WO2008084619A1 - めっき物及びその製造方法 - Google Patents

めっき物及びその製造方法 Download PDF

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Publication number
WO2008084619A1
WO2008084619A1 PCT/JP2007/073857 JP2007073857W WO2008084619A1 WO 2008084619 A1 WO2008084619 A1 WO 2008084619A1 JP 2007073857 W JP2007073857 W JP 2007073857W WO 2008084619 A1 WO2008084619 A1 WO 2008084619A1
Authority
WO
WIPO (PCT)
Prior art keywords
plated article
producing
coating layer
same
binder
Prior art date
Application number
PCT/JP2007/073857
Other languages
English (en)
French (fr)
Inventor
Hiroki Ashizawa
Takashi Suzuki
Original Assignee
Achilles Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007182194A external-priority patent/JP5181231B2/ja
Application filed by Achilles Corporation filed Critical Achilles Corporation
Priority to CN2007800497474A priority Critical patent/CN101578392B/zh
Priority to KR1020097013771A priority patent/KR101419968B1/ko
Publication of WO2008084619A1 publication Critical patent/WO2008084619A1/ja
Priority to HK09112169.1A priority patent/HK1135151A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)

Abstract

【課題】めっき物及びその製造方法を提供する。 【解決手段】基材の表面上に導電性高分子微粒子とバインダーを含む塗膜層が形成され、該塗膜層上に金属めっき膜が無電解めっき法により形成されためっき物であって、 前記バインダーは、前記導電性高分子微粒子１質量部に対して０．１ないし１０質量部で存在し、前記塗膜層の厚さは２０ないし５００ｎｍである、 めっき物。
PCT/JP2007/073857 2007-01-12 2007-12-11 めっき物及びその製造方法 WO2008084619A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2007800497474A CN101578392B (zh) 2007-01-12 2007-12-11 镀覆制品及其制造方法
KR1020097013771A KR101419968B1 (ko) 2007-01-12 2007-12-11 도금물 및 이의 제조방법
HK09112169.1A HK1135151A1 (en) 2007-01-12 2009-12-24 Plated article and method for producing the same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-004753 2007-01-12
JP2007004753 2007-01-12
JP2007-182194 2007-07-11
JP2007182194A JP5181231B2 (ja) 2007-01-12 2007-07-11 めっき物及びその製造方法

Publications (1)

Publication Number Publication Date
WO2008084619A1 true WO2008084619A1 (ja) 2008-07-17

Family

ID=39608518

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/073857 WO2008084619A1 (ja) 2007-01-12 2007-12-11 めっき物及びその製造方法

Country Status (2)

Country Link
KR (1) KR101419968B1 (ja)
WO (1) WO2008084619A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010031318A (ja) * 2008-07-28 2010-02-12 Achilles Corp めっき物
JP2010209424A (ja) * 2009-03-11 2010-09-24 Achilles Corp めっき下地層を形成する下地塗料、それを用いる筐体の製造方法及びそれにより製造される筐体
JP2015224380A (ja) * 2014-05-29 2015-12-14 アキレス株式会社 パターン化されためっき物の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0681190A (ja) * 1992-09-02 1994-03-22 Bridgestone Corp 絶縁体のめっき方法
JPH09116256A (ja) * 1995-10-20 1997-05-02 Nec Corp 印刷配線板及びその製造方法
JP2004131806A (ja) * 2002-10-10 2004-04-30 Japan Science & Technology Agency 導電性高分子上への金属粒子の光析出方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63303077A (ja) * 1987-05-31 1988-12-09 Res Inst For Prod Dev 導電性高分子のメッキ法
JP3208735B2 (ja) * 1995-11-29 2001-09-17 ツィッパーリング ケスラー ウント コー （ゲーエムベーハー ウント コー） 金属化物質の製造方法
JP4101705B2 (ja) 2003-06-18 2008-06-18 三菱伸銅株式会社 金属層形成方法
JP4549928B2 (ja) 2005-05-25 2010-09-22 テック大洋工業株式会社 高密着高耐蝕性鉄鋼材の製造方法および塗膜の密着性向上方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0681190A (ja) * 1992-09-02 1994-03-22 Bridgestone Corp 絶縁体のめっき方法
JPH09116256A (ja) * 1995-10-20 1997-05-02 Nec Corp 印刷配線板及びその製造方法
JP2004131806A (ja) * 2002-10-10 2004-04-30 Japan Science & Technology Agency 導電性高分子上への金属粒子の光析出方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010031318A (ja) * 2008-07-28 2010-02-12 Achilles Corp めっき物
JP2010209424A (ja) * 2009-03-11 2010-09-24 Achilles Corp めっき下地層を形成する下地塗料、それを用いる筐体の製造方法及びそれにより製造される筐体
JP2015224380A (ja) * 2014-05-29 2015-12-14 アキレス株式会社 パターン化されためっき物の製造方法

Also Published As

Publication number Publication date
KR20090104012A (ko) 2009-10-05
KR101419968B1 (ko) 2014-07-16

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