WO2009028552A1 - スパッタリング装置 - Google Patents
スパッタリング装置 Download PDFInfo
- Publication number
- WO2009028552A1 WO2009028552A1 PCT/JP2008/065298 JP2008065298W WO2009028552A1 WO 2009028552 A1 WO2009028552 A1 WO 2009028552A1 JP 2008065298 W JP2008065298 W JP 2008065298W WO 2009028552 A1 WO2009028552 A1 WO 2009028552A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- gas
- targets
- reaction gas
- sputtering apparatus
- introducing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
- H01J37/32449—Gas control, e.g. control of the gas flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3423—Shape
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008801048814A CN101790598B (zh) | 2007-08-31 | 2008-08-27 | 溅镀装置 |
KR1020107004987A KR101196650B1 (ko) | 2007-08-31 | 2008-08-27 | 스퍼터링 장치 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007226392A JP5291907B2 (ja) | 2007-08-31 | 2007-08-31 | スパッタリング装置 |
JP2007-226392 | 2007-08-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009028552A1 true WO2009028552A1 (ja) | 2009-03-05 |
Family
ID=40387269
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/065298 WO2009028552A1 (ja) | 2007-08-31 | 2008-08-27 | スパッタリング装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5291907B2 (ja) |
KR (1) | KR101196650B1 (ja) |
CN (1) | CN101790598B (ja) |
TW (1) | TWI433951B (ja) |
WO (1) | WO2009028552A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015139739A1 (en) * | 2014-03-18 | 2015-09-24 | Applied Materials, Inc. | Process gas segmentation for static reactive sputter processes |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD589322S1 (en) | 2006-10-05 | 2009-03-31 | Lowe's Companies, Inc. | Tool handle |
JP5186152B2 (ja) * | 2007-08-10 | 2013-04-17 | 株式会社アルバック | 薄膜形成方法 |
KR20120130518A (ko) * | 2011-05-23 | 2012-12-03 | 삼성디스플레이 주식회사 | 스퍼터링용 분할 타겟 장치 및 그것을 이용한 스퍼터링 방법 |
KR101794586B1 (ko) | 2011-05-23 | 2017-11-08 | 삼성디스플레이 주식회사 | 스퍼터링용 분할 타겟 장치 및 그것을 이용한 스퍼터링 방법 |
JP5718767B2 (ja) * | 2011-08-30 | 2015-05-13 | 株式会社アルバック | スパッタリング装置 |
JP5875462B2 (ja) * | 2012-05-21 | 2016-03-02 | 株式会社アルバック | スパッタリング方法 |
KR20140108028A (ko) * | 2013-02-28 | 2014-09-05 | 삼성디스플레이 주식회사 | 스퍼터링 장치 및 그것을 이용한 스퍼터링 방법 |
KR101683414B1 (ko) | 2013-04-10 | 2016-12-06 | 캐논 아네르바 가부시키가이샤 | 스퍼터링 장치 |
KR102248048B1 (ko) * | 2014-07-22 | 2021-05-04 | 주성엔지니어링(주) | 가스 분배장치 |
JP6935283B2 (ja) * | 2017-09-27 | 2021-09-15 | 株式会社アルバック | 処理装置 |
WO2019176343A1 (ja) * | 2018-03-16 | 2019-09-19 | 株式会社アルバック | 成膜方法 |
CN109023289B (zh) * | 2018-08-08 | 2020-07-31 | 武汉华星光电半导体显示技术有限公司 | 靶材清洁组件及靶材清洁方法、成膜设备 |
CN109913830B (zh) * | 2019-04-17 | 2021-08-06 | 深圳天成机器有限公司 | 一种多功能真空镀膜机 |
JP7263111B2 (ja) * | 2019-05-13 | 2023-04-24 | 株式会社アルバック | スパッタ成膜装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11193458A (ja) * | 1998-01-05 | 1999-07-21 | Sony Corp | スパッタ装置 |
JP2002129317A (ja) * | 2000-10-24 | 2002-05-09 | Nitto Denko Corp | 反応性スパッタにおける反応性ガス導入装置 |
JP2004027277A (ja) * | 2002-06-25 | 2004-01-29 | Sanyo Shinku Kogyo Kk | スパッタリング装置 |
JP2005290550A (ja) * | 2004-03-11 | 2005-10-20 | Ulvac Japan Ltd | スパッタリング装置 |
JP2005298966A (ja) * | 2004-03-19 | 2005-10-27 | Ulvac Japan Ltd | スパッタリング方法及びその装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005298996A (ja) * | 2004-04-08 | 2005-10-27 | Niwayuu:Kk | 抗菌寝具の製造方法 |
-
2007
- 2007-08-31 JP JP2007226392A patent/JP5291907B2/ja active Active
-
2008
- 2008-08-27 KR KR1020107004987A patent/KR101196650B1/ko active IP Right Grant
- 2008-08-27 WO PCT/JP2008/065298 patent/WO2009028552A1/ja active Application Filing
- 2008-08-27 CN CN2008801048814A patent/CN101790598B/zh active Active
- 2008-08-29 TW TW97133338A patent/TWI433951B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11193458A (ja) * | 1998-01-05 | 1999-07-21 | Sony Corp | スパッタ装置 |
JP2002129317A (ja) * | 2000-10-24 | 2002-05-09 | Nitto Denko Corp | 反応性スパッタにおける反応性ガス導入装置 |
JP2004027277A (ja) * | 2002-06-25 | 2004-01-29 | Sanyo Shinku Kogyo Kk | スパッタリング装置 |
JP2005290550A (ja) * | 2004-03-11 | 2005-10-20 | Ulvac Japan Ltd | スパッタリング装置 |
JP2005298966A (ja) * | 2004-03-19 | 2005-10-27 | Ulvac Japan Ltd | スパッタリング方法及びその装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015139739A1 (en) * | 2014-03-18 | 2015-09-24 | Applied Materials, Inc. | Process gas segmentation for static reactive sputter processes |
JP2017509795A (ja) * | 2014-03-18 | 2017-04-06 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 静的反応性スパッタ処理のための処理ガスセグメンテーション |
Also Published As
Publication number | Publication date |
---|---|
JP5291907B2 (ja) | 2013-09-18 |
TW200925307A (en) | 2009-06-16 |
KR101196650B1 (ko) | 2012-11-02 |
JP2009057608A (ja) | 2009-03-19 |
CN101790598A (zh) | 2010-07-28 |
TWI433951B (zh) | 2014-04-11 |
CN101790598B (zh) | 2011-10-05 |
KR20100049638A (ko) | 2010-05-12 |
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