WO2004112058A1 - フラットケーブル被覆材、及びフラットケーブル - Google Patents
フラットケーブル被覆材、及びフラットケーブル Download PDFInfo
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- WO2004112058A1 WO2004112058A1 PCT/JP2004/007502 JP2004007502W WO2004112058A1 WO 2004112058 A1 WO2004112058 A1 WO 2004112058A1 JP 2004007502 W JP2004007502 W JP 2004007502W WO 2004112058 A1 WO2004112058 A1 WO 2004112058A1
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- WIPO (PCT)
- Prior art keywords
- filler
- flat cable
- component
- bonding layer
- covering material
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/08—Flat or ribbon cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
- H01B7/29—Protection against damage caused by extremes of temperature or by flame
- H01B7/292—Protection against damage caused by extremes of temperature or by flame using material resistant to heat
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
- H01B7/29—Protection against damage caused by extremes of temperature or by flame
- H01B7/295—Protection against damage caused by extremes of temperature or by flame using material resistant to flame
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24595—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness and varying density
Definitions
- the present invention relates to a flat cable covering material, and more particularly, to a flat cable covering material for a flat cable used for electric equipment, electronic equipment, and the like having both flame retardancy and conductor adhesion. , And a flat cable using the same.
- flat cables are used for electrical connections and various wiring between computers and electronic components.
- the flat cable is routed inside the narrow housing of the electronic device, is slid along with the movement of the electronic component, and is used in a high-temperature environment due to the heat generated by the electronic component.
- the flat cable covering material covering the flat cable is required to have heat resistance to high temperatures, flame retardancy, and insulation, and flexibility and flexibility for sliding.
- the flat cable covering material is required to have adhesiveness to the conductor (heat sealability), self-adhesiveness between the covering materials, and blocking resistance in production.
- blocking means that the surface of the heat adhesive layer and the surface of the substrate film are alternately formed when a material obtained by coating and forming a heat adhesive layer on a base film is wound into a roll.
- a material obtained by coating and forming a heat adhesive layer on a base film is wound into a roll.
- the roll is unwound again after bonding, it becomes impossible to unwind, or if unwound, any layer is broken, or the interface between the base film and the heat bonding layer ( (It cannot be peeled off originally.)
- the ability to take up and rewind without causing force or light blocking is called “blocking resistance”.
- Non-halogen flame-retardant flat cables are known (for example, see Patent Documents 1 and 2).
- a non-halogen flame-retardant heat adhesive comprising a polyester resin (base film), a polyphosphoric flame retardant, and a non-polyphosphoric nitrogen-containing organic flame retardant is known (for example, see Patent Document 3). ).
- the flame retardancy of any of the above flat cables is left to the flame retardancy of the adhesive layer (sometimes referred to as an adhesive layer).
- the amount of the flame retardant in the adhesive layer is increased in order to improve the flame retardancy, the adhesion to the conductor is reduced.
- the amount of the flame retardant in the adhesive layer is reduced in order to improve the conductor adhesion, the flame retardancy will be reduced. That is, there is a drawback that the conductor adhesiveness and the flame retardancy are not compatible.
- Patent Document 1 Japanese Patent Application Laid-Open No. 9-221642
- Patent Document 2 Japanese Patent Application Laid-Open No. 9-279101
- Patent Document 3 JP 2001-89736 A
- the present invention has been made to solve such a problem.
- the purpose is to make the thermal bonding layer at least consist of a filler and a thermoplastic resin, and to make the distribution of the mass ratio of the filler component in the thermal bonding layer obliquely distributed with respect to the thickness direction of the thermal bonding layer.
- the mass ratio of the filler component to the heat bonding layer is distributed so as to decrease from the base film side toward the surface of the heat bonding layer, so that the adhesion to the conductor (heat sealing property) and the covering material are improved.
- Flat cable covering material and flat cable which have both adhesiveness such as self-adhesiveness and flame retardancy, and are excellent in heat resistance, insulation, flexibility and flexibility, which are excellent in blocking resistance in manufacturing. It is to provide.
- the present invention includes a base film and a heat bonding layer laminated on one surface of the base film directly or via another layer, and the heat bonding layer is composed of a filler (P) component, And a mass ratio P / (P + V) of the filler (P) component in the thermal adhesive layer (P + V) in the thermal adhesive layer (P + V), which is inclined and distributed along the thickness direction of the thermal adhesive layer.
- P filler
- P + V mass ratio of the filler (P) component in the thermal adhesive layer
- P + V thermal adhesive layer
- It is a flat cable covering material characterized by being coated.
- the mass ratio P / (P + V) of the filler (P) component in the heat bonding layer (P + V) decreases from the base film side toward the heat bonding layer surface side.
- Distributed at a slope It is a flat cable covering material characterized by the above-mentioned.
- the mass ratio P / (P + V) of the filler (P) component in the thermal adhesive layer (P + V) is inclined and distributed within the range of 90 to 50% by mass. It is a flat cable covering material characterized by the following.
- the filler (P) component comprises a hydrated metal compound (P) and another filler (P).
- ⁇ ⁇ indicates the thermal adhesion table from the substrate film side along the thickness direction of the thermal adhesive layer.
- a flat cable covering material characterized in that it is distributed so as to decrease toward the surface side.
- the mass ratio of ⁇ ) ⁇ ⁇ is characterized by being distributed in an inclined manner within the range of 80-0 mass%.
- a flat cable coating that is compatible with the heat-sealing coating material with a conductor, such as self-adhesiveness and flame retardancy, and is excellent in blocking resistance in production. Materials are provided.
- the filler ( ⁇ ) component contains a nitrogen-based compound, a phosphorus-based compound, or a halogen-based compound, and the mass ratio of these compounds in the filler ( ⁇ ) component is A flat cable covering material characterized by being distributed obliquely along the thickness direction of the flat cable.
- the filler (II) component is composed of a nitrogen compound and a phosphorus compound, and the mass ratio of the nitrogen compound in the heat bonding layer is from the base film side to the surface of the heat bonding layer. And the mass ratio of the phosphorus compound is distributed so as to be inclined so as to decrease toward the surface of the heat-bonding layer on the side of the substrate film.
- a flat cable covering material having particularly excellent flame retardancy.
- the filler ( ⁇ ⁇ ⁇ ⁇ ) component contains a compound other than a halogen-based compound or a compound other than a halogen-based compound and a phosphorus-based compound, and the mass ratio of these compounds in the filler ( ⁇ ) component Is characterized by being distributed at an angle along the thickness direction of the thermal bonding layer. Is a flat cable covering material.
- the present invention is the flat cable covering material, wherein the filler (P) component is composed of filler particles.
- the present invention relates to a flat cable including a plurality of conductors arranged on the same plane and a pair of flat cable covering members covering the plurality of conductors from both sides.
- the material comprises a base film and a heat bonding layer laminated on one side of the base film directly or via another layer, and the heat bonding layer comprises a filler (P) component and a thermoplastic resin ( V) component, and the mass percentage P / (P + V) of the filler (P) component in the thermal bonding layer (P + V) is distributed in a manner inclined along the thickness direction of the thermal bonding layer.
- This is a flat cable characterized by
- a flat cable capable of eliminating required physical properties inconsistent with flame retardancy, heat resistance, insulation properties, flexibility, flexibility, and interlayer adhesion strength.
- FIG. 1 is a schematic sectional view showing a configuration of a flat cable covering material of the present invention.
- FIG. 2 is a schematic sectional view showing a configuration of a flat cable of the present invention.
- FIG. 3 is a sectional view taken along the line AA of FIG.
- FIG. 4 is a cross-sectional view in the thickness direction of the heat bonding layer of the present invention.
- FIG. 5 is a graph illustrating the gradient distribution of components of the heat bonding layer of the present invention.
- FIG. 6 is a graph illustrating the gradient distribution of individual components of the heat bonding layer of the present invention.
- FIG. 1 is a schematic sectional view showing the configuration of one embodiment of the present invention.
- the flat cable covering material 10 of the present invention includes a base film 11 and a heat bonding layer 15 laminated on one surface of the base film 11 directly or via another layer.
- the other layers are a primer layer 13 for bonding the base film 11 and the heat bonding layer 15 more firmly, and an intermediate layer provided as needed.
- the thermal bonding layer 15 (P + V + other additives) comprises at least a filler (P) component 15a and a thermoplastic resin (V) component 15b.
- Filler (P) component 15a is at least a hydrated metal compound (P
- Irradiation (P, P, P, ' ⁇ ) may be contained.
- the other additives in the heat bonding layer 15 are not essential components and have little effect on the technical content of the present invention. Omitted, the heat bonding layer is described as a heat bonding layer 15 (P + V).
- the distribution of the mass ratio of the filler (P) component 15a in the thermal bonding layer 15 (P + V) is inclined with respect to the thickness direction of the thermal bonding layer 15;
- the weight ratio of the filler (P) component 15a in 15 is distributed so that it decreases from the base film 11 side toward the surface of the thermal bonding layer 15.
- the filler (P) component 15a contains at least a hydrated metal compound (P), and the total amount of the hydrated metal compound (P) (P + P +--+ P
- the mass ratio in 1 1 1 2n) is inclined and distributed so as to decrease from the base film 11 side in the thickness direction of the thermal bonding layer 15 toward the thermal bonding layer 15 surface 15c side.
- FIG. 2 is a schematic cross-sectional view (illustrated with some ends cut away) showing the configuration of the flat cable of the present invention.
- FIG. 3 is a sectional view taken along the line AA of FIG.
- the flat cable 1 includes a plurality of conductors 21 (generally forming parallel filaments) arranged on the same plane, and a pair of conductors 21 covering the plurality of conductors 21 from both sides. And a flat cable covering material 10.
- Each flat cable covering material 10 has a structure shown in FIG.
- two flat cable covering materials 10 are overlapped with the respective heat bonding layers 15 facing each other, and a plurality of conductors 21 such as a metal are further provided between the layers. It is composed of conductors 1J arranged on the same plane.
- the flat cable covering material 10 has adhesiveness to a conductor (hereinafter, also simply referred to as heat sealability) and self-adhesiveness of the covering materials (hereinafter, both are also simply referred to as adhesiveness).
- heat sealability a conductor
- adhesiveness self-adhesiveness of the covering materials
- In production blocking resistance is required, and the flat cable 1 is flame-retardant and Heat, insulation, flexibility, flexibility, and interlayer adhesion strength are required, and various contradictory physical properties are required.
- heat bonding layer it was difficult to achieve both flame retardancy and adhesion.
- the present inventor has conducted intensive studies and distributed the content ratio of the filler component of the thermal bonding layer and the mixing ratio of one of the filler components in the thickness direction of the thermal bonding layer in an inclined manner. The optimization has led to the present invention.
- the flat cable covering material and the flat cable of the present invention can be used for OA equipment such as a personal computer, a printer or a copying machine, electronic equipment such as a mobile phone and a game machine, display equipment such as a liquid crystal display, transportation equipment such as a car, computers and power supplies, It can be used for electrical connection and various wiring such as electronic components, display devices or sensors.
- the base film 11 has excellent mechanical strength, heat resistance, chemical resistance, and solvent resistance.
- polyethylene terephthalate polybutylene terephthalate, polyethylene naphthalate, ethylene glycol terephthalic acid-isophthalic acid copolymer, and terephthalic acid Polyester resins such as -cyclohexanedimethanol-ethylene glycol copolymer
- Polyamide-based resins such as nylon 6, nylon 66, and nylon 610, polypropylene, and polyolefin-based resins such as polymethylpentene, acrylic-based resins such as polymetaarylate, and polymethyl methacrylate, polyimide, polyamideimide, Polyimide resins such as polyetherimide, fluorine resin films, polyether sulfone, polyether ketone, polyether sulfide, polyarylate, polyester ether, wholly aromatic amide, polyaramid, polycarbonate and other resins can be used. These resins are used singly or as a mixture of a plurality of types (including alloys).
- the base film 11 may be a single layer composed of these resins or a laminate composed of a plurality of layers.
- a stretched film or an unstretched film may be used, but a film stretched in a uniaxial direction or a biaxial direction is preferable for the purpose of improving strength.
- polyalkylene terephthalate such as polyethylene terephthalate and polyethylene naphthalate can be preferably used from the viewpoints of mechanical strength, heat resistance, insulation and cost, and polyethylene terephthalate is most suitable.
- the thickness of the base film 11 usually 5 / im ⁇ 200 / im can be applied, and 10 / im ⁇ 100 zm is preferable.
- the thickness is less than 5 / m, the mechanical strength is insufficient, and the suitability for forming the primer layer 13, the heat bonding layer 15, and the like is reduced. If the thickness is 200 ⁇ or more, the flexibility is insufficient and the slidability deteriorates. Therefore, by setting the thickness to such a value, the strength required for the flat cable covering material 10 of the present invention is imparted. In addition to this, good forkability can be imparted to the flat cable covering material 10.
- the base film 11 may be supplemented with a filler such as a filler, a plasticizer, and an antistatic agent.
- a filler such as silica and calcium carbonate can be used.
- an antistatic agent a nonionic surfactant, an anionic surfactant, a cationic surfactant, a polyamide, an acrylic acid derivative or the like can be applied.
- a corona discharge treatment, an ozone treatment, an oxygen gas treatment, etc. may be applied to improve the adhesive strength and durability between the base film and the thermal adhesive layer.
- treatment such as low-temperature plasma treatment using nitrogen gas, glow discharge treatment, or chemical treatment may be performed.
- a primer layer 13 also called an undercoat, an anchor coat, or a primer coat may be provided.
- a polyfunctional compound having an isocyanate group, a block isocyanate group, and / or a carbodiimide group, and a glass transition point of about 20 to 100 ° C, preferably 30 to 100 ° C Polyester resin and polyurethane resin can be used.
- the material of the anchor coat layer 13 for example, a polyethyleneimine compound, an organic titanium compound, an isocyanate compound, a polyurethane compound, a polybutadiene compound, or the like can be used.
- a coating solution which is applied to the surface of the substrate film 11 by a printing method such as gravure printing, or roll coating, reverse roll coating, gravure coating, reverse gravure coating, or bar.
- the primer layer 13 is applied by a coating method such as a coat, a rod coat, a kiss coat, a knife coat, a die coat, a comma coat, a flow coat, a spray coat and the like, and dried to form a primer layer 13.
- the thickness of the primer layer 13 is about 0.05-10 / im, preferably 0.1-5 / im.
- the primer layer 13 firmly bonds the base film 11 and the thermal adhesive 15 to withstand sliding during use in electronic devices, suppresses delamination between layers, and improves insulation and durability. It is for doing.
- a heat bonding layer 15 is provided on the base film 11 or on the surface of the primer layer 13 provided as required.
- the heat bonding layer 15 needs to be highly flexible and have heat sealing properties between the substrate film 11 or the primer layer 13 and the conductor 21.
- the heat-bonding layer 15 can hold a conductor such as metal between the layers, and is softened and melted by heating and pressing by a heating roll or a heating plate, etc. (Self-adhesiveness) and excellent adhesion to conductors (conductor adhesion), and it is necessary to be able to carry the conductors without generating voids therein.
- the heat bonding layer 15 (P + V) is combined with the filler (P) component and the thermoplastic resin (V) component.
- the filler (P) component contains at least a hydrated metal compound (P), and is preferably In addition, inorganic compounds other than hydrated metal compounds (P) and / or other fillers (P, P, P),
- thermal bonding layer (P + V) 7 ( ⁇ ⁇ ) + thermoplastic tree
- Fat (V) and filler ( ⁇ ) ⁇ ( ⁇ + ⁇ + ⁇ + ⁇ + ⁇ ⁇ '+ ⁇ ).
- thermoplastic resin (V) If necessary, besides the filler ( ⁇ ) and thermoplastic resin (V),
- additives may be added.
- thermoplastic resin (Thermoplastic resin)
- thermoplastic resin 15b that contributes to the thermal bonding of the thermal bonding layer 15
- the thermoplastic resin 15b be melted by heat and self-adhered to each other, and more preferably the conductor adhesive force be larger.
- the thermoplastic resin include a polyethylene resin, a polypropylene resin, an ionomer resin, an ethylene-butyl acetate copolymer, an ethylene- (meth) acrylic acid copolymer, and an ethylene- (meth) acrylate ester copolymer.
- Polymer acid-modified polyolefin resin, ethylene-propylene copolymer, butyl acetate resin, (meth) acrylic resin, polystyrene resin, polychlorinated butyl resin, polyacrylonitrile resin, polybutene resin, polypentene resin Polyester resins, polyvinyl acetal resins, thermoplastic polyurethane resins, and the like can be used.
- thermoplastic resin 15b of the heat bonding layer 15 a polyester-based resin can be suitably used because of its heat sealing property with a conductor and easiness of mixing a flame retardant.
- the polyester resin is a saturated copolymerized polyester resin having a glass transition point of ⁇ 50 ° C. to 80 ° C. and a weight average molecular weight in the range of 7000 to 50,000. Those consisting of objects are preferred. Further, a polyester resin having a relatively low glass transition point and having high flexibility and a polyester resin having a relatively high glass transition point and having high heat resistance may be used in combination. Further, an amorphous polyester resin and a crystalline polyester resin may be appropriately blended and used.
- Filler component 15a (also referred to as filler (P)) includes chlorine-based and bromine-based halogen compounds, hydrated metal compounds, metal oxide compounds, metal compounds such as metal powders, phosphorus and phosphorus-based compounds, A nitrogen compound or the like can be applied.
- the function (purpose) of the filler component 15a is mainly to impart flame retardancy to the heat bonding layer 15, and in addition, the filler component 15a is formed into a roll after forming the heat bonding layer on the base film. A function to prevent blockage at the time can also be provided. Further, depending on the combination of the filler component 15a and the thermoplastic resin 15b, processing conditions, and the like, other functions may be provided.
- Examples of the chlorine-based compound include chlorinated paraffin, chlorinated polyethylene, chlorinated polyphenyl, perchlorcyclopentadecane, heptanoic anhydride, and chlorendic acid.
- Bromine compounds include, for example, tetrabromobisphenol A (TBA), deca-mouth-mododiphenyl oxide (DBDPO), hex-sub-mouth mocyclodecane (HBCD), otata-bromodiphenyl oxide ( ⁇ BDP ⁇ ), Bis (trib-opened mophenoxy) ethane (BTBPE), tribromophenol (TBP), ethylene bistetrabromophthalimide, TBA carbonate oligomer, brominated polystyrene, TBA epoxy oligomer, TBA epoxy polymer, ethylene bispentabromodipheninole, polydibromo Phenylene oxide, Hexabromobenzene, Tetrabromoethane, Mobiphenyl ether decab, Tetrabromophthalic anhydride, Tribromophenylenomaleimide, Tetrabromopentaerythritolone, Tris (pentabromobenzyl)
- Phosphorus and phosphorus-based compounds include, for example, red phosphorus, ammonium polyphosphate, triallyl phosphate, alkylaryl phosphate, alkyl phosphate, phosphonate, dimethyl phosphonate, halogenated phosphoric ester, trimethyl phosphate, triethylene phosphate, tributyl Phosphate, trioctyl phosphate, tributoxetinole phosphate, octyl diphenyl phosphate, tricresyl phosphate, cresyl diphenyl phosphate, triphenyl phosphate, tris (chloroethynole) phosphate, tris (2-chloropropyl propyl) phosphate , Tris (2,3-dichloropropyl) phosphate, tris (2,3-dibromochloropropane) phosphate, tris (2,3-dichloropropyl) Lo
- Nitrogen compounds include, for example, triazine ring-containing compounds including urea and melamine derivatives.
- the triazine ring-containing compound include, for example, melamine (cyanuric acid diamide), hammerin (cyanuric acid diamide), ammelide (cyanuric acid monoamide), melamine sulfate, melamine pyrophosphate, guanylmelamine sulfate, ethylenedimeramine, trimethylenediamine Melamine, tetramethylenedimelamine, hexamethylenedimelamine, 1,3-hexylenedimelamine, homoguanamine, acetoguanamine sulfate, benzoguanamine, benzguanamine, acetoguanamine, phthalodiguanamine, butylene diguanamine, norbornene diguanamine, methylene jig
- melamine cyanurate condensation of melamine and cyanolic
- hydrated metal compound for example, aluminum hydroxide, magnesium hydroxide, zirconium oxide, calcium hydroxide, barium hydroxide, titanium hydroxide, zinc hydroxide and the like can be applied.
- metal oxide compound for example, antimony trioxide, antimony pentoxide, tin oxide, molybdenum oxide, boron oxide, silicon dioxide, copper oxide, zirconium oxide, zinc borate, and the like can be used. These may be used alone or in combination of two or more.
- Other metal compounds or inorganic compounds include antimony trichloride, antimony borate, boric acid, antimony molybdate, molybdenum oxide, phosphorus-nitrogen compound, lithium aluminum silicate, zirconium compound , Tin compounds, dawsonite, calcium phenol oleate hydrate, copper powder, calcium carbonate, metal powder such as barium metaborate or inorganic compounds, zinc stannate, molybdic oxide, and the like.
- a silicone polymer, phlegmene, fumaric acid, maleic acid, sulfamic acid, etc. may be added. These may be used alone or in combination of two or more.
- Metal compounds such as the above-mentioned chlorine-based and bromine-based halogen-based compounds, hydrated metal compounds, metal oxide compounds or metal powders, phosphorus and phosphorus-based compounds, and nitrogen-based compounds.
- the filler component is generally called a flame retardant or a flame retardant auxiliary.
- the filler (P) component 15a is present in the heat bonding layer 15 as filler particles.
- the average particle size of the filler particles is about 0.01-100 / im as primary particles, and preferably 0.01-01zm. However, the average particle size is not more than the thickness t of the heat bonding layer. If the average particle size exceeds 40 x m, the dispersibility in the synthetic resin becomes poor, and the physical properties of the synthetic resin may be reduced. Further, a filler, a pigment, a lubricant, an antistatic agent, a foaming agent, a plasticizer, and the like may be added to the composition as necessary.
- these flame retardants may leak to the environment for some reason or be taken into the human body. You may be harmed to your health. Therefore, from the viewpoint of the environment, it is preferable that these flame retardants do not contain a halogen compound, and it is more preferable that these flame retardants do not contain phosphorus and a phosphorus compound in addition to the halogen compound.
- a pigment, a lubricant, an antistatic agent, a dispersant, an antioxidant, a metal corrosion inhibitor, a blocking inhibitor may be added to the heat-adhesive layer composition within a range that does not affect the effects of the present invention.
- various coupling agents, fillers, and flame retardant catalysts that increase the cohesive force between the resin and the flame retardant may be appropriately added.
- thermoplastic resin component a plasticizer, a cross-linking agent, a cross-linking auxiliary agent, a foaming agent, and the like may be appropriately added to the heat-adhesive layer composition in addition to the filler as necessary. These are integrated with the thermoplastic resin component.
- the composition of the heat bonding layer 15 is conventionally a filler component 15a such as a flame retardant and a thermoplastic resin.
- the fibrous resin component 15b, and one component of the filler is about 50 to 80% by mass. From the flame-retardant performance, the more fillers, the better.However, if the filler component is too large, the thermoplastic resin component will be reduced, and it will not be possible to form a film when forming the thermal adhesive layer. The required adhesion performance cannot be obtained. For this reason, there is a disadvantage that the composition having flame retardancy and good workability is limited to the above ratio.
- the workability is not deteriorated even if the filler component is increased and the flame retardancy is improved.
- the average concentration of the filler component averaged in the thickness direction is the conventional mass%, the self-adhesiveness and the conductor adhesiveness can be significantly improved.
- the above effect is more remarkable when the distribution is inclined so as to decrease from the substrate film side toward the heat bonding layer surface side.
- the filler component which has a small influence on the self-adhesive property and the conductor adhesive property even if the filler component is distributed on the conductor side may be distributed on the conductor side.
- the point is to reduce the amount of the filler component that affects self-adhesion and conductor adhesion from the conductor side.
- the filler (P) component contains at least a hydrated metal compound (P), and preferably further contains water.
- the slope distribution decreases so as to decrease from the base film 11 side to the surface side of the thermal adhesive layer 15 (which is the conductor side when a flat cable is used, also simply called the conductor side).
- the hydrated metal compound (P) is a component of the filler that affects the self-adhesion and the conductor adhesion, the partial force on the conductor side should also be reduced.
- the concentration of the hydrated metal compound (P) / (P + V) When used in combination with other fillers, the concentration of the hydrated metal compound (P) / (P + V
- Adhesion decreases. Within the preferred range, the above effect is further enhanced. Combining with P / (P + V) 90-50% by mass enhances the effect.
- Examples of the inorganic compound (P) other than the compound include metal oxide compounds such as antimony trioxide.
- the inorganic compound (P) and the flame retardant (P) have little effect on self-adhesion and conductor adhesion.
- the filler component is within this range, the effect on the adhesiveness is small. Within the preferred range, the influence on the adhesiveness is less.
- the range of the gradient distribution and its effect are disclosed in the examples and comparative examples.
- FIG. 4 is a cross-sectional view in the thickness direction of the heat bonding layer of the present invention.
- FIG. 5 is a graph illustrating the gradient distribution of the components of the heat bonding layer of the present invention.
- FIG. 6 is a graph illustrating the gradient distribution of the individual components of the heat bonding layer of the present invention.
- the thickness of the heat bonding layer 15 is represented by t, and a coordinate X is taken in the thickness direction.
- thermoplastic resin (V) per unit volume at the position ⁇ in the thickness direction is V (; c)
- mass of the total filler ( ⁇ ⁇ ) per unit volume is ⁇ ( ⁇ )
- the total filler concentration C ( % ) at the position ⁇ in the thickness direction is a decreasing function with respect to the thickness ⁇ , and is 50% by mass ⁇ % (%) ⁇ 90% by mass.
- ⁇ (%) ⁇ 1 (%) + ⁇ 2 (%) + ... + ⁇ i (%)> +-+ ⁇ n (%)
- It may be an increasing function or a stationary function for the concentration ( ⁇ ( ⁇ )) ⁇ %.
- the interval between the curve 30 and the curve 31 indicates the concentration of the filler ⁇ ( % ).
- the interval indicates the concentration of filler ⁇ ( ⁇ ), and the interval between curves 32 and 33 indicates the concentration of filler ⁇ .
- the concentration of the fillers ⁇ and ⁇ is a decreasing function of the thickness, but the concentration of the filler ⁇ is
- FIG. 6 illustrates this.
- the total concentration of the filler (total filler concentration) that decreases the adhesiveness instead of improving the flame retardancy is represented by the curve 30 in FIG. As shown in the figure, the distribution is inclined so as to have a decreasing function of the thickness; c (the substrate film 11 side has a high concentration and the conductor 21 side has a low concentration).
- the ratio is an increasing function of the thickness ⁇ or a steady state. As a function.
- a decreasing function of the thickness c.
- the phosphorus-based compound may be preferably used as a decreasing function so that the base film side becomes higher.
- thermoplastic resin and a filler component are optionally added as components of the thermal adhesive layer 15 as described above, and if necessary, other additives are optionally added.
- other additives are optionally added.
- toluene, xylene, methyl ethyl ketone, methyl isobutyl ketone, cyclohexane Kneading with a solvent such as xanone, ethyl acetate, butyl acetate, or isopropyl alcohol, or a diluent solubilize or disperse them to produce a composition ink for the thermal adhesive layer 15 with a viscosity of about 10-4000 cps. I do.
- the base film 11 is coated with the composition ink for the thermal adhesive layer 15 by using, for example, a mouth coat, a rhinoceric slow coat, a gravure coat, a reverse gravure coat, a no coat, and a rod coat.
- a mouth coat for example, a mouth coat, a rhinoceric slow coat, a gravure coat, a reverse gravure coat, a no coat, and a rod coat.
- Kiss coat, knife coat, die coat, slide coat, comma coat, floor coat, spray coat, etc. apply and dry to a thickness of about 15 150 ⁇ m (when dry), preferably 10-40 ⁇ m
- a heat-sealable heat-bonding layer 15 containing (when dried) a flame retardant is formed.
- the concentration of the filler component is inclined and distributed in the thickness direction of the thermal bonding layer.
- a method of making the gradient distribution a phase separation method, a multiple coating method, a slide coating method, or the like can be applied.
- the phase separation method is a method in which the thermal adhesive layer 15 composition ink is applied and dried by gradient separation by phase separation or the like. For example, water on the surface on the opposite side to the base film 11 is used.
- a certain period of time is maintained between application and drying (controlled by the application speed), and the difference in specific gravity between the thermoplastic resin and the filler, or the amount of filler that accompanies solvent drying.
- the filler component can be moved closer to or toward the base film 11 to achieve the desired concentration distribution range. Les ,.
- the composition is repeatedly applied and dried a plurality of times using a plurality of composition inks for the heat bonding layer 15 in which the concentration of a filler component such as a hydrated metal compound is changed in a gradient manner. Since the plurality of coating layers have the same resin and solvent system, they are compatible with each other and are substantially integrated to form the heat bonding layer 15, which can have a gradient distribution.
- the thermal bonding layer 15 has a desired density distribution range according to the density of the composition ink.
- a plurality of composition inks for the heat bonding layer 15 in which the concentration of the filler component is inclined are flowed from a multi-layer die, merged on the way, applied, and dried to obtain heat bonding. Layer 15 is formed.
- the heat bonding layer 15 has a desired concentration distribution range according to the concentration of the composition ink.
- the flat cable 1 of the present invention has a heat bonding layer 15 on both sides of a row of conductors 21 in which a plurality of linear conductors 21 are arranged in parallel on the same plane. It is covered with two flat cable covering members 10 facing each other.
- the flat cable covering material 10 described so far is used, and at least one of the two flat cable covering materials, preferably two of the flat cable covering materials 10, is used.
- the heat bonding layers 15 are superposed on each other with the surfaces facing each other, and a conductor row in which a plurality of conductors 21 such as metals are arranged in the same plane is interposed between the layers.
- the flat cable covering material 10 and the conductor 21 are heated and pressurized and heat-sealed, so that the heat-sealing heat bonding layer 15 and the conductor 21 constituting the flat cable covering material 10 are formed.
- the heat-sealing heat bonding layer 15 and the conductor 21 constituting the flat cable covering material 10 are formed.
- the opposing thermal bonding layers 15 themselves are also self-bonded to each other.
- the two flat cable covering materials 10 facing each other and the conductor 21 are brought into close contact with each other, and the flat cable 1 in which the conductor 21 is embedded in the heat bonding layer 15 and integrated can be manufactured.
- the cross section of the conductor 21 is not particularly limited, and may be, for example, a round shape, an elliptical shape, a rectangular shape, a rectangular shape, or the like, as long as it is linear in the longitudinal direction. Furthermore, it may be covered with a light conductor, that is, an optical fiber.
- the arrangement of the conductor rows may be linear, meandering, sinusoidal, Z-fold, etc., or a combination thereof, as long as the conductor itself is in the same plane.
- Example 5 Example 1
- the following primer layer composition ink is applied to a 23 / im PET film GEC_23 (trade name, manufactured by Teijin DuPont Films) by a gravure roll coating method so that the film thickness becomes 1 / m (dry state). It was applied and dried to form a primer layer.
- the solution A and the solution B were mixed and used immediately before being applied to a film-like substrate.
- a comma coater was applied on the primer layer at a speed of 5 m / min to a film thickness of 40 xm (dry state) and dried. Without blowing the front half of the zone, only the rear half was dried with hot air to form a thermal adhesive layer, and the flat cable covering material of Example 1 was obtained.
- the thermal adhesive layer composition ink includes, as a thermoplastic resin component, a glass transition point of 20 parts by mass of a polyester resin having a glass transition point of -30 ° C and a glass transition point of 4 parts by mass of a polyester resin having a glass transition point of 5 ° C.
- a thermoplastic resin component a glass transition point of 20 parts by mass of a polyester resin having a glass transition point of -30 ° C and a glass transition point of 4 parts by mass of a polyester resin having a glass transition point of 5 ° C.
- 1.2 parts by mass of a polyester resin at 80 ° C 42 parts by mass of aluminum hydroxide, 26.6 parts by mass of antimony trioxide, 4 parts by mass of melamine sulfate, and 1 part by mass of silicon dioxide are used as filler components.
- the mass ratio of the composition of the thermal adhesive layer of the obtained flat cable covering material on the substrate film side and the surface side (conductor side) thereof was measured.
- the measurement method was to remove 3 ⁇ m of the thickness of the substrate film side and the conductor side, and to determine each component and its ratio by the weight method using a known dry incineration method, XRD (X-ray diffraction method), XRF (fluorescence X-ray spectroscopy).
- XRD X-ray diffraction method
- XRF fluorescence X-ray spectroscopy
- the following two types of inks were applied with a comma coater at a speed of 25 m / min, and all of the drying zones were dried with hot air. Similarly, the first layer and the second layer are sequentially coated and dried twice so that the total film thickness becomes 40 ⁇ m (dry state) to form a thermal adhesive layer, and the flat cable covering material is formed. Obtained.
- the ink of the first layer is composed of 20 parts by mass of a polyester resin having a glass transition point of 30 ° C, 4 parts by mass of a polyester resin having a glass transition point of 5 ° C, and polyester having a glass transition point of 80 ° C.
- the ink of the second layer is composed of 28.5 parts by mass of a polyester resin having a glass transition point of 30 ° C and 5.0 parts by mass of a polyester resin having a glass transition point of 5 ° C as a thermoplastic resin component. Using 1.5 parts by mass of a polyester resin at 5 ° C., 59.5 parts by mass of antimony trioxide, 4 parts by mass of melamine sulfate, and 1.5 parts by mass of silicon dioxide were used as filler components.
- the ink of the first layer is composed of 20 parts by mass of a polyester resin having a glass transition point of _30 ° C, 4 parts by mass of a polyester resin having a glass transition point of 5 ° C, and a polyester having a glass transition point of 80 ° C as a thermoplastic resin component.
- the ink of the third layer contained 28.5 parts by mass of a polyester resin having a glass transition point of -30 ° C, 5 parts by mass of a polyester resin having a glass transition point of 5 ° C, and a glass transition point of 80 as thermoplastic resin components. (1.5 parts by weight of a polyester resin, and 61.0 parts by weight of antimony trioxide, 3.5 parts by weight of melamine sulfate, and 0.5 parts by weight of silicon dioxide as filler components.
- the proportions of the 3 zm components on the base film side and the conductor side of the thermal adhesive layer are as shown in Table 23. Further, in Examples 9 to 10, halogens were used instead of nitrogen-based melamine sulfate. In Example 11, the system decabromodiphenyl oxide (DBDPO) was replaced with melamine sulfate. A flat cable covering material was obtained in the same manner as in Example 1 except that a polyammonium polyphosphate was used.
- Example 9 Example 10 Example 11 1 Example 12
- the halogen-based flame retardant was used decabromodiphenyl diphenyl oxide (DBDP0) (Dimension
- Glass transition point to be thermoplastic resin component-50 parts by mass of polyester resin at 30 ° C, 8 parts by mass of polyester resin with glass transition point of 5 ° C, 2 parts by mass of polyester resin with glass transition point of 80 ° C, and filler component 35.5 parts by weight of antimony trioxide, 4 parts by weight of melamine sulfate, 0.5 parts by weight of silicon dioxide, and 1.7 parts by weight of a polyester plasticizer and 0.5 parts by weight of a dispersant was added, they were dissolved dispersed in a mixed solvent consisting of methyl E chill ketone / toluene 1/1, using the heat-bonding layer composition ink was prepared viscosity 2000c P s, at a comma coater, film Apply at a speed of 10 m / min to a thickness of 40 xm (dry state), dry with hot air at 120 ° C using a total drying zone (total length of 6 zones, 18 m), and remove the thermal adhesive layer. Except for forming, a flat
- a flat cable covering material was obtained in the same manner as in Example 1 except that the ratio of each component of 3 ⁇ m on the substrate film side and the conductor side of the thermal adhesive layer was as shown in ⁇ Table 4-1-5 ''. .
- V component (resin) 25.2 40 5 40 23.2 60
- the flat cable covering materials 10 of the above Examples and Comparative Examples were evaluated for flame retardancy, conductor adhesion, and blocking resistance.
- the flat cable coating material 10 was measured in accordance with UL Standard VW-1.Pass was indicated by “ ⁇ ”, and failure was indicated by “X”. Also described in the “flame retardancy” column.
- the evaluation of the conductor adhesiveness was performed by first measuring the thermal adhesive layer surface of the flat cable covering material 10 and the thickness force S100.
- ⁇ m tinned soft copper conductor was heat-sealed with a heated mold at a temperature of 170 ° C for 3 seconds at a pressure of 29.4 N / cm 3 , and in accordance with JIS_K_7127, at 100
- the peel strength was measured at a tensile speed of min and a peel angle of 180 degrees. Also shown in the “Conductor Adhesiveness” column in the lower column of I-5.
- the flat cable covering material 10 was cut into a size of 50 mm X 50 mm, and ten such pieces were stacked so that the base film 11 and the heat bonding layer 15 were in contact with each other. After storing at 40 ° C for 7 days while applying a pressure of 5N / cm 2 , take out and remove at 10 ° C / min tensile rate and peeling at 25 ° C in accordance with JIS-K-1 7127. Measured at an angle of 180 degrees, the peel strength (blocking strength) is 0.1N / width 10mm or less, and the peeling is not acceptable when the base film 11 and the heat bonding layer 15 are questionable. The above items were rejected and represented by "X", and also indicated in the "blocking resistance” column in the lower column of Table 15.
- Example 11 A flat cable is manufactured using the flat cable covering material of [12]. 17 smooth soft copper conductors (thickness 50 ⁇ , width 0.8mm) are arranged in parallel, and two flat cable covering materials 10 each of 60cm in width and 100cm in length face each other so that the thermal adhesive layers of the flat cable covering material 10 face each other. Then, a flat cable was manufactured by passing between a metal roll and a rubber roll heated to 150 ° C. at a speed of lm / min and heating and pressurizing. The flat cable has the same performance as the flat cable covering material of Example 1-112. When used as a wiring cable for connecting a print head and a control unit of an ink jet printer, the flat cable functions normally. did.
- the flat cable covering material of the present invention has both heat sealability with a conductor, adhesiveness such as self-adhesion between the covering materials, and flame retardancy, and is excellent in blocking resistance in production.
- the flat cable of the present invention can eliminate contradictory physical properties such as heat resistance, flame retardancy, insulation, flexibility, and flexibility.
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- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Insulated Conductors (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US10/560,117 US20060127645A1 (en) | 2003-06-11 | 2004-05-31 | Flat-cable-coating material and flat cable |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2003-166944 | 2003-06-11 | ||
JP2003166944A JP4614304B2 (ja) | 2003-06-11 | 2003-06-11 | フラットケーブル被覆材、及びフラットケーブル |
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WO2004112058A1 true WO2004112058A1 (ja) | 2004-12-23 |
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PCT/JP2004/007502 WO2004112058A1 (ja) | 2003-06-11 | 2004-05-31 | フラットケーブル被覆材、及びフラットケーブル |
Country Status (6)
Country | Link |
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US (1) | US20060127645A1 (ja) |
JP (1) | JP4614304B2 (ja) |
KR (1) | KR101006270B1 (ja) |
CN (1) | CN100446131C (ja) |
TW (1) | TW200509145A (ja) |
WO (1) | WO2004112058A1 (ja) |
Cited By (1)
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---|---|---|---|---|
WO2007143043A2 (en) | 2006-06-01 | 2007-12-13 | Carrier Corporation | Air purification system |
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US20040050581A1 (en) * | 2002-09-18 | 2004-03-18 | Hager Thomas P. | Low cost, high performance flexible reinforcement for communications cable |
TWI410690B (zh) * | 2005-06-13 | 2013-10-01 | Tomoegawa Paper Co Ltd | 帶件芯線之製造裝置、帶件芯線用配線裝置及方法 |
JP4770291B2 (ja) * | 2005-06-29 | 2011-09-14 | 大日本印刷株式会社 | ヒ−トシ−ル性テ−プおよびそれを使用したフラットケ−ブル |
JP5093842B2 (ja) * | 2007-07-23 | 2012-12-12 | 東京特殊電線株式会社 | 難燃性フレキシブルフラットケーブル |
KR100866496B1 (ko) * | 2008-06-10 | 2008-11-03 | (주)동방전자 | 플렉시블 플렛 케이블의 제조방법 |
CN101659870B (zh) * | 2009-07-24 | 2011-08-17 | 安徽欣意电缆有限公司 | 低烟低卤阻燃剂及其制备方法以及由其制备阻燃物的方法 |
JP5699314B2 (ja) * | 2010-08-23 | 2015-04-08 | 大日本印刷株式会社 | フラットケーブル用被覆材およびそれを使用したフラットケーブル |
US20120071121A1 (en) * | 2010-09-22 | 2012-03-22 | Lockheed Martin Corporation | Multi-conductor transmit antenna for magnetic communication systems |
DE202011004328U1 (de) | 2011-03-22 | 2012-06-25 | Big Dutchman International Gmbh | Schachtvergaser zum Betrieb bei einer unterstöchiometrischen Oxidation |
JP5644716B2 (ja) * | 2011-08-17 | 2014-12-24 | 日立金属株式会社 | 接着フィルム及びフラットケーブル |
TWI557461B (zh) * | 2011-12-27 | 2016-11-11 | 鴻海精密工業股份有限公司 | 光纖及其製造方法 |
CN102610328B (zh) * | 2012-02-28 | 2013-12-11 | 无锡友方电工有限公司 | 聚乙烯醇缩醛漆包NbTi/Cu超导线制备方法 |
US9376596B2 (en) * | 2012-03-09 | 2016-06-28 | Hitachi Metals, Ltd. | Adhesive film and flat cable using the same |
KR101947223B1 (ko) * | 2015-07-28 | 2019-04-22 | 주식회사 두산 | 절연필름 및 플렉서블 플랫 케이블(ffc) |
CN105304174A (zh) * | 2015-11-17 | 2016-02-03 | 东莞市欧亚电线电缆有限公司 | 一种中和汽车尾气的六芯传感线 |
US11646131B2 (en) * | 2018-08-13 | 2023-05-09 | 3M Innovative Properties Company | Electrical cable with structured dielectric |
JP7419697B2 (ja) * | 2019-08-01 | 2024-01-23 | 株式会社オートネットワーク技術研究所 | ワイヤーハーネス |
CN112812681A (zh) * | 2021-02-08 | 2021-05-18 | 国网山东省电力公司济南供电公司 | 室温固化防水阻燃型双组分聚氨酯浇注树脂及其制备方法 |
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2003
- 2003-06-11 JP JP2003166944A patent/JP4614304B2/ja not_active Expired - Fee Related
-
2004
- 2004-05-31 US US10/560,117 patent/US20060127645A1/en not_active Abandoned
- 2004-05-31 CN CNB2004800164519A patent/CN100446131C/zh not_active Expired - Fee Related
- 2004-05-31 WO PCT/JP2004/007502 patent/WO2004112058A1/ja active Application Filing
- 2004-05-31 KR KR1020057023675A patent/KR101006270B1/ko active IP Right Grant
- 2004-06-10 TW TW093116710A patent/TW200509145A/zh not_active IP Right Cessation
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JPH05128918A (ja) * | 1991-11-06 | 1993-05-25 | Sumitomo Electric Ind Ltd | フラツトケーブル |
JPH06267338A (ja) * | 1993-03-15 | 1994-09-22 | Sumitomo Electric Ind Ltd | フラットケーブル |
JPH09279101A (ja) * | 1996-02-07 | 1997-10-28 | Sekisui Chem Co Ltd | 難燃性多層フィルム及びそれを用いたフラットケーブル |
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JP2002279831A (ja) * | 2001-03-19 | 2002-09-27 | Dainippon Printing Co Ltd | フラットケーブル用シールド材及びシールド付きフラットケーブル |
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WO2007143043A2 (en) | 2006-06-01 | 2007-12-13 | Carrier Corporation | Air purification system |
Also Published As
Publication number | Publication date |
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KR20060017861A (ko) | 2006-02-27 |
JP2005005123A (ja) | 2005-01-06 |
TWI297897B (ja) | 2008-06-11 |
CN100446131C (zh) | 2008-12-24 |
KR101006270B1 (ko) | 2011-01-06 |
US20060127645A1 (en) | 2006-06-15 |
JP4614304B2 (ja) | 2011-01-19 |
TW200509145A (en) | 2005-03-01 |
CN1806297A (zh) | 2006-07-19 |
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