WO2008108400A1 - 光透過性電磁波シールド材及びその製造方法、並びに貴金属の極薄膜を有する微粒子 - Google Patents

光透過性電磁波シールド材及びその製造方法、並びに貴金属の極薄膜を有する微粒子 Download PDF

Info

Publication number
WO2008108400A1
WO2008108400A1 PCT/JP2008/053940 JP2008053940W WO2008108400A1 WO 2008108400 A1 WO2008108400 A1 WO 2008108400A1 JP 2008053940 W JP2008053940 W JP 2008053940W WO 2008108400 A1 WO2008108400 A1 WO 2008108400A1
Authority
WO
WIPO (PCT)
Prior art keywords
electromagnetic shielding
light
producing
shielding material
transmitting electromagnetic
Prior art date
Application number
PCT/JP2008/053940
Other languages
English (en)
French (fr)
Inventor
Hidefumi Kotsubo
Tatsuya Funaki
Kiyomi Sasaki
Kentaro Hanzawa
Original Assignee
Bridgestone Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bridgestone Corporation filed Critical Bridgestone Corporation
Priority to US12/529,887 priority Critical patent/US20100126767A1/en
Priority to EP08721360A priority patent/EP2120525A4/en
Publication of WO2008108400A1 publication Critical patent/WO2008108400A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
    • H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1664—Process features with additional means during the plating process
    • C23C18/1669—Agitation, e.g. air introduction
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0001—Rooms or chambers
    • H05K9/0005—Shielded windows
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2998—Coated including synthetic resin or polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Chemically Coating (AREA)
  • Building Environments (AREA)
  • Laminated Bodies (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

　光透過性、電磁波シールド性、外観性、及び視認性に優れ、高精度のメッシュパターンを有する光透過性電磁波シールド材を、迅速に製造することができる方法を提供する。 　表面に貴金属の極薄膜を有する微粒子を含む無電解めっき前処理剤を、透明基板上にメッシュ状に印刷することにより、透明基板上にメッシュ状の前処理層を形成する工程、及び前処理層上に、無電解めっき処理によりメッシュ状の金属導電層を形成する工程、を含む光透過性電磁波シールド材の製造方法。
PCT/JP2008/053940 2007-03-05 2008-03-05 光透過性電磁波シールド材及びその製造方法、並びに貴金属の極薄膜を有する微粒子 WO2008108400A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/529,887 US20100126767A1 (en) 2007-03-05 2008-03-05 Process for the preparation of light transmissive electromagnetic wave shielding material, light transmissive electromagnetic wave shielding material and fine particle having extremely-thin noble metal film
EP08721360A EP2120525A4 (en) 2007-03-05 2008-03-05 ELECTROMAGNETIC LIGHT-EMITTING SHIELDING MATERIAL, MANUFACTURING METHOD THEREOF, AND FINE PARTICLES HAVING ULTRAMINIC FILM OF NOBLE METAL

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-054248 2007-03-05
JP2007054248A JP2008218714A (ja) 2007-03-05 2007-03-05 光透過性電磁波シールド材及びその製造方法、並びに貴金属の極薄膜を有する微粒子及びその製造方法

Publications (1)

Publication Number Publication Date
WO2008108400A1 true WO2008108400A1 (ja) 2008-09-12

Family

ID=39738273

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053940 WO2008108400A1 (ja) 2007-03-05 2008-03-05 光透過性電磁波シールド材及びその製造方法、並びに貴金属の極薄膜を有する微粒子

Country Status (6)

Country Link
US (1) US20100126767A1 (ja)
EP (1) EP2120525A4 (ja)
JP (1) JP2008218714A (ja)
KR (1) KR20090118954A (ja)
CN (1) CN101622919A (ja)
WO (1) WO2008108400A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010041675A1 (ja) * 2008-10-08 2010-04-15 株式会社ブリヂストン 光透過性電磁波シールド材及びその製造方法

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5499943B2 (ja) * 2010-06-29 2014-05-21 大日本印刷株式会社 電磁波遮蔽材の電気抵抗低減化処理を利用した製造方法
TWI584709B (zh) * 2011-10-25 2017-05-21 優尼畫素顯示器公司 高解析傳導圖案之光學性質變化
CN102573313A (zh) * 2012-02-13 2012-07-11 苏州晶讯科技股份有限公司 一种利用贱金属催化油墨制作印刷电路的方法
CN104204114B (zh) * 2012-03-29 2016-03-30 Dic株式会社 导电性墨组合物、导电性图案的制造方法以及导电性电路
US9706667B2 (en) 2014-05-19 2017-07-11 Sierra Circuits, Inc. Via in a printed circuit board
US9398703B2 (en) * 2014-05-19 2016-07-19 Sierra Circuits, Inc. Via in a printed circuit board
US10573610B2 (en) 2014-05-19 2020-02-25 Catlam, Llc Method for wafer level packaging
US20160175830A1 (en) * 2014-12-19 2016-06-23 Nippon Sheet Glass Company, Limited Plating catalyst coating agent and laminate obtained using same
WO2016103510A1 (ja) * 2014-12-26 2016-06-30 日本テクノリード株式会社 透明基板上にパターニングされた導電性高分子層を有する積層基板の製造方法及びメタルメッシュ基板の製造方法
CN104735964B (zh) * 2015-02-02 2018-04-27 邓秀梅 微波暗室用吸波材料及其印制法生产方法
US10849233B2 (en) 2017-07-10 2020-11-24 Catlam, Llc Process for forming traces on a catalytic laminate
US10939541B2 (en) * 2017-03-31 2021-03-02 Huawei Technologies Co., Ltd. Shield structure for a low crosstalk single ended clock distribution circuit
US10349520B2 (en) 2017-06-28 2019-07-09 Catlam, Llc Multi-layer circuit board using interposer layer and conductive paste
US10765012B2 (en) 2017-07-10 2020-09-01 Catlam, Llc Process for printed circuit boards using backing foil
US10547116B2 (en) * 2017-08-01 2020-01-28 University Of Cyprus Wireless communication paradigm: realizing programmable wireless environments through software-controlled metasurfaces
US10827624B2 (en) 2018-03-05 2020-11-03 Catlam, Llc Catalytic laminate with conductive traces formed during lamination
KR102654448B1 (ko) * 2018-12-07 2024-04-03 현대자동차 주식회사 자동차용 기호 버튼 및 이의 제조 방법
CN111057863A (zh) * 2019-12-24 2020-04-24 湖北千里材料科技有限公司 一种环境友好型贵金属吸附树脂材料的应用
CN112423574B (zh) * 2020-11-18 2023-03-10 中国科学院宁波材料技术与工程研究所 一种超薄柔性透明电磁屏蔽薄膜及制备方法
US11632884B2 (en) * 2021-05-31 2023-04-18 Nano And Advanced Materials Institute Limited Transparent EMI shielding film and production method for the same

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6318096A (ja) * 1986-07-11 1988-01-25 Nisshin Steel Co Ltd 超微粉末に金属を被覆する方法
JPH0317987B2 (ja) 1986-01-27 1991-03-11 Kansaka Kk
JPH0317988B2 (ja) 1985-10-16 1991-03-11 Inax Corp
JPH11170420A (ja) * 1997-12-17 1999-06-29 Sumitomo Osaka Cement Co Ltd 透明導電膜およびその製造方法
JP3241348B2 (ja) 1999-01-28 2001-12-25 住友ゴム工業株式会社 透光性電磁波シールド部材の製造方法
JP2002170429A (ja) * 2000-11-29 2002-06-14 C Uyemura & Co Ltd 高密度触媒核分散層を有する基体並びに改質酸化亜鉛皮膜を有する導電性物品及びその作製方法
JP3425400B2 (ja) 1999-12-15 2003-07-14 住友ゴム工業株式会社 透光性電磁波シールド部材およびその製造方法
JP3532146B2 (ja) 2000-08-09 2004-05-31 住友ゴム工業株式会社 透光性電磁波シールド部材とその製造方法
JP3544498B2 (ja) 1999-10-01 2004-07-21 住友ゴム工業株式会社 透光性電磁波シールド部材とその製造方法
JP2005150367A (ja) * 2003-11-14 2005-06-09 Bridgestone Corp 電磁波シールド性光透過窓材及びその製造方法
JP2005213576A (ja) * 2004-01-29 2005-08-11 Nikko Materials Co Ltd 無電解めっき前処理剤、それを用いる無電解めっき方法、及び無電解めっき物

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010046021A1 (en) * 1997-08-28 2001-11-29 Takeshi Kozuka A conductive particle to conductively bond conductive members to each other, an anisotropic adhesive containing the conductive particle, a liquid crystal display device using the anisotropic conductive adhesive, a method for manufacturing the liquid crystal display device
US7288494B2 (en) * 2001-07-27 2007-10-30 3M Innovative Properties Company Electro-magnetic wave shield cover
JP2003064500A (ja) * 2001-08-23 2003-03-05 Sekisui Chem Co Ltd 導電性微粒子及び基板構成体
JP2003304090A (ja) * 2002-04-11 2003-10-24 Sumitomo Chem Co Ltd 電磁波遮蔽材料及びその製造方法
ATE444381T1 (de) * 2002-09-10 2009-10-15 Nippon Mining Co Verfahren zur metallabscheidung und vorbehandlungsmittel
EP1558067A4 (en) * 2002-10-28 2008-07-09 Bridgestone Corp LIGHT-EMITTING FILTRATION PROTECTIVE MATERIAL AGAINST ELECTROMAGNETIC WAVES AND METHOD FOR PRODUCING SAME
WO2005048674A1 (ja) * 2003-11-14 2005-05-26 Bridgestone Corporation 電磁波シールド性光透過窓材及びその製造方法
JP4867029B2 (ja) * 2004-07-01 2012-02-01 奥野製薬工業株式会社 ２液性無電解銀めっき液
CN1981347A (zh) * 2004-07-15 2007-06-13 积水化学工业株式会社 导电性微粒、导电性微粒的制造方法、和各向异性导电材料
KR20060008534A (ko) * 2004-07-21 2006-01-27 삼성코닝 주식회사 신규 블랙 매트릭스, 그 제조방법 및 그를 이용한평판표시소자 및 전자파차폐 필터
DE112005001688T5 (de) * 2004-07-27 2007-06-06 Dai Nippon Printing Co., Ltd. Abschirmvorrichtung für elektromagnetische Wellen
TWI356425B (en) * 2005-03-24 2012-01-11 Nippon Catalytic Chem Ind Coated fine particle and their manufacturing metho
JP2006336090A (ja) * 2005-06-03 2006-12-14 Fujifilm Holdings Corp 導電性膜形成用めっき液、導電性膜及びその製造方法並びに透光性電磁波シールド膜及びプラズマディスプレーパネル
US7176387B1 (en) * 2005-12-05 2007-02-13 King Star Enterprise, Inc. Electromagnetic shielding device
US7737370B2 (en) * 2006-07-31 2010-06-15 Hitachi Cable, Ltd. Electromagnetic shielding filter

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0317988B2 (ja) 1985-10-16 1991-03-11 Inax Corp
JPH0317987B2 (ja) 1986-01-27 1991-03-11 Kansaka Kk
JPS6318096A (ja) * 1986-07-11 1988-01-25 Nisshin Steel Co Ltd 超微粉末に金属を被覆する方法
JPH11170420A (ja) * 1997-12-17 1999-06-29 Sumitomo Osaka Cement Co Ltd 透明導電膜およびその製造方法
JP3363083B2 (ja) 1997-12-17 2003-01-07 住友大阪セメント株式会社 透明基体およびその製造方法
JP3241348B2 (ja) 1999-01-28 2001-12-25 住友ゴム工業株式会社 透光性電磁波シールド部材の製造方法
JP3544498B2 (ja) 1999-10-01 2004-07-21 住友ゴム工業株式会社 透光性電磁波シールド部材とその製造方法
JP3425400B2 (ja) 1999-12-15 2003-07-14 住友ゴム工業株式会社 透光性電磁波シールド部材およびその製造方法
JP3532146B2 (ja) 2000-08-09 2004-05-31 住友ゴム工業株式会社 透光性電磁波シールド部材とその製造方法
JP2002170429A (ja) * 2000-11-29 2002-06-14 C Uyemura & Co Ltd 高密度触媒核分散層を有する基体並びに改質酸化亜鉛皮膜を有する導電性物品及びその作製方法
JP2005150367A (ja) * 2003-11-14 2005-06-09 Bridgestone Corp 電磁波シールド性光透過窓材及びその製造方法
JP2005213576A (ja) * 2004-01-29 2005-08-11 Nikko Materials Co Ltd 無電解めっき前処理剤、それを用いる無電解めっき方法、及び無電解めっき物

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2120525A4 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010041675A1 (ja) * 2008-10-08 2010-04-15 株式会社ブリヂストン 光透過性電磁波シールド材及びその製造方法
JP2010093040A (ja) * 2008-10-08 2010-04-22 Bridgestone Corp 光透過性電磁波シールド材及びその製造方法

Also Published As

Publication number Publication date
KR20090118954A (ko) 2009-11-18
EP2120525A4 (en) 2011-05-25
US20100126767A1 (en) 2010-05-27
EP2120525A1 (en) 2009-11-18
CN101622919A (zh) 2010-01-06
JP2008218714A (ja) 2008-09-18

Similar Documents

Publication Publication Date Title
WO2008108400A1 (ja) 光透過性電磁波シールド材及びその製造方法、並びに貴金属の極薄膜を有する微粒子
EP2056997A4 (en) VEHICLE STRUCTURE WITH THREE-DIMENSIONAL FILM AND METHOD THEREFOR
EP1434248A3 (en) Method for producing light-transmitting electromagnetic wave-shielding film, light-transmitting eletromagnetic wave-shielding film and plasma display panel using the shielding film
KR101600871B1 (ko) 장식 부착 터치 센서와 그 제조 방법, 및 거기에 사용되는 터치 센서
CN104376899B (zh) 电子装置、触控屏、透明导电膜及透明导电膜的制备方法
WO2006135735A3 (en) Enhanced transparent conductive coatings and methods for making them
WO2009063882A1 (ja) 透明導電性部材の製造方法
JP2008210528A (ja) 照光スイッチ付き筺体とその製造方法
WO2003099709A3 (en) Method for patterning carbon nanotube coating and carbon nanotube wiring
JP2010118552A (ja) 周波数選択型の電磁波シールド材の製造方法、及びそれを用いた電磁波吸収体
WO2003045125A1 (fr) Materiau de fenetre transmettant la lumiere et protege contre les ondes electromagnetiques et procede de fabrication de ce materiau
CN105120019A (zh) 壳体及其制备方法
WO2009045990A9 (en) Nano inks for imparting emi shielding to windows
WO2009066584A1 (ja) 画像形成方法、光透過性電磁波シールド材の製造方法、並びに光透過性電磁波シールド材
TWI532246B (zh) 以噴塗及雷射雕刻製造具電路之機殼的方法
WO2021208738A1 (en) Method for photolithography to manufacture two-sided touch sensor
CN107195246B (zh) 一种玻璃盖板、制作方法以及电子设备
CN104608436B (zh) 具有金属光泽的透光板体及其制造方法
TW201417982A (zh) 電子裝置之殼體的組裝方法及電子裝置之殼體的組合
TW200606036A (en) Thin metal sheet having a pattern and manufacturing method therefor
US20070128412A1 (en) Structure of an electromagnetic shield layer for a plasma display panel and method for manufacturing the same
US11209923B2 (en) Protective film for metal mesh touch sensor
JP4964073B2 (ja) 加飾シートとその製造方法、加飾成形品
KR200477596Y1 (ko) 정전용량식 터치스크린
WO2008084619A1 (ja) めっき物及びその製造方法

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880007033.1

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08721360

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2008721360

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 12529887

Country of ref document: US

WWE Wipo information: entry into national phase

Ref document number: 1020097018492

Country of ref document: KR

NENP Non-entry into the national phase

Ref country code: DE