WO2008136337A1 - スパッタリング装置及びスパッタリング方法 - Google Patents

スパッタリング装置及びスパッタリング方法 Download PDF

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Publication number
WO2008136337A1
WO2008136337A1 PCT/JP2008/057894 JP2008057894W WO2008136337A1 WO 2008136337 A1 WO2008136337 A1 WO 2008136337A1 JP 2008057894 W JP2008057894 W JP 2008057894W WO 2008136337 A1 WO2008136337 A1 WO 2008136337A1
Authority
WO
WIPO (PCT)
Prior art keywords
sputtering
targets
gas
parallel
introducing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/057894
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Tatsunori Isobe
Yasuhiko Akamatsu
Takaomi Kurata
Makoto Arai
Takashi Komatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to CN2008800118311A priority Critical patent/CN101657562B/zh
Priority to KR1020097021361A priority patent/KR101050121B1/ko
Publication of WO2008136337A1 publication Critical patent/WO2008136337A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/228—Gas flow assisted PVD deposition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
PCT/JP2008/057894 2007-05-01 2008-04-24 スパッタリング装置及びスパッタリング方法 Ceased WO2008136337A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008800118311A CN101657562B (zh) 2007-05-01 2008-04-24 溅镀装置及溅镀方法
KR1020097021361A KR101050121B1 (ko) 2007-05-01 2008-04-24 스퍼터링 장치 및 스퍼터링 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-120708 2007-05-01
JP2007120708A JP4707693B2 (ja) 2007-05-01 2007-05-01 スパッタリング装置及びスパッタリング方法

Publications (1)

Publication Number Publication Date
WO2008136337A1 true WO2008136337A1 (ja) 2008-11-13

Family

ID=39943448

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057894 Ceased WO2008136337A1 (ja) 2007-05-01 2008-04-24 スパッタリング装置及びスパッタリング方法

Country Status (5)

Country Link
JP (1) JP4707693B2 (enExample)
KR (1) KR101050121B1 (enExample)
CN (1) CN101657562B (enExample)
TW (1) TWI433949B (enExample)
WO (1) WO2008136337A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5975653B2 (ja) * 2011-01-25 2016-08-23 Hoya株式会社 マスクブランク製造用スパッタリング装置及び表示装置用マスクブランクの製造方法並びに表示装置用マスクの製造方法
JP5721815B2 (ja) * 2011-04-12 2015-05-20 株式会社アルバック ターゲット及びターゲットの製造方法
KR20120130518A (ko) * 2011-05-23 2012-12-03 삼성디스플레이 주식회사 스퍼터링용 분할 타겟 장치 및 그것을 이용한 스퍼터링 방법
JP5875462B2 (ja) * 2012-05-21 2016-03-02 株式会社アルバック スパッタリング方法
AT513190B9 (de) 2012-08-08 2014-05-15 Berndorf Hueck Band Und Pressblechtechnik Gmbh Vorrichtung und Verfahren zur Plasmabeschichtung eines Substrats, insbesondere eines Pressblechs
JP6196078B2 (ja) * 2012-10-18 2017-09-13 株式会社アルバック 成膜装置
JP6251588B2 (ja) * 2014-02-04 2017-12-20 株式会社アルバック 成膜方法
CN106103787B (zh) * 2014-03-18 2019-06-28 应用材料公司 用于静态反应溅射的工艺气体分段
WO2019176343A1 (ja) * 2018-03-16 2019-09-19 株式会社アルバック 成膜方法
KR102395512B1 (ko) 2020-07-16 2022-05-09 제이엔티(주) 자체 안전제동 전동기 구동 노약자 보행보조장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03193870A (ja) * 1989-12-25 1991-08-23 Matsushita Electric Ind Co Ltd 低ガス圧力スパッタリング装置
JPH05239634A (ja) * 1991-12-11 1993-09-17 Leybold Ag 陰極スパッタリング装置
JP2005290550A (ja) * 2004-03-11 2005-10-20 Ulvac Japan Ltd スパッタリング装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2443972Y (zh) * 2000-08-18 2001-08-22 深圳威士达真空系统工程有限公司 中频反应溅射镀膜设备中反应气体的供气装置
JP4580781B2 (ja) * 2004-03-19 2010-11-17 株式会社アルバック スパッタリング方法及びその装置
JP4922581B2 (ja) * 2005-07-29 2012-04-25 株式会社アルバック スパッタリング装置及びスパッタリング方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03193870A (ja) * 1989-12-25 1991-08-23 Matsushita Electric Ind Co Ltd 低ガス圧力スパッタリング装置
JPH05239634A (ja) * 1991-12-11 1993-09-17 Leybold Ag 陰極スパッタリング装置
JP2005290550A (ja) * 2004-03-11 2005-10-20 Ulvac Japan Ltd スパッタリング装置

Also Published As

Publication number Publication date
CN101657562B (zh) 2011-05-11
JP2008274366A (ja) 2008-11-13
JP4707693B2 (ja) 2011-06-22
KR20090122383A (ko) 2009-11-27
TWI433949B (zh) 2014-04-11
CN101657562A (zh) 2010-02-24
KR101050121B1 (ko) 2011-07-19
TW200920868A (en) 2009-05-16

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