WO2007148696A1 - 基板検査装置及び基板検査方法 - Google Patents
基板検査装置及び基板検査方法 Download PDFInfo
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- WO2007148696A1 WO2007148696A1 PCT/JP2007/062336 JP2007062336W WO2007148696A1 WO 2007148696 A1 WO2007148696 A1 WO 2007148696A1 JP 2007062336 W JP2007062336 W JP 2007062336W WO 2007148696 A1 WO2007148696 A1 WO 2007148696A1
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- Prior art keywords
- inspection
- inspected
- substrate
- substrates
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2805—Bare printed circuit boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
Definitions
- the present invention relates to a substrate inspection apparatus and a substrate inspection method, and more particularly, to perform a short circuit inspection on a plurality of substrates in parallel, thereby reducing the number of short circuit inspections and shortening the inspection time.
- the present invention relates to a substrate inspection apparatus and a substrate inspection method.
- the inspection “substrate” in the present invention includes a printed circuit board, a flexible circuit board, a multilayer circuit board, an electrode plate for a liquid crystal display or a plasma display, a package substrate for a semiconductor package, a film carrier, or the like. It is a waste. Background
- a continuity inspection of a substrate having a plurality of wiring patterns is performed by applying a current or a voltage to both ends of a wiring to be inspected (by supplying power from a power source) to reduce the resistance value of the wiring. Measured and judged as good or bad with a predetermined resistance value as a threshold value.
- a current or voltage is applied to the wiring to be inspected (by supplying power from the power supply), and the resistance value with respect to the remaining wiring is determined. By measuring, as in the continuity test, a good / bad judgment was made with a predetermined resistance value as a threshold value.
- one inspection jig, one power source and one measuring device (ammeter and Z or voltmeter) corresponding to this substrate are used for one substrate.
- Patent Document 1 Japanese Patent Laid-Open No. 8-21867
- the number of power supplies and measuring devices must be increased as well as the number of inspection jigs must be increased.
- the device itself has to be large and has a problem of high costs.
- the present invention has been made in view of such circumstances, and performs a short-circuit inspection on a plurality of substrates in parallel without increasing the number of power supplies and measuring devices, thereby reducing the number of short-circuit inspections.
- a substrate inspection apparatus and a substrate inspection method that can shorten the inspection time are provided.
- the invention according to claim 1 is a substrate inspection apparatus in which a plurality of substrates to be inspected having a plurality of wiring patterns are arranged, and inspects electrical characteristics of the plurality of substrates to be inspected, wherein the substrate to be inspected A plurality of inspection probes having a plurality of inspection probes having electrical contact with predetermined inspection points set on the wiring pattern, and a plurality of inspection jigs arranged in accordance with each of the plurality of inspected substrates For each of the plurality of substrates to be inspected, an inspection probe that makes electrical contact with the one wiring pattern to be inspected on the plurality of wiring pattern forces on the substrate to be inspected is set as the first inspection unit.
- a control means for setting a test probe that is in electrical contact with a wiring pattern other than the one wiring pattern to be inspected as a second inspection section, and based on the setting of the control means, and Multiple first inspection units are connected in parallel and set as the first group
- a switching means for connecting the plurality of second inspection units in parallel and setting the second group; a power supply means for generating a predetermined potential difference between the first group and the second group; and a potential difference by the power supply means.
- Detecting means for detecting an electrical characteristic between the first group and the second group when the error occurs, and a short circuit of the plurality of substrates to be inspected based on the electrical characteristic detected by the detecting means.
- a substrate inspection apparatus having a determination means for determining presence or absence.
- control means sequentially sets inspection probes other than the inspection probe set as the first inspection section as the first inspection section, and the second inspection section Set as the first inspection part! 2.
- the invention of claim 3 is characterized in that the power supply means is connected in series with the first group, and the detection means is connected in series with the second group.
- the board inspection device according to Item 1 is provided.
- the invention according to claim 4 is characterized in that the detection means is an ammeter, and the determination means compares the current value measured by the ammeter with a predetermined threshold value to detect a short circuit of the substrate to be inspected.
- the plurality of substrates to be inspected are the same type of substrate, and the first inspection unit and the second inspection unit for each substrate to be inspected set by the control means are the same inspection.
- the invention according to claim 6 is a substrate inspection method in which a plurality of substrates to be inspected having a plurality of wiring patterns are arranged, and the electrical characteristics of the plurality of substrates to be inspected are inspected.
- a plurality of inspection probes having a plurality of inspection probes having electrical contact with predetermined inspection points set on the wiring pattern, and a plurality of inspection jigs arranged in accordance with each of the plurality of inspected substrates Are arranged on the substrate to be inspected so that the inspection point and the inspection probe are in electrical contact, and each of the plurality of substrates to be inspected is inspected from the plurality of wiring pattern covers.
- An inspection probe that makes electrical contact with one wiring pattern to be used is set as the first inspection section, and an inspection probe that makes electrical contact with wiring patterns other than the one wiring pattern to be inspected Is set as the second inspection section, and the plurality of One inspection part is connected in parallel to be set as the first group, the plurality of second inspection parts are connected in parallel to be set as the second group, and a predetermined potential difference is generated between the first group and the second group. And detecting electrical characteristics between the first group and the second group when the potential difference is generated, and determining whether or not the plurality of substrates to be inspected are short-circuited based on the electrical characteristics.
- a substrate inspection method is provided.
- the inspection program that makes electrical contact with one wiring pattern to be inspected, including the plurality of wiring pattern on the substrate to be inspected.
- Set the probe as the first inspection part, and set the inspection probe that makes electrical contact with the wiring pattern other than the one wiring pattern to be inspected as the second inspection part.
- a predetermined potential difference is generated, the electrical characteristics between the first group and the second group when the potential difference is generated are detected, and the presence or absence of a short circuit of a plurality of substrates to be inspected is determined based on the electrical characteristics. Therefore, it is possible to perform a short circuit inspection of a plurality of substrates by using one power supply means and one detection means. For this reason, it is possible to perform a short circuit inspection on a plurality of substrates in parallel, thereby reducing the number of short circuit inspections and shortening the inspection time.
- control means sequentially sets inspection probes other than the inspection probe set as the first inspection section as the first inspection section, and the second inspection section Since all inspection probes having electrical contact with the wiring patterns are set as one inspection unit, the wiring patterns provided on all the substrates can be efficiently inspected.
- the detection means is an ammeter
- the determination means determines the presence or absence of a short circuit of the substrate to be inspected by comparing the current value measured by the ammeter with a predetermined threshold value. Therefore, it is possible to easily and reliably find a short circuit failure.
- the plurality of substrates to be inspected are the same type of substrate, and the first inspection unit and the second inspection unit for each substrate to be inspected set by the control means have the same inspection point. Therefore, it is possible to easily and quickly perform a short circuit inspection of substrates having the same wiring pattern.
- a plurality of inspection probes having electrical contact with predetermined inspection points set on the wiring pattern of the inspection substrate are provided, and a plurality of inspection substrates are provided.
- a plurality of substrate inspection jigs arranged according to each are arranged on the substrate to be inspected so that the inspection point and the inspection probe are in electrical contact with each other.
- a test probe that is in electrical contact with one wiring pattern to be inspected from a plurality of wiring patterns on the board to be inspected is set as the first inspection section, and wiring other than one wiring not to be inspected
- the inspection probe that is in electrical contact with the pattern is set as the second inspection section, the plurality of first inspection sections are connected in parallel to be set as the first group, and the plurality of second inspection sections are connected in parallel.
- Two groups are set, a predetermined potential difference is generated between the first group and the second group, the electrical characteristics between the first group and the second group when the potential difference is generated are detected, and based on the electrical characteristics.
- a short circuit inspection of a plurality of substrates can be performed using one power supply means and one detection means. For this reason, it is possible to reduce the number of short-circuit inspections by shortening the inspection time by performing a short-circuit inspection on a plurality of substrates in parallel.
- FIG. 1 is a plan view showing an embodiment of a substrate to be inspected to be inspected by the substrate inspection apparatus according to the present invention.
- FIG. 2 is a schematic configuration diagram of the substrate inspection apparatus according to the present invention.
- FIG. 4 is an external perspective view of an embodiment of a substrate inspection jig of the substrate inspection apparatus according to the present invention, and
- FIG. 4 is a schematic diagram showing electrical connection between the substrate inspection apparatus and the substrate to be inspected according to the present invention. It is. Incidentally, in the explanatory diagram as shown in FIG. 4, the case where the substrate to be inspected has four wiring patterns is explained, but it is not particularly limited.
- the substrate inspection apparatus can simultaneously perform a short-circuit inspection on a plurality of substrates, thereby reducing the inspection time. Further, by using one power supply means and one detection means, it is economically low cost, and a substrate inspection apparatus having one power supply means and one detection means can be used as a plurality of substrates to be inspected. By processing the short-circuit inspections simultaneously (in parallel), the processing capacity of the inspection is improved.
- the substrate inspection apparatus 1 can simultaneously perform a short-circuit inspection process on a plurality of substrates 100 to be inspected.
- the substrate to be inspected 100 to be inspected by the substrate inspection apparatus 1 can exemplify the substrate as described above, and can process a plurality of types of substrates.
- the substrate inspection apparatus 1 can efficiently perform a short circuit inspection by using the same type of substrate, the case of using the same type of substrate will be described. Even when different substrates are used, the location of the inspection probe where the control means sets the first group (first inspection unit) and the second group (second inspection unit), which will be described later, is the substrate to be inspected. By knowing every time, it is possible to shorten the short circuit inspection.
- a plurality of wiring pattern patterns A are formed on a strip-shaped sheet member 101 to form a plurality of substrates 100 to be inspected.
- three patterns A of wiring patterns are formed, and three substrates 100 to be inspected are formed.
- a plurality of wiring patterns A are arranged on a sheet member 101 along the longitudinal direction.
- the pattern of the wiring pattern shown in FIG. 1 is appropriately changed by the creator according to the type of the substrate.
- the substrate inspection apparatus 1 of the present invention includes a substrate inspection jig 2, a control unit 3, a switching unit 4, a power supply unit 5, a detection unit 6, and a determination unit 7 as shown in FIG. .
- the board inspection jig 2 is brought into contact with the front surface and the Z or back surface of the substrate 100 to be inspected, and obtains electrical contact with a predetermined inspection point set on the wiring pattern of the substrate 100 to be inspected.
- This board inspection jig 2 has a multi-needle contact portion 21 having a contact which comes into contact with the wiring pattern of the board 100 to be inspected as shown in FIG.
- the multi-needle contact portion 21 includes a plurality of inspection probes 211 arranged in a multi-needle shape so as to contact a plurality of predetermined inspection points as shown in FIG.
- the inspection probe 211 is brought into an electrical contact state by being in direct contact with the inspection point or arranged with a predetermined interval and being capacitively coupled with the predetermined interval. For this reason, one end of the inspection probe 211 is in electrical contact with the inspection point, and the other end of the inspection probe 211 is electrically connected to an electrode portion (not shown) of the substrate inspection jig 2. To touch.
- This electrode portion can be electrically connected to the power supply means and Z or detection means described later. As a result, electrical signals can be exchanged from the inspection point of the substrate to be inspected 100 via the substrate inspection tool 2.
- the substrate inspection jig 2 can supply electric power for short circuit inspection to a predetermined inspection point of the substrate 100 to be inspected, and can detect electrical characteristics for short circuit inspection. Thus, if the inspection point and the substrate inspection apparatus 1 can be electrically connected, the shape is not specified as shown in FIG.
- the substrate inspection apparatus 1 In order to perform a short-circuit inspection of a plurality of substrates 100 to be inspected simultaneously on a plurality of substrates 100 to be inspected, the substrate inspection apparatus 1 has the same number of substrates as the number of substrates 100 to be inspected simultaneously. Inspection jig 2 is prepared. For example, in order to simultaneously process the short circuit inspection of three substrates to be inspected 100 as shown in FIG. 1, the substrate inspection jig 2 for the three substrates to be inspected 100 is arranged. In order to perform inspection corresponding to the three substrates 100 (100a, 100b, 10 Oc) shown in FIG. 1, three substrate inspection jigs 2 corresponding to the substrate 100 to be inspected are arranged in parallel. .
- the control means 3 sets the inspection probe P that is in electrical contact with one wiring pattern W to be inspected as the first inspection unit S 1 from a plurality of wiring patterns provided on the substrate 100 to be inspected. To do.
- the wiring pattern W force set as the first inspection unit S1 is inspected whether it is short-circuited with another wiring pattern W or not. For this reason, the wiring pattern W set as the first inspection section S1 is subjected to a short circuit inspection by the method described later, and if it is confirmed that it is not a defective wiring pattern, the short circuit inspection is still performed! In other words, the wiring pattern W is sequentially set as the first inspection unit S1, and all the wiring patterns W are inspected.
- the first inspection unit S1 set by the control means 3 is set for each of the plurality of substrates to be inspected 100.
- the first inspection unit S1 The inspection probe P (wiring pattern W) at the same location is set.
- the first inspection unit S1 is set and the second inspection unit S2 is set.
- the second inspection unit S2 is a wiring pattern W that is inspected for a short circuit with respect to the wiring pattern W set in the first inspection unit S1.
- an inspection probe P that is in electrical contact with a wiring pattern W other than the wiring pattern W set in the first inspection unit S1 is set.
- Inspection probe set in this second inspection section S2 For P, at least the wiring pattern W adjacent to the wiring pattern w set in the first inspection unit SI is set. If the wiring pattern W set in the first inspection unit S1 is fine and complex, the wiring pattern W set as the second inspection unit S2 is changed to the wiring pattern W set as the first inspection unit S1. Set all inspection probes P that are in electrical contact with the wiring pattern W other than.
- the wiring pattern W set as the first inspection unit S1 corresponds to all the remaining wiring patterns W set as the second inspection unit S2, and the short circuit is more reliably performed. Inspection can be performed.
- the second inspection unit S 2 is also set with the sequential wiring pattern W, and a plurality of substrates 100 to be inspected are of the same type.
- the inspection probe P is set in the same place in the second inspection portion S2 of each substrate to be inspected.
- FIG. 4 shows three substrates to be inspected 100 (100a, 100b, 100c), and three wiring patterns W that become the first inspection part S 1 are shown on the left-hand side toward the paper surface. .
- FIG. 4 shows the case where the total number of wiring patterns W of the substrate 100 to be inspected is four, and the wiring pattern W force to be the second inspection portion S2 is shown by three for each substrate 100 to be inspected and the total number 9 The book is shown.
- the switching unit 4 connects the wiring patterns W of the first inspection unit S 1 and the second inspection unit S 2 set by the control unit 3 to the power supply unit 5 and the detection unit 6 described later.
- This switching means 4 connects each inspection probe P set as the first inspection section S 1 of each board 100 to be inspected in parallel and connects as the first group ⁇ , and each of the boards 100 to be inspected.
- the inspection probes set as the second inspection section S2 are connected in parallel and connected as a second group 8).
- the wiring patterns W of the plurality of substrates 100 to be inspected are set to two sets of the first group a and the second group j8.
- the switching means 4 can use a switching element connected to each inspection probe P, and switching is performed so that the power supply means 5 and the detection means 6 can be connected by switching the switching elements.
- the power supply means 5 generates a predetermined potential difference between the first group oc and the second group ⁇ . This power supply means 5 detects a short circuit by generating a potential difference between the first group oc and the second group ⁇ .
- the power supply means 5 can use a current control power source. By controlling a predetermined current value, the predetermined voltage is applied to the first group, and the first group oc and the second group ⁇ A predetermined potential difference is generated.
- the power supply means 5 is not particularly limited as long as it is a device that can generate a predetermined potential difference between the first group oc and the second group ⁇ .
- This power supply means 5 is connected in series with the first group ⁇ , and is electrically arranged upstream in the closed circuit between the wiring patterns W as shown in FIG. In FIG. 4, the power supply means 5 is set so that a predetermined voltage can be applied to each of the three wiring patterns W that are the first group ⁇ .
- the detection means 6 detects the electrical characteristics between the first group and the second group ⁇ when the power supply means 5 generates a potential difference between the first group oc and the second group ⁇ . By detecting the electrical characteristics generated between the first group (X and the second group ⁇ ), the detection means 6 can perform the short circuit determination of the inspected substrate 100 in the determination means 7 described later.
- This detection means 6 is particularly limited as long as it is a device that can detect a force electrical characteristic that can use an ammeter that detects a current that is an electrical characteristic between the first group oc and the second group ⁇ . Is not to be done.
- the detecting means 6 is connected in series with the second group
- the determination means 7 includes a plurality of substrates to be inspected based on the electrical characteristics detected by the detection means 6.
- This determination means 7 compares the preset value of the electrical characteristic set with the detection value of the electrical characteristic detected by the detection means 6. For example, if a short circuit exists between the first group ⁇ and the second group 13 (between the wiring patterns W forming each group), a current flows between the first group ⁇ and the second group 13. become. Because of this, electrically downstream The detection means 6 arranged on the side detects some electrical change. As a result, when this electrical change is detected, a short circuit has occurred in the first group ⁇ and the second group
- This determination means 7 is used when the detection means 6 uses an ammeter. By comparing the current value measured by the ammeter as the detection means 6 with a predetermined threshold value preset in the determination means 7, it is set so as to determine whether or not the inspected substrate 100 is short-circuited.
- this determination means 7 determines that there is a short circuit, since a plurality of substrates 100 to be inspected are simultaneously inspected, it is specified on which substrate the short circuit has occurred. In this case, if the short circuit is determined by the determination means 7, the first inspection sections S1 forming the first group ⁇ are inspected again. As a result, the short circuit inspection is performed again for each substrate to be inspected 100, so that a defective substrate having a short circuit can be found.
- the substrate inspection apparatus 1 can perform a short circuit inspection on a plurality of substrates simultaneously by using the control means 3 and the switching means 4 as described above. For this reason, if an inspection apparatus has electrical contact with a plurality of inspection points for a plurality of substrates, the control means is merely provided with one power supply means 5 and one detection means 6. By using 3 and the switching means 4, the short circuit inspection method of the present invention can be used. As a result, the short circuit inspection time can be shortened without requiring a complicated configuration of the substrate inspection apparatus.
- FIG. 5 is a flowchart showing the operation of the board inspection apparatus according to the present invention
- FIG. 6 is an embodiment showing the electrical connection between the board inspection apparatus and the board to be inspected.
- a substrate to be inspected is prepared.
- a plurality of substrates are prepared, and a plurality of substrates having the same wiring pattern pattern are inspected (for example, see FIG. 1).
- a multi-needle-shaped substrate inspection jig 2 as shown in FIG. 3 is brought into contact with the inspection points on the wiring pattern W of the substrate 100 to be inspected (SD).
- the multi-needle-like substrate inspection jig 2 is brought into contact with each of the substrates 100 to be inspected, and the inspection is performed simultaneously.
- the substrate inspection jig 2 is prepared for the substrate 100 to be inspected, first, using this substrate inspection jig 2, the continuity of the wiring pattern W of the substrate 100 to be inspected is inspected ( S2).
- the continuity test is executed using, for example, a test probe P between two points set in each wiring pattern W.
- the inspection probe P that is in electrical contact with the wiring pattern W of the substrate 100 to be inspected is divided into a first inspection unit S1 and a second inspection unit S2 (S3).
- the first inspection portions S1 of the inspected substrates 100 are connected in parallel to form the first group ⁇ , and the second inspection portions S2 of the inspected substrates 100 are connected in parallel to each other.
- the first group oc is connected in series with the power supply means 5 in order to generate a predetermined potential difference between the first group a and the second group ⁇ .
- the detection means 6 is connected in series with the second group ⁇ in order to detect the electrical characteristics between the first group a and the second group ⁇ .
- the power supply means 5 applies a voltage to the first group ⁇ , and the detection means 6 detects the electrical characteristics (S5).
- test substrates 100 (100a, 100b, 100c) as shown in FIG. 6 are arranged and the test substrate 100b arranged in the middle has a short circuit T
- a voltage is applied to the first group oc formed by the three first inspection portions S1 of each board to be inspected by the power supply means 5
- a current flows due to a short circuit T of the board to be inspected 100.
- the detecting means 6 detects a current that is a change in electrical characteristics.
- the detection means 6 detects a current that is a change in electrical characteristics (a detected current value that is larger than a preset current setting value)
- one or more of the three substrates to be inspected 100a, 100b, 100c Is determined to have a short circuit failure.
- the three switches SW1, SW2 and SW3 of the switching means 4 shown in FIG. 6 are turned off, and each is activated independently. As a result, even if the switch SW1 and the switch SW3 are activated, the detection means 6 does not detect a change in electrical characteristics (current), and when the switch SW2 is activated, the detection means 6 does not change the electrical characteristics. Will be detected. Then, the inspected substrate 100b has a short circuit T. As a result, it can be determined that the inspected substrate 100b is a defective substrate (S6
- the two substrates 100a and 100c shown in FIG. 6 do not have a short circuit defect and are determined to be good products. Further, when the detection means 6 does not detect the electrical characteristics, the inspected substrate 100 to be inspected is determined to be a non-defective product.
- FIG. 1 is a plan view showing an embodiment of a substrate to be inspected that is to be inspected by a substrate inspection apparatus according to the present invention.
- FIG. 2 shows a schematic configuration diagram of a substrate inspection apparatus according to the present invention.
- FIG. 3 is an external perspective view of one embodiment of a substrate inspection jig of the substrate inspection apparatus according to the present invention.
- FIG. 4 is a schematic diagram showing electrical connection between a substrate inspection apparatus according to the present invention and a substrate to be inspected.
- FIG. 5 is a flowchart showing the operation of the substrate inspection apparatus according to the present invention.
- FIG. 6 is an example showing the electrical connection between the substrate inspection apparatus and the substrate to be inspected.
Abstract
Description
Claims
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JP2006-169820 | 2006-06-20 | ||
JP2006169820A JP2008002823A (ja) | 2006-06-20 | 2006-06-20 | 基板検査装置及び基板検査方法 |
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JP (1) | JP2008002823A (ja) |
KR (1) | KR20090027610A (ja) |
CN (1) | CN101454680A (ja) |
TW (1) | TW200809226A (ja) |
WO (1) | WO2007148696A1 (ja) |
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JP2009264834A (ja) * | 2008-04-23 | 2009-11-12 | Hioki Ee Corp | 絶縁検査装置および絶縁検査方法 |
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JP2011027578A (ja) * | 2009-07-27 | 2011-02-10 | Hioki Ee Corp | 回路基板検査方法および回路基板検査装置 |
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JP5828697B2 (ja) * | 2011-07-15 | 2015-12-09 | 日置電機株式会社 | 回路基板検査装置および回路基板検査方法 |
JP4858657B1 (ja) * | 2011-08-11 | 2012-01-18 | 富士ゼロックス株式会社 | 基板検査装置、及び基板検査方法 |
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JP2013257195A (ja) * | 2012-06-12 | 2013-12-26 | Nidec-Read Corp | 基板検査治具及び基板検査装置 |
JP2014020815A (ja) * | 2012-07-13 | 2014-02-03 | Hioki Ee Corp | 基板検査装置および基板検査方法 |
JP6182974B2 (ja) * | 2013-05-20 | 2017-08-23 | 日本電産リード株式会社 | 基板検査方法 |
JP2015001470A (ja) * | 2013-06-17 | 2015-01-05 | 日本電産リード株式会社 | 基板検査装置 |
JP6229877B2 (ja) * | 2013-08-27 | 2017-11-15 | 日本電産リード株式会社 | 検査装置 |
JP7182951B2 (ja) * | 2018-08-27 | 2022-12-05 | 株式会社日本マイクロニクス | 検査装置及び検査方法 |
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- 2007-06-05 TW TW096120180A patent/TW200809226A/zh unknown
- 2007-06-19 KR KR1020087026199A patent/KR20090027610A/ko not_active Application Discontinuation
- 2007-06-19 CN CNA2007800194236A patent/CN101454680A/zh active Pending
- 2007-06-19 WO PCT/JP2007/062336 patent/WO2007148696A1/ja active Application Filing
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JPS52155364A (en) * | 1976-06-18 | 1977-12-23 | Matsushita Electric Ind Co Ltd | Circuit wiring board inspecting system |
JPS63262572A (ja) * | 1987-04-20 | 1988-10-28 | Matsushita Electric Ind Co Ltd | プリント基板箔スクリ−ニング検査方法 |
JPH1114710A (ja) * | 1997-06-27 | 1999-01-22 | Rohm Co Ltd | 電子回路における不良素子検出方法および記憶媒体 |
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JP2000193702A (ja) * | 1998-12-28 | 2000-07-14 | Nippon Densan Riido Kk | 基板の絶縁検査装置及びその絶縁検査方法 |
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JP2009264834A (ja) * | 2008-04-23 | 2009-11-12 | Hioki Ee Corp | 絶縁検査装置および絶縁検査方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20090027610A (ko) | 2009-03-17 |
CN101454680A (zh) | 2009-06-10 |
JP2008002823A (ja) | 2008-01-10 |
TW200809226A (en) | 2008-02-16 |
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