KR101050121B1 - 스퍼터링 장치 및 스퍼터링 방법 - Google Patents

스퍼터링 장치 및 스퍼터링 방법 Download PDF

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KR101050121B1
KR101050121B1 KR1020097021361A KR20097021361A KR101050121B1 KR 101050121 B1 KR101050121 B1 KR 101050121B1 KR 1020097021361 A KR1020097021361 A KR 1020097021361A KR 20097021361 A KR20097021361 A KR 20097021361A KR 101050121 B1 KR101050121 B1 KR 101050121B1
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South Korea
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target
gas
targets
sputter
sputtering
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Korean (ko)
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KR20090122383A (ko
Inventor
타쯔노리 이소베
야스히코 아카마쯔
타카오미 구라타
마코토 아라이
타카시 코마쯔
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가부시키가이샤 알박
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/228—Gas flow assisted PVD deposition

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
KR1020097021361A 2007-05-01 2008-04-24 스퍼터링 장치 및 스퍼터링 방법 Active KR101050121B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2007-120708 2007-05-01
JP2007120708A JP4707693B2 (ja) 2007-05-01 2007-05-01 スパッタリング装置及びスパッタリング方法
PCT/JP2008/057894 WO2008136337A1 (ja) 2007-05-01 2008-04-24 スパッタリング装置及びスパッタリング方法

Publications (2)

Publication Number Publication Date
KR20090122383A KR20090122383A (ko) 2009-11-27
KR101050121B1 true KR101050121B1 (ko) 2011-07-19

Family

ID=39943448

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097021361A Active KR101050121B1 (ko) 2007-05-01 2008-04-24 스퍼터링 장치 및 스퍼터링 방법

Country Status (5)

Country Link
JP (1) JP4707693B2 (enExample)
KR (1) KR101050121B1 (enExample)
CN (1) CN101657562B (enExample)
TW (1) TWI433949B (enExample)
WO (1) WO2008136337A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5975653B2 (ja) * 2011-01-25 2016-08-23 Hoya株式会社 マスクブランク製造用スパッタリング装置及び表示装置用マスクブランクの製造方法並びに表示装置用マスクの製造方法
JP5721815B2 (ja) * 2011-04-12 2015-05-20 株式会社アルバック ターゲット及びターゲットの製造方法
KR20120130518A (ko) * 2011-05-23 2012-12-03 삼성디스플레이 주식회사 스퍼터링용 분할 타겟 장치 및 그것을 이용한 스퍼터링 방법
JP5875462B2 (ja) * 2012-05-21 2016-03-02 株式会社アルバック スパッタリング方法
AT513190B9 (de) 2012-08-08 2014-05-15 Berndorf Hueck Band Und Pressblechtechnik Gmbh Vorrichtung und Verfahren zur Plasmabeschichtung eines Substrats, insbesondere eines Pressblechs
JP6196078B2 (ja) * 2012-10-18 2017-09-13 株式会社アルバック 成膜装置
JP6251588B2 (ja) * 2014-02-04 2017-12-20 株式会社アルバック 成膜方法
CN106103787B (zh) * 2014-03-18 2019-06-28 应用材料公司 用于静态反应溅射的工艺气体分段
WO2019176343A1 (ja) * 2018-03-16 2019-09-19 株式会社アルバック 成膜方法
KR102395512B1 (ko) 2020-07-16 2022-05-09 제이엔티(주) 자체 안전제동 전동기 구동 노약자 보행보조장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005290550A (ja) * 2004-03-11 2005-10-20 Ulvac Japan Ltd スパッタリング装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03193870A (ja) * 1989-12-25 1991-08-23 Matsushita Electric Ind Co Ltd 低ガス圧力スパッタリング装置
DE4140862A1 (de) * 1991-12-11 1993-06-17 Leybold Ag Kathodenzerstaeubungsanlage
CN2443972Y (zh) * 2000-08-18 2001-08-22 深圳威士达真空系统工程有限公司 中频反应溅射镀膜设备中反应气体的供气装置
JP4580781B2 (ja) * 2004-03-19 2010-11-17 株式会社アルバック スパッタリング方法及びその装置
JP4922581B2 (ja) * 2005-07-29 2012-04-25 株式会社アルバック スパッタリング装置及びスパッタリング方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005290550A (ja) * 2004-03-11 2005-10-20 Ulvac Japan Ltd スパッタリング装置

Also Published As

Publication number Publication date
CN101657562B (zh) 2011-05-11
JP2008274366A (ja) 2008-11-13
JP4707693B2 (ja) 2011-06-22
KR20090122383A (ko) 2009-11-27
TWI433949B (zh) 2014-04-11
CN101657562A (zh) 2010-02-24
WO2008136337A1 (ja) 2008-11-13
TW200920868A (en) 2009-05-16

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