MX2010006214A - Unidad de recubrimiento al vacio de pvd. - Google Patents

Unidad de recubrimiento al vacio de pvd.

Info

Publication number
MX2010006214A
MX2010006214A MX2010006214A MX2010006214A MX2010006214A MX 2010006214 A MX2010006214 A MX 2010006214A MX 2010006214 A MX2010006214 A MX 2010006214A MX 2010006214 A MX2010006214 A MX 2010006214A MX 2010006214 A MX2010006214 A MX 2010006214A
Authority
MX
Mexico
Prior art keywords
substrate carrier
pvd coating
sheet
cutting edge
coating unit
Prior art date
Application number
MX2010006214A
Other languages
English (en)
Inventor
Christian Wohlrab
Juergen Ramm
Original Assignee
Oerlikon Trading Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Trading Ag filed Critical Oerlikon Trading Ag
Publication of MX2010006214A publication Critical patent/MX2010006214A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Cutting Tools, Boring Holders, And Turrets (AREA)
  • Battery Electrode And Active Subsutance (AREA)

Abstract

Se describe una unidad de recubrimiento al vacío que incluye una entrada de gas reactivo (12), por lo menos una fuente de recubrimiento de PVD (8, 21) con un cátodo laminar (11) y un portador de sustrato (6) que contiene una pluralidad de sustratos (7), en donde el portador de sustrato (6) forma una longitud horizontal bidimensional, y este portador se coloca entre por lo menos dos fuentes de recubrimiento de PVD, y en donde la pluralidad de sustratos (7) son las herramientas de corte con por lo menos un filo (E) en la región de margen periférica del sustrato laminar (7), que se deponen distribuidas en un plano de longitud bidimensional del portador de sustrato (6), en donde el portador de sustrato (6) se coloca en un plano horizontal (3) en la cámara de proceso al vacío (1) separada entre los cátodos laminares (11) de por lo menos dos fuentes de recubrimiento de PVD (8, 21) y colocada tal que por lo menos una pieza de cada una de por lo menos un filo (E) incluye un filo activo (F) y este filo activo está orientado opuesto a por lo menos uno de los cátodos (11) de las fuentes de recubrimiento de PVD (8, 21) expuestas en cualquier momento en la línea de visión.
MX2010006214A 2007-12-06 2008-11-17 Unidad de recubrimiento al vacio de pvd. MX2010006214A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH18902007 2007-12-06
PCT/CH2008/000485 WO2009070903A1 (de) 2007-12-06 2008-11-17 Pvd - vakuumbeschichtungsanlage

Publications (1)

Publication Number Publication Date
MX2010006214A true MX2010006214A (es) 2010-06-23

Family

ID=39186114

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2010006214A MX2010006214A (es) 2007-12-06 2008-11-17 Unidad de recubrimiento al vacio de pvd.

Country Status (12)

Country Link
US (1) US8968830B2 (es)
EP (1) EP2220265A1 (es)
JP (1) JP5449185B2 (es)
KR (1) KR20100094558A (es)
CN (1) CN101889102B (es)
BR (1) BRPI0820014A2 (es)
CA (1) CA2707581A1 (es)
MX (1) MX2010006214A (es)
RU (1) RU2486280C2 (es)
SG (2) SG186624A1 (es)
TW (1) TWI498442B (es)
WO (1) WO2009070903A1 (es)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2454393B1 (de) * 2009-07-14 2016-09-28 MSM Krystall GBR Verfahren zur herstellung von wendeschneidplatten
CZ304905B6 (cs) * 2009-11-23 2015-01-14 Shm, S.R.O. Způsob vytváření PVD vrstev s pomocí rotační cylindrické katody a zařízení k provádění tohoto způsobu
DE102010038077B4 (de) 2010-10-08 2018-05-30 Msm Krystall Gbr (Vertretungsberechtigte Gesellschafter: Dr. Rainer Schneider, 12165 Berlin; Arno Mecklenburg, 10999 Berlin) Wendeschneidplatte und Verfahren zu deren Herstellung
EP2540858B1 (en) * 2011-06-30 2014-12-17 Lamina Technologies SA Cathodic arc deposition
CN104004993B (zh) * 2013-02-25 2018-01-12 北京中科三环高技术股份有限公司 一种表面处理装置
DE102015004856A1 (de) * 2015-04-15 2016-10-20 Oerlikon Metaplas Gmbh Bipolares Arc-Beschichtungsverfahren
KR102079460B1 (ko) 2015-12-17 2020-02-19 가부시키가이샤 알박 진공 처리 장치
US11322338B2 (en) * 2017-08-31 2022-05-03 Taiwan Semiconductor Manufacturing Co., Ltd. Sputter target magnet
DE102018004086A1 (de) * 2018-05-18 2019-11-21 Singulus Technologies Ag Durchlaufanlage und Verfahren zum Beschichten von Substraten
EP3899616A4 (en) * 2018-12-17 2022-08-17 Applied Materials, Inc. DIRECTIONAL PVD DEPOSITION FOR ENCAPSULATION
US20200255941A1 (en) * 2019-02-11 2020-08-13 Kennametal Inc. Supports for chemical vapor deposition coating applications
ES2928498T3 (es) 2019-05-07 2022-11-18 Light Med Usa Inc Método de fase líquida transitoria de plata-indio de unión de dispositivo semiconductor y soporte de dispersión de calor y estructura semiconductora que tiene una junta de unión de fase líquida transitoria de plata-indio

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1264025A (en) 1987-05-29 1989-12-27 James A.E. Bell Apparatus and process for coloring objects by plasma coating
DE4209384C1 (es) 1992-03-23 1993-04-22 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung Ev, 8000 Muenchen, De
RU2058427C1 (ru) * 1993-06-01 1996-04-20 Александр Иванович Дерюгин Вакуумная установка для нанесения покрытий
RU2099439C1 (ru) * 1995-05-06 1997-12-20 Самарская государственная архитектурно-строительная академия Устройство для нанесения покрытий (варианты)
DE29615190U1 (de) * 1996-03-11 1996-11-28 Balzers Verschleissschutz GmbH, 55411 Bingen Anlage zur Beschichtung von Werkstücken
CN1169477A (zh) * 1996-05-10 1998-01-07 萨蒂斯真空工业销售股份公司 在光学基片上蒸镀镀膜的方法
US5803971A (en) * 1997-01-13 1998-09-08 United Technologies Corporation Modular coating fixture
CN1239924C (zh) * 1997-05-16 2006-02-01 Hoya株式会社 有抗反射膜的塑料光学器件和使抗反射膜厚度均一的机构
JP4345869B2 (ja) 1997-05-16 2009-10-14 Ｈｏｙａ株式会社 スパッタ成膜用の膜厚補正機構
SE517046C2 (sv) 1997-11-26 2002-04-09 Sandvik Ab Plasmaaktiverad CVD-metod för beläggning av skärverktyg med finkornig aluminiumoxid
JP2000141108A (ja) 1999-01-01 2000-05-23 Hitachi Tool Engineering Ltd 被覆スロ―アウェイチップの製造方法
JP2001049428A (ja) 1999-08-05 2001-02-20 Nippon Sheet Glass Co Ltd 基体に被膜を被覆する方法およびその方法に用いるスパッタリング装置
DE50115410D1 (de) 2000-09-05 2010-05-12 Oerlikon Trading Ag Vakuumanlage mit koppelbarem Werkstückträger
US20020160620A1 (en) * 2001-02-26 2002-10-31 Rudolf Wagner Method for producing coated workpieces, uses and installation for the method
DE202004011179U1 (de) * 2003-07-21 2004-12-02 Unaxis Balzers Ag Trog zum Stapeln, Aufnehmen und Transportieren von kleinen Teilen, insbesondere Werkzeugen
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Also Published As

Publication number Publication date
WO2009070903A1 (de) 2009-06-11
EP2220265A1 (de) 2010-08-25
CN101889102B (zh) 2013-04-10
RU2010127857A (ru) 2012-01-20
US8968830B2 (en) 2015-03-03
JP2011505262A (ja) 2011-02-24
CA2707581A1 (en) 2009-06-11
US20090148599A1 (en) 2009-06-11
RU2486280C2 (ru) 2013-06-27
TWI498442B (zh) 2015-09-01
SG186624A1 (en) 2013-01-30
KR20100094558A (ko) 2010-08-26
JP5449185B2 (ja) 2014-03-19
TW200936795A (en) 2009-09-01
CN101889102A (zh) 2010-11-17
SG10201604607PA (en) 2016-07-28
BRPI0820014A2 (pt) 2015-05-19

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