WO2006030665A1 - 半田ペーストおよびそれを用いた電子機器 - Google Patents
半田ペーストおよびそれを用いた電子機器 Download PDFInfo
- Publication number
- WO2006030665A1 WO2006030665A1 PCT/JP2005/016291 JP2005016291W WO2006030665A1 WO 2006030665 A1 WO2006030665 A1 WO 2006030665A1 JP 2005016291 W JP2005016291 W JP 2005016291W WO 2006030665 A1 WO2006030665 A1 WO 2006030665A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solder
- solder paste
- flux
- weight
- temperature
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0224—Conductive particles having an insulating coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/111—Preheating, e.g. before soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Definitions
- the present invention relates to a solder paste used in the field of electronic equipment, particularly to a solder paste for soldering a minute electronic component onto various substrates and an electronic equipment using the same.
- solder paste used here is about 80% to 90% by weight of solder fine powder having a particle size of several tens of zm, and about a flux composed of rosin, solvent, activator, thixotropic agent, etc. It is made into a paste by mixing as 10 wt% to 20 wt%, and its viscosity is adjusted to be suitable for screen printing.
- solder paste is mainly used for the purpose of connecting electronic components such as semiconductor elements, resistors and capacitors on a printed wiring board.
- the general implementation method is as follows. First, an appropriate amount of solder paste is applied on a copper foil land that is a connection terminal of a printed wiring board by screen printing or a dispenser. Next, the electronic component to be mounted is mounted on the copper foil land to which the solder paste is applied, for example, using an automatic mounting machine.
- the electronic components are mainly surface mount electronic components such as so-called passive components and semiconductor integrated circuit elements.
- the solder is melted by heating with a heating device such as a reflow oven, an infrared irradiation device or a laser irradiation device, and the copper foil land of the printed wiring board and the electrode terminal portion of the electronic component are joined to mount the solder.
- a heating device such as a reflow oven, an infrared irradiation device or a laser irradiation device
- the area of the electrode terminal portions of these electronic components is also decreasing.
- the area ratio is about 0.5 and the amount applied is about 0.3 for the 1005 size.
- the area]; wrinkle is about 0.2, and the coating amount is about 0.07.
- the amount of solder paste to be applied must be significantly smaller than that of the conventional one. As a result, the solder melts insufficiently even under conditions where soldering was possible stably in the past. As a result, it has been found that solder balls or the like are generated, resulting in poor bonding.
- the so-called lead soldering force mainly composed of a Pb—Sn alloy which has been used from the viewpoint of environmental protection, is also a lead-free solder, that is, Sn—Zn alloy, Sn_Ag alloy. Or it has been replaced by Sn_Ag_Cu alloy.
- soldering between the electronic component and the wiring board is first preheated at a temperature of 140 ° C to 180 ° C in a reflow furnace, and then the solder melts from 200 ° C to Heat to 280 ° C soldering temperature.
- the outermost flux flows between the solder particles, and the solder particles on the surface layer are not covered with the flux and are exposed directly to the atmosphere.
- the solder particles in the surface layer are oxidized. For this reason, even if most of the solder particles in the solder paste are melted and integrated, the solder particles whose surface is oxidized cannot be melted and integrated, and eventually remain as solder balls.
- solder ball causes short circuit failure. Furthermore, in the case of the above-described passive components having a small size and semiconductor integrated circuit elements having narrow terminal pitches, it is necessary to reduce the amount of solder paste used. Therefore, when solder balls that are not used effectively for soldering occur The occurrence of soldering defects and the reliability of the soldered parts are reduced.
- Japanese Unexamined Patent Publication No. 6-7989 discloses the following method. For example, assuming that the generation of solder balls is caused by sagging of the solder paste during preheating, a solder paste in which a fluorine compound is added to the flux to prevent the sagging is shown.
- the addition of a fluorine compound to the flux prevents the solder paste from sagging during preheating, thereby preventing the generation of solder balls.
- solder particles also flow out and spread more widely than the print application area, causing sagging.
- the solder particles in the expanded area are left behind even when melted, resulting in solder balls. This phenomenon is prevented by adding a fluorine compound.
- the solder paste application area becomes very small as in the case of 0603 size passive components and the amount of solder paste applied becomes very small, such dripping hardly occurs. Therefore, it seems difficult to prevent the generation of solder balls that occur when a small amount of soldering is carried out simply by preventing the occurrence of sagging.
- the method of the second example in which a material that generates nitrogen gas is included in the flux and the vicinity of the solder particles during preheating is in a nitrogen gas atmosphere is effective if the amount of the conventional solder paste is applied.
- the amount of solder paste applied is very small, the amount of nitrogen gas generated will be small, so that it will not be possible to obtain a sufficient antioxidant effect.
- the present invention prevents the oxidation of solder particles, which is a problem in soldering a small-sized passive component or a semiconductor integrated circuit element having a small terminal pitch, and uses a very small amount of solder paste. This makes it possible to perform solder bonding with high reliability.
- the solder paste of the present invention has a structure in which a solder alloy powder is mixed with a flux, and the flux is added. It has a high temperature retention characteristic that covers the surface of the solder alloy powder at the preheating temperature during the heat melting process.
- solder alloy powder is covered with the flux up to the preheat temperature and is not exposed to the air, the surface can be prevented from being oxidized. Therefore, even a 0603 size electronic component using a small amount of solder paste or a semiconductor integrated circuit device connected at a narrow pitch can be bonded with high reliability without generation of solder balls.
- the electronic device of the present invention includes a circuit board on which electronic components are mounted, and the solder paste for soldering the electronic components to the circuit board is the solder paste described above. It is characterized by being.
- Electronic components include passive components such as chip resistors and chip components, and functional components such as semiconductor integrated circuit elements and sensors.
- FIG. 1A is a schematic diagram of the heating behavior of the solder paste in the case of a coating amount corresponding to a 1005 size chip component.
- FIG. 1B is a schematic diagram showing a state in which preheating is performed at an application amount corresponding to the chip component.
- FIG. 1C is a schematic view showing a molten state of the solder in a state where it is heated to a peak temperature that is a melting temperature of the solder at an application amount corresponding to the chip component.
- FIG. 2A is a schematic diagram of the heating behavior of the solder paste in the case of a coating amount corresponding to a 0603 size chip component.
- FIG. 2B is a schematic diagram showing a state in which preheating is performed at an application amount corresponding to the chip component.
- FIG. 2C is a schematic view showing a molten state of the solder in a state where it is heated to a peak temperature that is the melting temperature of the solder at an application amount corresponding to the chip component.
- FIG. 3 is a cross-sectional view showing an example in which an electronic circuit board used for a mobile phone is manufactured using the solder paste of Example 1.
- 4 is a perspective view of a mobile phone using the electronic circuit board shown in FIG.
- a flux for solder paste In general, when producing a flux for solder paste, the constituent materials of the flux are mixed and heated to form a solution. However, in this embodiment, since a heat-polymerizable polymer material whose viscosity increases irreversibly by heating is used, a flux solution is prepared by kneading at room temperature to uniformly dissolve and mix the constituent materials. . In this embodiment, a thermosetting resin is also included in the heat-polymerizable polymer.
- the solder paste that is effective in the present embodiment is a solder having a particle size of 10/1 111 to 40/111 mixed with a pine resin resin, a thixotropic agent, an activator, and a solvent as a flux component to form a binder.
- the alloy powder is mixed to make a paste, and heat polymerization type polymer whose viscosity increases at high temperature is added.
- rosin resin Conventionally used rosin resin, thixotropic agent, activator and solvent can be used.
- pine rosin resin WW rosin, polymerized rosin, hydrogenated rosin, etc.
- Agents include stearyl amide and hydrogenated castor castor oil, and activators include dipheny.
- Luganidine HBr Cyclohexylamine HBr, Adipic acid, Sebacic acid, etc.
- solvents Butyl carbitol, Propylene glycol, Hexylene glycol, Hiichi TV neol, etc. It can be used.
- a solder paste manufacturing method that is effective in the present embodiment is as follows. That is, the flux component is first heated and dissolved to form a solution, and then cooled to room temperature or below. Thereafter, by adding and mixing a heat-polymerizable polymer material such as an epoxy resin, a high-temperature retention property that covers the solder alloy powder (hereinafter sometimes referred to as solder particles) up to the preheating temperature is imparted. Alternatively, a thickening agent that suppresses a decrease in the viscosity of the flux at a high temperature is added so that the flux covers the surface of the solder particles even at the preheating temperature.
- solder particles selected from 31—8 ⁇ -001, Sn-Ag-In-Bi, Sn—Zn—Bi, Sn—Ag—Cu—Bi, etc. are uniformly used as solder components.
- a solder paste is prepared by mixing with.
- the mixing ratio of the flux and the solder alloy powder is preferably 7 wt% to 13 wt% of the flux and 87 wt% to 93 wt% of the solder alloy powder.
- the flux may have a viscosity that is equal to or higher than that at normal temperature when pre-heated. This makes it difficult for the flux to flow out even at the preheating temperature, so that the solder alloy powder can be reliably covered and oxidation can be prevented.
- the flux may contain a heat-polymerizable polymer material. Further, this heat-polymerizable polymer material may be selected from polyester resin, methyl methacrylate resin, epoxy resin, polystyrene resin, phenol resin and drying oil. By using such a material, since the flux has a high viscosity even during preheating, the generation of solder balls can be effectively suppressed.
- the above-mentioned flux has a viscosity at 140 ° C to 180 ° C equal to or higher than 70% of the viscosity at normal temperature, and reliably coats the surface of the solder alloy powder at the preheating temperature. And oxidation of the solder particles can be effectively suppressed.
- the conventional lead solder can be used only with lead-free solder such as Sn_Ag_Cu alloy solder, Sn_Zn alloy solder or Sn_Ag alloy solder, which are generally used. This is effective when solder paste is used.
- the flux may contain a polymer having thixotropic properties as a thickener.
- This polymer is carboxyvinyl polymer, sodium alginate, propylene glycol alginate, ethyl cellulose, carboxymethyl cellulose, synthetic sodium magnesium silicate, dimethyl distearyl ammonium hectorite, sodium polyacrylate, hydroxyethyl cellulose, hydroxy At least one of propylmethylcellulose may be used. This makes it possible to suppress changes in viscosity at high temperatures.
- the content of the flux may be less than 20 weight 0/0. This can reliably prevent the oxidation of the solder alloy powder during preheating. If the content is 15% by weight or less, a solder paste having excellent printing characteristics in addition to preventing oxidation can be realized. Furthermore, if the amount is 11% by weight or less, the amount of solder alloy powder can be relatively increased, so that even when a small amount of solder paste is applied, melting between the solder alloy powders is surely generated, and the generation of solder balls is further suppressed. it can.
- the solder alloy powder may be any of Sn_Ag_Cu alloy, Sn_Ag_In_Bi alloy, Sn_Z n_Bi alloy and Sn_Ag_Cu_Bi alloy.
- An electronic device includes a circuit board on which an electronic component is mounted, and a solder paste for soldering the electronic component to the circuit board is the solder paste described above. It is characterized by being.
- Electronic components include passive components such as chip resistors and chip components, and functional components such as semiconductor integrated circuit elements and sensors.
- the electronic device of the present invention includes a portable electronic device that is particularly required to be downsized and highly functional, such as a mobile phone, a portable information device, a laptop computer, a recording device, a video camera, a digital camera, When applied to a car navigation system, a remarkable effect is obtained.
- a portable electronic device that is particularly required to be downsized and highly functional, such as a mobile phone, a portable information device, a laptop computer, a recording device, a video camera, a digital camera, When applied to a car navigation system, a remarkable effect is obtained.
- an image receiving device such as a laptop personal computer or a television, or various household electric appliances and commercial electric appliances.
- solder paste of the present invention it becomes possible to effectively suppress the oxidation of the surface of the solder alloy powder, and the electrode terminals on the printed wiring board and the electrodes of the electronic component can be strengthened. Can be soldered. Furthermore, since it is possible to suppress the generation of solder balls and the like during mounting, it is possible to prevent short-circuiting between terminals and obtain high connection reliability.
- the flux was 8% by weight and the solder alloy powder (Sn-Ag-Cu) was 92% by weight.
- the components of the flux were as follows.
- the viscosity was adjusted to cover the surface of the solder particles even at the preheating temperature during reflow soldering.
- the flux was 10% by weight and the solder alloy powder (Sn_Ag_In_Bi) was 90% by weight.
- the components of the flux were as follows.
- the preheating temperature during reflow soldering can be also achieved in the same manner as in Example 1.
- the viscosity was adjusted to cover the surface of the solder particles.
- the flux was 8% by weight and the solder alloy powder (Sn_Ag_Cu_Bi) was 92% by weight.
- the flux components were as follows.
- benzoyl peroxide is used as a curing catalyst for the styrene monomer, and as in the case of Example 1 and Example 2, even at the preheating temperature during reflow soldering, the viscosity of the flutters covers the surface of the solder particles. It was adjusted.
- the flux was 11% by weight and the solder alloy powder (Sn_Ag_Cu) was 89% by weight.
- the components of the flux were as follows.
- Methyl methacrylate resin 10% by weight
- benzoyl peroxide was used as a curing catalyst for the methyl methacrylate resin, and at the preheat temperature during reflow soldering as in Examples 1 to 3. The viscosity is adjusted so that the flux covers the surface of the solder particles.
- the solder paste used in this embodiment has a flux of 8 wt% to 11 wt%, and a solder alloy powder of 89 wt% to 92 wt%. It is desirable to knead at room temperature or a temperature below room temperature. Also, it is preferable to store at room temperature or lower.
- the particle size of the solder alloy powder is 10! ⁇ 30 zm was used.
- the flux was 8% by weight and the solder alloy powder (Sn-Ag-Cu) was 92% by weight.
- the components of the flux were as follows.
- the flux was 10% by weight and the solder alloy powder (Sn_Ag_Cu) was 90% by weight.
- the components of the flux were as follows.
- the flux was 9% by weight and the solder alloy powder (Sn_Ag_Cu) was 91% by weight.
- the components of the flux were as follows.
- hydroxyethyl cellulose was added to 100% by weight of the flux.
- sodium alginate, propylene glycol alginate, ethyl cellulose, carboxymethyl cellulose, dimethyl disteyl ammonium hectorite, sodium polyacrylate, hydroxypropyl methyl cell mouth It is also possible to use at least one of the source.
- solder paste produced in Examples 1 to 7 of the present invention a conventional solder paste in which flux flows out or volatilizes at the preheating temperature is produced as follows. It was set as a comparative example.
- the flux was 10% by weight and the solder alloy powder (Sn_Ag_Cu) was 90% by weight.
- the components of the flux were as follows.
- the flux was 11% by weight and the solder alloy powder (Sn_Ag_Cu) was 89% by weight.
- the components of the flux were as follows. [0057] 48% by weight of polymerized rosin
- solder paste from Example 1 to Example 7 described above and the solder paste from Comparative Example 1 and Comparative Example 2 1005 size chip resistance and 0603 size chip resistance are soldered onto the printed circuit board.
- the molten state of the solder paste and the presence or absence of solder balls were evaluated. That is, it is required that the amount of solder applied to the 0603 size chip resistor should be about 1/4 compared to the amount of solder applied to the 1005 size chip resistor. Therefore, the solder paste amount required for each of the two types of chip resistors is applied to the solder bases of the above seven types of examples and the two types of comparative examples, and the solder paste is melted by heating. The state of solder ball generation was observed. The observation was performed as follows.
- the printed wiring board on which the solder paste was applied was placed in the heating section of a high-temperature microscope, and the reflow conditions were set as follows to evaluate the change state of the solder paste during heating. In about 60 seconds from room temperature, it heated to 180 degreeC which is a preheating temperature, and hold
- Table 1 shows the evaluation results.
- the flux covered the solder particles during preheating as well as the 1005 size application amount and 0603 size application amount. It was observed that the whole melted at the time of heating. Even after cooling, the whole was melted and the solder ball was not seen.
- a thickening agent such as a heat-polymerizable polymer such as an epoxy resin or a polyester resin or a carboxybule polymer
- the flux covers the surface of the solder particles even at the preheat temperature, preventing oxidation. It depends on what was possible.
- solder paste even when a small amount of solder paste is applied, it has been found that melting between the solder alloy powders is surely generated during heating for bonding, and the generation of solder balls can be further suppressed.
- the flux sinks at the preheating temperature, and the solder particles are exposed to the atmosphere. For this reason, the surface of the solder particles existing in the outermost surface layer is oxidized. Oxidized solder particles were generated in almost the same manner for both the 1005 size coating amount and the 0603 size coating amount. However, in the case of a coating amount corresponding to 1005 size, it was confirmed that when the peak heating was performed, the whole melted. On the other hand, in the case of a coating amount corresponding to 0603 size, unmelted solder particles were present after peak heating, and solder balls were formed after cooling.
- FIGS. 1A to 2C are schematic diagrams of the heating behavior of the solder paste in the case of a coating amount corresponding to a 1005 size chip component.
- FIGS. 2A to 2C are schematic diagrams of the heating behavior of the solder paste in the case of a coating amount corresponding to a 0603 size chip component.
- the electrode material 10 and the solder paste of the printed wiring board use the same material, but the amount of solder paste applied differs. That is, compared with the solder paste 20 shown in FIGS. 1A to 1C, the amount of the solder paste 200 shown in FIGS. 2A to 2C is about 1/4.
- FIG. 1A and FIG. 2A are schematic cross-sectional views showing a state in which solder pastes 20 and 200 are respectively applied on the surface of the electrode terminal 10.
- the solder pastes 20 and 200 on the electrode terminal 10 are formed by solder particles 22 and 220 and fluxes 24 and 240, respectively.
- FIG. 1B and FIG. 2B are schematic views showing a state in which preheating is performed at the same temperature.
- preheating in the case of a coating amount corresponding to 1005 size, as shown in FIG. 1B, the solder particles 22 existing on the surface side are exposed to the atmosphere due to the sinking and volatilization of the flux 24, and the surface is oxidized.
- solder particles 26 having an oxide film are formed on the surface side of the solder paste 20.
- the peak temperature which is the melting temperature at which the solder melts, the unoxidized solder particles 22 present inside melt and melt.
- FIG. 1C is a schematic diagram showing a molten state of solder in a state where the solder is heated to a peak temperature that is a melting temperature of the solder. As can be seen from FIG. 1C, after melting, the solder 30 is uniformly melted and integrated.
- solder particles 220 existing on the surface side are exposed to the atmosphere due to the settlement and volatilization of the flat during preheating, and the surface is oxidized. .
- solder particles 260 having an oxide film are formed on the surface side of the solder paste 200. Even when heated to the peak temperature, the amount of unoxidized solder particles 220 is small, so the energy of volume expansion is small when they are melted and integrated. The oxide film on the surface of solder particles 260 having an oxide film is reduced. Something that cannot be broken is created. For this reason, it is considered that solder balls are generated.
- FIG. 2C is a schematic diagram showing a molten state of the solder in a state where the solder is heated to a peak temperature that is a melting temperature of the solder. As can be seen from Fig. 2C, solder balls that remain with only solder 300 remain after melting.
- the solder paste in the present invention uses a flux having a high temperature retention property that can cover the surface of the solder particles even at the preheating temperature. Even solder particles present on the outermost surface side can be shielded from the atmosphere to prevent surface oxidation. As a result, even with a small amount of application, it is possible to suppress a stable molten state and generation of solder balls, and it is possible to mount minute electronic components on a printed wiring board with high density.
- FIG. 3 is a cross-sectional view showing an example in which an electronic circuit board used for a mobile phone is manufactured using the solder paste of Example 1 described above.
- a 0603 size chip part 412, a 1005 size chip part 414, and a semiconductor chip 416 are mounted on a multilayer wiring board 410 made of a resin base material.
- a multilayer wiring board 410 made of a resin base material.
- FIG. 3 shows only three 0603-sized chip components 412, one 1005-size chip component 414, and only two semiconductor chips 416 are shown.
- the multilayer wiring board 410 is also formed with internal conductors, inner vias, through conductors, and the like as shown.
- elements having various functions such as a memory and a control LSI, may be mounted as a back chip, or may be mounted in a packaged state.
- these implementations can use an optimum method according to the form of the semiconductor chip, such as a flip chip method, a wire bonding method, or a mounting method using a ball grind array as shown in the figure.
- the semiconductor chip may be connected to the multilayer wiring board without using the solder paste of the present invention, for example, using a conductive adhesive or an anisotropic conductive resin.
- FIG. 4 is a perspective view of a mobile phone using this electronic circuit board.
- a bendable housing 420 is provided with buttons 424 having various functions and a display element 422, and an electronic circuit board shown in FIG. 3 is provided inside the housing.
- This cellular phone has no short circuit or poor connection of the electronic circuit board, and has a good manufacturing yield and high reliability. Industrial applicability
- solder particle oxidation which is a problem in soldering small-sized passive components and semiconductor integrated circuit elements with small terminal pitches, and ensures reliable soldering even when a small amount of solder paste is used It is useful in the field of circuit boards in which minute electronic components are soldered onto a board using solderable solder paste.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006535751A JPWO2006030665A1 (ja) | 2004-09-13 | 2005-09-06 | 半田ペーストおよびそれを用いた電子機器 |
US11/660,552 US20070277909A1 (en) | 2004-09-13 | 2005-09-06 | Solder Paste and Electronic Device Using Same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004265148 | 2004-09-13 | ||
JP2004-265148 | 2004-09-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006030665A1 true WO2006030665A1 (ja) | 2006-03-23 |
Family
ID=36059920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/016291 WO2006030665A1 (ja) | 2004-09-13 | 2005-09-06 | 半田ペーストおよびそれを用いた電子機器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20070277909A1 (ja) |
JP (1) | JPWO2006030665A1 (ja) |
CN (1) | CN100551604C (ja) |
WO (1) | WO2006030665A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011016967A (ja) * | 2009-07-10 | 2011-01-27 | Panasonic Electric Works Co Ltd | 熱硬化性樹脂組成物及び回路基板 |
JP2017535066A (ja) * | 2014-09-09 | 2017-11-24 | マイクロニック アーベーMycronic Ab | はんだペーストフラックスを塗布するための方法および装置 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011258838A (ja) * | 2010-06-10 | 2011-12-22 | Fujitsu Ltd | 積層回路基板、接着シート、積層回路基板の製造方法および接着シートの製造方法 |
JP5728636B2 (ja) * | 2010-09-29 | 2015-06-03 | パナソニックIpマネジメント株式会社 | 導電性接着剤、及びそれを用いた回路基板、電子部品モジュール |
CN103170757A (zh) * | 2011-12-23 | 2013-06-26 | 富泰华工业(深圳)有限公司 | 锡膏及其制备方法 |
US8872315B2 (en) * | 2012-08-09 | 2014-10-28 | Infineon Technologies Ag | Electronic device and method of fabricating an electronic device |
US9554468B2 (en) | 2013-12-19 | 2017-01-24 | Intel Corporation | Panel with releasable core |
US9522514B2 (en) | 2013-12-19 | 2016-12-20 | Intel Corporation | Substrate or panel with releasable core |
US9554472B2 (en) * | 2013-12-19 | 2017-01-24 | Intel Corporation | Panel with releasable core |
US9434135B2 (en) | 2013-12-19 | 2016-09-06 | Intel Corporation | Panel with releasable core |
CN107921588A (zh) * | 2015-08-04 | 2018-04-17 | 索尔维公司 | 制造焊剂组合物的方法 |
CN106119667B (zh) * | 2016-06-29 | 2018-05-25 | 北京态金科技有限公司 | 熔点为60℃的低熔点金属粘接膏及其制备方法和应用 |
TWI674682B (zh) * | 2016-09-07 | 2019-10-11 | 優顯科技股份有限公司 | 光電半導體裝置及其製造方法 |
US10160066B2 (en) * | 2016-11-01 | 2018-12-25 | GM Global Technology Operations LLC | Methods and systems for reinforced adhesive bonding using solder elements and flux |
CN107755921B (zh) * | 2017-09-18 | 2020-04-21 | 广东省焊接技术研究所(广东省中乌研究院) | 一种水性有机成膏体及其包含该成膏体的铝焊膏 |
CN108538878A (zh) * | 2018-07-11 | 2018-09-14 | 大连德豪光电科技有限公司 | 微发光二极管基板及其制备方法、显示装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08174265A (ja) * | 1994-12-27 | 1996-07-09 | Matsushita Electric Ind Co Ltd | クリ−ムはんだ |
JPH08174264A (ja) * | 1994-12-20 | 1996-07-09 | Nec Corp | ソルダーペースト |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01157798A (ja) * | 1987-12-15 | 1989-06-21 | Showa Denko Kk | クリームはんだ |
JP3137477B2 (ja) * | 1992-12-22 | 2001-02-19 | トヨタ自動車株式会社 | クリームはんだ用フラックス |
JPH1085984A (ja) * | 1996-09-10 | 1998-04-07 | Aoki Metal:Kk | はんだ付け用フラックス及びやに入りはんだ |
JPH11320176A (ja) * | 1998-05-18 | 1999-11-24 | Fujitsu Ltd | はんだペースト |
JP3105505B1 (ja) * | 1999-11-19 | 2000-11-06 | 株式会社ニホンゲンマ | はんだ用フラックスおよびソルダペースト |
US6402013B2 (en) * | 1999-12-03 | 2002-06-11 | Senju Metal Industry Co., Ltd | Thermosetting soldering flux and soldering process |
WO2002028574A1 (en) * | 2000-10-02 | 2002-04-11 | Asahi Kasei Kabushiki Kaisha | Functional alloy particles |
JP2002144077A (ja) * | 2000-11-08 | 2002-05-21 | Uchihashi Estec Co Ltd | はんだ付け方法及びソルダペースト |
JP4486287B2 (ja) * | 2001-09-26 | 2010-06-23 | タムラ化研株式会社 | ソルダペースト組成物及びリフローはんだ付方法 |
US20050056365A1 (en) * | 2003-09-15 | 2005-03-17 | Albert Chan | Thermal interface adhesive |
-
2005
- 2005-09-06 CN CNB200580030731XA patent/CN100551604C/zh not_active Expired - Fee Related
- 2005-09-06 JP JP2006535751A patent/JPWO2006030665A1/ja not_active Withdrawn
- 2005-09-06 US US11/660,552 patent/US20070277909A1/en not_active Abandoned
- 2005-09-06 WO PCT/JP2005/016291 patent/WO2006030665A1/ja active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08174264A (ja) * | 1994-12-20 | 1996-07-09 | Nec Corp | ソルダーペースト |
JPH08174265A (ja) * | 1994-12-27 | 1996-07-09 | Matsushita Electric Ind Co Ltd | クリ−ムはんだ |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011016967A (ja) * | 2009-07-10 | 2011-01-27 | Panasonic Electric Works Co Ltd | 熱硬化性樹脂組成物及び回路基板 |
JP2017535066A (ja) * | 2014-09-09 | 2017-11-24 | マイクロニック アーベーMycronic Ab | はんだペーストフラックスを塗布するための方法および装置 |
JP2021010013A (ja) * | 2014-09-09 | 2021-01-28 | マイクロニック アーベーMycronic Ab | はんだペーストフラックスを塗布するための方法および装置 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2006030665A1 (ja) | 2008-05-15 |
CN100551604C (zh) | 2009-10-21 |
CN101018643A (zh) | 2007-08-15 |
US20070277909A1 (en) | 2007-12-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2006030665A1 (ja) | 半田ペーストおよびそれを用いた電子機器 | |
KR102183512B1 (ko) | 솔더 페이스트 | |
CN100404597C (zh) | 导热性粘合剂组合物和器件连接工艺 | |
JP5342453B2 (ja) | 導電性ペーストおよびこれを用いた電気電子機器 | |
WO2017110052A1 (ja) | ペースト状熱硬化性樹脂組成物、半導体部品、半導体実装品、半導体部品の製造方法、半導体実装品の製造方法 | |
JP2006199937A (ja) | 導電性接着剤、これを用いた導電部及び電子部品モジュール | |
JP2002336992A (ja) | 回路基板はんだ付用はんだ加工物及び回路基板 | |
JP3592006B2 (ja) | ビアホール充填用導電性ペースト及びそれを用いたプリント配線板 | |
WO2008056676A1 (fr) | Pâte à braser sans plomb, carte de circuit électronique utilisant cette pâte à braser sans plomb, et procédé de fabrication de carte de circuit électronique | |
JP2002224880A (ja) | はんだペースト、および電子装置 | |
JP2000151095A (ja) | プリント配線基板に対する部品のはんだ付け方法、プリント配線基板の作製方法 | |
JP2006225426A (ja) | 導電性接着剤 | |
JP2008238253A (ja) | Pbフリーはんだ接続材料及びこれを用いた半導体実装構造体の製造方法 | |
JP2002201448A (ja) | 導電性接着剤 | |
JPH10279903A (ja) | 導電性接着剤 | |
JP2007116181A (ja) | 回路基板 | |
JPH067989A (ja) | ソルダーペースト | |
JP6677231B2 (ja) | 電子部品の接合方法および接合体の製造方法 | |
JP2005297011A (ja) | ソルダーペーストおよび半田付け物品 | |
KR101239665B1 (ko) | 도전성 복합체 및 이를 이용한 이방성 도전성 접착제 | |
KR102150263B1 (ko) | 무연솔더 페이스트 | |
JPH02117794A (ja) | クリーム半田 | |
JP2002224884A (ja) | 半田付け用フラックス及びこれを用いた半田バンプの形成方法 | |
WO2023106219A1 (ja) | 積層体および接合部材 | |
JP5140328B2 (ja) | 導電性接着剤を用いて形成された導通接続部およびその導通接続部を用いた回路基板と電子電気機器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KM KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NG NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU LV MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2006535751 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 11660552 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 200580030731.X Country of ref document: CN |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 05778482 Country of ref document: EP Kind code of ref document: A1 |
|
WWP | Wipo information: published in national office |
Ref document number: 11660552 Country of ref document: US |