JP2008522038A5 - - Google Patents
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- Publication number
- JP2008522038A5 JP2008522038A5 JP2007544342A JP2007544342A JP2008522038A5 JP 2008522038 A5 JP2008522038 A5 JP 2008522038A5 JP 2007544342 A JP2007544342 A JP 2007544342A JP 2007544342 A JP2007544342 A JP 2007544342A JP 2008522038 A5 JP2008522038 A5 JP 2008522038A5
- Authority
- JP
- Japan
- Prior art keywords
- disposed
- metal
- substrate
- continuous uniform
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims 10
- 239000000758 substrate Substances 0.000 claims 6
- 239000002094 self assembled monolayer Substances 0.000 claims 3
- 238000000151 deposition Methods 0.000 claims 1
- 238000007772 electroless plating Methods 0.000 claims 1
Claims (2)
- 金属微細構造化表面を有する基材を提供する工程と、
自己組織化モノレイヤーを該金属微細構造化表面上に形成する工程と、
該自己組織化モノレイヤーを、可溶型の堆積金属を含む無電解めっき液に暴露させる工程と、
該堆積金属を選択的に該金属微細構造化表面上に無電解堆積させる工程と、
を含む方法。 - 基材表面と、該基材表面上に配置されたトポグラフィカル形体とを有する基材と、
該トポグラフィカル形体に隣接した該基材表面上におよび該トポグラフィカル形体上に配置された連続均一金属層と、
該連続均一金属層上に配置された自己組織化モノレイヤーと、
該トポグラフィカル形体上の該連続均一金属層上に配置され、そして該トポグラフィカル形体に隣接した該連続均一金属層基材表面上には配置されない堆積金属と、
を含む物品。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/003,233 US7160583B2 (en) | 2004-12-03 | 2004-12-03 | Microfabrication using patterned topography and self-assembled monolayers |
| PCT/US2005/036575 WO2006062575A2 (en) | 2004-12-03 | 2005-10-11 | Microfabrication using patterned topography and self-assembled monolayers |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008522038A JP2008522038A (ja) | 2008-06-26 |
| JP2008522038A5 true JP2008522038A5 (ja) | 2008-11-20 |
| JP4662994B2 JP4662994B2 (ja) | 2011-03-30 |
Family
ID=36574630
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007544342A Expired - Fee Related JP4662994B2 (ja) | 2004-12-03 | 2005-10-11 | パターン化トポグラフィおよび自己組織化モノレイヤーを用いる微細加工 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US7160583B2 (ja) |
| EP (1) | EP1825021B1 (ja) |
| JP (1) | JP4662994B2 (ja) |
| KR (1) | KR101298808B1 (ja) |
| CN (1) | CN101094936B (ja) |
| AT (1) | ATE397680T1 (ja) |
| DE (1) | DE602005007379D1 (ja) |
| WO (1) | WO2006062575A2 (ja) |
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| BRPI1010855A2 (pt) * | 2009-06-12 | 2016-04-05 | Lord Corp | método para proteção de um substrato contra interferência eletromagnética |
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| WO2014105637A1 (en) * | 2012-12-31 | 2014-07-03 | 3M Innovative Properties Company | Re-inking roller for microcontact printing in a roll-to-roll process |
| CN103176650B (zh) * | 2013-03-01 | 2016-09-28 | 南昌欧菲光科技有限公司 | 导电玻璃基板及其制作方法 |
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| TWI739285B (zh) | 2014-02-04 | 2021-09-11 | 荷蘭商Ａｓｍ Ｉｐ控股公司 | 金屬、金屬氧化物與介電質的選擇性沉積 |
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| US10428421B2 (en) | 2015-08-03 | 2019-10-01 | Asm Ip Holding B.V. | Selective deposition on metal or metallic surfaces relative to dielectric surfaces |
| US10121699B2 (en) | 2015-08-05 | 2018-11-06 | Asm Ip Holding B.V. | Selective deposition of aluminum and nitrogen containing material |
| US10566185B2 (en) | 2015-08-05 | 2020-02-18 | Asm Ip Holding B.V. | Selective deposition of aluminum and nitrogen containing material |
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| US11501965B2 (en) | 2017-05-05 | 2022-11-15 | Asm Ip Holding B.V. | Plasma enhanced deposition processes for controlled formation of metal oxide thin films |
| WO2018213018A1 (en) | 2017-05-16 | 2018-11-22 | Asm Ip Holding B.V. | Selective peald of oxide on dielectric |
| US10900120B2 (en) | 2017-07-14 | 2021-01-26 | Asm Ip Holding B.V. | Passivation against vapor deposition |
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| US11139163B2 (en) | 2019-10-31 | 2021-10-05 | Asm Ip Holding B.V. | Selective deposition of SiOC thin films |
| TW202204658A (zh) | 2020-03-30 | 2022-02-01 | 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 | 在兩不同表面上同時選擇性沉積兩不同材料 |
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-
2004
- 2004-12-03 US US11/003,233 patent/US7160583B2/en not_active Expired - Fee Related
-
2005
- 2005-10-11 KR KR1020077012384A patent/KR101298808B1/ko not_active IP Right Cessation
- 2005-10-11 CN CN2005800416088A patent/CN101094936B/zh not_active Expired - Fee Related
- 2005-10-11 EP EP20050810475 patent/EP1825021B1/en not_active Not-in-force
- 2005-10-11 DE DE200560007379 patent/DE602005007379D1/de active Active
- 2005-10-11 AT AT05810475T patent/ATE397680T1/de not_active IP Right Cessation
- 2005-10-11 JP JP2007544342A patent/JP4662994B2/ja not_active Expired - Fee Related
- 2005-10-11 WO PCT/US2005/036575 patent/WO2006062575A2/en active Application Filing
-
2006
- 2006-11-29 US US11/564,582 patent/US7682703B2/en not_active Expired - Fee Related
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