WO2008084627A1 - 導電性接触子ユニット - Google Patents

導電性接触子ユニット Download PDF

Info

Publication number
WO2008084627A1
WO2008084627A1 PCT/JP2007/074148 JP2007074148W WO2008084627A1 WO 2008084627 A1 WO2008084627 A1 WO 2008084627A1 JP 2007074148 W JP2007074148 W JP 2007074148W WO 2008084627 A1 WO2008084627 A1 WO 2008084627A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
contact unit
members
conductive contacts
conductive contact
Prior art date
Application number
PCT/JP2007/074148
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Toshio Kazama
Kohei Hironaka
Shigeki Ishikawa
Original Assignee
Nhk Spring Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co., Ltd. filed Critical Nhk Spring Co., Ltd.
Priority to JP2008553036A priority Critical patent/JP5154450B2/ja
Priority to TW096148579A priority patent/TW200837356A/zh
Publication of WO2008084627A1 publication Critical patent/WO2008084627A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Measuring Leads Or Probes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
PCT/JP2007/074148 2006-12-19 2007-12-14 導電性接触子ユニット WO2008084627A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008553036A JP5154450B2 (ja) 2006-12-19 2007-12-14 導電性接触子ユニット
TW096148579A TW200837356A (en) 2006-12-19 2007-12-19 Conductive contacting unit

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006341854 2006-12-19
JP2006-341854 2006-12-19
JP2007044746 2007-02-23
JP2007-044746 2007-02-23

Publications (1)

Publication Number Publication Date
WO2008084627A1 true WO2008084627A1 (ja) 2008-07-17

Family

ID=39608526

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/074148 WO2008084627A1 (ja) 2006-12-19 2007-12-14 導電性接触子ユニット

Country Status (5)

Country Link
JP (1) JP5154450B2 (zh)
KR (1) KR20090094843A (zh)
CN (1) CN101563617A (zh)
TW (1) TW200837356A (zh)
WO (1) WO2008084627A1 (zh)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010016608A1 (ja) * 2008-08-08 2010-02-11 日本発條株式会社 電気接点部材およびコンタクトプローブ
JP2010048771A (ja) * 2008-08-25 2010-03-04 Onishi Denshi Kk プリント配線板の検査治具
JP2010204082A (ja) * 2009-02-04 2010-09-16 Kasasaku Electronics:Kk プローブピン用ソケット及びプローブユニット
JP2011158329A (ja) * 2010-01-29 2011-08-18 Citizen Tohoku Kk コンタクトプローブ及びこれを用いた電子回路試験装置
JP2013546141A (ja) * 2010-12-02 2013-12-26 インターコネクト・デバイシーズ・インコーポレイテッド 埋め込まれたシェル層を有する電気コネクタ
WO2015170601A1 (ja) * 2014-05-09 2015-11-12 株式会社ヨコオ ソケット
WO2019082259A1 (ja) * 2017-10-24 2019-05-02 井上商事株式会社 検査治具

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011162362A1 (ja) 2010-06-25 2011-12-29 日本発條株式会社 コンタクトプローブおよびプローブユニット
JP2012190558A (ja) * 2011-03-08 2012-10-04 Fujitsu Ltd 表面実装型コネクタ及び基板ユニット
JP5901570B2 (ja) * 2013-05-08 2016-04-13 本田技研工業株式会社 電流印加方法および電流印加装置
JP2017142080A (ja) * 2016-02-08 2017-08-17 日本電産リード株式会社 接触端子、検査治具、及び検査装置
CN110260724A (zh) * 2019-07-23 2019-09-20 融硅思创(北京)科技有限公司 带有注册模块的起爆器

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62225961A (ja) * 1986-03-26 1987-10-03 Sanko Giken Kogyo Kk コンタクトプロ−ブ植設方法
JPH10239349A (ja) * 1996-12-27 1998-09-11 Nhk Spring Co Ltd 導電性接触子
JP2000329790A (ja) * 1999-03-12 2000-11-30 Nhk Spring Co Ltd 導電性接触子
JP2002048817A (ja) * 2000-08-04 2002-02-15 Inoue Shoji Kk プリント配線板の導通検査治具
JP2002048816A (ja) * 2000-08-04 2002-02-15 Inoue Shoji Kk プリント配線板の導通検査治具
JP2002062312A (ja) * 2000-08-22 2002-02-28 Toyo Denshi Giken Kk コンタクト装置
JP2003307542A (ja) * 2002-02-18 2003-10-31 Tokyo Cosmos Electric Co Ltd Ｉｃソケット
JP2005019384A (ja) * 2003-05-30 2005-01-20 Fujitsu Ltd 電子部品用コンタクタ及びこれを用いた試験方法
JP2005292060A (ja) * 2004-04-02 2005-10-20 Totsuka Densi Kk プリント配線基板の検査治具
JP2007322136A (ja) * 2006-05-30 2007-12-13 Inoue Shoji Kk プリント配線板の導通検査治具

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62225961A (ja) * 1986-03-26 1987-10-03 Sanko Giken Kogyo Kk コンタクトプロ−ブ植設方法
JPH10239349A (ja) * 1996-12-27 1998-09-11 Nhk Spring Co Ltd 導電性接触子
JP2000329790A (ja) * 1999-03-12 2000-11-30 Nhk Spring Co Ltd 導電性接触子
JP2002048817A (ja) * 2000-08-04 2002-02-15 Inoue Shoji Kk プリント配線板の導通検査治具
JP2002048816A (ja) * 2000-08-04 2002-02-15 Inoue Shoji Kk プリント配線板の導通検査治具
JP2002062312A (ja) * 2000-08-22 2002-02-28 Toyo Denshi Giken Kk コンタクト装置
JP2003307542A (ja) * 2002-02-18 2003-10-31 Tokyo Cosmos Electric Co Ltd Ｉｃソケット
JP2005019384A (ja) * 2003-05-30 2005-01-20 Fujitsu Ltd 電子部品用コンタクタ及びこれを用いた試験方法
JP2005292060A (ja) * 2004-04-02 2005-10-20 Totsuka Densi Kk プリント配線基板の検査治具
JP2007322136A (ja) * 2006-05-30 2007-12-13 Inoue Shoji Kk プリント配線板の導通検査治具

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010016608A1 (ja) * 2008-08-08 2010-02-11 日本発條株式会社 電気接点部材およびコンタクトプローブ
CN102112885A (zh) * 2008-08-08 2011-06-29 日本发条株式会社 电接点部件及接触式探头
JPWO2010016608A1 (ja) * 2008-08-08 2012-01-26 日本発條株式会社 ワーク部材、電気接点部材、コンタクトプローブおよび電気接点部材の製造方法
JP2010048771A (ja) * 2008-08-25 2010-03-04 Onishi Denshi Kk プリント配線板の検査治具
JP2010204082A (ja) * 2009-02-04 2010-09-16 Kasasaku Electronics:Kk プローブピン用ソケット及びプローブユニット
JP2011158329A (ja) * 2010-01-29 2011-08-18 Citizen Tohoku Kk コンタクトプローブ及びこれを用いた電子回路試験装置
JP2013546141A (ja) * 2010-12-02 2013-12-26 インターコネクト・デバイシーズ・インコーポレイテッド 埋め込まれたシェル層を有する電気コネクタ
WO2015170601A1 (ja) * 2014-05-09 2015-11-12 株式会社ヨコオ ソケット
JP2015215223A (ja) * 2014-05-09 2015-12-03 株式会社ヨコオ ソケット
WO2019082259A1 (ja) * 2017-10-24 2019-05-02 井上商事株式会社 検査治具

Also Published As

Publication number Publication date
TWI378240B (zh) 2012-12-01
CN101563617A (zh) 2009-10-21
KR20090094843A (ko) 2009-09-08
JPWO2008084627A1 (ja) 2010-04-30
TW200837356A (en) 2008-09-16
JP5154450B2 (ja) 2013-02-27

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