526B2 (ja) 2014-07-23
KR20120089347A (ko) 2012-08-09
WO2009008448A1 (fr) 2009-01-15
KR20100033527A (ko) 2010-03-30
TW200919657A (en) 2009-05-01
JP2012044202A (ja) 2012-03-01

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