WO2008038493A1 - Boundary acoustic wave device - Google Patents
Boundary acoustic wave device Download PDFInfo
- Publication number
- WO2008038493A1 WO2008038493A1 PCT/JP2007/067032 JP2007067032W WO2008038493A1 WO 2008038493 A1 WO2008038493 A1 WO 2008038493A1 JP 2007067032 W JP2007067032 W JP 2007067032W WO 2008038493 A1 WO2008038493 A1 WO 2008038493A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- idt
- acoustic wave
- boundary acoustic
- film thickness
- boundary
- Prior art date
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims description 40
- 239000002184 metal Substances 0.000 claims description 40
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical group [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 claims description 27
- 229910045601 alloy Inorganic materials 0.000 claims description 12
- 239000000956 alloy Substances 0.000 claims description 12
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 230000001568 sexual effect Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 abstract description 10
- 230000037431 insertion Effects 0.000 abstract description 10
- 230000001902 propagating effect Effects 0.000 abstract description 8
- 229910003327 LiNbO3 Inorganic materials 0.000 abstract 1
- 229910001120 nichrome Inorganic materials 0.000 description 13
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 12
- 238000010586 diagram Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 6
- 229910052719 titanium Inorganic materials 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 239000003989 dielectric material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000010897 surface acoustic wave method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/0222—Details of interface-acoustic, boundary, pseudo-acoustic or Stonely wave devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14538—Formation
- H03H9/14541—Multilayer finger or busbar electrode
Definitions
- the present invention relates to a boundary acoustic wave device using boundary acoustic waves propagating along a boundary between first and second media having different sound velocities, and more specifically, a piezoelectric body having a LiNbO force, and a key oxide.
- the present invention relates to a boundary acoustic wave device having a structure in which a powerful dielectric is laminated.
- boundary acoustic wave filter device uses boundary acoustic waves that propagate along the boundary between the piezoelectric body and the dielectric body. Therefore, since a package having a cavity is not required !, the boundary acoustic wave filter device can be miniaturized.
- Patent Document 1 discloses an example of this type of boundary acoustic wave device!
- an electrode including IDT is formed at the boundary between a piezoelectric body and a dielectric body, and an SH type boundary acoustic wave propagating through the boundary is used.
- the thickness of the IDT is determined so that the sound velocity of the SH type boundary acoustic wave is lower than the delay velocity propagating through the dielectric, the sound velocity of the transverse wave, and the delay velocity propagating through the piezoelectric material, and the velocity of the transverse wave.
- the propagation loss is determined so that the sound velocity of the SH type boundary acoustic wave is lower than the delay velocity propagating through the dielectric, the sound velocity of the transverse wave, and the delay velocity propagating through the piezoelectric material, and the velocity of the transverse wave.
- the electrode film thickness range for the force ⁇ and the cut angle range for LiNbO that reduces unnecessary spurious are shown.
- Patent Document 1 WO2004 / 070946
- the frequency characteristics change due to temperature changes may be required to be very small, that is, the absolute value of TCF may be smaller depending on the application.
- the boundary acoustic wave device described in Patent Document 1 LiNbO is used as a piezoelectric body,
- the frequency temperature coefficient TCF of SiO is a positive value. Therefore, LiNbO and Si When O is used, the absolute value of the frequency temperature coefficient TCF can be reduced.
- the electrode film thickness at which the propagation loss of the SH-type boundary acoustic wave becomes zero differs depending on the duty ratio of the IDT.
- the duty ratio is reduced, the propagation loss does not become 0 in the film thickness range of the IDT described in Patent Document 1, and may be relatively large. In such a case, even if the TCF can be reduced, the loss must be increased.
- An object of the present invention is to eliminate the above-mentioned drawbacks of the prior art, and when the duty ratio is small, the frequency temperature coefficient TCF and the insertion loss are small, and when the duty ratio is large, the yield is reduced. It is an object of the present invention to provide a boundary acoustic wave device that is difficult to generate and has low loss.
- the pressure which also has the LiNbO force with the main surface as the surface rotated by 15 ° ⁇ 10 ° on the Y axis.
- the boundary acoustic wave filter device using the boundary acoustic wave, the density of the IDT is p (kg / m 3 ), the film thickness is H m), the wavelength determined by the period of the electrode finger of the IDT is m), the duty is A boundary acoustic wave device is characterized in that when the ratio of X is X, the product of H / ⁇ and p and X is within the range satisfying the following equation (1).
- the upper limit of the IDT film thickness is not particularly limited in achieving the object of the present invention, but is preferably 0.35 ⁇ or less due to manufacturing restrictions. .
- the silicon oxide constituting the dielectric is preferably SiO, in which case it is preferred.
- the acoustic velocity of the elastic boundary wave is less than 93% of 3757 m / s, which is the velocity of the transverse wave of SiO.
- the insertion loss can be further reduced.
- IDT can be formed of various metals or alloys.
- the IDT is made of Au or an alloy containing Au as a main component, and when the film thickness of Au or an alloy containing Au as a main component is H, the film thickness H is expressed by the following formula ( 2)
- the TCF absolute value and insertion loss can be reduced, and when a large duty ratio is selected, the yield is good and the loss can be reduced.
- a small duty ratio refers to a duty ratio smaller than 0.5
- a large duty ratio refers to a duty ratio larger than 0.5.
- the IDT duty is normally set to 0.5, and with 0.5 as a reference, a duty ratio smaller than 0.5 is set to a small duty ratio, and a duty ratio exceeding 0.5 is set to a large duty ratio.
- the IDT is made of Cu or an alloy containing Cu as a main component, and the film thickness of the alloy containing Cu or Cu as a main component is H. Thickness H is below
- the Cu Cu range is satisfied.
- T the TCF absolute value and insertion loss can be reduced. If a large duty ratio is selected, the yield can be improved and the insertion loss can be reduced.
- H is the IDT film thickness m
- ⁇ is the wavelength m) determined by the period of the IDT electrode fingers. Therefore, H / ⁇ is the normalized film thickness of IDT, and H / ⁇ and ⁇ / ⁇ are
- the IDT includes a laminated metal film in which a plurality of metal layers are laminated, and an average density corresponding to a film thickness ratio of each of the laminated metal layers is the p (kg / kg). m 3 ), and the total film thickness of the laminated metal film is H, the product of H and p satisfies the above formula (1). It is configured to add.
- the metal layer that constitutes the multilayer metal film that may form the IDT from the multilayer metal film, the adhesion between the piezoelectric body and the dielectric can be improved, and the power resistance can be improved. Can be increased.
- the IDT has a Au-based metal layer made of Au or an alloy containing Au as a main component, and a laminated film made of a frequency adjusting film / Ti / Pt / Au-based metal layer / Pt / Ti.
- Metal film power The diffusion of Au and Ti is suppressed, and the adhesion of the piezoelectric material to the dielectric is enhanced by the Ti film. Therefore, the reliability of the boundary acoustic wave filter device can be improved.
- the Pt film thickness ranges from 3 to; In that case, the diffusion of Au from the Au-based metal layer can be reliably suppressed, the electrode finger resistance can be reduced, and the insertion loss can be further reduced by J / S.
- the IDT duty ratio is preferably in the range of 0.3 to 0.7, more preferably in the range of 0.3 to 0.4. If the IDT duty ratio is in the range of 0.3 to 0.7, the IDT can be easily formed. If the IDT duty ratio is in the range of 0.3 to 0.4, the IDT can be easily formed. And TCF and loss can be reduced.
- an IDT is formed at the boundary between a piezoelectric material having a LiNbO force whose principal surface is a surface rotated about the Y axis by 15 ° ⁇ 10 ° and a dielectric material made of oxide silicon. Including electrode structure
- the product of the standardized film thickness ⁇ / ⁇ and density ⁇ and the duty ratio X are within the range satisfying the above-mentioned formula (1). Can be achieved.
- an optimal value for the duty ratio may be selected according to the intended use.
- the film thickness of the IDT depends on the duty ratio. Since the IDT film thickness is determined in consideration of the duty ratio X, when the above equation (1) is satisfied, if the duty ratio is relatively small, the frequency temperature coefficient TCF and Both the input loss and the loss can be reduced, and it is possible to improve the frequency temperature characteristics and reduce the loss. In addition, when a relatively large duty ratio is selected, it is possible to provide a boundary acoustic wave device with good yield and low loss.
- FIG. 1 (a) and (b) are a schematic front sectional view and a schematic plan view showing an electrode structure of a boundary acoustic wave filter device according to an embodiment of the present invention.
- FIG. 2 is a diagram showing the relationship between the thickness of the Au film and the acoustic velocity of the boundary acoustic wave when the duty repulsion is 0.30, 0.40, 0.50, and 0.60.
- FIG. 3 is a diagram showing the relationship between IDT duty ratio and IDT normalized film thickness H / e in which boundary acoustic waves are confined.
- Figure 4 shows the relationship between the standardized film thickness H / ⁇ of IDT, which is a NiCr / Ti / Pt / Au / Pt / Ti laminated metal film containing Au layers of various thicknesses, and the frequency temperature coefficient TCF. It is a figure which shows
- FIG. 5 is a diagram showing the relationship between the film thickness of Au constituting the IDT and the sheet resistance.
- FIG. 6 is a diagram showing the relationship between the product of the normalized film thickness ⁇ / ⁇ and the density p and the duty ratio when the boundary acoustic wave is confined.
- FIG. 7 is a diagram showing the relationship between the duty ratio and the normalized film thickness H / e of IDT made of Cu when boundary acoustic waves are confined.
- Figure 8 shows the duty ratio and frequency temperature coefficient TCF of IDT, which consists of a NiCr / Ti / Pt / Au / Pt / Ti laminated metal film and has a normalized film thickness ⁇ / ⁇ of 6.6%.
- FIG. 9 is a diagram showing the relationship between the duty ratio and the sound velocity of the boundary acoustic wave.
- FIG. 10 is a partially enlarged cross-sectional view schematically showing an electrode structure when the IDT used in the boundary acoustic wave filter device of the present invention has a laminated metal film force.
- FIG. 1 (a) is a front sectional view schematically showing a boundary acoustic wave filter device according to an embodiment of the present invention
- FIG. 1 (b) is a schematic plan view showing an electrode structure including an IDT. is there.
- the boundary acoustic wave filter device 1 includes a piezoelectric body 2 and a dielectric body 3.
- the piezoelectric body 2 also has a LiNbO force whose principal surface is the surface rotated by 15 ° ⁇ 10 ° about the Y axis.
- Dielectric 3 is a silicon oxide.
- SiO is used as the silicon oxide.
- dielectric is used as the silicon oxide.
- the body 3 may be made of a silicon oxide other than SiO. Boundary between piezoelectric 2 and dielectric 3
- the electrode structure 4 shown in FIG. 1 (b) is formed. That is, a plurality of IDTs 5, 5, 5 and reflectors 6, 6 arranged on both sides of the boundary acoustic wave propagation direction of IDTs 5, 5, 5 are formed. Accordingly, a longitudinally coupled resonator type boundary acoustic wave filter device is configured.
- the piezoelectric body 2 made of LiNbO, and SiO?
- An electrode structure 4 including IDT5 is formed using a metal having a high density at the boundary with the dielectric 3 made of 3 2.
- the acoustic velocity of the SH boundary wave propagating through the boundary is set to be equal to or lower than the acoustic velocity of the transverse wave of the piezoelectric material 2 and the transverse wave of the dielectric material 3, so that the SH type elastic boundary wave is confined to the boundary. .
- the film thickness of IDT5 When the film thickness of IDT5 is thin, the acoustic velocity of the boundary acoustic wave is not sufficiently low. The waves are harder to stay. Therefore, loss increases. Therefore, in order to confine the boundary acoustic wave, the film thickness of IDT5 must be a certain value or more, that is, there is a lower limit to the film thickness of IDT5. This lower limit film thickness is referred to as a cut-off film thickness. The cutoff film thickness can be determined by the sound velocity of the boundary acoustic wave.
- Figure 2 shows the SiO / Au / LiNbO structure
- FIG. 11 is a diagram showing the relationship between the sound velocity of an SH-type boundary acoustic wave and the normalized film thickness H / ⁇ of IDT made of Au in the boundary acoustic wave filter device of 23.
- the layer structure is a structure in which an IDT made of Au is formed at the boundary between SiO and LiNbO.
- the sound velocity of the SH boundary acoustic wave shown in Fig. 2 is the sound velocity at the lower end of the stop band, obtained by the finite element method. This speed of sound corresponds to the end of the passband of the boundary acoustic wave filter device 1 on the low frequency side.
- the IDT duty ratio is 0.30, 0.40, 0.50, and 0.60
- the sound velocity decreases as the Au film thickness decreases. It rises, and it turns out that the boundary acoustic wave closes and it becomes difficult to crawl. From Fig. 2, it is possible to obtain the Au film thickness value at which the acoustic velocity of the boundary acoustic wave is 3210 m / sec at each duty ratio.
- the film thickness of IDT which is also a force
- the sound velocity of the boundary acoustic wave becomes slower than 3210 m / s, and the boundary acoustic wave can be confined in the boundary. Therefore, by making the film thickness larger than the film thickness indicated by the broken line in FIG.
- FIG. 4 shows a boundary acoustic wave filter device 1 when the thickness of an IDT made of a NiCr / Ti / Pt / Au / Pt / Ti laminated metal film including an Au layer having various thicknesses is varied 1
- FIG. 3 is a diagram showing the relationship between the normalized film thickness H / ⁇ of IDT and the frequency temperature coefficient TCF (ppm / ° C). The thickness of each NiCr, Ti, Pt, Pt, Ti layer other than the Au layer is fixed at lOnm.
- the TCF increases as the Au layer thickness increases. Become worse. Shi However, the TCF becomes the worst value when the Au layer thickness is about 7.0% .If the thickness of the 1S Au layer increases further, the TCF becomes smaller and better. Understand
- FIG. 5 is a diagram showing a change in sheet resistance value when the IDT is formed only of Au and the film thickness (nm) of Au is changed.
- the electrode sheet resistance decreases and the IDT electrode finger resistance decreases.
- the insertion loss can be reduced. Therefore, as the IDT film thickness increases, the insertion loss and TCF are improved. Therefore, in order to obtain good characteristics, the upper limit of the IDT film thickness is not particularly limited! / .
- the film thickness of DT is preferably 0.35 ⁇ or less due to process limitations.
- the lower limit of the IDT film thickness is determined by the cut-off film thickness, and it can be seen that there is no particular upper limit for improving the characteristics.
- the cut-off film thickness depends on the duty ratio, and the smaller the duty ratio, the smaller the mass load at the same film thickness.
- IDT film thickness at which cut-off occurs is almost determined by the density of the electrode material, and the density and the cut-off film thickness are in an inversely proportional relationship. Therefore, it is necessary to make the product of IDT density and film thickness equal to or greater than a certain value.
- the product of the IDT film thickness ⁇ / ⁇ and the IDT density satisfies the following formula (1).
- the film thickness may be greater than or equal to the film thickness on the broken line shown in FIG.
- the film thickness H / ⁇ may be in a range satisfying the following formula (3).
- the film thickness may be greater than or equal to the film thickness on the broken line shown in FIG.
- Fig. 8 shows changes in the frequency temperature coefficient TCF when the duty ratio of IDT is changed.
- IDT has a NiCr / Ti / Pt / Au / Pt / Ti laminated structure, The results are shown when the normalized film thickness H / ⁇ is 6.6%.
- the duty ratio is less than 0.5, the absolute value of TCF becomes small and good frequency temperature characteristics can be obtained.
- FIG. 9 is a diagram showing the relationship between the duty ratio when the IDT is made of Au and the sound velocity of the boundary acoustic wave.
- the duty ratio is larger than 0.5, that is, the duty ratio is large
- the dependence of the acoustic velocity of the boundary acoustic wave is small, that is, the dependence of the frequency characteristic on the electrode finger line width. It turns out that the nature becomes small. Therefore, it can be understood that the yield, which is difficult to cause the characteristic variation due to the variation of the width of the electrode finger during the manufacturing, can be improved. Therefore, as is apparent from FIGS.
- the above-described case is used in each of the cases where the duty ratio is smaller than 0.5 and larger than 0.5. It can be seen that the duty ratio should be selected according to the intended application. That is, by making the duty ratio smaller than 0.5, both TCF and loss can be reduced. On the other hand, when the duty ratio is made larger than 0.5, the loss can be reduced and the yield can be reduced. It can be seen that improvement can be achieved. Therefore, according to the present embodiment, the loss can be reduced if the duty ratio is selected according to the purpose of use within the range that satisfies the above-described formula (1), formula (2), or formula (3). .
- the duty ratio and film thickness of the IDT electrode are as described in (1) above using a material of density ⁇ , (2) above using Au, or (3) above using Cu. If it is misaligned, SiO
- the acoustic velocity of the boundary acoustic wave at the low-frequency end is set to 3210 m / sec or less.
- the acoustic velocity of the boundary acoustic wave is the SiO shear wave velocity at the low frequency side of the passband.
- the film thickness of the IDT electrode placed at the boundary between SiO and LiNbO is the sound velocity of the SH-type boundary acoustic wave.
- the duty ratio When the duty ratio is small, the duty ratio is large! /, And is set to be thicker than the case! /, So that the wave speed is sufficiently slower than 4031m / sec.
- the acoustic velocity (wavelength X frequency) of the boundary acoustic wave throughout the passband is SiO.
- the passband width of the bandpass filter used for the mobile phone is large, it is about 7% of the center frequency.
- the wavelength that is the electrode finger pitch of the IDT electrode is constant. Therefore, the acoustic velocity of the boundary acoustic wave at the low frequency end of the passband is 7% or less of the acoustic velocity of the boundary acoustic wave at the high frequency end of the passband.
- the acoustic velocity of the boundary acoustic wave at the high-frequency end of the passband propagates through SiO.
- the acoustic velocity of the boundary acoustic wave at the high-frequency end of the passband propagates through SiO.
- the acoustic velocity of the boundary acoustic wave at the low-frequency end of the passband is the slow! /
- the IDT may be a laminated metal film in which a plurality of metal layers are not necessarily formed by a single metal layer.
- the IDT11 shown in FIG. 10 six metal layers are laminated on the piezoelectric body 2 made of LiNbO.
- These six metal layers consist of Ti layer l la, Pt layer l lb, Au layer l lc, Pt layer in order from the LiNbO side.
- the IDT 11 may be formed by stacking a plurality of metal layers.
- the density p of IDT11 is obtained by dividing the sum of the product of the thickness of each metal layer and the density of the metal constituting each metal layer by the sum of the thickness of each metal layer. The average density obtained may be used.
- Adhesion to SiO can be improved. That is, Au is against LiNbO and SiO
- the NiCr layer l lf provided at the top is provided for frequency adjustment.
- the frequency can be adjusted by decreasing the film thickness, or the NiCr layer can be formed by increasing the film thickness. That is, the electrode
- the frequency S due to the line width and film thickness is controlled by adjusting the film thickness of the NiCr layer 1 If.
- the Pt layers l ib and l id are provided to prevent Au diffusion. That is, if the Au layer 11c and the Ti layers 11a, 1 le are in direct contact, there is a risk that Au and Ti may diffuse together due to heating or the like. Therefore, Pt layers l ib and l id are inserted in order to prevent diffusion.
- the thickness of the Pt layers l ib and l id is not less than a thickness that can prevent the diffusion of Au and Ti and not more than a thickness that does not increase loss. According to the experiment by the present inventor, it was confirmed that the diffusion of Au and Ti can be prevented by setting the thickness of the Pt layer to 3 nm or more, and that the insertion loss does not increase so much by setting it to lOnm or less. . Therefore, the thickness of the Pt layers l ib and l id is preferably in the range of 3 to; Onm.
- a range of 40 is desirable.
- the IDT When actually producing a boundary acoustic wave filter device, it is easier for the IDT to have the line width of the electrode fingers closer to the gap width between the electrode fingers. In other words, it is easier to manufacture when the duty ratio is close to 0.50. Therefore, by setting the duty ratio in the range close to 0.5 force, that is, in the range of 0.30-0.70, the loss can be reduced according to the present invention without incurring the complexity of the IDT manufacturing process. it can.
- duty ratio in the range of 0.30 to 0.40, it is easy to manufacture and can reduce TCF and loss, which is desirable.
- the IDT can be formed of various metal materials.
- the IDT is formed so as to include Au or an alloy mainly containing Au, that is, an Au-based metal layer.
- the IDT may be formed by a laminated metal film including an Au-based metal layer, as shown in FIG.
- the boundary acoustic wave filter device of the present invention is not limited to the filter device having the electrode structure shown in FIG. 1 (b) described above, but is applied to the boundary acoustic wave filter device having various electrode structures. .
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Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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CN200780035382XA CN101517893B (zh) | 2006-09-25 | 2007-08-31 | 弹性边界波装置 |
JP2008536312A JP4947055B2 (ja) | 2006-09-25 | 2007-08-31 | 弾性境界波装置 |
EP07806505.9A EP2068442B1 (en) | 2006-09-25 | 2007-08-31 | Boundary acoustic wave device |
US12/409,702 US7898145B2 (en) | 2006-09-25 | 2009-03-24 | Boundary acoustic wave device |
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JP2006-259023 | 2006-09-25 | ||
JP2006259023 | 2006-09-25 |
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US12/409,702 Continuation US7898145B2 (en) | 2006-09-25 | 2009-03-24 | Boundary acoustic wave device |
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US (1) | US7898145B2 (ja) |
EP (1) | EP2068442B1 (ja) |
JP (1) | JP4947055B2 (ja) |
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JP4826633B2 (ja) * | 2006-11-24 | 2011-11-30 | 株式会社村田製作所 | 弾性境界波装置の製造方法及び弾性境界波装置 |
WO2008108215A1 (ja) * | 2007-03-06 | 2008-09-12 | Murata Manufacturing Co., Ltd. | 弾性境界波装置 |
JP5392353B2 (ja) * | 2009-10-19 | 2014-01-22 | 株式会社村田製作所 | 弾性表面波装置 |
DE102010034121A1 (de) * | 2010-08-12 | 2012-02-16 | Epcos Ag | Mit akustischen Wellen arbeitendes Bauelement mit reduziertem Temperaturgang der Frequenzlage und Verfahren zur Herstellung |
JP2018056630A (ja) * | 2016-09-26 | 2018-04-05 | 株式会社村田製作所 | 弾性波装置、高周波フロントエンド回路及び通信装置 |
US11070193B2 (en) * | 2017-11-24 | 2021-07-20 | Murata Manufacturing Co., Ltd. | Elastic wave device, radio-frequency front-end circuit, and communication device |
DE102019204755A1 (de) | 2018-04-18 | 2019-10-24 | Skyworks Solutions, Inc. | Akustikwellenvorrichtung mit mehrschichtigem piezoelektrischem substrat |
US11431318B2 (en) * | 2018-12-14 | 2022-08-30 | Samsung Electro-Mechanics Co., Ltd. | Acoustic resonator and method of manufacturing thereof |
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US4484098A (en) * | 1983-12-19 | 1984-11-20 | United Technologies Corporation | Environmentally stable lithium niobate acoustic wave devices |
DE4132309A1 (de) * | 1991-09-27 | 1993-04-01 | Siemens Ag | Stoneleywellen-bauteil mit nicht-reflektierenden interdigitalwandlern |
JP3295921B2 (ja) * | 1994-06-20 | 2002-06-24 | 住友電気工業株式会社 | 表面弾性波素子用ダイヤモンド基材及び素子 |
WO1998052279A1 (fr) | 1997-05-12 | 1998-11-19 | Hitachi, Ltd. | Dispositif a onde elastique |
JP3815424B2 (ja) | 2002-11-08 | 2006-08-30 | 株式会社村田製作所 | 弾性境界波装置 |
EP1947763A3 (en) * | 2003-02-10 | 2009-01-14 | Murata Manufacturing Co. Ltd. | Boundary acoustic wave device |
JPWO2005036743A1 (ja) | 2003-10-10 | 2007-11-22 | 株式会社村田製作所 | 弾性境界波装置 |
WO2005036744A1 (ja) * | 2003-10-10 | 2005-04-21 | Murata Manufacturing Co., Ltd. | 弾性境界波装置 |
JP3894917B2 (ja) * | 2003-11-12 | 2007-03-22 | 富士通メディアデバイス株式会社 | 弾性境界波デバイス及びその製造方法 |
CN101714858B (zh) * | 2004-03-29 | 2013-05-01 | 株式会社村田制作所 | 声界面波装置的制造方法 |
DE102004058016B4 (de) * | 2004-12-01 | 2014-10-09 | Epcos Ag | Mit akustischen Oberflächenwellen arbeitendes Bauelement mit hoher Bandbreite |
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2007
- 2007-08-31 CN CN200780035382XA patent/CN101517893B/zh active Active
- 2007-08-31 EP EP07806505.9A patent/EP2068442B1/en not_active Not-in-force
- 2007-08-31 WO PCT/JP2007/067032 patent/WO2008038493A1/ja active Application Filing
- 2007-08-31 JP JP2008536312A patent/JP4947055B2/ja active Active
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2009
- 2009-03-24 US US12/409,702 patent/US7898145B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001077658A (ja) * | 1999-09-01 | 2001-03-23 | Kyocera Corp | 弾性表面波装置 |
WO2005060094A1 (ja) * | 2003-12-16 | 2005-06-30 | Murata Manufacturing Co., Ltd. | 弾性境界波装置 |
Non-Patent Citations (1)
Title |
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See also references of EP2068442A4 * |
Also Published As
Publication number | Publication date |
---|---|
EP2068442A1 (en) | 2009-06-10 |
CN101517893B (zh) | 2012-05-30 |
JPWO2008038493A1 (ja) | 2010-01-28 |
US20090174284A1 (en) | 2009-07-09 |
US7898145B2 (en) | 2011-03-01 |
CN101517893A (zh) | 2009-08-26 |
EP2068442B1 (en) | 2016-09-28 |
EP2068442A4 (en) | 2013-11-20 |
JP4947055B2 (ja) | 2012-06-06 |
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