Classifications

• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J7/00—Adhesives in the form of films or foils
  • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J7/00—Adhesives in the form of films or foils
  • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
  • C09J7/38—Pressure-sensitive adhesives [PSA]
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2301/00—Additional features of adhesives in the form of films or foils
  • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
  • C09J2301/18—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet characterized by perforations in the adhesive tape
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2301/00—Additional features of adhesives in the form of films or foils
  • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
  • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
  • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture

Definitions

• the present invention relates to a pressure-sensitive adhesive sheet capable of preventing or removing air pockets and blisters.
• the adhesive sheet may be replaced with another adhesive sheet, the adhesive sheet may be peeled once and then re-applied, or a swollen area of the adhesive sheet may be used. It has been practiced to puncture the air with a needle. However, when replacing the adhesive sheet, it takes time and effort and costs are increased, and when replacing the adhesive sheet, the adhesive sheet is torn, wrinkled on the surface, In many cases, problems such as deterioration of performance occur. On the other hand, the method of piercing with a needle impairs the appearance of the adhesive sheet.
• resin materials such as acrylic resin, ABS resin, polystyrene resin, and polycarbonate resin have a force that can generate gas by heating or without heating.
• a blister (swelling) force S is generated on the pressure-sensitive adhesive sheet by the gas generated by the adherend force.
• Patent Documents 1 and 2 disclose an adhesive layer.
• an adhesive sheet in which a large number of independent small projections are arranged in a scattered manner on the adhesive surface.
• the tips of the small protrusions of the pressure-sensitive adhesive layer are in close contact with the adherend, and the basic flat surface of the pressure-sensitive adhesive layer is kept away from the adherend. Since a gap is formed between the surface and the adherend that communicates with the outside, air or gas is evacuated to the outside from the gap to prevent air pockets or blisters in the adhesive sheet.
• Patent Document 1 Japanese Patent Publication No. 2503717
• Patent Document 2 Japanese Patent No. 2587198
• the pressure-sensitive adhesive sheet if the pressure-sensitive adhesive sheet is exposed to a high temperature after being adhered to the adherend, the pressure-sensitive adhesive layer flows and the small protrusions disappear, so that after the high-temperature exposure, the remaining air pool or the pressure-sensitive layer remains. If insufficient follow-up to the recessed body was found or blisters were generated, air or gas could not be extracted to the outside, and air pockets and blisters could not be removed or prevented.
• the present invention has been made in view of such circumstances, and it is possible to prevent or remove air pockets and blisters while maintaining the sufficient adhesive force without impairing the appearance of the pressure-sensitive adhesive sheet. It is another object of the present invention to provide a pressure-sensitive adhesive sheet which is excellent in air bleeding property even when exposed to a high temperature after the adherend is attached.
• the present invention comprises a base material and an adhesive layer, and a plurality of through-holes penetrating through one surface and the other surface is formed.
• Tmax after attaching body (However, the temperature is 20 ° C ⁇ Tmax ⁇ 130 ° C.)
• the pressure-sensitive adhesive sheet is exposed to a temperature of 0.1 to 300 / im.
• the pore density was 30 to 50,000 / 100 cm 2
• the storage elastic modulus at Tmax of the pressure-sensitive adhesive layer was 4.5 ⁇ 10 3 Pa or more
• the loss tangent at Tmax of the pressure-sensitive adhesive layer was 0.
• the present invention provides an adhesive sheet characterized by having a ratio of not more than 78 (Invention 1).
• the present invention is an adhesive sheet comprising a base material and an adhesive layer, wherein a plurality of through holes penetrating from one surface to the other surface are formed,
• the pore size in the base material and the pressure-sensitive adhesive layer is 0.1300 xm, the pore density is 30 to 50,000 / 100 cm2, and the storage elastic modulus at 120 ° C of the pressure-sensitive adhesive layer is 4.5 ⁇ 10 3 Pa
• the pressure-sensitive adhesive sheet is characterized in that the loss tangent at 120 ° C of the pressure-sensitive adhesive layer is 0.78 or less (Invention 2).
• sheet includes the concept of a film
• film includes the concept of a sheet
• the air between the adherend and the pressure-sensitive adhesive surface passes through the outside of the pressure-sensitive adhesive sheet surface, so that when adhering to the adherend, It is possible to prevent the formation of an air pool in which air is hardly wound. Even if air is trapped in the air and an air pocket is created, the air can be forced out of the adhesive sheet surface by re-pressing the air pool or the air pool surrounding the air pool. The air pocket disappears. Further, even if gas is generated from the adherend after being attached to the adherend, the gas escapes from the through-hole to the outside of the surface of the pressure-sensitive adhesive sheet, so that blisters can be prevented.
• the through-holes have a diameter of 300 ⁇ m or less, they are inconspicuous on the surface of the pressure-sensitive adhesive sheet and do not impair the appearance of the pressure-sensitive adhesive sheet. Further, since the hole density of the through holes is 50,000 / 100 cm 2 or less, the mechanical strength of the pressure-sensitive adhesive sheet is maintained.
• the pressure-sensitive adhesive layer usually has a relatively soft material strength
• the through-holes formed in the pressure-sensitive adhesive layer are formed when the pressure-sensitive adhesive sheet attached to the adherend is exposed to a high temperature.
• at least a part of the adhesive layer in the depth direction is easily lost due to the flow of the adhesive, and if the through-holes of the adhesive layer are crushed in such a manner, the air pocket is then removed, or Can no longer be prevented or eliminated.
• the pressure-sensitive adhesive sheet according to the above invention by defining the storage elastic modulus and the loss tangent of the pressure-sensitive adhesive layer as described above, the pressure-sensitive adhesive sheet is exposed to a high temperature (for example, 120 ° C) after the adherend is attached. Even when this occurs, the through hole of the pressure-sensitive adhesive layer is not crushed, and a predetermined hole diameter can be maintained.
• the through holes are formed by laser processing (Invention 3).
• the laser filter fine through holes with good air bleeding property can be easily formed at a desired hole density.
• the method of forming the through hole is not limited to this, and the through hole may be formed by, for example, a water jet, a micro drill, a precision press, a hot needle, a hot hole, or the like.
• the pressure-sensitive adhesive sheet of the present invention it is possible to prevent or remove air pockets and blisters while maintaining a sufficient adhesive force without impairing the appearance. Further, the adhesive sheet of the present invention is excellent in air bleeding property even when exposed to a high temperature after the adherend is adhered. Even if blisters are generated, a strong air pocket can be removed and prevented.
• FIG. 1 is a sectional view of an adhesive sheet according to one embodiment of the present invention.
• FIG. 2 is a cross-sectional view showing one example of a method for producing a pressure-sensitive adhesive sheet according to one embodiment of the present invention.
• FIG. 1 is a cross-sectional view of the pressure-sensitive adhesive sheet according to one embodiment of the present invention.
• the pressure-sensitive adhesive sheet 1 As shown in FIG. 1, the pressure-sensitive adhesive sheet 1 according to the present embodiment is formed by laminating a substrate 11, a pressure-sensitive adhesive layer 12, and a release material 13. However, the release material 13 is released when the adhesive sheet 1 is used.
• this pressure-sensitive adhesive sheet 1 a plurality of through holes 2 penetrating through the base material 11 and the pressure-sensitive adhesive layer 12 and reaching the pressure-sensitive adhesive sheet surface 1A and the pressure-sensitive adhesive surface 1B are formed.
• air between the adherend and the pressure-sensitive adhesive surface 1B of the pressure-sensitive adhesive layer 12 and gas generated from the adherend escape from the through-hole 2 to the outside of the pressure-sensitive adhesive sheet surface 1A. As a result, air pockets and blisters can be prevented or eliminated.
• the cross-sectional shape of the through-hole 2 is not particularly limited, but the diameter of the through-hole 2 in the substrate 11 and the pressure-sensitive adhesive layer 12 is 0.1 to 300 ⁇ m, preferably 0.5 to 150 ⁇ m. ⁇ m. If the diameter of the through hole 2 is less than 0.1 / im, it is difficult for air or gas to escape.If the diameter of the through hole 2 exceeds 300 ⁇ m, the through hole 2 becomes conspicuous and impairs the appearance of the adhesive sheet 1. No.
• the hole diameter of the through-hole 2 on the adhesive sheet surface 1A is 40 ⁇ m or less, the hole itself (the internal space of the through-hole 2) may become invisible to the naked eye.
• the upper limit of the hole diameter of the through hole 2 on the pressure-sensitive adhesive sheet surface 1A is preferably set to 40 ⁇ m.
• the pore diameter inside the base material 11 and the pressure-sensitive adhesive layer 12 that can be affected only by the surface 1A of the pressure-sensitive adhesive sheet can affect the hole visibility.
• the upper limit of the pore size in the inside of the material 11 and in the pressure-sensitive adhesive layer 12 is 60 zm.
• the hole diameter of the through hole 2 may be constant in the thickness direction of the pressure-sensitive adhesive sheet 1, or may vary in the thickness direction of the pressure-sensitive adhesive sheet 1, When the hole diameter changes in the thickness direction of the adhesive sheet 1, the hole diameter of the through-hole 2 gradually decreases from the adhesive surface 1B to the adhesive sheet surface 1A. It is preferred that it be smaller. By changing the hole diameter of the through-hole 2 in this way, the through-hole 2 becomes less noticeable on the surface 1A of the pressure-sensitive adhesive sheet, and the appearance of the pressure-sensitive adhesive sheet 1 can be kept good. However, even in this case, the hole diameter of the through-hole 2 in the base material 11 and the pressure-sensitive adhesive layer 12 needs to be within the above range (0.1 300 ⁇ m).
• the hole density of the through holes 2 is less than 30 ZlOOcm 2
• the air or pore density of difficulty ingredients through holes 2 missing gas exceeds 50,000 / 100 cm 2
• the mechanical strength of the pressure-sensitive adhesive sheet 1 is lowered .
• the through-hole 2 is preferably formed by a laser filter described later. According to the laser filter, fine through holes with good air bleeding property can be easily formed with a desired hole density.
• the method of forming the through hole 2 is not limited to this, and for example, the through hole 2 may be formed by a water jet, a micro drill, a precision press, a hot needle, a molten hole, or the like.
• the material of the base material 11 is not particularly limited as long as it can form the above-described through-holes 2.
• the material include a resin film, a metal film, a metal-deposited resin film, Paper, a laminate thereof, and the like. These materials may contain various additives such as an inorganic filler, an organic filler, and an ultraviolet absorber.
• the substrate 11 When the substrate 11 is made of a resin film, the substrate 11 may be opaque or transparent. Generally, when the substrate 11 is opaque, the through holes 2 are less noticeable.
• a decoration layer may be formed on the surface of the material by, for example, printing, printing, application of paint, transfer from a transfer sheet, vapor deposition, sputtering, or the like.
• An undercoat layer such as an easy-adhesion coat or a dalos adjustment coat, may be formed, or a top coat layer, such as a hard coat or a contamination prevention coat, may be formed.
• the decorative layer, the undercoat layer or the topcoat layer may be formed on the entire surface of the above-mentioned material, or may be formed partially.
• the resin film examples include polyolefin such as polyethylene and polypropylene, polyester such as polyethylene terephthalate and polybutylene terephthalate, polyvinyl chloride, polystyrene, polyurethane, polycarbonate, polyamide, polyimide, polymethyl methacrylate, and polybutene.
• polyolefin such as polyethylene and polypropylene
• polyester such as polyethylene terephthalate and polybutylene terephthalate
• polyvinyl chloride polystyrene
• polyurethane polycarbonate
• polyamide polyamide
• polyimide polymethyl methacrylate
• polybutene examples include polybutene.
• polybutadiene Polymethylpentene, ethylene butyl acetate Copolymer, ethylene (meth) acrylic acid copolymer, ethylene (meth) acrylate copolymer, ABS resin, ionomer resin; thermoplastic elastomer containing components such as polyolefin, polyurethane, polystyrene, polychlorinated butyl, and polyester Films made of such resins, foamed films, or laminated films thereof can be used.
• the resin finolem a commercially available resin may be used, or a resin finolem formed by a casting method using a process material may be used.
• the paper for example, high-quality paper, dalasin paper, coated paper, laminated paper, and the like can be used.
• the process material is not particularly limited as long as it is made of a material capable of forming the through-hole 2 by a desired drilling method.
• various papers, polyethylene terephthalate, polypropylene, A film obtained by subjecting a resin film of polyethylene or the like to a release treatment of a silicone-based, polyester-based, acrylic-based, alkyd-based, urethane-based or the like or a synthetic resin can be used.
• the thickness of the process material is usually about 10 to 200 zm, preferably about 25 to 150 / im.
• the thickness of the base material 11 can be appropriately changed depending on the use of the adhesive sheet 1, which is usually about 1 1 500 ⁇ 500 ⁇ , preferably about 3 to 300 / im.
• the pressure-sensitive adhesive layer 12 When the pressure-sensitive adhesive sheet 1 is exposed to the temperature of the maximum Tmax (here, 20 ° C ⁇ Tmax ⁇ 130 ° C) after the adherend is adhered, the pressure-sensitive adhesive layer 12
• the storage elastic modulus is 4.5 ⁇ 10 3 Pa or more, preferably 5.0 ⁇ 10 3 —5.0 ⁇ 10 6 Pa, and the loss tangent at Tmax is 0.78 or less, preferably 0.01 ⁇ Must be 0.75.
• the pressure-sensitive adhesive layer 12 satisfies these conditions, even when the pressure-sensitive adhesive sheet 1 affixed to the adherend is exposed to the temperature of Tmax, the through-hole 2 does not collapse due to the flow of the pressure-sensitive adhesive.
• the hole diameter can be maintained. That is, even when the pressure-sensitive adhesive sheet 1 is placed at a high temperature after the adherend is attached, the shape of the through hole 2 is stable, and the air pockets and the removal of blisters can be prevented.
• the temperature at which the pressure-sensitive adhesive sheet 1 can be exposed after the adherend is attached is usually about 120 ° C in most cases, and thus the storage elastic modulus and the loss tangent are fixed at 120 ° C. It can also be specified as a value.
• the kind of the adhesive constituting the adhesive layer 12 includes the above-mentioned storage elastic modulus and loss.
• the material is not particularly limited as long as it has a loss tangent, and may be any of acrylic, polyester, polyurethane, rubber, silicone, and the like.
• the pressure-sensitive adhesive may be a cross-linking type or a non-cross-linking type, which may be any of an emulsion type, a solvent type, and a non-solvent type.
• the thickness of the pressure-sensitive adhesive layer 12 is usually 1 to 300 x m, and preferably about 5 to 100 Pm.
• the material of the release material 13 is not particularly limited as long as it can form the through-hole 2 as described above.
• a film made of a resin such as polyethylene terephthalate, polypropylene, or polyethylene or Those obtained by subjecting such a foamed film or paper such as dalasin paper, coated paper, or laminated paper to a release treatment with a release agent such as a silicone-based, fluorine-based, or long-chain alkyl group-containing carbamate can be used.
• the thickness of the release material 13 is usually about 10 to 250 zm, preferably about 20 to 200 ⁇ m.
• the thickness of the release agent in the release material 13 is usually 0.05-5 ⁇ , preferably 0.1-3 ⁇ ⁇ .
• the through-hole 2 in the pressure-sensitive adhesive sheet 1 according to the present embodiment may also penetrate the force release material 13 that penetrates only the base material 11 and the pressure-sensitive adhesive layer 12.
• the pressure-sensitive adhesive sheet 1 according to the present embodiment includes the release material 13, but the present invention is not limited to this, and the release material 13 may be omitted. Furthermore, the size, shape, and the like of the pressure-sensitive adhesive sheet 1 according to the present embodiment are not particularly limited.
• the pressure-sensitive adhesive sheet 1 may be a tape-shaped (pressure-sensitive adhesive tape) composed of only the base material 11 and the pressure-sensitive adhesive layer 12, and may be wound into a roll and formed into a roll.
• the pressure-sensitive adhesive layer 12 is formed on the release-treated surface of the release material 13.
• an adhesive that make up the adhesive layer 12 a coating agent containing the optionally further solvent to prepare a roll coater, Na Ifuko " ⁇ ' ⁇ , mouth 1 Norenaifuko " ⁇ ' ⁇ , Eanaifuko” ⁇ data 1 to, Daigo 1 to data 1 to bar' ⁇ co-1 to data
• the coating material such as a gravure coater or a curtain coater may be applied to the release-treated surface of the release material 13 and dried.
• the substrate 11 is pressed on the surface of the pressure-sensitive adhesive layer 12 to form a laminate including the substrate 11, the adhesive layer 12, and the release material 13. .
• the release material 13 is peeled off from the adhesive layer 12, as shown in FIG. 2 (e)
• the release material 13 penetrates through the laminate composed of the base material 11 and the adhesive layer 12. The hole 2 is formed, and the release material 13 is again adhered to the pressure-sensitive adhesive layer 12 as shown in FIG.
• the through-hole 2 is formed by a laser cutter, and the pressure-sensitive adhesive layer 12 is directly irradiated with a laser from the pressure-sensitive adhesive layer 12 side.
• the hole diameter of the through-hole 2 is smaller on the base material 11 side than on the release material 13 side. Therefore, the through holes 2 become less noticeable on the surface of the pressure-sensitive adhesive sheet 1, and the appearance of the pressure-sensitive adhesive sheet 1 can be kept good.
• the through-hole 2 opening of the pressure-sensitive adhesive layer 12 becomes a molten material of the release material 13, so-called dross. Therefore, the through-holes 2 which are unlikely to enter water or the like which may adversely affect the pressure-sensitive adhesive sheet 1 having a high accuracy of the hole diameter and the hole density can be formed.
• the laser irradiation time can be reduced or the output energy of the laser can be reduced by not interposing the release material 13. When the output energy of the laser is small, the thermal effect on the pressure-sensitive adhesive layer 12 and the base material 11 is reduced, and it is possible to form the well-formed through hole 2 with little dross or the like.
• the type of laser used for laser processing is not particularly limited.
• a carbon dioxide (CO 2) laser for example, a TEA-CO laser, a YAG laser, a UV-YAG laser, an excimer laser
• Lasers semiconductor lasers, YVO lasers, YLF lasers, etc. can be used.
• a peelable protective sheet may be laminated on the surface of the base material 11 at an arbitrary stage before performing the laser irradiation.
• a protective sheet for example, a known pressure-sensitive adhesive protective sheet composed of a substrate and a removable pressure-sensitive adhesive layer can be used.
• the dross is attached to the surface of the base material 11 where a dross may adhere to the periphery of the opening of the through hole 2.
• the protection sheet is attached instead of the base material 11, so that the appearance of the pressure-sensitive adhesive sheet 1 can be kept better.
• the pressure-sensitive adhesive layer 12 was formed on the release material 13, and the formed pressure-sensitive adhesive layer 12 and the base material 11 were bonded.
• the pressure-sensitive adhesive layer 12 may be formed directly on the substrate 11.
• laser peeling may be performed with the release material 13 laminated, or laser may be irradiated from the base material 11 or the protective sheet side.
• the release material 13 When attaching the pressure-sensitive adhesive sheet 1 to an adherend, the release material 13 is peeled from the pressure-sensitive adhesive layer 12, and the exposed pressure-sensitive adhesive surface 1B of the pressure-sensitive adhesive layer 12 is brought into close contact with the adherend. Press 1 against the adherend. At this time, the air between the adherend and the adhesive surface 1B of the adhesive layer 12 passes through the through hole 2 formed in the adhesive sheet 1 to the outside of the adhesive sheet surface 1A, so that the adherend and the adhesive surface 1B Is prevented from being trapped in the air between them. Even if air is entrained and an air pocket is formed, the air is trapped from the through-hole 2 and the adhesive sheet surface 1A by re-pressing the air pool or the air pool area including the air pool. The air pocket disappears. Such an air pocket can be removed even after a long time has passed since the adhesive sheet 1 was attached.
• the force capable of preventing or removing air pockets and blisters as described above. Since the through-holes 2 formed in the pressure-sensitive adhesive sheet 1 are very fine, the pressure-sensitive adhesive sheet In addition, even if the through-holes 2 are present, there is no possibility that the adhesive strength is reduced.
• the pressure-sensitive adhesive sheet 1 is excellent in air bleeding property even when exposed to a high temperature after the adherend is adhered. Therefore, when the residual air pool or insufficient follow-up to the concave portion of the adherend is found after the high-temperature exposure, Even when blisters are generated, force and air pockets can be removed and prevented.
• Acrylic solvent-based adhesive available from Lintec Co., Ltd., FPM-11, thickness: 175 m
• a coating agent manufactured by Lintec Corporation, MF was applied using a knife coater so that the thickness after drying became 30 ⁇ m, and dried at 90 ° C for 1 minute.
• a black opaque base material made of polychlorinated vinyl resin was pressure-bonded to the adhesive layer thus formed to obtain a three-layer laminate.
• the laminate force is peeled off and the adhesive layer side force is irradiated with a CO laser to the laminate.
• the storage elastic modulus and loss tangent of the pressure-sensitive adhesive layer in the obtained pressure-sensitive adhesive sheet were measured using a viscoelasticity measuring device (manufactured by Rheometrics Co., Ltd., device name: DYNAMIC ANALYZER RDA II) at 23 ° C. at 1 Hz and 80 ° C. ° C, 100 ° C and 120 ° C values were measured. The results are shown in Table 1.
• An adhesive sheet was produced in the same manner as in Example 1, except that the diameter was about 30 x m and the pore diameter on the adhesive face was about 45 zm. Then, the storage elastic modulus and the loss tangent of the pressure-sensitive adhesive layer in the obtained pressure-sensitive adhesive sheet were measured in the same manner as in Example 1. The results are shown in Table 1.
• the example was performed using an acrylic solvent-based adhesive (Lintec, PK) as the adhesive, with the through-hole having a pore diameter of about 30 ⁇ on the substrate surface and a pore diameter of about 80 / im on the adhesive surface.
• An adhesive sheet was produced in the same manner as in 1. Then, the storage elastic modulus and the loss tangent of the pressure-sensitive adhesive layer in the obtained pressure-sensitive adhesive sheet were measured in the same manner as in Example 1. Table 1 shows the results. [Example 4]
• Example 2 A rubber-based solvent-type adhesive (Lintec, PV-2) was used as the adhesive, and the through hole had a diameter of about 30 xm on the substrate surface and a diameter of about 80 zm on the adhesive surface.
• An adhesive sheet was produced in the same manner as in 1. Then, the storage elastic modulus and the loss tangent of the pressure-sensitive adhesive layer in the obtained pressure-sensitive adhesive sheet were measured in the same manner as in Example 1. The results are shown in Table 1.
• Acrylic emulsion type adhesive (Lintec, MHL) is used as the adhesive, and a white opaque base made of polypropylene resin containing an inorganic filler as the base (Oji Yuka, Upo SGS80, thickness : 80 / m), and the adhesive sheet was prepared in the same manner as in Example 1 except that the through-hole had a pore size of about 30 ⁇ on the substrate surface and a pore size of about 80 / im on the adhesive face. Then, the storage elastic modulus and the loss tangent of the pressure-sensitive adhesive layer in the obtained pressure-sensitive adhesive sheet were measured in the same manner as in Example 1. The results are shown in Table 1.
• An acrylic emulsion-type adhesive (Lintec KV-12) was used as the adhesive, and the through hole had a diameter of about 40 ⁇ m on the substrate surface and a diameter of about 90 ⁇ m on the adhesive surface.
• An adhesive sheet was produced in the same manner as in Example 6. Then, the storage elastic modulus and the loss tangent of the pressure-sensitive adhesive layer in the obtained pressure-sensitive adhesive sheet were measured in the same manner as in Example 1. The results are shown in Table 1.
• Acrylic emulsion type adhesive (PC, manufactured by Lintec Corporation) is used as the adhesive.
• the diameter of the through-hole on the substrate surface is about 70 ⁇ m, and the diameter of the hole on the adhesive surface is about 100 ⁇ m.
• an adhesive sheet was produced in the same manner as in Example 6. Then, the storage elastic modulus and the loss tangent of the pressure-sensitive adhesive layer in the obtained pressure-sensitive adhesive sheet were measured in the same manner as in Example 1. Table 1 shows the results.
• the example was conducted using a rubber-based solvent-type adhesive (Lintec, PT-3) as the adhesive, with the through hole having a diameter of about 40 xm on the base material surface and a diameter of about 80 zm on the adhesive surface.
• An adhesive sheet was produced in the same manner as in 1. Then, the storage elastic modulus and the loss tangent of the pressure-sensitive adhesive layer in the obtained pressure-sensitive adhesive sheet were measured in the same manner as in Example 1. The results are shown in Table 1.
• Both sides of high-quality paper (weighing 110 g / m 2 ) were laminated with a low-density polyethylene resin so that the thickness of the laminate layer was 25 zm, and a silicone-based release agent was applied to one side.
• a metal embossing roll was pressed against the release-treated surface at 80 ° C. to form a recess on the release-treated surface, and this was used as a release material.
• a laminate having a three-layer structure (base material + adhesive layer + release material) was prepared in the same manner as in Example 1 except that the obtained release material and the adhesive used in Example 3 were used. This was used as an adhesive sheet. On the adhesive surface when the release material was peeled off from the adhesive sheet, substantially square convex portions in a plan view having a side length of 150 / im and a height of 10 ⁇ m were formed at intervals of 50 ⁇ m in length and width.
• Example 3 An adhesive sheet was produced in the same manner as in Example 3, except that no through-hole was formed. Then, the storage elastic modulus and the loss tangent of the pressure-sensitive adhesive layer in the obtained pressure-sensitive adhesive sheet were measured in the same manner as in Example 1. The results are shown in Table 1.
• Air pool disappearance test The pressure-sensitive adhesive sheet cut to 50 mm X 50 mm and the release material was peeled off was Attach it to a melamine-coated plate with a partially spherical depression with a diameter of 15 mm and a maximum depth of lmm (there is an air pocket between the depression and the adhesive sheet). It was left for 24 hours at each of ° C, 100 ° C and 120 ° C. Next, after holding at room temperature (23 ° C., humidity 50%) for 1 hour, the pressure-sensitive adhesive sheet was pressed with a squeegee to check whether the air pockets could be removed.
• the pressure-sensitive adhesive sheet of the present invention is generally used when air pockets and blisters are easily generated in the pressure-sensitive adhesive sheet, for example, when the area of the pressure-sensitive adhesive sheet is large, or when gas is generated from an adherend. Particularly, it can be preferably used when exposed to a high temperature after the adherend is attached.

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• Chemical & Material Sciences (AREA)
• Organic Chemistry (AREA)
• Adhesive Tapes (AREA)
• Adhesives Or Adhesive Processes (AREA)
• Laminated Bodies (AREA)

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• 2004
  • 2004-02-27 JP JP2004053936A patent/JP4748941B2/ja not_active Expired - Lifetime
• 2005
  • 2005-02-21 US US10/590,514 patent/US20070254136A1/en not_active Abandoned
  • 2005-02-21 WO PCT/JP2005/002732 patent/WO2005083024A1/ja not_active Ceased
  • 2005-02-21 EP EP05719351A patent/EP1728842A4/en not_active Withdrawn
  • 2005-02-21 AU AU2005217263A patent/AU2005217263B2/en not_active Ceased
  • 2005-02-21 CA CA002557409A patent/CA2557409A1/en not_active Abandoned
  • 2005-02-21 KR KR1020067017154A patent/KR20060123595A/ko not_active Withdrawn
  • 2005-02-21 CN CN2005800060815A patent/CN1946821B/zh not_active Expired - Fee Related
  • 2005-02-24 TW TW094105544A patent/TW200532002A/zh unknown

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