WO2007124879A3 - Vorrichtung und verfahren zur homogenen pvd-beschichtung - Google Patents
Vorrichtung und verfahren zur homogenen pvd-beschichtung Download PDFInfo
- Publication number
- WO2007124879A3 WO2007124879A3 PCT/EP2007/003523 EP2007003523W WO2007124879A3 WO 2007124879 A3 WO2007124879 A3 WO 2007124879A3 EP 2007003523 W EP2007003523 W EP 2007003523W WO 2007124879 A3 WO2007124879 A3 WO 2007124879A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrates
- cathodes
- pvd coating
- anode
- coating chamber
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3464—Sputtering using more than one target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Plasma Technology (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Vorrichtung und Verfahren zur PVD-Beschichtung von Substraten. Die Vorrichtung (1) umfasst eine Beschichtungskammer (2), zwei oder mehrere peripher innerhalb der Beschichtungskammer angeordnete Kathoden (3), Substratträger (6) zur Halterung der Substrate (4), Vakuumpumpen (8) und Spannungsquellen (15, 16, 17), wobei eine einzelne Anode (5) zentrisch zwischen den Kathoden (3) in der Beschichtungskammer (2) angeordnet ist und die Substrate (4) zwischen der Anode (5) und den Kathoden (3) positioniert sind. Bei dem Verfahren zur PVD-Beschichtung wird zwischen der einzelnen Anode (5) und den Kathoden (3) jeweils eine Gasentladung mit einem Plasma (14) gezündet. Die Substrate (4) werden stationär gehalten oder um eine oder mehrere Achsen gedreht und dabei den Plasmen (14) ausgesetzt.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07724453A EP2013374A2 (de) | 2006-04-26 | 2007-04-23 | Vorrichtung und verfahren zur homogenen pvd-beschichtung |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006020004.7 | 2006-04-26 | ||
DE200610020004 DE102006020004B4 (de) | 2006-04-26 | 2006-04-26 | Vorrichtung und Verfahren zur homogenen PVD-Beschichtung |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007124879A2 WO2007124879A2 (de) | 2007-11-08 |
WO2007124879A3 true WO2007124879A3 (de) | 2008-07-17 |
Family
ID=38325449
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2007/003523 WO2007124879A2 (de) | 2006-04-26 | 2007-04-23 | Vorrichtung und verfahren zur homogenen pvd-beschichtung |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2013374A2 (de) |
DE (1) | DE102006020004B4 (de) |
WO (1) | WO2007124879A2 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2159820B1 (de) * | 2008-08-25 | 2018-04-11 | Oerlikon Surface Solutions AG, Pfäffikon | Vorrichtung zur Beschichtung durch Ablagerung physikalischer Dämpfe sowie Verfahren zur Ablagerung physikalischer Dämpfe |
DE102008050499B4 (de) | 2008-10-07 | 2014-02-06 | Systec System- Und Anlagentechnik Gmbh & Co. Kg | PVD-Beschichtungsverfahren, Vorrichtung zur Durchführung des Verfahrens und nach dem Verfahren beschichtete Substrate |
DE102008062332A1 (de) | 2008-12-15 | 2010-06-17 | Gühring Ohg | Vorrichtung zur Oberflächenbehandlung und/oder -beschichtung von Substratkomponenten |
DE102009015477A1 (de) | 2009-03-26 | 2010-09-30 | Roth & Rau Ag | PVD-Beschichtungsverfahren |
DE102009015478A1 (de) | 2009-03-26 | 2010-09-30 | Roth & Rau Ag | Verfahren zur Herstellung von Hartstoffschichten |
CZ304905B6 (cs) * | 2009-11-23 | 2015-01-14 | Shm, S.R.O. | Způsob vytváření PVD vrstev s pomocí rotační cylindrické katody a zařízení k provádění tohoto způsobu |
US9793098B2 (en) | 2012-09-14 | 2017-10-17 | Vapor Technologies, Inc. | Low pressure arc plasma immersion coating vapor deposition and ion treatment |
US9412569B2 (en) | 2012-09-14 | 2016-08-09 | Vapor Technologies, Inc. | Remote arc discharge plasma assisted processes |
US10056237B2 (en) | 2012-09-14 | 2018-08-21 | Vapor Technologies, Inc. | Low pressure arc plasma immersion coating vapor deposition and ion treatment |
EP3279364B1 (de) | 2016-08-03 | 2021-10-06 | IHI Hauzer Techno Coating B.V. | Vorrichtung zur beschichtung von substraten |
RU2752334C1 (ru) * | 2020-05-08 | 2021-07-26 | Федеральное государственное бюджетное учреждение науки Институт физического материаловедения Сибирского отделения Российской академии наук | Газоразрядное распылительное устройство на основе планарного магнетрона с ионным источником |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3341442A (en) * | 1963-09-16 | 1967-09-12 | Ibm | Method of cathode sputtering including cleaning by ion bombardment wherein an article to be coated is subjected to canal rays |
US3594301A (en) * | 1968-11-22 | 1971-07-20 | Gen Electric | Sputter coating apparatus |
GB2342361A (en) * | 1998-10-09 | 2000-04-12 | Beijing Zhentao Int L Ti Gold | Planar unbalanced magnetron sputtering cathode |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4239843A1 (de) * | 1992-11-27 | 1994-06-01 | Leybold Ag | Vorrichtung für die Erzeugung von Plasma, insbesondere zum Beschichten von Substraten |
US5616225A (en) * | 1994-03-23 | 1997-04-01 | The Boc Group, Inc. | Use of multiple anodes in a magnetron for improving the uniformity of its plasma |
GB9700158D0 (en) * | 1997-01-07 | 1997-02-26 | Gencoa Limited | Versatile coating deposition system |
US6352627B2 (en) * | 1997-04-14 | 2002-03-05 | Cemecon-Ceramic Metal Coatings | Method and device for PVD coating |
-
2006
- 2006-04-26 DE DE200610020004 patent/DE102006020004B4/de active Active
-
2007
- 2007-04-23 EP EP07724453A patent/EP2013374A2/de not_active Withdrawn
- 2007-04-23 WO PCT/EP2007/003523 patent/WO2007124879A2/de active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3341442A (en) * | 1963-09-16 | 1967-09-12 | Ibm | Method of cathode sputtering including cleaning by ion bombardment wherein an article to be coated is subjected to canal rays |
US3594301A (en) * | 1968-11-22 | 1971-07-20 | Gen Electric | Sputter coating apparatus |
GB2342361A (en) * | 1998-10-09 | 2000-04-12 | Beijing Zhentao Int L Ti Gold | Planar unbalanced magnetron sputtering cathode |
Non-Patent Citations (1)
Title |
---|
See also references of EP2013374A2 * |
Also Published As
Publication number | Publication date |
---|---|
WO2007124879A2 (de) | 2007-11-08 |
DE102006020004B4 (de) | 2011-06-01 |
EP2013374A2 (de) | 2009-01-14 |
DE102006020004A1 (de) | 2008-01-17 |
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