WO2005062396A1 - 積層型圧電素子 - Google Patents
積層型圧電素子 Download PDFInfo
- Publication number
- WO2005062396A1 WO2005062396A1 PCT/JP2004/019447 JP2004019447W WO2005062396A1 WO 2005062396 A1 WO2005062396 A1 WO 2005062396A1 JP 2004019447 W JP2004019447 W JP 2004019447W WO 2005062396 A1 WO2005062396 A1 WO 2005062396A1
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- WIPO (PCT)
- Prior art keywords
- piezoelectric
- layer
- conductor
- piezoelectric element
- thickness
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- 239000004020 conductor Substances 0.000 claims abstract description 86
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 76
- 238000010304 firing Methods 0.000 claims abstract description 28
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 16
- 239000000203 mixture Substances 0.000 claims abstract description 12
- 229910052745 lead Inorganic materials 0.000 claims abstract description 3
- 238000002347 injection Methods 0.000 claims description 25
- 239000007924 injection Substances 0.000 claims description 25
- 239000000843 powder Substances 0.000 claims description 20
- 239000002994 raw material Substances 0.000 claims description 20
- 239000002131 composite material Substances 0.000 claims description 15
- 229910052760 oxygen Inorganic materials 0.000 claims description 13
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 12
- 239000001301 oxygen Substances 0.000 claims description 12
- 239000011800 void material Substances 0.000 claims description 12
- 239000000919 ceramic Substances 0.000 claims description 11
- 230000000737 periodic effect Effects 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 239000012508 resin bead Substances 0.000 claims description 10
- 239000013078 crystal Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 238000003860 storage Methods 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 5
- 229910052726 zirconium Inorganic materials 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 239000002003 electrode paste Substances 0.000 claims description 3
- 229910021476 group 6 element Inorganic materials 0.000 claims description 3
- 229910052741 iridium Inorganic materials 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910052707 ruthenium Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 229910052703 rhodium Inorganic materials 0.000 claims description 2
- 239000010419 fine particle Substances 0.000 claims 1
- 229910052762 osmium Inorganic materials 0.000 claims 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 239000000470 constituent Substances 0.000 description 12
- 239000002245 particle Substances 0.000 description 12
- 238000009413 insulation Methods 0.000 description 11
- 239000000446 fuel Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 238000010298 pulverizing process Methods 0.000 description 8
- 230000005684 electric field Effects 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 239000011324 bead Substances 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 230000010287 polarization Effects 0.000 description 4
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000010344 co-firing Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
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- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 241000894007 species Species 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 230000009189 diving Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004299 exfoliation Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 241001634822 Biston Species 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 244000132059 Carica parviflora Species 0.000 description 1
- 235000014653 Carica parviflora Nutrition 0.000 description 1
- 229910052692 Dysprosium Inorganic materials 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910052689 Holmium Inorganic materials 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 229910052775 Thulium Inorganic materials 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- FFGPTBGBLSHEPO-UHFFFAOYSA-N carbamazepine Chemical compound C1=CC2=CC=CC=C2N(C(=O)N)C2=CC=CC=C21 FFGPTBGBLSHEPO-UHFFFAOYSA-N 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
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- 238000001035 drying Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 230000000877 morphologic effect Effects 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 239000002574 poison Substances 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
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- 230000036316 preload Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000007569 slipcasting Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02M—SUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
- F02M51/00—Fuel-injection apparatus characterised by being operated electrically
- F02M51/06—Injectors peculiar thereto with means directly operating the valve needle
- F02M51/0603—Injectors peculiar thereto with means directly operating the valve needle using piezoelectric or magnetostrictive operating means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
- H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8548—Lead-based oxides
- H10N30/8554—Lead-zirconium titanate [PZT] based
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
Definitions
- the present invention relates to a multilayer piezoelectric element, and more particularly to a simultaneous firing type multilayer piezoelectric element in which a conductor layer and a piezoelectric layer are formed by simultaneous firing, a method for manufacturing the same, and the multilayer piezoelectric element.
- the injection device is a multilayer piezoelectric element, and more particularly to a simultaneous firing type multilayer piezoelectric element in which a conductor layer and a piezoelectric layer are formed by simultaneous firing, a method for manufacturing the same, and the multilayer piezoelectric element.
- a co-fired type multi-layer piezoelectric element having a columnar multi-layer piezoelectric body in which a conductor layer and a piezoelectric layer are formed by co-firing has conventionally been used as a piezoelectric actuator, a piezoelectric transformer, an ink jet printer head, or the like.
- a co-fired laminated piezoelectric element is composed of a ceramic green sheet (corresponding to a piezoelectric layer) and a conductor pattern as described in, for example, JP-A-2002-293365.
- a columnar laminated body in which turn layers (corresponding to conductor layers) are alternately laminated is simultaneously fired in the air to form a columnar laminated piezoelectric body, and external electrodes are formed on the side surfaces of the columnar laminated piezoelectric body. It is formed.
- an object of the present invention is to provide a laminated piezoelectric element in which a Pb-containing piezoelectric layer and a palladium (Pd) -containing conductor layer are formed by simultaneous firing, and in which the insulation resistance of the piezoelectric layer is large, and a method of manufacturing the same. To provide.
- Another object of the present invention is to provide an injection device using the above-mentioned laminated piezoelectric element.
- a region where Pb and Pd coexist is formed in a layer at the interface with the conductor layer.
- a laminated piezoelectric element having a thickness of 30/0 or less with respect to the thickness of the piezoelectric layer is provided.
- the regions each have a thickness of 1 to 3 o / o with respect to the thickness of the piezoelectric layer
- the thickness of the piezoelectric layer is 50 m or more
- the piezoelectric layer has a perovskite-type composite oxide having an ABO 3 type composition including a Pb at an A site and a Zr and a Ti at a B site as a crystal phase.
- the element ratio (AZB) between the A-site element and the B-site element present in the piezoelectric layer is less than 1;
- the thickness of the conductor layer is 1 / m or more
- the conductor layer contains, as a conductor component, at least a palladium-containing element of the Periodic Table, a Coral Group element, and a Group Ib element of the Periodic Table,
- the conductor layer contains at least one selected from the group consisting of Ni, Pt, Rh, Ir, Ru, and s as a Group VI element of the periodic table, and palladium. And contains at least one of Cu, Ag, and Au as a Group Ib element of the periodic table;
- Fine voids are distributed in the piezoelectric layer in an amount of 15% or less per volume of the piezoelectric layer
- the voids are distributed in a flat shape with the thickness direction of the piezoelectric layer being a short axis and the plane direction of the piezoelectric layer being a long axis;
- Forming a conductor paste layer by applying a conductor paste containing palladium as a conductor component to one surface of a green sheet molded using a piezoelectric raw material powder containing a Pb component;
- the step of forming the columnar laminate, the oxygen partial pressure is 1 0- 1 2 atm ⁇ 0 1 9 5 atm columnar laminated piezoelectric material by firing in an atmosphere of.;
- a storage container having an injection hole, the multilayer piezoelectric element accommodated in the storage container, and a valve for ejecting a liquid from the injection hole by driving the multilayer piezoelectric element.
- Pd in the conductor layer becomes Pb (existing in the form of oxide) in the piezoelectric layer. ) And diffuses into the piezoelectric layer.
- the piezoelectric layer formed between the two conductor layers has an interface between the conductor layer and the piezoelectric layer.
- 01 is formed in a layered manner (hereinafter, this layered area is referred to as a Pb-Pd mixed area).
- This Pb-Pd mixed region can be confirmed by an analytical electron microscope, as shown in Examples described later. In such a Pb-Pd mixed region, Pd exists in the form of an oxide or an alloy with Pb.
- the presence of the Pb-Pd mixed region as described above improves the adhesion between the conductor layer and the piezoelectric layer, but lowers the insulation resistance of the piezoelectric layer. If this insulating post is low, the capacitance will be low, resulting in a decrease in piezoelectric performance.
- the simultaneous firing with the conductor layer containing a piezoelectric layer and a P d containing P b component, the oxygen partial pressure is 1 0- 1 2 atm ⁇ 0.
- FIG. 1 is a schematic sectional view of one embodiment of the multilayer piezoelectric element of the present invention.
- FIG. 2 is a partially enlarged view showing a layered structure of the multilayer piezoelectric element of FIG.
- FIG. 3 is an enlarged cross-sectional view showing a piezoelectric layer in the multilayer piezoelectric element of FIG. 1 in an enlarged manner.
- FIG. 4 is a schematic diagram showing the structure of a piezoelectric layer in a preferred example of the present invention.
- FIG. 5 is an explanatory diagram of an injection device using the laminated piezoelectric element of FIG.
- this laminated piezoelectric element is a columnar laminated body in which a plurality of piezoelectric layers 1 and conductor layers (internal electrode layers) 3 are alternately laminated. (Element body) 5, and external electrode plates 7, 7 are connected to different side surfaces of the element body 5, and a lead wire 9 is connected to each external electrode plate 7. (That is, one of the external electrode plates 7, 7 becomes a positive electrode plate, and the other becomes a negative electrode plate.)
- the adjacent conductor layers 3 are connected to different external electrode plates 7, and when a predetermined voltage is applied to the external electrode plates 7, the adjacent piezoelectric layers 3 are connected to each other. 1 and 1 are configured so that electric fields in opposite directions are applied to each other, and displacement in the stacking direction occurs due to the reverse piezoelectric effect.
- a Pb-Pd mixed region 10 is formed at the interface between the piezoelectric layer 1 and the conductor layer 3.
- the piezoelectric layer 1 is formed of a piezoelectric ceramic containing a Pb component.
- a Pb-containing piezoelectric ceramic is an ABO 3- type composition bevelskite containing Pb as an A-site constituent element.
- 6-type composite oxide is precipitated as the main crystal phase.
- Particularly preferred as such a belovskite-type composite oxide is one containing Zr and Ti as the B site constituent element species.
- Such a belovskite-type composite oxide is ideally The following formula (1):
- a part of Pb present on the A site is replaced with another element, for example, at least one element selected from the group consisting of Ca, Sr, Ba, Nd, and Li. May be.
- some of the Zr and Ti of the B site may be replaced by other elements, and such B site replacing elements include Y, Dy, Ho, Er, and Tm. , Yb, Lu, W, Nb, Sb, and the like.
- One or more of such B-site-substituting elements partially substitute for Zr and Ti. May be.
- the element ratio (A / B) between the A-site constituent element and the B-site constituent element present in the piezoelectric layer 1 is less than 1, particularly 0.980 to 0. It is preferably in the range of 99.9.
- the B-site constituent element to be present in a slight excess as compared with the A-site constituent element, it is possible to allow most of the Pb element to stably exist in the A-site of the vitreous bushite composite oxide.
- the average valence of the B-site constituent element species is 4.002 to 4%. It is preferable that the content of these elemental species is set so as to be in the range of 0.09. In the piezoelectric layer 1 in which the average valence of the B-site constituent elements is in such a range, the amount of oxygen becomes excessive compared to the ideal composition of the bevelskite-type composite oxide, and as a result, the co-firing occurs.
- the reaction with Pb in the body layer 1 can be suppressed, and an increase in the thickness of the Pb-Pd mixed region can be effectively avoided.
- the average valence of the B-site constituent element means the valence of ionization resulting from the general excess or deficiency of electrons in the periodic table.
- the B-site constituent element type When the total amount of is 1 mol, Zr (valence: +4) is 0.4 mol, Ti (valence: +4) is 0.4 mol, and W (valence: +6) is 0 mol.
- the average crystal grain size of the perovskite composite oxide constituting the piezoelectric layer 1 is 1 to 6 im, particularly 1.5 to 4 / m, most preferably, in order to secure high piezoelectric properties and strength. Is preferably in the range of 2 to 3 m. This average crystal grain size can be controlled by the average grain size of the raw material powder and its calcined product.
- the thickness of the piezoelectric layer 1 is not particularly limited, a thickness of 50 ⁇ m or more is preferable in that a decrease in piezoelectric characteristics due to the Pb-Pd mixed region 10 can be suppressed. It is preferred to have.
- Conductive layer 3 contains at least Pd. That is, the conductor layer 3 is formed of a Group Ib metal of the periodic table (or an alloy thereof) such as Ag, Cu, or Au from the viewpoint of ensuring high electrical conductivity. However, in this case, the firing temperature is low, and it is difficult to simultaneously fire the piezoelectric layer 1 described above. For this reason, in the present invention, the conductor layer 3 is formed by using Pd in combination with the Group Ib metal (particularly preferably Ag). This allows simultaneous firing of the piezoelectric layer 1 and the conductor layer 3. Also, Pd can be combined with other Group VI metals of the Periodic Table and used in combination with Group Ib metals.
- a Group Ib metal of the periodic table or an alloy thereof
- the conductor layer 3 is formed by using Pd in combination with the Group Ib metal (particularly preferably Ag). This allows simultaneous firing of the piezoelectric layer 1 and the conductor layer 3.
- Pd can be combined with other Group VI metals of the Periodic Table and used in combination with Group Ib metal
- Group 1 metals other than Pd include Ni, Pt, R h, Ir, Ru and O s can be exemplified, and P t is particularly preferable.
- Such Group VI metals other than Pd can be used in amounts up to 5 mol% per Pd.
- the content of the group VI metal (including Pd) in the conductor layer 3 is Ml mass% and the content of the group Ib metal is M 2 mass%, the following conditions are satisfied;
- M 1 + M 2 100 mass. /.
- Satisfaction is preferred in that simultaneous firing is possible while ensuring high electrical conductivity.
- the conductor layer 3 contains a small amount of an inorganic dielectric component, for example, a perovskite-type composite oxide used for forming the piezoelectric layer 1 (or a composite oxide used for forming the composite oxide).
- An oxide component can be contained, whereby the adhesion between the internal electrode layer 3 and the piezoelectric layer 1 can be enhanced.
- the electrical conductivity of the conductive layer 3 is impaired. Therefore, such an inorganic dielectric component is used as a conductive component of the conductive layer 3. 5% by mass or less per total amount of Further, it is preferable that the particle diameter of the inorganic dielectric material is smaller than the average crystal particle diameter of the piezoelectric ceramic forming the piezoelectric layer 1.
- the thickness of the above-mentioned conductor layer 3 be 1 im or more. That is, by setting the thickness of the conductor layer 3 to 1 ⁇ m or more, even if a part of the conductor component (P d) in the conductor layer 3 diffuses into the piezoelectric layer 1, the influence of such diffusion is reduced. It can be effectively suppressed, the effective area of the conductor layer 3 can be maintained high, and a decrease in characteristics such as capacitance can be suppressed.
- a Pb—Pd mixed region 10 is formed at the interface between the piezoelectric layer 1 and the conductor layer 3.
- d Mixed area 10 is the thickness t!
- the simultaneous By adjusting the firing atmosphere during the firing, P b-P d mixed region 1 0 thickness t is smaller than the conventional multilayer piezoelectric element, the thickness of the piezoelectric layer 1 t 0 equivalent Li 3 ⁇ 1 ⁇ 2
- the content is suppressed to 2.90 / 0 or less, a decrease in the electrical insulation of the piezoelectric layer 1 due to the Pb—Pd mixed region 10 is suppressed, and a decrease in the piezoelectric characteristics is avoided.
- the obtained piezoelectric characteristics can be ensured.
- the P b-P d mixed region 1 0 thickness t is too thin, reduced adhesive strength between the piezoelectric layer 1 and the conductor layer 3, it becomes liable to occur exfoliation or the like, its thickness t lambda
- the thickness is preferably 1% or more per the thickness t0 of the piezoelectric layer 1.
- the number of the piezoelectric layers 1 and the number of the conductor layers 3 are preferably 100 to 400 layers, respectively, in order to obtain desired characteristics.
- the shape of the laminated piezoelectric element (element body 5) may be any column such as a quadrangular prism, a hexagonal prism, a circular column, or the like, but is preferably a quadrangular prism for ease of cutting.
- fine voids 13 are distributed in the piezoelectric layer 1 as shown in FIG. That is, by distributing such fine voids, the deformability of the piezoelectric layer 1 can be enhanced, and the amount of displacement due to the inverse piezoelectric effect can be increased.
- the total amount of such a hole 13 is set to 15% by volume or less, particularly 5% by volume with respect to the piezoelectric layer 1, it is necessary to avoid a decrease in the strength of the piezoelectric layer 1. It is suitable.
- the above-mentioned void 13 is formed by baking with mixing resin beads, and is deformed into a flat shape by the pressure applied in the manufacturing process. For example, as shown in FIG. It is distributed in the piezoelectric layer 1 in a shape with the direction being the short axis and the plane direction being the long axis. It is desirable that the voids 13 distributed in this manner have a small flatness. For example, when the length of the short axis is a and the length of the long axis is, the following conditions are satisfied;
- the shape of 3 can be adjusted by the particle size of the resin bead to be used and the temperature and pressure applied to the piezoelectric sheet for forming the piezoelectric layer before firing.
- a piezoelectric material powder having a predetermined composition is prepared, calcined, and then molded to produce a green sheet for a piezoelectric layer.
- the piezoelectric raw material powder is a mixture of the powder of the raw material compound for the A site and the powder of the raw material compound for the B site, and the raw material compound for the A site is Pb oxide and if necessary described above. An oxide or carbonate of the A-site substitution element is used.
- Pb oxides As raw material compounds for the site.Particularly, it is easy to pulverize, and it is stable to various solvents described below and does not cause composition fluctuation, and composition adjustment in that it is easy, Rukoto using P b 3 0 4 is desirable. These raw material compounds are usually mixed so as to satisfy the composition ratio of the above-mentioned formula (1), but in the present invention, the element ratio (AZB) between the A-site constituent element and the B-site constituent element is used. Should be mixed so as to be less than 1, especially 0.980 to 0.999.
- AZB element ratio
- the thickness of the Pb-Pd mixed region described above can be reduced by reducing the amount of the Pb raw material that does not contribute to the formation of the belovskite composite oxide.
- the above-mentioned raw material powder, 1 00 o ° firing at a low temperature in c below order to effectively perform it is preferable that an average particle diameter D 5 0 is adjusted to less fine 0. 8 m .
- Such pulverization can be performed using, for example, a vibration mill, an attritor, a ball mill, or the like.In particular, pulverization can be performed by wet pulverization using a ball mill having a diameter of 5 mm or less. preferable. Zirconia is preferred as the material of the pole, because it can suppress the contamination of impurities and can suppress the deterioration of the piezoelectric characteristics even when the impurities derived from the pole are mixed.
- the raw material powder finely divided as described above is dried at 900 ° C. or lower, preferably at 700 ° C. to 800 ° C., and more preferably at 730 ° C. It is calcined in the low temperature range of ° C.
- the resulting calcined product is by the appropriate pulverization Li, the average particle diameter D 5 0 becomes less 0. 8 jt m, such uniform as particularly cumulative particle diameter D 9 0 becomes less 0.1 9 ⁇ m It is desirable that the particle size is adjusted to have a particle size distribution. Further, by such pulverization, the BET specific surface area of 7 m 2 Z g or more, it is preferable that particularly a 8 m 2 Zg above.
- the calcined product can be reduced in pulverization (pulverization to such a degree that the agglomerates can be released), and the particle size can be adjusted as described above.
- firing at a low temperature of 1,000 ° C. or less the desired piezoelectric layer 1 can be formed.
- a green sheet for the piezoelectric layer can be obtained by molding using the calcined powder whose particle size has been adjusted as described above.
- This molding is performed by a means known per se. Can be.
- the calcined powder is mixed with an organic binder such as an acrylic resin, and if necessary, a solvent such as water or alcohol and a plasticizer are mixed to prepare a molding slurry.
- a green sheet can be obtained by molding means such as a doctor blade method and an extrusion molding method.
- the resin 13 should be contained in the above-mentioned molding slurry in such an amount that the volume ratio of the void 13 is within the above-mentioned range.
- ⁇ Mix beads The resin beads preferably have a shape close to a true sphere produced by emulsion polymerization or suspension polymerization so that a uniform shaped void 13 is formed.
- the diameter is preferably in the range of about 1 to 30 / m.
- beads made of polyolefin such as polyethylene or polypyrene or beads made of acrylic resin such as poly (meth) acrylate are preferably used from the viewpoint of cost and the like.
- a conductor prepared by mixing the above-described conductor layer-forming conductor component containing Pd as a conductor component with an organic binder-solvent on one surface of the piezoelectric sheet green sheet produced as described above.
- the paste is printed by a screen printing method to form a conductor paste layer corresponding to the conductor layer 3.
- a predetermined number of green sheets on which such a conductive paste layer is formed are laminated, and a conductive paste is applied to the uppermost and lowermost layers of the laminate. Green sheets that are not formed are laminated to produce a columnar laminated body corresponding to the element body 5.
- the columnar laminate is heated at 50 to 200 ° C.
- the binder is removed by heating for about 40 hours, followed by firing.
- the resin beads described above are blended in the green sheet, the resin beads are slightly flattened by pressing and heating of the columnar laminate, as shown in FIG.
- the resin beads are distributed in a morphological manner, and the binder is removed to form a poison 13.
- the shape of the void 13 slightly changes due to shrinkage during firing, but basically depends on the shape of the resin beads at the time of pressing and heating the columnar laminate. It is set so as to generate a void 13 that satisfies the conditions described above. For example, when the pressure is high and the heating temperature is high, the deformation of the resin beads is large, and voids 13 having a high flatness are generated.
- the firing is performed in a low-temperature region of 100 ° C. or less, particularly, 950 ° C. to 980 ° C., for about 2 to 5 hours, whereby the conductive paste layer and the green sheet are simultaneously fired.
- Element body in which dense piezoelectric layers 1 and conductor layers 3 are alternately stacked A laminated sintered body corresponding to 5 is obtained.
- the above calcination is performed in an atmosphere having an oxygen partial pressure of 10 to 12 atm to 0.195 atm.
- pd in the conductive paste layer reacts appropriately with the Pb component (lead oxide) in the green sheet and diffuses into the green sheet.
- the Pb-Pd mixed region 10 having an appropriate thickness described above is formed at the interface between the layer 1 and the conductor layer 3.
- the amount of Pd that reacts with the Pb component increases, and as a result, the Pd formed in the piezoelectric layer 1
- the thickness t of the b-Pd mixed region 10 becomes larger than the above-mentioned range, and the insulation resistance of the piezoelectric layer 1 is reduced.
- the oxygen partial pressure in the firing atmosphere should be set to a particularly low side even within the above range. preferable for preventing the oxidation of Ya C U.
- the end of the internal electrode layer 2 is exposed on the side surface of the element body (laminated sintered body) 5 obtained above. For this reason, on two predetermined side surfaces of the element body 5, the ends of the internal electrode layer 2 are ground every other layer to form a groove.
- the groove formed on one side surface and the groove formed on the other side surface are alternated.
- these grooves usually have a depth of about 50 to 150 jt / m, and a width (length in the stacking direction) of about 50 to 100 m.
- the groove formed in this way is filled with an insulator such as silicone rubber, if necessary, and the external electrode plate 7 is adhered to each side having such a groove with an adhesive or the like.
- one external electrode plate 7 and the other external electrode plate 7 have a structure in which they are alternately connected to ends of different internal electrode layers 3, respectively.
- the lead wire 9 is connected to each of the external electrode plates 7, 7 to obtain a laminated piezoelectric element having the structure shown in FIGS. 1 and 2.
- This multi-layer piezoelectric element is coated with a silicone rubber on the outer peripheral surface by diving or the like, and then subjected to a polarization treatment by applying a polarization electric field of 3 kV / mm, thereby finally forming a piezoelectric actuator. Provided for use.
- the conductor layer serving as the internal electrode layer can be manufactured by co-firing with the piezoelectric layer, and furthermore, the reduction of the insulation resistance of the piezoelectric layer is suppressed, and a high capacitance is secured. It has excellent piezoelectric properties.
- Such a laminated piezoelectric element is useful as an injection device for a medium such as various fuels and gases.
- Such an injection device is one in which a multilayer piezoelectric element having the above-described structure is accommodated in a storage container having an injection hole, for example, and a liquid is ejected from the injection hole by driving the multilayer piezoelectric element. It has a valve to let
- FIG. 5 shows an example of the structure of the above-described injection device.
- a laminated piezoelectric element (piezoelectric actuator) 43 having the above-described structure is accommodated inside a cylinder 39 of a storage container 31.
- An injection hole 33 is provided at one end of the storage container 31, and a needle valve 35 that can open and close the injection hole 33 is stored in the storage container 31.
- a fuel passage 37 is connected to the injection hole 33 so as to be shut off by a needle valve 35, and the fuel passage 37 is connected to an external fuel supply source. Is supplied at high pressure. That is, when the needle valve 35 opens the injection hole 33, the fuel supplied to the fuel passage 37 is jetted at a constant high pressure into a fuel chamber (not shown) of the internal combustion engine. I have.
- the upper end of the needle valve 35 has a large diameter, and is connected to a biston 41 slidable in the cylinder 39.
- the piston 41 is urged upward by a disc spring 45.
- a piezoelectric actuator 43 housed in a cylinder 39.
- the piezoelectric actuator 43 contracts, the disc spring 45 pushes back the piston 4 1, and the injection hole 33 communicates with the fuel passage 37 to inject fuel. It has become.
- Such an injection device employs the above-described high-performance and low-cost laminated piezoelectric element as an actuator which is the heart of the injection device. Therefore, according to the present invention, it is possible to achieve higher performance and lower cost of the injection device.
- the element ratio (A / B) between the A-site element and the B-site element is set to 0.99-1 (see Table 1), and the average valence of the B-site is 4.00. It is set to 5.
- the above raw material powder, dehydrated, dried, 7 5 0 was disintegrated after 3 hours calcined in ° C, mean particle size of the calcined product with (D 50) 0. 8 m or less, the BET specific surface area 8 Adjusted to m 2 g or more.
- a slurry was prepared by mixing the above calcined powder, an acryl resin binder, and dibutyl phthalate (plasticizer), and a ceramic green having a thickness of 150 ⁇ m was formed by a slip casting method.
- a sheet was prepared.
- a conductor base mainly composed of Ag-Pd and having the AgZPd ratio shown in Table 1
- the paste is printed in a predetermined pattern to a thickness of 5 m by a screen printing method, the conductor paste is dried, and then a plurality of green sheets on which a conductor paste layer is formed are laminated on 200 sheets. On both the upper end and the lower end of the laminate, 10 green sheets to which the conductive paste was not applied were laminated.
- the laminate is pressed at 100 ° C. while being heated, the laminate is integrated, cut into a size of 12 mm ⁇ 12 mm, and then cut at 800 ° C.
- main firing was performed at 950 to 100 ° C for 2 hours in an atmosphere having an oxygen partial pressure shown in Table 1 to obtain a laminated sintered body that became the main body of the actuator. Obtained.
- External electrode plates (a positive electrode plate and a negative electrode plate) were formed on the two sides of the laminated sintered body at the ends of the piezoelectric ceramic including the ends of the internal electrodes so as to be alternated on the two sides. Thereafter, lead wires are connected to the positive and negative electrode plates, and the outer peripheral surface is coated with silicone rubber by diving, followed by applying a polarization voltage of 3 kV / mm and performing a polarization process to obtain a laminated piezoelectric element.
- the thickness, insulation resistance, effective piezoelectric strain constant, and Curie temperature of the Pb-Pd mixed region in the piezoelectric layer were evaluated by the following methods. Are shown in Table 1.
- the thickness of the Pb-Pd mixed region was determined by polishing the cut cross section of the piezoelectric layer and analyzing the elemental components using an analytical electron microscope, and expressed as a ratio to the thickness of the piezoelectric layer.
- the insulation resistance was represented by a resistance value measured after applying a voltage of 1 V for 30 seconds.
- the Curie temperature was determined by measuring the temperature characteristics of the capacitance of the piezoelectric ceramic. (table 1 )
- Sample N o. 2 7 is a laminated piezoelectric element of the present invention, no exfoliation, insulation resistance 4 X 1 0 8 Omega
- the effective piezoelectric strain constant was 860 pm / V or more, and the Curie temperature was high and stable at 328 ° C.
- the relative strength of the porcelain forming the piezoelectric layer was high. The densities were all over 950/0 and the average crystal grain size of the porcelain was 16 jUm.
- the thickness of the Pb-Pd mixed region was as large as 40, and the insulation was large. resistance and 1 0 8 ⁇ , were lower than the samples of the present invention.
- a laminated piezoelectric element was produced in exactly the same manner as in Sample No. 27 of Experimental Example 1 except that polyethylene beads having a particle size of 500 jwm were mixed with the calcined powder as a raw material (green).
- the integration of the sheet laminate by heating and pressing was performed at a temperature of 100 ° C and a pressure of 10 MPa).
- a voltage of 2 kVZmm was applied to such a stacked piezoelectric element and the displacement was confirmed.
- the displacement was larger than that of the sample in Experimental Example 1 in which no void was formed.
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- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Fuel-Injection Apparatus (AREA)
- Compositions Of Oxide Ceramics (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Abstract
Description
Claims
Priority Applications (3)
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CN2004800390134A CN1898812B (zh) | 2003-12-24 | 2004-12-17 | 层压压电器件 |
EP04807803A EP1717873B1 (en) | 2003-12-24 | 2004-12-17 | Multilayered piezoelectric element |
US10/596,475 US7656077B2 (en) | 2003-12-24 | 2004-12-17 | Laminated piezoelectric device |
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JP2003-426902 | 2003-12-24 | ||
JP2003426902A JP4593912B2 (ja) | 2003-12-24 | 2003-12-24 | 積層型圧電素子およびその製法、並びに噴射装置 |
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PCT/JP2004/019447 WO2005062396A1 (ja) | 2003-12-24 | 2004-12-17 | 積層型圧電素子 |
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US (1) | US7656077B2 (ja) |
EP (1) | EP1717873B1 (ja) |
JP (1) | JP4593912B2 (ja) |
CN (1) | CN1898812B (ja) |
WO (1) | WO2005062396A1 (ja) |
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US20200185590A1 (en) * | 2018-12-11 | 2020-06-11 | Facebook Technologies, Llc | Spatially addressable nanovoided polymers |
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JP4593912B2 (ja) * | 2003-12-24 | 2010-12-08 | 京セラ株式会社 | 積層型圧電素子およびその製法、並びに噴射装置 |
JP4735837B2 (ja) * | 2006-03-24 | 2011-07-27 | Tdk株式会社 | 積層型圧電素子の製造方法及び積層型圧電素子 |
CN101252330B (zh) * | 2008-03-27 | 2010-09-29 | 大连理工大学 | 一种用压电叠堆精密定位的方法和装置 |
JP4655243B2 (ja) * | 2008-09-09 | 2011-03-23 | ソニー株式会社 | スピーカシステムおよびスピーカ駆動方法 |
DE102010005403A1 (de) * | 2010-01-22 | 2011-07-28 | Epcos Ag, 81669 | Verfahren zur Herstellung eines piezoelektrischen Vielschichtbauelements und piezoelektrisches Vielschichtbauelement |
JP2011166901A (ja) * | 2010-02-08 | 2011-08-25 | Nikon Corp | 振動アクチュエータ、これを備えるレンズ鏡筒及びカメラ |
JP5905292B2 (ja) * | 2012-02-21 | 2016-04-20 | 日本碍子株式会社 | 圧電素子及び圧電素子の製造方法 |
TWI604936B (zh) * | 2013-10-11 | 2017-11-11 | Yao-Hong Qiu | Large single-layer ceramic passive element with composite electrode layer |
JP6381246B2 (ja) * | 2014-03-25 | 2018-08-29 | 日本特殊陶業株式会社 | 圧電素子およびその製造方法 |
CN104092402A (zh) * | 2014-07-31 | 2014-10-08 | 王少夫 | 一种压电陶瓷变压器 |
CN110965136B (zh) * | 2019-11-08 | 2022-01-28 | 北京科技大学 | 一种基于钙钛矿聚合物复合材料的柔性压电纳米发电机制备方法 |
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- 2004-12-17 CN CN2004800390134A patent/CN1898812B/zh not_active Expired - Fee Related
- 2004-12-17 WO PCT/JP2004/019447 patent/WO2005062396A1/ja active Application Filing
- 2004-12-17 EP EP04807803A patent/EP1717873B1/en not_active Ceased
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US20200185590A1 (en) * | 2018-12-11 | 2020-06-11 | Facebook Technologies, Llc | Spatially addressable nanovoided polymers |
US11448798B1 (en) | 2018-12-11 | 2022-09-20 | Meta Platforms Technologies, Llc | Nanovoided graded-index optical elements, optical arrays, and methods of forming the same |
US11594672B2 (en) * | 2018-12-11 | 2023-02-28 | Meta Platforms Technologies, Llc | Spatially addressable nanovoided polymers |
US11953702B1 (en) | 2018-12-11 | 2024-04-09 | Meta Platforms Technologies, Llc | Nanovoided graded-index optical elements, optical arrays, and methods of forming the same |
Also Published As
Publication number | Publication date |
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US7656077B2 (en) | 2010-02-02 |
JP4593912B2 (ja) | 2010-12-08 |
CN1898812B (zh) | 2010-11-24 |
EP1717873A1 (en) | 2006-11-02 |
EP1717873B1 (en) | 2011-08-17 |
US20070209173A1 (en) | 2007-09-13 |
EP1717873A4 (en) | 2010-04-07 |
JP2005191049A (ja) | 2005-07-14 |
CN1898812A (zh) | 2007-01-17 |
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