WO2008007516A1 - Robot à articulations multiples - Google Patents

Robot à articulations multiples Download PDF

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Publication number
WO2008007516A1
WO2008007516A1 PCT/JP2007/062154 JP2007062154W WO2008007516A1 WO 2008007516 A1 WO2008007516 A1 WO 2008007516A1 JP 2007062154 W JP2007062154 W JP 2007062154W WO 2008007516 A1 WO2008007516 A1 WO 2008007516A1
Authority
WO
WIPO (PCT)
Prior art keywords
joint
moving mechanism
articulated robot
hand
arm
Prior art date
Application number
PCT/JP2007/062154
Other languages
English (en)
Japanese (ja)
Inventor
Satoshi Sueyoshi
Kentaro Tanaka
Tomohiro Matsuo
Original Assignee
Kabushiki Kaisha Yaskawa Denki
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kabushiki Kaisha Yaskawa Denki filed Critical Kabushiki Kaisha Yaskawa Denki
Priority to KR1020087018493A priority Critical patent/KR101120824B1/ko
Priority to JP2007548639A priority patent/JP4168410B2/ja
Priority to CN2007800014784A priority patent/CN101360589B/zh
Publication of WO2008007516A1 publication Critical patent/WO2008007516A1/fr

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00Programme-controlled manipulators
    • B25J9/02Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041Cylindrical coordinate type
    • B25J9/042Cylindrical coordinate type comprising an articulated arm
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00Manipulators not otherwise provided for
    • B25J11/0095Manipulators transporting wafers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00Arms
    • B25J18/02Arms extensible
    • B25J18/04Arms extensible rotatable
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00Programme-controlled manipulators
    • B25J9/10Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/106Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/141Associated with semiconductor wafer handling includes means for gripping wafer

Abstract

L'invention a pour objet un robot à articulations multiples qui empêche la contamination d'un substrat par les poussières produites par un arbre à déplacement vertical, et qui transfère avec un rendement amélioré des pièces en forme de plaques minces, telles que des substrats de verre pour cristaux liquides et des plaquettes de semi-conducteur, afin de les introduire dans une unité de stockage ou les extraire d'une unité de stockage. Le robot (1) à articulations multiples comprend une section main (8) sur laquelle un objet à transférer vient se placer, un bras (1) articulations multiples, relié à la section main (8), qui comprend au moins deux articulations rotatives (3, 4, 5), et qui s'avance et se rétracte de façon à mouvoir la section main (8) dans une direction, ce bras étant opposé à la direction d'un arbre, un élément de support (10) qui relie le bras (1) à articulations multiples à un mécanisme d'actionnement (11) à déplacement vertical, et une base (13) disposée sur le mécanisme d'actionnement (11) et présentant une fonction de rotation. Le mécanisme d'actionnement (11) comprend une colonne (12) orientée dans la même direction que la direction de déplacement de la section main (8), et l'élément de support (10), qui est installé sur le mécanisme d'actionnement (11), s'avance dans une direction formant une intersection orthogonale avec la direction de déplacement de la section main (8), et est couplée au bras (2) à articulations multiples.
PCT/JP2007/062154 2006-07-11 2007-06-15 Robot à articulations multiples WO2008007516A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020087018493A KR101120824B1 (ko) 2006-07-11 2007-06-15 다관절 로봇
JP2007548639A JP4168410B2 (ja) 2006-07-11 2007-06-15 多関節ロボット
CN2007800014784A CN101360589B (zh) 2006-07-11 2007-06-15 多关节机器人

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006190822 2006-07-11
JP2006-190822 2006-07-11

Publications (1)

Publication Number Publication Date
WO2008007516A1 true WO2008007516A1 (fr) 2008-01-17

Family

ID=38923081

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/062154 WO2008007516A1 (fr) 2006-07-11 2007-06-15 Robot à articulations multiples

Country Status (5)

Country Link
JP (3) JP4168410B2 (fr)
KR (3) KR100914387B1 (fr)
CN (3) CN101360589B (fr)
TW (3) TW200817151A (fr)
WO (1) WO2008007516A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008018480A (ja) * 2006-07-11 2008-01-31 Yaskawa Electric Corp 多関節ロボットおよびそのロボットの移送方法と設置方法
JP2010064219A (ja) * 2008-09-12 2010-03-25 Yaskawa Electric Corp 多関節ロボット
CN102145488A (zh) * 2011-02-14 2011-08-10 山东碧通通信技术有限公司 一种柔性四自由度机械手
CN103189168A (zh) * 2010-11-30 2013-07-03 川崎重工业株式会社 搬送机械手

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4591624B1 (ja) 2010-03-12 2010-12-01 株式会社安川電機 産業用ロボット
KR200466172Y1 (ko) * 2010-04-28 2013-04-09 히라따기꼬오 가부시키가이샤 기판반송로봇
JP5376065B2 (ja) * 2010-09-13 2013-12-25 トヨタ自動車株式会社 サポートアーム
KR101211911B1 (ko) * 2010-11-02 2012-12-13 주식회사 로보스타 표시장치용 패널의 반전로봇
KR101682465B1 (ko) * 2010-11-17 2016-12-05 삼성전자 주식회사 기판이송로봇
JP5565345B2 (ja) * 2011-03-07 2014-08-06 株式会社安川電機 搬送ロボット
CN102126209B (zh) * 2011-03-16 2012-08-15 哈尔滨工业大学 一种用于硅片传输机器人的w轴差轴传动机构
CN102126208B (zh) * 2011-03-16 2012-09-19 哈尔滨工业大学 一种并联型r轴扩展机械臂
CN102161199B (zh) * 2011-03-16 2012-09-19 哈尔滨工业大学 一种用于硅片传输机器人的w轴同轴传动机构
CN102152297B (zh) * 2011-03-16 2013-04-10 哈尔滨工业大学 一种串联型r轴扩展机械臂
JP5387622B2 (ja) * 2011-06-17 2014-01-15 株式会社安川電機 搬送ロボット
JP5429256B2 (ja) * 2011-10-03 2014-02-26 株式会社安川電機 ロボットシステム
JP5768827B2 (ja) * 2013-03-14 2015-08-26 株式会社安川電機 ロボットシステムおよびワークの搬送方法
KR101458697B1 (ko) * 2013-04-19 2014-11-05 현대중공업 주식회사 기판 이송장치 및 이를 이용한 기판 이송방법
JP6295037B2 (ja) * 2013-08-08 2018-03-14 日本電産サンキョー株式会社 産業用ロボット
KR101506188B1 (ko) * 2013-08-30 2015-03-26 주식회사 로보스타 멀티플 암을 구비한 반송 로봇
JP6352016B2 (ja) * 2014-03-27 2018-07-04 日本電産サンキョー株式会社 産業用ロボット
CN105922233B (zh) * 2016-06-28 2018-08-07 江苏捷帝机器人股份有限公司 一种高精准智能化机械臂及其工作方法
CN106041876B (zh) * 2016-06-28 2019-01-29 江苏捷帝机器人股份有限公司 一种全方位移动的智能化机械臂及其工作方法
CN105922242B (zh) * 2016-06-28 2018-06-29 江苏捷帝机器人股份有限公司 一种高效的智能化机械臂及其工作方法
CN106175934B (zh) * 2016-06-29 2019-04-30 微创(上海)医疗机器人有限公司 手术机器人及其机械臂
CN106078724B (zh) * 2016-06-29 2020-01-24 微创(上海)医疗机器人有限公司 机械臂及其手术机器人
JP6873881B2 (ja) * 2017-10-13 2021-05-19 日本電産サンキョー株式会社 産業用ロボット
KR102059445B1 (ko) 2017-11-28 2019-12-27 주식회사 엠티에스이 이동식 워크 테이블
CN108608460A (zh) * 2018-04-23 2018-10-02 深圳市华星光电半导体显示技术有限公司 机械臂结构及机器人
CN110549354A (zh) * 2018-05-31 2019-12-10 北新集团建材股份有限公司 下抄式机械抓取夹具
CN110454554A (zh) * 2019-08-26 2019-11-15 苏州领裕电子科技有限公司 一种单轴折叠手臂直线模组

Citations (3)

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Publication number Priority date Publication date Assignee Title
JPH09511453A (ja) * 1994-03-04 1997-11-18 マイケル、ジョゼフ プログラム可能な材料
JPH11347982A (ja) * 1998-06-02 1999-12-21 Mecs Corp 搬送ロボットの摺動部構造
JP2001274218A (ja) * 2000-03-23 2001-10-05 Sankyo Seiki Mfg Co Ltd ダブルアーム型ロボット

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JPS58109284A (ja) * 1981-12-22 1983-06-29 株式会社小松製作所 ロボツト装置
JP2599571B2 (ja) * 1994-05-11 1997-04-09 ダイトロンテクノロジー株式会社 基板搬送ロボット
CN2341778Y (zh) * 1998-12-02 1999-10-06 和椿事业股份有限公司 机械手臂
JP2003158170A (ja) * 2001-11-20 2003-05-30 Aitec:Kk 基板用カセットのスロット検出装置
CN2637135Y (zh) * 2003-07-02 2004-09-01 陕西科技大学 凸轮式提升转位机械手
CN100342519C (zh) * 2003-07-16 2007-10-10 东京毅力科创株式会社 搬送装置及驱动机构
JP4063781B2 (ja) * 2004-03-04 2008-03-19 株式会社ラインワークス 搬送装置
WO2008007517A1 (fr) * 2006-07-11 2008-01-17 Kabushiki Kaisha Yaskawa Denki Robot à articulations multiples et procédé de câblage

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09511453A (ja) * 1994-03-04 1997-11-18 マイケル、ジョゼフ プログラム可能な材料
JPH11347982A (ja) * 1998-06-02 1999-12-21 Mecs Corp 搬送ロボットの摺動部構造
JP2001274218A (ja) * 2000-03-23 2001-10-05 Sankyo Seiki Mfg Co Ltd ダブルアーム型ロボット

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008018480A (ja) * 2006-07-11 2008-01-31 Yaskawa Electric Corp 多関節ロボットおよびそのロボットの移送方法と設置方法
JP2010064219A (ja) * 2008-09-12 2010-03-25 Yaskawa Electric Corp 多関節ロボット
CN103189168A (zh) * 2010-11-30 2013-07-03 川崎重工业株式会社 搬送机械手
US9579804B2 (en) 2010-11-30 2017-02-28 Kawasaki Jukogyo Kabushiki Kaisha Transfer robot
CN102145488A (zh) * 2011-02-14 2011-08-10 山东碧通通信技术有限公司 一种柔性四自由度机械手

Also Published As

Publication number Publication date
CN101863015B (zh) 2012-02-15
CN101844359B (zh) 2013-06-05
TWI357375B (fr) 2012-02-01
CN101360589B (zh) 2011-02-09
JPWO2008007516A1 (ja) 2009-12-10
JP5077406B2 (ja) 2012-11-21
KR101120824B1 (ko) 2012-03-23
TW200817151A (en) 2008-04-16
KR20080081196A (ko) 2008-09-08
CN101844359A (zh) 2010-09-29
JP4596375B2 (ja) 2010-12-08
JP2008155361A (ja) 2008-07-10
JP2010274413A (ja) 2010-12-09
KR20080081197A (ko) 2008-09-08
JP4168410B2 (ja) 2008-10-22
CN101360589A (zh) 2009-02-04
TW200932456A (en) 2009-08-01
KR20080082606A (ko) 2008-09-11
TW200930524A (en) 2009-07-16
TWI315244B (fr) 2009-10-01
KR100914387B1 (ko) 2009-08-28
KR100914386B1 (ko) 2009-08-28
CN101863015A (zh) 2010-10-20
TWI315243B (fr) 2009-10-01

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