WO2005005686A1 - 金属酸化物被膜の成膜方法および蒸着装置 - Google Patents
金属酸化物被膜の成膜方法および蒸着装置 Download PDFInfo
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- WO2005005686A1 WO2005005686A1 PCT/JP2004/009903 JP2004009903W WO2005005686A1 WO 2005005686 A1 WO2005005686 A1 WO 2005005686A1 JP 2004009903 W JP2004009903 W JP 2004009903W WO 2005005686 A1 WO2005005686 A1 WO 2005005686A1
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- Prior art keywords
- vapor
- steam
- substrate
- vapor deposition
- nozzle
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Links
- 238000000576 coating method Methods 0.000 title claims abstract description 16
- 239000011248 coating agent Substances 0.000 title claims abstract description 15
- 238000007740 vapor deposition Methods 0.000 title claims description 59
- 238000000034 method Methods 0.000 title claims description 38
- 229910044991 metal oxide Inorganic materials 0.000 title claims description 18
- 150000004706 metal oxides Chemical class 0.000 title claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 42
- 238000002156 mixing Methods 0.000 claims abstract description 27
- 239000011941 photocatalyst Substances 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims description 112
- 238000006243 chemical reaction Methods 0.000 claims description 22
- 150000002736 metal compounds Chemical class 0.000 claims description 22
- 238000010438 heat treatment Methods 0.000 claims description 12
- 238000010304 firing Methods 0.000 claims description 11
- 239000002243 precursor Substances 0.000 claims description 7
- 229910001510 metal chloride Inorganic materials 0.000 claims description 6
- 238000005019 vapor deposition process Methods 0.000 claims description 4
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 239000012702 metal oxide precursor Substances 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 abstract description 91
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 abstract description 57
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 abstract description 55
- 238000000151 deposition Methods 0.000 abstract description 27
- 230000008021 deposition Effects 0.000 abstract description 26
- 238000005229 chemical vapour deposition Methods 0.000 abstract description 15
- 239000002131 composite material Substances 0.000 abstract description 11
- 239000007921 spray Substances 0.000 abstract description 4
- 229910003074 TiCl4 Inorganic materials 0.000 abstract 3
- 239000010408 film Substances 0.000 description 89
- 239000000463 material Substances 0.000 description 36
- 230000001699 photocatalysis Effects 0.000 description 26
- 230000015572 biosynthetic process Effects 0.000 description 24
- 239000007789 gas Substances 0.000 description 20
- 239000000843 powder Substances 0.000 description 16
- 239000010453 quartz Substances 0.000 description 15
- 239000002994 raw material Substances 0.000 description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 15
- 239000012071 phase Substances 0.000 description 14
- 238000012360 testing method Methods 0.000 description 13
- 238000002347 injection Methods 0.000 description 11
- 239000007924 injection Substances 0.000 description 11
- 238000010793 Steam injection (oil industry) Methods 0.000 description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 239000010936 titanium Substances 0.000 description 8
- 230000007423 decrease Effects 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000006460 hydrolysis reaction Methods 0.000 description 6
- 238000000354 decomposition reaction Methods 0.000 description 5
- 238000010790 dilution Methods 0.000 description 5
- 239000012895 dilution Substances 0.000 description 5
- 239000004744 fabric Substances 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 4
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000007146 photocatalysis Methods 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 229910052723 transition metal Inorganic materials 0.000 description 3
- 150000003624 transition metals Chemical class 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 150000004703 alkoxides Chemical class 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000009776 industrial production Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- 230000003373 anti-fouling effect Effects 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- RBFQJDQYXXHULB-UHFFFAOYSA-N arsane Chemical compound [AsH3] RBFQJDQYXXHULB-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000004332 deodorization Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910001195 gallium oxide Inorganic materials 0.000 description 1
- UPWPDUACHOATKO-UHFFFAOYSA-K gallium trichloride Chemical compound Cl[Ga](Cl)Cl UPWPDUACHOATKO-UHFFFAOYSA-K 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- -1 titanium alkoxide Chemical class 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45502—Flow conditions in reaction chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J35/00—Catalysts, in general, characterised by their form or physical properties
- B01J35/30—Catalysts, in general, characterised by their form or physical properties characterised by their physical properties
- B01J35/39—Photocatalytic properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J37/00—Processes, in general, for preparing catalysts; Processes, in general, for activation of catalysts
- B01J37/02—Impregnation, coating or precipitation
- B01J37/0238—Impregnation, coating or precipitation via the gaseous phase-sublimation
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G23/00—Compounds of titanium
- C01G23/04—Oxides; Hydroxides
- C01G23/047—Titanium dioxide
- C01G23/07—Producing by vapour phase processes, e.g. halide oxidation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/405—Oxides of refractory metals or yttrium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45568—Porous nozzles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
- C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J21/00—Catalysts comprising the elements, oxides, or hydroxides of magnesium, boron, aluminium, carbon, silicon, titanium, zirconium, or hafnium
- B01J21/06—Silicon, titanium, zirconium or hafnium; Oxides or hydroxides thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J21/00—Catalysts comprising the elements, oxides, or hydroxides of magnesium, boron, aluminium, carbon, silicon, titanium, zirconium, or hafnium
- B01J21/06—Silicon, titanium, zirconium or hafnium; Oxides or hydroxides thereof
- B01J21/063—Titanium; Oxides or hydroxides thereof
Definitions
- the present invention relates to a method for forming a metal oxide film, such as a titanium oxide film, which exhibits a photocatalytic action on a substrate surface by a CVD (chemical vapor deposition) method, and a vapor deposition method suitable for use in forming this film.
- CVD chemical vapor deposition
- titanium oxide photocatalyst composite materials in which a titanium oxide photocatalyst film is formed on various substrates have been developed.
- titanium tetrachloride (TiC) vapor reacts with water vapor on the surface of the base material and hydrolyzes to form a titanium oxide precursor film on the base material. I do.
- the base material is baked to convert the titanium oxide precursor constituting the film into titanium oxide.
- other hydrolyzable titanium compounds such as titanium alkoxide can be used instead of TiCl., But industrially, it is advantageous to use inexpensive and low boiling point TiC.
- JP-A-2000-262904 and JP-A-2000-266902 disclose that the substrate heating temperature during firing is 500 to 900 °. Method C is disclosed. H 2 0 necessary for hydrolysis of said TiC is supplied from water vapor contained in the atmosphere. That is, H 2 O is supplied from the surrounding atmosphere or by supplying humidified air to the vapor deposition chamber as required. Although the titanium oxide film formed by this method has photocatalytic activity, its activity is not so high. Further, this coating has the disadvantage that a smooth surface cannot be obtained because of a large crystallite diameter, and the adhesion is poor and the coating is easily peeled off.
- the present inventors By controlling the contact between the raw material TiC vapor and steam, the present inventors The above-mentioned CVD film formation was studied from a new point of view of suppressing the progress of the reaction between TiC and H 20 . As a result, the time of contact and mixing can be controlled by injecting both steam and steam from the nozzle through the TiC, thereby enabling the mixing of the two types of steam and the mixed steam. of the control child within a proper range the elapsed time until the contact to the substrate, significantly inhibited the reaction to proceed with Ti C Mr and H 2 0 in the gas phase, the problem described above It turns out that it can be solved.
- the TiC vapor is brought into contact with the substrate within 3 seconds, preferably within 1 second from the mixing with the steam, the occurrence of the hydrolysis reaction at locations other than the substrate surface is suppressed.
- a remarkable improvement in the deposition rate and the utilization of TiC is achieved, and a titanium oxide film having a uniform thickness and a good appearance can be formed.
- the present invention provides a vapor deposition step of forming a film of a metal oxide precursor on the surface of a substrate by bringing the vapor of a hydrolyzable metal compound and water vapor into contact with the substrate, A baking step of converting the precursor into a metal oxide by heating in an oxidizing atmosphere, wherein the vaporizing step comprises the steps of:
- This is a method for forming a metal oxide film, which comprises mixing water vapor in advance and bringing the mixed vapor into contact with a substrate within 3 seconds after mixing.
- the invention relating to this film forming method is referred to as a first invention.
- the vapor deposition step is preferably performed by injecting the vapor of the hydrolyzed metal compound and water vapor onto the continuously moving substrate.
- the mixing is performed by intersecting the jet stream of the steam of the hydrolyzable metal compound and the jet stream of the steam before reaching the base material. I can.
- the vapor of the hydrolyzable metal compound is jetted from the porous nozzle in a direction opposite to the traveling direction of the substrate, and the steam is jetted from the slit nozzle.
- the hydrolyzable metal compound of the vapor deposition raw material is preferably a metal chloride (eg, TiC), but a metal alkoxide (eg, tetraalkoxytitanium) can also be used.
- the metal species is not limited to Ti, and the first invention can be applied to the formation of oxide films of various metals such as Si, Sn, Zr, Zn, Sb, In, W, and Ta. .
- the oxide coating may contain two or more metals.
- metal oxides examples include titanium oxide, tin oxide, zinc oxide, zirconium oxide, and tungsten oxide that exhibit photocatalysis. As is well known, trace amounts of doping elements can be included to enhance or alter photocatalytic activity.
- metal oxides other than the photocatalyst include, but are not limited to, ITO (tin-containing indium oxide) and antimony-containing tin oxide useful as a transparent conductive film, and gallium oxide serving as an insulating film. Some of the metal oxides exhibiting photocatalysis can be used for purposes other than photocatalysis. For example, zinc oxide can be used as an ultraviolet absorber or a conductive film.
- the vapor of the hydrolyzable metal compound contains a hydrolyzable metal compound of two or more metals.
- the metal oxide film contains a doping element.
- the present invention is a vapor deposition apparatus for forming a film formed by a reaction between two kinds of vapors on a surface of a continuously moving substrate, comprising a porous nozzle and a slit nozzle.
- the vapor deposition apparatus is characterized in that these nozzles are arranged in a direction in which jets from the nozzles cross each other.
- the invention relating to the vapor deposition apparatus is referred to as a second invention.
- the vapor deposition apparatus according to the second invention is widely used for deposition of various other materials generated by a reaction between two kinds of vapors by a CVD method, in addition to the method for forming a metal oxide film according to the first invention. can do.
- the coating other than the metal oxide described above in relation to the first invention examples include gallium nitride (blue light emitting diode) by reaction of gallium chloride or trimethylgallium with ammonia, and arsenic by reaction of arsine with trimethylgallium.
- gallium arsenide compound semiconductor
- gallium carbide compound semiconductor and others
- FIG. 1 is an explanatory view showing one example of a vapor deposition device according to the second invention.
- the first invention Ti C steam and water vapor (i.e., TiC and Mr. H 2 0 in the gas phase, respectively) and the deposition step of forming a touch contact with the substrate to be brought to the substrate surface a titanium oxide precursor film, And heating the substrate in an oxidizing atmosphere to form a titanium oxide photocatalyst film on the surface of the substrate.
- TiC used in the vapor deposition step is mixed in advance with steam and steam, and the mixed steam is brought into contact with the substrate within 3 seconds, preferably within 1 second after mixing.
- the means for performing the pre-mixing is not particularly limited, but since the time from mixing to contact with the substrate is within 3 seconds, it is practical to mix two types of vapors in the vapor deposition chamber in practice. . To bring the mixed vapor into contact with the substrate within 3 seconds of mixing, both the TiCh vapor and steam are injected from the nozzle toward the substrate, and two steam jets are generated until they reach the substrate. Mixing may be performed by crossing each other.
- the base material By continuously moving the base material in one direction and passing it through the evaporation chamber, the base material can be continuously vaporized. That is, while continuously moving the substrate, the TiC is vaporized and steam is injected toward the substrate such that the two jet streams cross each other, so that the mixed vapor is preferably mixed within 3 seconds after mixing. Can perform film formation by continuous operation while satisfying the condition of the first invention that the substrate is brought into contact with the substrate within one second. This method has high working efficiency and is suitable for industrial production of titanium oxide photocatalyst composites.
- the time from mixing of the mixed gas to contact with the substrate can be measured, for example, by the following method.
- a video camera is installed inside the evaporation chamber (or through an appropriate observation window) so that the jet can be observed.
- a steam jet stream is formed, and a jet stream of TiCl 4 steam is jetted so as to intersect the jet stream. Is the injection flow at the intersection (mixing point) immediately after the start of TiC and steam injection? From the recorded video. Any video camera capable of high-speed shooting can accurately measure this arrival time. If it is difficult to measure at the start of TiC and steam injection, measurement can be performed at the time of shutdown. Alternatively, the arrival time can also be measured by instantaneously varying the pressure of the injected stream of TiC and steam during injection (adding noise to the pressure).
- the reaction in the gas phase before the mixed gas reaches the substrate becomes significant, and powder is generated. Significantly increase the ratio. Some of the generated powder remains on the substrate surface, but most of the powder is exhausted from the deposition chamber by the flow of the jet stream. In this way, most of the TiC vapor is wasted, so that the deposition rate on the substrate surface is slowed down, and the TiC utilization is significantly reduced. Part of the powder adheres to the surface of the base material, but it is easy to peel off because it is not formed into a film. Both the case where the powder is peeled off and the case where the powder remains adhered impair the appearance of the film, particularly the smoothness.
- FIG. 1 shows an outline of an example of a vapor deposition apparatus that can be used in the above-described vapor deposition step in the present invention.
- the vapor deposition apparatus shown in FIG. 1 includes a transport member 2 such as a conveyor capable of continuously moving a placed base material 1 in one direction, and an upper wall member 4 having a steam exhaust port 3.
- the two steam injection nozzles 5 and 6 are arranged so as to penetrate the upper wall member 4 so as to form injection flows crossing each other.
- the illustrated apparatus includes an upper nozzle 5 arranged at an angle closer to vertical and a lower nozzle 6 arranged at an angle closer to horizontal. It is preferable that each of these nozzles is capable of relatively uniformly injecting steam over the entire width of the substrate, for example, a slit nozzle or a perforated nozzle.
- Baffle plates 7 and 8 are attached to the end surfaces on both sides of the upper wall member 4, respectively, leaving a gap between the base member 1 and the lower conveying member 2.
- the space surrounded by the transfer member 2, the upper wall member 4, and the baffles 7 and 8 on both sides is a vapor deposition chamber 9.
- a guide 10 for reducing the space in the vapor deposition chamber 9 is attached to the upper wall member 4.
- a baking furnace is provided in front (downstream side) of the base material of the vapor deposition apparatus in the traveling direction, and the base material that has been vapor-deposited in the vapor deposition apparatus then proceeds to the baking furnace to undergo baking.
- the titanium oxide photocatalyst composite material can be manufactured continuously.
- the process from mixing the raw material TiC vapor and the steam to contacting the mixed vapor with the base material is performed. It is required to be uniform in the direction perpendicular to the material advancing direction (the width direction of the base material, hereinafter simply referred to as the width direction).
- the present inventors have studied various nozzles and combinations thereof for a method of uniformly injecting raw material vapor in the width direction of a substrate.
- the most basic method is achieved by injecting TiC and steam from the porous nozzle in a direction opposite to the direction of the substrate, and injecting steam from the slit type nozzle in a direction that intersects with the jet flow of TiC and steam.
- film formation can be performed uniformly in the width direction of the material.
- the second aspect of the present invention is a vapor deposition apparatus provided with the multi-hole nozzle and the slit nozzle arranged so that the jet flows cross each other.
- This vapor deposition device can be used for film formation by the CVD method using various materials as raw materials.
- the jet flow jetting from the slit type nozzle is generated by the jet flow jetting from the nozzle holes arranged in a tandem with the multi-hole type nozzle. It was found that the two types of vapors were mixed in the form of breakthrough, and that the uniformity of the film formation in the width direction became higher.
- the jets from the two nozzles intersect and collide before coming into contact with the substrate, and within three seconds after the mixing of the vapors occurs. Arrange to reach the material.
- Either the slit type nozzle or the multi-hole type nozzle may be located on the upper side, but the film can be formed more uniformly by using the multi-hole type nozzle as the upper nozzle.
- the upper multi-hole nozzle can be arranged so as to inject steam in the opposite direction (backward direction) with respect to the direction of travel of the base material, in order to reduce the amount of steam diffused as the base material moves. I like it. It is preferable that TiC is injected from the upper perforated nozzle and steam is injected, and steam is injected from the lower slit nozzle. By doing this, the upper nozzle that injects TiC and steam
- the angle of the center line of the jet flow of TiC vapor and water vapor with respect to the substrate surface (and SH 20 , respectively) is ⁇ ⁇ > ⁇ ⁇ 20 because it is closer to vertical. Note that the angle of the jet flow center line with respect to the substrate surface is equal to the angle in the nozzle axis direction with respect to the substrate surface.
- the angle of the upper multi-hole nozzle that injects TiC vapor with respect to the base material is 30 ° ⁇ ⁇ 80 °. It is preferable to do so.
- the reason why 0 ° is set to 30 ° or more is that when the TiC is sprayed at a higher angle with respect to the substrate surface, the distance to the substrate contact becomes shorter, the diffusion of vapor is reduced, and a higher film is formed. This is because speed can be obtained.
- the reason for setting 0 M ⁇ 80 ° is that as the injection angle approaches 90 °, the amount of powder generated in the gas phase adhering to the substrate increases significantly.
- SM is more preferably 45 to 75 °.
- 0 ⁇ 2 ⁇ (indicated as ⁇ 2 in FIG. 1) may be smaller than 0 ⁇ , but is preferably 10 to 40 °.
- the vapor velocity of the upper nozzle > the vapor velocity of the lower nozzle (thus, in the above example, the vapor velocity of TiC> 7 ⁇ vapor velocity). If the steam flow rate of the upper nozzle is lower than the steam flow rate of the lower nozzle, the steam flow jetted from the upper nozzle loses the steam flow jetted from the lower nozzle, and the steam jetted from the upper nozzle hits the base material. The probability of contact decreases, and the deposition rate on the substrate decreases.
- the pitch between nozzles is preferably 3 to 10 mm. If the pitch of the multi-hole nozzle is too wide, there is a portion where the TiC vapor injected from this nozzle does not mix with the uniform jet of water vapor injected from the slit nozzle. The TiC from the steam becomes homogeneous in the horizontal direction (a state close to the slit jet), and it becomes difficult to obtain appropriate mixing by the “combination of slit type and porous type”.
- a guide 10 that reduces the cross-sectional area of the vapor passage in the vapor deposition chamber 9 is installed. be able to.
- the set consisting of two steam injection nozzles and an exhaust port as shown in the figure is arranged in two or more sets in a row in the direction of movement of the base material, and vapor deposition is performed to increase the speed of progress of the base material and increase production. It is also possible to increase speed.
- the baffle plates may be provided only at two locations at both ends where the entire set is arranged, or may be provided at both ends of each set.
- the vapor of the TiC vapor and the vapor which are the vapor deposition materials, be supplied to the vapor in the form of a diluted vapor obtained by diluting the vapor with an appropriate gas in terms of the film forming rate and the utilization of the TiC vapor. If the concentration of the raw material vapor in the diluted vapor is too high, the rate of reaction in the gas phase will increase, the use efficiency of the raw material TiC will decrease, and the film formation rate on the substrate will decrease. TiC and H 2 0 concentrations diluted in the vapor supplied to the vapor deposition, respectively from 0.1 to 10% range is preferred. Dry air / inert gas (eg, nitrogen, argon) can be used as the dilution gas.
- dry air / inert gas eg, nitrogen, argon
- TiC and the ratio of steam and water vapor supplied is, H 2 0 / Ti C Mr molar ratio of preferably be Rukoto so that 0.05 to 4. If the molar ratio is less than 0.05, the ratio of TiC is too small, and the film forming rate is reduced. If the molar ratio is greater than 4, the proportion of TiC consumed for powder formation in the gas phase increases, reducing the utilization of TiC and increasing the amount of powder adhering to the substrate. The result is that the appearance of the product is impaired.
- the molar ratio is more preferably in the range of 0.1 to 3 to enable more efficient film formation.
- the substrate temperature in the deposition step is preferably in the range of 150 to 250 ° C. If the temperature of the substrate is lower than 150 ° C, a uniform film is not formed and a powdery vapor deposition form is formed, and the adhesion between the film and the substrate is reduced. On the other hand, when the temperature exceeds 250 ° C, the crystal grains forming the titanium oxide film to be deposited are coarsened, the photocatalytic activity is reduced, and the adhesion to the substrate is also reduced.
- the substrate temperature is temperature at which the vapor mixture of Ti C Mr and H 2 0 is in contact with the substrate, the entire deposition chamber, in particular upstream, need the substrate temperature is maintained Is not necessarily.
- the substrate temperature may be adjusted by one or more appropriate means.
- the substrate can be preheated by a suitable heating means before the vapor deposition step, a heating means is provided on a member for transporting the substrate, and / or the substrate can be heated at a temperature in the vapor deposition chamber.
- the temperature in the deposition chamber is set so that Ti C vapor and water vapor do not condense.
- Titanium oxide and Si0 2 Sn0 case of producing a composite film of 2 and / or Zr0 2 is, Ti C to vapors or dilution steam and supplies, Si, mixing the vapor of Sn and Z or Zr halides And then mix with steam. The result is a more evenly mixed titanium oxide Can be obtained.
- a transition metal halide or a transition metal oxyhalide is mixed into the supplied TiC vapor or its diluted vapor, and then mixed with water vapor to achieve an atomic level.
- a uniformly doped titanium oxide film can be obtained.
- the substrate on which the titanium oxide precursor film is formed on the surface by vapor deposition is heated in the firing step to convert the titanium oxide precursor to at least partially crystalline titanium oxide and oxidize the surface A titanium oxide photocatalyst composite having a titanium coating is obtained.
- the heating temperature in the firing step is preferably from 300 to 600 ° C., more preferably from 400 to 500 t, so as to generate an anatase type titanium oxide crystal having high photocatalytic activity.
- a rutile phase appears in the crystal form of the obtained titanium oxide, and the catalytic activity decreases.
- crystallization is insufficient and high catalytic activity cannot be obtained.
- the firing atmosphere is not particularly limited, but an atmospheric atmosphere is sufficient.
- the deposition conditions may be appropriately changed.
- the coating is other than titanium oxide
- the firing conditions can be appropriately changed so that an oxide coating having optimal performance is formed.
- the material of the substrate is not particularly limited as long as it can withstand firing. Since the method of the present invention utilizes vapor phase deposition, it is possible to perform uniform deposition on substrates of various forms. For example, uniform deposition is performed on irregularly shaped base materials such as glass, ceramics, metal, and glass cloth, glass cloth, and other fibrous, porous ceramics, spheres, pebbles, and crushed pieces. It is possible.
- the thickness of the titanium oxide film is not particularly limited, it is preferably 30 nra or more to exhibit a sufficient photocatalytic activity, and is usually within the range of 300 to 1000 nm. When the application of the coating is other than the photocatalyst, the thickness of the metal oxide coating can be appropriately selected according to the application. Example
- a quartz plate as a substrate is placed at an angle of 20 ° to the horizontal plane inside a quartz tube placed horizontally, and TiC, which is a raw material for evaporation, is vaporized from one end of the quartz tube.
- TiC which is a raw material for evaporation
- TiC vapor is diluted with argon, and steam is diluted with dry air. It was used for blowing in the state of steam.
- the atmosphere in the tube before the steam injection was argon.
- the substrate temperature was set to 180 t by heating the inside of the tube to 180 ° C with an external heater.
- each dilution vapor was heated by heating the piping to the quartz tube inlet to 60 ° C.
- the position of the substrate was changed in the quartz tube, and the time from mixing TiC to the vapor and water vapor to contacting the substrate was changed. This time was measured by taking a quartz tube from outside with a video camera capable of high-speed photography at the start of steam injection. The deposition process was continued for 3 minutes from the start of the steam injection.
- the quartz plate of the base material was taken out of the quartz tube, heated at 500 ° C for 60 minutes in a heating furnace in an air atmosphere, and fired to form an anatase-type crystalline titanium oxide film on the surface of the base material.
- the thickness of the formed titanium oxide film was determined by forcibly peeling off part of the film and measuring the resulting step with the surface of the substrate using a surface roughness meter. This film thickness was divided by the deposition time to calculate a film formation rate. The molar amount of Ti atoms in the film was determined from the thickness of the titanium oxide film, and the TiC was calculated as the ratio of the molar amount of Ti in the film to the molar amount of supplied TiC and vapor.
- Deposition and firing were performed according to Example 1 except for the following.
- the position of the substrate in the quartz tube was fixed at a position where the time from mixing of TiC vapor and water vapor to contacting the substrate was 2 seconds, and the temperature of the substrate was changed in the range of 100 to 500 t. Was.
- the substrate temperature was controlled to a predetermined temperature by externally heating the quartz tube with an electric furnace.
- the pipe for each dilution steam up to the inlet of the quartz tube was heated to 60 ° C. or higher.
- the photocatalytic activity of the formed titanium oxide film was evaluated by an aldehyde decomposition test described below. Further, the adhesion of the titanium oxide film was tested by a tape peeling test, and evaluated as ⁇ : no peeling, X: peeling. Table 2 shows the test results together with the substrate temperature.
- a 40 mm square substrate was placed in a quartz reaction cell, and the reaction cell was connected to a closed circulation line (total internal volume about 3.0 L).
- a gas obtained by diluting acetoaldehyde with nitrogen gas containing 20 vol% of oxygen (acetaldehyde concentration: 250 ppm) was introduced into the line. While circulating this gas in the line, ultraviolet rays were irradiated from a mercury lamp. The amount of ultraviolet irradiation was 4 mW / cm 2 .
- the reaction was monitored by measuring the concentration of carbon dioxide generated by the decomposition of acetoaldehyde over time by an automatic gas chromatograph connected to a circulation line. Photocatalytic activity was evaluated from the rate of carbon dioxide generation. Table 2
- Example 2 Except for the following points, vapor deposition and firing were performed in the same manner as in Example 2.
- the substrate temperature was likewise 180 ° C as in Example 1, was varied the ratio (H 2 0 / TiC and molar ratio) of TiC vapor and water vapor blown into the quartz tube.
- Table 3 shows the results of measuring the film formation rate and photocatalytic activity of the formed titanium oxide film as described in Examples 1 and 2, respectively.
- this molar ratio is preferably 3 or less, and particularly, when the molar ratio was around 0.5, both the film forming rate and the photocatalytic activity became the highest.
- Example 2 Deposition and firing were performed in the same manner as in Example 2 except for the following points.
- the substrate temperature was 180 ° C as in Example 1, and the concentration of TiC blown into the quartz tube and that of the diluted steam was changed within the range of 0.05 to 20%.
- Water vapor concentration of the dilution water vapor, H 2 0 / TiC and molar ratio is adjust so that 0.5.
- Example 4 As described in Example 1, the deposition rate of the formed titanium oxide film and the utilization rate of TiC were determined as described in Example 1. Table 4 shows the measurement results. Table 4
- the substrate 1 having a width of 210 mm and a length of 300 m is continuously moved in one direction by using the vapor deposition apparatus shown in FIG. 1 having the two upper and lower steam jet nozzles 5 and 6.
- the material was continuously deposited.
- the substrate used was glass cloth, and the moving speed (feed speed) of the substrate was 15 cm / min.
- the substrate was preheated so that the substrate temperature during steam contact was 180 ° C.
- TiC and steam were injected from the upper nozzle 5 and steam was injected from the lower nozzle 6. Both steam also, as Ti C or H 2 0 concentration of 2%, TiC and steam with argon, water vapor was diluted vapor diluted in dry ⁇ air. Steam injection rate was adjusted to H 2 0 / TiC and molar ratio is 0.5. The injection flow rate of each steam was the same in all tests. The temperature inside the injection nozzle and the deposition chamber was 180.
- a multi-hole nozzle and a slit nozzle are used in various combinations, and the angles of the nozzle axes of the upper and lower nozzles with respect to the substrate traveling direction (Fig. 1 and S, respectively) 2 ) was also changed.
- 0 90 except where °, the inclination of each nozzle faces for injecting steam in the opposite direction to the traveling direction of the substrate (i.e., the theta 2 Hides Both are 90 ° or less), and the two jets from the nozzle intersect each other.
- the time from mixing the TiC vapor and water vapor to contacting the substrate was less than 1 second.
- the substrate exiting the deposition chamber was passed through a heating furnace, heated at 400 t for 60 minutes, and fired.
- the obtained titanium oxide photocatalyst composite material had a titanium oxide coating on each glass fiber of the glass cloth.
- the magnitude of the powder adhesion was also evaluated by visual observation of the sample on the mirror-finished titanium plate.
- the photocatalytic activity was evaluated by the same aldehyde decomposition test as in Example 2 using a glass cloth substrate sample.
- the test specimen used was a square specimen cut at 40 oval angles.
- the above test results, the vertical type of nozzle and between the porous type nozzle nozzle pitch and distribution ⁇ degree (6, and theta 2) together with, are summarized in Table 5.
- vapor deposition was performed by supplying water vapor to the atmosphere inside the vapor deposition chamber, instead of spraying water vapor from the nozzle, according to the conventional method (Test No. 13). Table 5 also shows the results.
- the value “5” next to P in “(P5)” means the pitch (mm) between nozzles.
- the uniformity in the width direction was maintained despite the same substrate speed and injection flow rate and injection angle of TiC steam. Poor and photocatalytic activity was very low. The reason is that when water vapor is supplied to the atmosphere, It is considered that the molar ratio of H 20 / TiC is not kept in a suitable range and becomes too large or too small, so that uniform film formation is hindered.
- the photocatalytic activity was significantly improved as compared with Test No. 13.
- the width of the perforated nozzles in the width direction is extremely large unless the inter-nozzle pitch is too large or small.
- the film uniformity was also significantly improved. Powder adhesion increased when the arrangement angle ( ⁇ ,) of the upper perforated nozzle reached 90 °. If the angle of the upper nozzle was too small, the uniformity in the width direction was slightly reduced.
- a method suitable for industrialization in which a titanium oxide film is formed by continuously depositing a substrate while moving the substrate in one direction, is uniform in the width direction of the substrate, has high photocatalytic activity, This makes it possible to form a titanium oxide film with good appearance with little adhesion to the body at a high utilization rate and high film formation rate with good TiC. This enables continuous mass production of high-performance titanium oxide photocatalyst composites at low cost.
- the film forming method of the present invention can be applied to the film formation of metal oxides other than titanium oxide. Further, the vapor deposition apparatus of the present invention can be applied to other materials other than the metal oxide generated by the reaction between two kinds of vapors. It can also be applied to film formation. This makes it possible to form a metal oxide film with good uniformity and good adhesion at a good raw material utilization rate. That is, the present invention can be widely applied not only to photocatalysts but also to various thin film utilization technologies.
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Abstract
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- 2004-07-06 CN CNA2004800194228A patent/CN1820091A/zh active Pending
- 2004-07-06 US US10/564,015 patent/US20070054044A1/en not_active Abandoned
- 2004-07-06 EP EP04747371A patent/EP1650325A4/en not_active Withdrawn
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Also Published As
Publication number | Publication date |
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WO2005005686A8 (ja) | 2005-03-17 |
JP2005029866A (ja) | 2005-02-03 |
JP4124046B2 (ja) | 2008-07-23 |
EP1650325A1 (en) | 2006-04-26 |
EP1650325A4 (en) | 2009-06-03 |
CN1820091A (zh) | 2006-08-16 |
US20070054044A1 (en) | 2007-03-08 |
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