WO2004104129A1 - 熱伝導性感圧接着剤組成物、熱伝導性シート状成形体および該成形体の製造方法 - Google Patents
熱伝導性感圧接着剤組成物、熱伝導性シート状成形体および該成形体の製造方法 Download PDFInfo
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- WO2004104129A1 WO2004104129A1 PCT/JP2004/007408 JP2004007408W WO2004104129A1 WO 2004104129 A1 WO2004104129 A1 WO 2004104129A1 JP 2004007408 W JP2004007408 W JP 2004007408W WO 2004104129 A1 WO2004104129 A1 WO 2004104129A1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/003—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/064—Copolymers with monomers not covered by C09J133/06 containing anhydride, COOH or COOM groups, with M being metal or onium-cation
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
Definitions
- the present invention relates to a heat-conductive pressure-sensitive adhesive composition, a heat-conductive sheet-like molded product, and a method for producing the molded product.
- the present invention relates to a heat-conductive pressure-sensitive adhesive composition, a heat-conductive sheet-like molded product comprising the same, and a method for producing a heat-conductive sheet-like molded product.
- heat generation of electronic components such as plasma display panels (PDP) and integrated circuit (IC) chips has increased as their performance has improved.
- PDP plasma display panels
- IC integrated circuit
- heat is diffused by attaching a heat sink such as a heat sink, a heat dissipating metal plate, or a heat dissipating fin to a heating element such as an electronic component.
- Various heat conductive sheets are used to efficiently conduct heat from the heat generator to the heat radiator, but in general, a pressure-sensitive adhesive sheet is required for fixing the heat generator and the heat radiator .
- Japanese Unexamined Patent Publication No. Hei 6-88061 discloses a polymer and a thermally conductive electrically insulating particle (a thermally conductive particle) comprising a monomer containing a polar monomer copolymerizable with an alkyl (meth) acrylate.
- 10-324853 discloses a monomer mixture containing a (meth) acrylic acid alkyl ester as a main component and containing no polar group-containing monomer, a photopolymerization initiator, Also disclosed is a thermally conductive pressure sensitive adhesive comprising a photopolymer of a mixture of a polyfunctional (meth) acrylate as a binder and a thermally conductive filler.
- Japanese Patent Application Laid-Open No. 2002-322449 discloses a heat transfer composition obtained by blending heat conductive particles with a copolymer of an alkyl (meth) acrylate and a vinyl monomer satisfying a specific formula. Sensitive pressure sensitive adhesives are disclosed.
- the specific biel monomer used here is preferably a special one such as a (meth) acrylate having a phosphate group or 2-hydroxy-13-phenoxypropyl acrylate.
- WO98 / 24860 discloses that an acrylate polymer obtained by copolymerizing a polar monomer having a glass transition temperature of 0 ° C. or lower as a homopolymer and a thermopolymer having a specific polarity are disclosed.
- a heat conductive pressure-sensitive adhesive comprising a conductive filler is disclosed.
- a large amount of a special monomer must be used in order to obtain a suitable effect, which is not economically advantageous, and balances hardness and pressure-sensitive adhesiveness. There is a problem that it is difficult.
- the present applicant has proposed a pressure-sensitive adhesive composition containing a (meth) acrylate polymer having a specific solvent solubility as a solution to these problems of the prior art (Japanese Patent Application Laid-Open No. 20-210). However, it has been found that it is still difficult to keep the balance between the hardness and the pressure-sensitive adhesive property sufficiently good.
- an object of the present invention is to provide a heat-conductive pressure-sensitive adhesive having sufficient pressure-sensitive adhesiveness and, in particular, excellent balance between hardness, pressure-sensitive adhesiveness, and low odor.
- An object of the present invention is to provide a composition and a heat conductive pressure-sensitive adhesive sheet.
- the present inventors have been intensively studying the heat conductive pressure-sensitive adhesive composition, and as a result, in the synthesis of the (meth) acrylic acid ester copolymer, a specific polymerization method has been adopted to have a specific structure. It has been found that the above object can be achieved by obtaining a (meth) acrylic acid ester copolymer and using it as a pressure-sensitive adhesive, and based on this finding, completed the present invention.
- a thermally conductive pressure-sensitive adhesive composition comprising: a thermally conductive inorganic compound (B) by weight.
- the monomer mixture (A2m) polymerized in the presence of the copolymer (A1) forms a homopolymer having a glass transition temperature of -20 ° C or lower.
- the monomer mixture (A'2m) is preferable, and the half-life temperature for one minute of 0.01 to 3 parts by weight per 100 parts by weight of the monomer mixture (A'2m) is 135 to 165 °.
- An organic peroxide-based thermal polymerization initiator (C'2) which is C and satisfies the condition of [Formula 1], and 0 to 20 parts by weight of an internal crosslinking agent having two or more polymerizable unsaturated bonds (D2 ) Is preferred.
- the heat conductive inorganic compound (B) is preferably aluminum hydroxide.
- thermoly conductive sheet-like molded product comprising the above thermally conductive pressure-sensitive adhesive composition.
- a heat-conductive sheet-like molded product comprising a substrate and a layer of the heat-conductive pressure-sensitive adhesive composition formed on at least a part of the surface thereof Is provided.
- the present invention provides a method for producing a thermally conductive sheet-shaped product, which comprises mixing, heating and sheeting a thermally conductive inorganic compound (B) in an amount of 70 to 170 parts by weight per part by weight.
- the thermal polymerization initiator (C2) has a half-life temperature of 135-minute per minute. 165 ° C and the following formula 1
- Formula 1 A ⁇ 0 / MX 100 ⁇ 3 (A ⁇ 0: theoretical amount of active oxygen (% by weight) of organic peroxide-based thermal polymerization initiator, M: molecular weight of organic peroxide-based thermal polymerization initiator)
- an organic peroxide-based thermal polymerization initiator (C2) that satisfies the following conditions is used, and 0 to 20 parts by weight of an internal crosslinking agent (D2) having two or more polymerizable unsaturated bonds is used. Is also preferred.
- the thermally conductive sheet-shaped molded product is a copolymer (Al), a monomer mixture (A2m), an organic peroxide-based thermal polymerization initiator (C ′ 2), It can be obtained by mixing the inorganic compound (B) and, if necessary, an internal crosslinking agent (D2) having two or more polymerizable unsaturated bonds, and then forming a sheet under heating.
- Al a copolymer
- A2m monomer mixture
- C ′ 2 organic peroxide-based thermal polymerization initiator
- the heat conductive pressure-sensitive adhesive composition of the present invention contains a (meth) acrylic acid ester copolymer (A) as a first essential component.
- the (meth) acrylate copolymer (A) forms a homopolymer having a glass transition temperature of -20 ° C or lower.
- Units derived from (meth) acrylate monomers (a 1) 80 To 99.9% by weight, a monomer unit having an organic acid group (a 2) 0.1 to 20% by weight, a monomer unit having a functional group other than the organic acid group (a 3) 0 to: L 0% by weight and a monomer unit derived from a monomer copolymerizable therewith (a4) A copolymer containing 0 to 10% by weight (A1) Glass transition in the presence of 100 parts by weight (Meth) acrylic acid ester monomer (a 5m) 40 to 100% by weight, preferably 50 to 99.9% by weight to form a homopolymer having a temperature of -20 ° C or less Monomer (a 6m) having a content of 0 to 60% by weight, preferably 0.1 to 30% by weight, and a monomer copolymerizable therewith (a 7m) having a content of 0 to 20% by weight Mixture (A2m) 5 to 70 parts by weight It is.
- the term “(meth) acrylate” means acrylate and / or methacrylate.
- the (meth) acrylate an alkyl (meth) acrylate having an alkyl group having 2 to 10 carbon atoms or an alkoxyalkyl (meth) acrylate having an alkoxyalkyl group having 2 to 8 carbon atoms is preferable. Used.
- the copolymer (A1) used to obtain the (meth) acrylate copolymer (A) forms a homopolymer having a glass transition temperature of not more than 120 ° C.
- a 1 80 to 99.9% by weight, monomer unit having an organic acid group (a 2) 0.1 to 20% by weight, unit containing a functional group other than an organic acid group Body unit (a 3) 0-10% by weight And a monomer unit derived from a monomer copolymerizable therewith ( a 4) 0 to L 0% by weight.
- the (meth) acrylate monomer (aim), which gives a (meth) acrylate monomer unit (a1) that forms a homopolymer having a glass transition temperature of less than or equal to 20 ° C, is particularly useful.
- examples include, but are not limited to, ethyl acrylate (glass transition temperature of the homopolymer is -24 ° C), n-propyl acrylate (at the same 37), n-butyl acrylate (at the same 54 ° C), acrylic Acid sec-butyl (identical 22 ° C), n-pentyl acrylate (identical 60 ° C), n-hexyl acrylate (identical 61 ° C), n-octyl acrylate (identical 65 ° C), acrylic acid 2-ethylhexyl (identical 50 ° C), 2-methoxyethyl acrylate (identical 50 ° C), 3-methoxypropyl acrylate (identical 75 °
- the monomer unit (al) derived therefrom is 80 to 99.9% by weight in the (meth) acrylic acid ester copolymer (A1). Preferably, it is used in the polymerization in such an amount that it becomes 85 to 99% by weight, more preferably 90 to 97% by weight.
- the amount of the (meth) acrylic acid ester monomer (a im) is less than the lower limit of the above range, the pressure-sensitive adhesive property of the heat-conductive pressure-sensitive adhesive composition obtained therefrom near room temperature decreases.
- the monomer (a 2m) that gives the monomer unit (a 2) having an organic acid group is not particularly limited, and typical examples thereof include sulfonic acid groups, acid anhydride groups, and sulfonic acid groups.
- a monomer having an organic acid group can be mentioned.
- monomers containing a sulfenic acid group, a sulfinic acid group, a phosphoric acid group and the like can also be used.
- Specific examples of the monomer having a carboxylic acid group include a,) 3-ethylenically unsaturated monocarboxylic acid such as acrylic acid, methacrylic acid, and crotonic acid; and i3, such as itaconic acid, maleic acid, and fumaric acid.
- the monomer having a sulfonic acid group include ⁇ , ⁇ monounsaturated sulfonic acids such as acrylsulfonic acid, methallylsulfonic acid, vinylsulfonic acid, styrenesulfonic acid, and acrylamido-2-methylpropanesulfonic acid. These salts can be mentioned.
- monomers having an organic acid group monomers having a carbonyl group are preferred, and acrylic acid and methacrylic acid are more preferred. These are industrially cheap and easy It has good copolymerizability with other monomer components and is preferable in terms of productivity.
- One of these monomers having an organic acid group (a 2m) may be used alone, or two or more may be used in combination.
- the monomer unit (a 2) derived from the monomer (a 2m) is 0.1 to 20% by weight in the (meth) acrylate copolymer (A1), Preferably, it is used in the polymerization in an amount of 1 to 15% by weight, more preferably 3 to 10% by weight. If less than 0.1% by weight of the monomer (a 2m) is used, the resulting heat conductive pressure-sensitive adhesive sheet will have poor pressure-sensitive adhesive properties.
- the monomer unit (a 2) having an organic acid group can be conveniently introduced into a copolymer by polymerization of a monomer (a 2m) having an organic acid group.
- an organic acid group may be introduced by a known polymer reaction.
- the copolymer (A 1) used to obtain the (meth) acrylate copolymer (A) is a polymer derived from a monomer (a 3m) containing a functional group other than an organic acid group.
- Unit (a3) may contain 10% by weight or less, preferably 5% by weight or less.
- Examples of the functional group other than the organic acid group include a hydroxyl group, an amino group, an amide group, an epoxy group, and a mercapto group.
- Examples of the monomer having a hydroxyl group include hydroxyalkyl (meth) acrylates such as hydroxyethyl (meth) acrylate and hydroxypropyl (meth) acrylate.
- Examples of the monomer having an amino group include ⁇ , ⁇ -dimethylaminomethyl (meth) acrylate, ⁇ , ⁇ -dimethylaminoethyl (meth) acrylate, and aminostyrene.
- Examples of the monomer having an amide group include acrylamide, methacrylamide, ⁇ -methyl acrylamide, ⁇ -methyl methacrylamide, ⁇ ,] 3-ethylenically unsaturated carboxylic acid such as ⁇ , ⁇ -dimethylacrylamide and the like. Acid amide monomers and the like can be mentioned.
- Examples of the monomer having an epoxy group include (meth) glycidyl acrylate and arylglycidyl ether.
- the monomer (a3m) containing a functional group other than the organic acid group one type may be used alone, or two or more types may be used in combination.
- the monomer unit (a 3) derived from the monomer unit (a 3m) is 10% by weight or less in the (meth) acrylate copolymer (A1). Preferably, it is used in the polymerization in such an amount that it is less than 5% by weight. If the monomer (a 3m) is used in an amount exceeding 10% by weight, the viscosity at the time of polymerization is remarkably increased, solidifying and making the handling of the polymer difficult.
- the copolymer (A1) forms a homopolymer having a glass transition temperature of -20 ° C or lower (me E)
- the monomer units having organic acid groups (a 2) and the monomer units containing functional groups other than organic acid groups (a 3) may contain a monomer unit (a4) derived from a monomer (a4m) copolymerizable with these monomers.
- the monomer (a4m) one type may be used alone, or two or more types may be used in combination.
- the monomer (a 4m) is not particularly limited, but specific examples thereof include a monomer other than a (meth) acrylate monomer (a im) which forms a homopolymer having a glass transition temperature of ⁇ 20 ° C. or lower.
- the amount of the monomer unit (a4) derived from the monomer (a4m) is an amount that is 10% by weight or less of the copolymer (A1), preferably an amount that is 5% by weight or less. .
- (meth) acrylate monomers other than the (meth) acrylate monomer (a im) which form a homopolymer having a glass transition temperature of not more than 20 ° C include acryl.
- Methyl acrylate (glass transition temperature of homopolymer is 10 ° C), methyl methacrylate (105 ° C), ethyl methacrylate (63 ° C), n-propyl methacrylate (25 ° C), N-Butyl acrylate (20 ° C).
- 3-ethylenically unsaturated polycarboxylic acid perfect ester include dimethyl fumarate, getyl fumarate, di-n-butyl fumarate, dimethyl maleate, getyl maleate, and di-n-maleate.
- alkenyl aromatic monomer include styrene, ⁇ -methylstyrene, methyl permethylstyrene, piertruene and dipinylbenzene.
- conjugated diene monomers include 1,3-butadiene, 2-methyl-1,3-butanediene, 1,3-pentenediene, 2,3-dimethyl-1,3-butadiene, Chlor-1,3-butadiene, cyclopentene, and the like can be mentioned.
- non-conjugated diene monomer examples include 1,4-hexadiene, dicyclopentene, and edidenenorpolene.
- pinyl cyanide monomer examples include acrylonitrile, methacrylonitrile, ⁇ -chloroacrylonitrile, ⁇ -eduracrylonitrile, and the like.
- carboxylic acid unsaturated alcohol ester monomer examples include pinyl acetate.
- olefin monomer examples include ethylene, propylene, butene, pentene and the like.
- the weight average molecular weight (Mw) of the copolymer (A1) was determined by gel permeation chromatography. It is preferably 200,000 or more, and particularly preferably in the range of 250,000 to 400,000, as measured by the GPC method (using polystyrene as a standard substance). When the weight average molecular weight (M w) is within this range, excellent shape retention can be obtained.
- the copolymer (A1) forms a homopolymer having a glass transition temperature of ⁇ 20 ° C. or lower (medium) Acrylate monomer (a lm), monomer having an organic acid group (a2m ), A monomer containing a functional group other than the organic acid group (a 3m) and, if necessary, a copolymerizable monomer (a 4m) with these monomers. be able to.
- the method of polymerization is not particularly limited, and may be any of solution polymerization, emulsion polymerization, suspension polymerization, bulk polymerization, and the like, and may be other methods.
- Solution polymerization is preferable, and among them, solution polymerization using a carboxylic acid ester such as ethyl acetate or ethyl lactate or an aromatic solvent such as benzene, toluene, or xylene as a polymerization solvent is preferable.
- the monomer may be added in portions to the polymerization reaction vessel, but it is preferable to add the entire amount at once.
- the method of initiating the polymerization is not particularly limited, but it is preferable to use a thermal polymerization initiator (C1) as the polymerization initiator.
- the thermal polymerization initiator (C1) is not particularly limited, and may be either a peroxide or an azo compound.
- peroxide thermal polymerization initiators examples include hydroperoxides such as t-butyl hydroperoxide; peroxides such as benzoylperoxide and cyclohexanone peroxide; persulfuric acid sodium and sodium persulfate Persulfates such as ammonium persulfate; and the like.
- peroxides can be used as a redox catalyst in appropriate combination with a reducing agent.
- azo compound thermal polymerization initiator examples include 2,2'-azobisisobutyronitrile, 2,2'-azobis (2,4-dimethylvaleronitrile), and 2,2'-azobis (2-methylbutyl nitrile). ) And the like.
- the amount of the polymerization initiator is not particularly limited, but is usually in the range of 0.01 to 5 parts by weight based on 100 parts by weight of the monomer.
- the other polymerization conditions (polymerization temperature, pressure, stirring conditions, etc.) of these monomers are not particularly limited.
- the obtained polymer is separated from the polymerization medium.
- the method of separation is not particularly limited, but in the case of solution polymerization, a polymer can be obtained by placing the polymerization solution under reduced pressure and distilling off the polymerization solvent.
- the (meth) acrylate copolymer (A) used in the present invention has a glass transition temperature of not more than 20 ° C. in the presence of 100 parts by weight of the copolymer (A1) obtained as described above.
- An example of a (meth) acrylic acid ester monomer (a 5m) that forms a homopolymer having a glass transition temperature of not more than 20 ° C is (meth) acrylic acid used in the synthesis of the polymer (A1).
- the same (meth) acrylate monomer as the ester monomer (aim) can be mentioned.
- the (meth) acrylate monomer (a5m) one type may be used alone, or two or more types may be used in combination.
- the ratio of the (meth) acrylate monomer (a5m) in the monomer mixture (A2m) is 40 to 100% by weight, preferably 50 to 99.9% by weight, and more preferably 70 to 99.5%. %, Particularly preferably 90 to 99% by weight.
- the ratio of the (meth) acrylic acid ester monomer (a 5m) is less than the above range, the flexibility of the heat conductive pressure-sensitive adhesive composition obtained using the copolymer (A) is insufficient.
- the monomer (A2m) does not need to contain any monomer other than the (meth) acrylate monomer (a5m), but if it does not, the high-temperature bonding of the resulting thermally conductive sheet-like molded product The strength tends to be poor, and problems such as odor due to unreacted monomers are likely to occur.
- Examples of the monomer (a 6m) having an organic acid group include monomers having the same organic acid group as those exemplified as the monomer (a 2m) used for the synthesis of the polymer (A1). Can be.
- the monomer having an organic acid group (a 6m) one type may be used alone, or two or more types may be used in combination.
- the proportion of the monomer having an organic acid group (a6m) in the monomer mixture (A2m) is from 0 to 60% by weight, preferably from 0.5 to 30% by weight, more preferably from 0.5 to 0.5% by weight. It is preferably 20 to 20% by weight, particularly preferably 1 to 10% by weight.
- the monomer having an organic acid group (a 6m) is not essential, but the use of this monomer (a 6m) improves the pressure-sensitive adhesive properties of the resulting heat conductive pressure-sensitive adhesive composition. . However, when the monomer (a 6m) is used in an amount exceeding 60% by weight, the hardness of the heat conductive pressure-sensitive adhesive sheet increases.
- a homopolymer capable of forming a homopolymer having a glass transition temperature of 20 ° C or lower is a monomer copolymerizable with a (meth) acrylate monomer (a 5m) and a monomer having an organic acid group (a 6m).
- Examples of the monomer (a 7m) include the same monomers as those exemplified as the monomer (a 3m) or the monomer (a 4m) used in the synthesis of the polymer (A1).
- the ratio of the monomer (a7m) in the monomer mixture (A2m) is an amount which is 20% by weight or less, preferably 10% by weight or less of the monomer mixture (A2m).
- the amount of the monomer mixture (A2m) is 5 to 70 parts by weight, preferably 20 to 60 parts by weight, based on 100 parts by weight of the copolymer (A1). If the amount of the monomer mixture (A 2 m) is less than the lower limit of the above range, it is difficult to uniformly mix the (meth) acrylate copolymer (A) and the thermally conductive inorganic compound (B). And the high-temperature holding power, thermal conductivity, and the like of the obtained heat-conductive sheet-like molded body decrease.
- the conditions for polymerizing the monomer mixture (A2m) in the presence of the copolymer (A1) are not particularly limited except for the method of initiating the polymerization, and are the same as those for the synthesis of the copolymer (A1). Can be shown.
- a thermal polymerization initiator (C2) is used as a polymerization initiation method for polymerizing the monomer mixture (A2m) in the presence of the copolymer (A1).
- a photopolymerization initiator is used in place of the thermal polymerization initiator, the degree of polymerization of the sheet formed from the obtained heat conductive pressure-sensitive adhesive composition becomes nonuniform near and inside the light-irradiated surface. The adhesive strength of the sheet may be poor.
- the thermal polymerization initiator (C2) include the same type as the thermal polymerization initiator (C1) mentioned as a preferable one among the polymerization initiators used in the synthesis of the copolymer (A1).
- a compound having a one-minute half-life temperature of 120 to 170 ° C or lower is used, and preferably a one-minute half-life temperature of 135 to 165 ° C, and the following formula 1:
- a ⁇ 0 / MX 100 ⁇ 3 (A ⁇ 0: theoretical active oxygen content of organic peroxide-based thermal polymerization initiator (% by weight), M: molecular weight of organic peroxide-based thermal polymerization initiator)
- An organic peroxide-based thermal polymerization initiator (C, 2) that satisfies the above condition is used. If at least one of the one-minute half-life temperature and [Equation 1] does not satisfy the above range, the odor intensity of the resulting heat conductive pressure-sensitive adhesive composition tends to increase.
- organic peroxide-based thermal polymerization initiator (C ′ 2) include 1,6-bis (t-butylperoxyl-propyloxy) hexane [1 minute half-life temperature 150.
- C, A. O / MX 100 2.6: Abbreviations (150, 2.6).
- T-butylperoxy-2-ethylhexyl monopotassium liponate (161, 2.6), 2,2-bis (4,4-zy t-butylperoxycyclohexyl) propane (154, 2.0) ), T-butylperoxylaurate (159, 2.2), 2,5-dimethyl-2,5-di (m-toluoylperoxy) hexane (156, 1.9), 2 , 5-Dimethyl-2,5-di (benzoylperoxy) hexane (158, 2.1), diethylene glycol bis (t-butylbenzyloxyluponate)
- the amount of the thermal polymerization initiator (C2) used is 5 parts per 100 parts by weight of the monomer mixture (A2m). It can be appropriately selected within the range of 0 parts by weight or less, but is usually 0.01 to 10 parts by weight, preferably 0.01 to 3 parts by weight, more preferably 0.05 to 2 parts by weight, particularly Preferably it is in the range of 0.1 to 1.5 parts by weight. If the thermal polymerization initiator (C 2) is not used, it is not preferable because monomer odor remains in the resulting heat conductive sheet. On the other hand, if the amount is too large, the odor intensity due to the initiator or its residue increases, which is not preferable.
- an internal cross-linking agent (D 2) having two or more polymerizable unsaturated bonds to perform intra- and / or inter-molecular cross-linking on the copolymer. Can be formed. .
- Examples of the internal crosslinking agent (D 2) having two or more polymerizable unsaturated bonds include 1,6-hexandiol di (meth) acrylate, 1,2-ethylene glycol di (meth) acrylate, 1,1,2-dodecanediol di (meth) acrylate, polyethylene glycol (meth) acrylate, polypropylene glycol (meth) acrylate, neopentylda alcohol (meta) acrylate, erythritol ) Acrylate, trimethylolpropane tri.
- the content of the internal crosslinking agent (D 2) having two or more polymerizable unsaturated bonds is 0 to 20 parts by weight, preferably 0 to 100 parts by weight, based on the monomer mixture (A 2 m). It is from 3 to 15 parts by weight, more preferably from 0.5 to 10 parts by weight. If the content of the internal crosslinking agent (D 2) having two or more polymerizable unsaturated bonds exceeds 20 parts by weight, the hardness of the heat-conductive pressure-sensitive adhesive sheet increases, which is not preferable.
- the polymerization conversion of the monomer mixture (A 2 m) and the reaction rate of the internal crosslinking agent (D 2) having two or more polymerizable unsaturated bonds are both preferably 95% by weight or more. If the polymerization conversion rate or the reaction rate is too low, monomer odor remains in the obtained heat conductive sheet, which is not preferable.
- the heat conductive pressure-sensitive adhesive composition of the present invention comprises a (meth) acrylate copolymer (A) and a heat conductive inorganic compound (B).
- thermally conductive inorganic compound (B) examples include metal oxides such as alumina, magnesium oxide, beryllium oxide, and titanium oxide; metal nitrides such as boron nitride, gay nitride, and aluminum nitride; carbides such as silicon carbide; and copper.
- Metals such as silver, iron, aluminum, and nickel; carbon compounds such as diamond and carbon; silica powders such as quartz and quartz glass; and more preferably, Group 2 or Group 13 of the periodic table.
- Group 2 metals include magnesium, calcium, strontium, barium and the like, and Group 13 metals include aluminum, gallium and indium. Among them, metal hydroxides are preferable, and aluminum hydroxide is particularly preferable. By using aluminum hydroxide, excellent flame retardancy can be imparted to the heat conductive pressure-sensitive adhesive composition of the present invention.
- One of these heat conductive inorganic compounds (B) may be used alone, or two or more thereof may be used in combination.
- the shape of the thermally conductive inorganic compound (B) is not particularly limited, either, and may be spherical, needle-like, fibrous, squamous, dendritic, flat, or irregular.
- the zK aluminum oxide one having a particle size of usually 0.2 to 120 m, preferably 0.7 to: L 0 0 m is used. Further, those having a particle size of 1 to 80 / xm are more preferable.
- the average particle size is less than 0.2 m, the viscosity of the pressure-sensitive adhesive composition may increase, and it may be difficult to knead the polymer and the thermally conductive inorganic compound. There is a possibility that the adhesiveness of the sheet-shaped molded body is reduced. On the other hand, if it exceeds 120 im, the holding power of the pressure-sensitive adhesive composition and the sheet-shaped molded product may be reduced.
- the amount of the thermally conductive inorganic compound (B) used is 70 to 170 parts by weight, preferably 80 to 160 parts by weight, based on 100 parts by weight of the copolymer (A). It is more preferably in the range of 100 to 150 parts by weight. If the amount is too small, there are problems such as high-temperature adhesive strength and thermal conductivity. On the other hand, if the amount is too large, the hardness increases and the problem of reduced adhesion occurs.
- the heat conductive pressure-sensitive adhesive composition of the present invention contains the copolymer (A) and the heat conductive inorganic compound (B) in the above-described ratio, and, if necessary, pigments, other fillers, flame retardants, and aging.
- Various known additives such as an inhibitor, a thickener, and a tackifier can be contained.
- Pigments can be used regardless of organic or inorganic pigments, such as Rippon Pump Rack or titanium dioxide.
- fillers include inorganic compound and organic compound fine particles. Nanoparticles such as fullerene and carbon nanotubes may be added.
- Examples of the flame retardant include ammonium polyphosphate, zinc borate, tin compounds, organic phosphorus compounds, red phosphorus compounds, and silicone flame retardants.
- the antioxidant it is not usually used because it has a high possibility of inhibiting radical polymerization, but if necessary, an antioxidant such as a polyphenol-based, hydroquinone-based, or hindered amine-based antioxidant can be used.
- fine particles of inorganic compounds such as acrylic polymer particles and fine silica, and reactive inorganic compounds such as magnesium oxide can be used.
- terpene resins As tackifiers, terpene resins, terpene phenol resins, rosin resins, stones Examples include oil-based resins, cumarone-indene resins, phenolic resins, 7-added rosin esters, disproportionated gin esters, and xylene resins.
- the heat conductive pressure-sensitive adhesive composition of the present invention further comprises an external cross-linking agent for enhancing cohesive strength as a pressure-sensitive adhesive and improving heat resistance, etc., so that the copolymer has a cross-linked structure. Can be introduced.
- Examples of the external cross-linking agent include multi-functional isocyanate cross-linking agents such as trimethylene diisocyanate, trimethylolpropane diisocyanate, and diphenylmethane triisocyanate; diglycidyl ether, polyethylene dalicol diglycidyl ether, and trimethylolpropane.
- Epoxy crosslinking agents such as tridalicidyl ether; melamine resin crosslinking agents; amino resin crosslinking agents; metal salt crosslinking agents; metal chelate crosslinking agents; and peroxide crosslinking agents.
- the external cross-linking agent is used to form a cross-link in the molecule of the copolymer and / or between the molecules by performing a heating treatment or a radiation irradiation treatment after obtaining the copolymer and adding it.
- the method for obtaining the heat conductive pressure-sensitive adhesive composition of the present invention from the (meth) acrylate copolymer (A) and the heat conductive inorganic compound (B) is not particularly limited. B) and a separately synthesized (meth) acrylate copolymer (A) may be mixed, but the (meth) acrylate copolymer (A) and the thermally conductive inorganic compound (B) may be mixed. From the viewpoint of uniformly mixing the (meth) acrylic ester copolymer (A) and the mixing with the heat conductive inorganic compound (B), it is preferable to perform the method simultaneously.
- the method of mixing is not particularly limited, and for example, the dried ( Even in the dry mixing method in which the acrylate copolymer (A) and the thermally conductive inorganic compound (B) are mixed using a roll, a Hensiel mixer, a kneader, etc., the organic compound is kept in a container equipped with a stirrer.
- a wet mixing method of mixing in the presence of a solvent may be used.
- the mixing order of each component is not particularly limited. The mixing is preferably performed at such a temperature that the polymerization of the monomer mixture (A 2 m) does not proceed.
- the heat conductive pressure-sensitive adhesive composition of the present invention can be formed into a sheet-like molded body.
- the sheet-shaped molded article may be composed only of the heat-conductive pressure-sensitive adhesive composition. It may be a composite comprising a heat-conductive and pressure-sensitive adhesive composition layer formed on at least a part of its surface, usually one or both surfaces.
- the thickness of the heat conductive pressure-sensitive adhesive composition layer in the sheet-shaped molded body of the present invention is not particularly limited, but is usually 50 xm to 3 mm. If the thickness is less than 50 zm, air may easily be entrained when affixed to the heat generator and the heat radiator, and as a result, sufficient thermal conductivity may not be obtained. On the other hand, if the thickness is more than 3 mm, the thermal resistance of the sheet increases, and the heat dissipation may be impaired.
- the substrate is not particularly limited.
- thermoconductive plastic film containing a heat-conductive filler includes polyimide, polyethylene terephthalate, polyethylene naphthalate, polytetrafluoroethylene, polyether ketone, polyester sulphone, polymethyl pentene, polyether imide, polysulfone, polyphenylene sulfide, and polyamide imide. Films made of heat-resistant polymers such as polyesterimide, aromatic polyamide and the like can be used.
- the method for producing the sheet-shaped molded article from the heat-conductive pressure-sensitive adhesive composition is not particularly limited.
- the heat-conductive pressure-sensitive adhesive composition or a solution thereof may be prepared by peeling a process paper such as a polyester film. The solvent may be removed by an appropriate method if necessary. If necessary, the heat conductive pressure-sensitive adhesive composition may be sandwiched between two release-processed sheets of paper and passed between rolls to form a sheet. Furthermore, it is also possible to control the thickness through a die when extruding from the extruder.
- thermoly conductive sheet-like molded product comprising the substrate and the thermally conductive pressure-sensitive adhesive composition layer formed on one or both surfaces thereof can be obtained.
- the heat conductive pressure-sensitive adhesive composition of the present invention can be provided directly as a part of an electronic component by being directly formed on a substrate such as a heat radiator.
- the heat conductive sheet-like molded article of the present invention is a unit (a 1) 80 derived from a (meth) acrylate monomer which forms a homopolymer having a glass transition temperature of ⁇ 20 ° C. or lower. to 9 9.9 wt%, the monomer unit having an organic acid group (a 2) 0.
- monomer having an organic acid group (a 6 m) 0 5 to 70 parts by weight of a monomer mixture (A 2 m) consisting of 1 to 30% by weight, and a monomer copolymerizable therewith (a 7m) 0 to 20% by weight; m) 0.01 to 3 parts by weight of an organic peroxide-based thermal polymerization initiator (C'2) per 100 parts by weight, and 0 to 20 parts by weight of an interior having two or more polymerizable unsaturated bonds.
- a 6 m 0 5 to 70 parts by weight of a monomer mixture (A 2 m) consisting of 1 to 30% by weight, and a monomer copolymerizable therewith (a 7m) 0 to 20% by weight; m) 0.01 to 3 parts by weight of an organic peroxide-based thermal polymerization initiator (C'2) per 100 parts by weight, and 0 to 20 parts by weight of an interior having two or more polymerizable unsaturated bonds.
- C'2 organic peroxide-
- the (meth) acrylic acid ester copolymer (A) is produced from the copolymer (A1) and the monomer mixture (A2m), and at the same time, the (meth) acrylic ester copolymer (B) It is possible to produce a sheet-like molded product of the heat-conductive pressure-sensitive adhesive composition mixed uniformly.
- the method of forming the heat-conductive pressure-sensitive adhesive composition in which the (meth) acrylic ester copolymer (A) is produced and simultaneously mixed with the heat-conductive inorganic compound (B) at the same time.
- the high-temperature adhesive strength of the heat-conductive pressure-sensitive adhesive composition sheet-like molded body which was difficult without conventional photopolymerization and photocrosslinking, and the pressure-sensitive adhesiveness over a wide temperature range from low to high temperatures
- the performance of having both of these can be achieved only by heat treatment.
- the odor of the heat-conductive pressure-sensitive adhesive composition sheet-like molded product can be suppressed to a low level.
- the copolymer (Al), the monomer mixture (A2m), the organic peroxide-based thermal polymerization initiator (C'2), the thermally conductive inorganic compound (B), and if necessary After mixing the internal cross-linking agent (D2) having two or more polymerizable unsaturated bonds by heating under heating, the obtained (meth) acrylic ester copolymer (A) and the thermally conductive inorganic compound (B) are mixed.
- the thermally conductive pressure-sensitive adhesive composition mixed uniformly is sheeted.
- the mixing method is not particularly limited, but the polymerization of the copolymer (A1) and the monomer mixture (A2m) is carried out by polymerizing an organic peroxide-based thermal polymerization initiator (C2) and, if necessary, two or more polymerization initiators.
- C2 organic peroxide-based thermal polymerization initiator
- D2 internal cross-linking agent having an unsaturated bond
- uniform mixing of the resulting (meth) acrylate copolymer (A) and the thermally conductive inorganic compound (B) is ensured.
- a powerful mixer for this purpose, it is preferable to use a powerful mixer. Mixing may be carried out batchwise or continuously.
- the order of mixing the components is not particularly limited.
- Examples of the batch-type mixer include kneaders and stirrers for low-viscosity raw materials such as crushers, crushers, internal mixers, and planetary mixers.
- Examples of the continuous mixer include a Farrell-type continuous mixer that combines a rotor and a screw, and a screw-type mixer with a special structure.
- a single-screw extruder and a twin-screw extruder used for the extrusion process are exemplified. These extruders and kneaders may be used in combination of two or more kinds, or two or more machines of the same type may be used in combination. Among them, twin-screw extruders are preferred from the viewpoints of continuity and shear rate.
- the heating temperature must be a temperature at which the polymerization proceeds smoothly.
- 0T preferably in the range of 120 ° C to 160 ° C.
- the atmosphere during the heating and mixing is not particularly limited as long as the atmosphere allows the radical polymerization to proceed.
- the method of forming the heat-conductive pressure-sensitive adhesive composition obtained by heating and mixing into a sheet is not particularly limited, but a method in which the heat-sensitive pressure-sensitive adhesive composition is sandwiched between process papers and passed between rolls, and a method in which a die is passed when extruded from a kneader and so on.
- the same mixer as used in the production method (I) can be mentioned.
- the order of mixing the components is not particularly limited.
- the temperature at which each component is mixed should be 60 ° C or less. If the mixing is carried out at a temperature higher than 60 ° C, the monomer mixture (A2m) starts to polymerize during the mixing, and the viscosity increases, making subsequent operations difficult.
- the mixture of each component is formed into a sheet under heating.
- the heat of the copolymer (A1) and the monomer mixture (A2m) cause the polymerization of the organic peroxide-based thermal polymerization initiator (C'2) and, if necessary, two or more polymerizable unsaturated bonds.
- C'2 organic peroxide-based thermal polymerization initiator
- D2 internal cross-linking agent
- the heating temperature ranges from 100 ° C to 180 ° C, preferably from 120 to 160 ° C.
- the polymerization reaction of the monomer mixture (A2m) does not proceed sufficiently, resulting in a problem that the obtained sheet-like molded article has a low holding power at high temperatures and unreacted monomers generate odor. There is it. If the temperature exceeds 180 ° C, the resulting thermally conductive sheet-shaped molded product may have poor appearance such as foaming.
- the evaluation method of each characteristic of the (meth) acrylate copolymer, the heat conductive pressure-sensitive adhesive composition, and the heat conductive sheet is as follows.
- a 25 mm X 125 mm test piece is placed on an aluminum plate, pressed with a 2 kg roller, and left for 1 hour. This sample is set in a thermostatic chamber set at room temperature, and the maximum adhesive strength in the direction of 90 degrees is measured at a tensile speed of 50 mmZ.
- a 25 mm X 25 mm test piece is placed on an aluminum plate, pressed with a 2 kg mouthpiece, and then a glass plate is pressed on the other surface. After standing for 1 hour, the aluminum plate is fixed to the wall with the test piece in a vertical position, and a 500 g weight is hung on the glass plate and placed on a constant temperature layer in a 100 ° C atmosphere. In this state, the time until the weight falls is measured.
- the test is performed in accordance with 111 ⁇ Standard 11 94 "Combustion test method for plastic materials for equipment parts".
- the sheet-shaped sample is subjected to flame contact for 10 seconds.
- the second flame contact for 10 seconds is conducted, and the test items shown in Table 1 are evaluated.
- Combustion class classification UL94 V—0 UL94 V—1 UL94 V—2 Maximum afterburning time (* 1) seconds ⁇ 30 seconds ⁇ 30 seconds Afterburning after first and second contact ⁇ 50 seconds ⁇ 250 seconds ⁇ 250 seconds Sum of time (* 2)
- * 3 The maximum value of five samples, the sum of the afterflame time and the flameless combustion time obtained for each sample.
- TMCH Abbreviated as "TMCH”.
- the one-minute half-life temperature is 149 ° C. 1.
- 1.6 parts and 210 parts of aluminum hydroxide were added all at once, and the mixture was sufficiently mixed at room temperature using a crusher. At this time, the weight ratio of aluminum hydroxide to the total of 100 parts of the copolymer (Al) (1) and the monomer mixture (A2m) (1) is 145 parts.
- degas while stirring under reduced pressure A liquid sample was obtained. Place a polyester film with a release agent on the bottom of a 400 mm long, 400 mm wide, 2 mm deep mold, then inject the same sample into the mold and cover it with a polyester film with a mold release agent.
- a monomer consisting of 15.6% of butyl acrylate, 75.4% of 2-ethylhexyl acrylate, 3.5% of methacrylic acid, 4.1% of acrylic acid, and 1.4% of PEGDMA 100 parts of the mixture, 13.4 parts of TMCH, 700 parts of ethyl acetate, and 145 parts of aluminum hydroxide were added and uniformly mixed. After the mixture was replaced with nitrogen, a polymerization reaction was carried out at 80 ° C for 6 hours. The polymerization conversion was 97%. When the mixture of the obtained polymer and aluminum hydroxide was dried under reduced pressure and the ethyl acetate was evaporated, the mixture was remarkably thickened and solidified.
- Copolymer obtained in the same manner as in Example 1 (1) 100 parts, butyl acrylate 50.6%, methacrylic acid 11.2%, 2-ethylhexyl acrylate 33.7% and PEGMA4 54.5% monomer mixture (A2m) 44.5 parts, TMCH 1.6 ⁇ (5, and aluminum hydroxide 210 sound
- the screw rotation speed of the twin-screw extruder was set to 120 rotations / minute, and all barrels in the extruder were controlled at 50 ° C.
- a heat conductive pressure-sensitive adhesive composition sheet was prepared in the same manner as in Example 2, except that 1,1,1-bis (t-butylpropyl) -1,3,3,5-trimethylcyclohexane was not used. An attempt was made, however, curing did not proceed sufficiently and no sheet was obtained.
- Comparative example 3 In the same manner as in Example 2 except that 2.5 parts of 2,2-dimethoxy-1,2-diphenylethane-one-one, which is a photopolymerization initiator, is used instead of TMCH, a polyester with a mold release agent on both sides is used. A thermally conductive pressure-sensitive adhesive composition sheet (3) covered with a tell film was obtained. The properties of the sheet-shaped molded article (3) of the heat conductive pressure-sensitive adhesive composition were evaluated. The results are shown in Table 2.
- the copolymer (Al), the monomer mixture (A2m), the thermal polymerization initiator (C2) and the thermally conductive inorganic compound (B) are mixed to obtain a mixture, and the thermally conductive pressure-sensitive adhesive composition is heated.
- the sheet-shaped molding in which the sheet was formed by performing sheeting at the same time as the preparation of the product, the sheet-shaped molding was excellent in thermal conductivity, good in hardness, and excellent in adhesive strength. The body is obtained.
- Comparative Example 1 having the same total monomer composition as in Example 1 but carrying out polymerization by batch charging of all monomers instead of polymerization in the presence of the copolymer (A1). Did not get a sheet.
- Comparative Example 2 In Comparative Example 2 in which no polymerization initiator was used, no sheet was obtained. Further, in Comparative Example 3 in which a photopolymerization initiator was used in place of the thermal polymerization initiator, a sheet was obtained, but the hardness was low and the adhesive strength was poor.
- a polyester film with a release agent was laid on the bottom of a 300 mm long, 200 mm wide, 2 mm deep mold, and then the same sample was poured into the entire mold and covered with a polyester film with a release agent. This was taken out of the mold and pressed under a condition of 130 ° C and 0.5MPa using a hydraulic press for 30 minutes to allow polymerization to proceed.Thermal conductivity was covered on both sides with a polyester film with a release agent. A sheet-shaped compact (4) was obtained. When the polymerization conversion of the monomer mixture (A2m) (4) was calculated from the amount of the residual monomer in the sheet, it was 99.9%.
- a copolymer (A l), a monomer mixture (A 2 m), an organic peroxide-based thermal polymerization initiator (C 2), an internal crosslinking agent having two or more polymerizable unsaturated bonds (D 2), And the heat conductive inorganic compound (B) are mixed to obtain a mixture.
- the half-life temperature per minute is between 135 and: L 65 ° C, and the value of (A ⁇ O / MX 100) is less than 3, using an organic peroxide-based thermal polymerization initiator.
- a thermally conductive sheet-like molded product having low odor intensity (excellent in low odor), good hardness, and long retention time (excellent in pressure-sensitive adhesiveness) was obtained.
- Example 5 using an organic peroxide-based thermal polymerization initiator having a value of (A ⁇ O / MX 100) of 3 or more, the odor intensity was higher than in Examples 3 and 4. (Inferior in low odor) and short performance retention time (inferior in pressure-sensitive adhesiveness).
- Example 6 using an organic peroxide-based thermal polymerization initiator having a one-minute half-life temperature outside 135-165 ° C, the odor intensity was high (it was inferior in low odority). ), Hardness is also higher.
- Industrial applicability is also higher.
- the heat conductive pressure-sensitive adhesive composition of the present invention has a sufficient pressure-sensitive adhesive property, and particularly has an excellent balance of hardness, pressure-sensitive adhesive property, and low odor, and has a sufficient heat conductivity. Have. Therefore, the heat-conductive sheet-like molded body obtained from this is used as a heat-conductive sheet for efficiently conducting heat from a heating element such as an electronic component such as a plasma display panel (PDP) to a radiator. Useful.
- a heating element such as an electronic component such as a plasma display panel (PDP) to a radiator.
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Abstract
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| JP2006348236A (ja) * | 2005-06-20 | 2006-12-28 | Fujicopian Co Ltd | 基材レス両面粘着テープ |
| JP2006348234A (ja) * | 2005-06-20 | 2006-12-28 | Fujicopian Co Ltd | 感圧接着テープ |
| JP2007217478A (ja) * | 2006-02-15 | 2007-08-30 | Nippon Zeon Co Ltd | 熱伝導性感圧接着性発泡シート及びその製造方法 |
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Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0688061A (ja) * | 1992-04-15 | 1994-03-29 | Minnesota Mining & Mfg Co <3M> | 熱伝導電気絶縁テープ |
| JPH07157736A (ja) * | 1993-12-03 | 1995-06-20 | Mitsui Toatsu Chem Inc | 情報担体シート用感圧接着剤 |
| JPH10316953A (ja) * | 1997-05-16 | 1998-12-02 | Nitto Denko Corp | 剥離可能な熱伝導性感圧接着剤とその接着シ―ト類 |
| JPH11181381A (ja) * | 1997-12-19 | 1999-07-06 | Toyo Kagaku Kk | 剥離可能な接着剤、及び、剥離可能な接着シート |
| JPH11181368A (ja) * | 1997-12-22 | 1999-07-06 | Nitto Denko Corp | 熱伝導性感圧接着シ―ト類およびこれを用いた電子部品と放熱部材との固定方法 |
| JPH11269438A (ja) * | 1998-03-25 | 1999-10-05 | Dainippon Ink & Chem Inc | 熱伝導難燃性感圧接着剤及び感圧接着テープ |
| JP2000281997A (ja) * | 1999-03-30 | 2000-10-10 | Dainippon Ink & Chem Inc | 熱伝導難燃性感圧接着剤及び感圧接着テープ |
| JP2002285121A (ja) * | 2001-03-27 | 2002-10-03 | Nippon Zeon Co Ltd | 感圧接着性組成物およびそれを用いたシート |
| JP2002294192A (ja) * | 2001-03-29 | 2002-10-09 | Three M Innovative Properties Co | 熱伝導性難燃性感圧接着剤及びシート |
| JP2002322447A (ja) * | 2001-04-27 | 2002-11-08 | Nippon Zeon Co Ltd | 感圧接着性組成物およびそれを用いたシート |
| JP2002322449A (ja) * | 2001-04-24 | 2002-11-08 | Sekisui Chem Co Ltd | 熱伝導性感圧接着剤 |
| JP2003105299A (ja) * | 2001-09-28 | 2003-04-09 | Sekisui Chem Co Ltd | 熱伝導性感圧接着剤、熱伝導性感圧接着シート及びその積層体 |
| JP2003160775A (ja) * | 2001-11-28 | 2003-06-06 | Dainippon Ink & Chem Inc | 熱伝導難燃性感圧接着テープ |
| JP2003201306A (ja) * | 2001-12-28 | 2003-07-18 | Clariant Polymer Kk | 合成樹脂エマルジョン、それを含んでなる易水膨潤性粘着剤組成物、および合成樹脂エマルジョンの製造方法 |
| JP2003321658A (ja) * | 2002-04-30 | 2003-11-14 | Dainippon Ink & Chem Inc | 難燃性熱伝導電気絶縁粘着シート |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04309545A (ja) * | 1991-04-04 | 1992-11-02 | Nippon Oil & Fats Co Ltd | ポリプロピレンの架橋用組成物及び架橋方法 |
| JPH06299003A (ja) * | 1993-04-14 | 1994-10-25 | Nippon Oil & Fats Co Ltd | ゴムのオープン架橋方法 |
| JP3747090B2 (ja) * | 1996-03-19 | 2006-02-22 | 化薬アクゾ株式会社 | パーオキシカーボネート、硬化剤及びこれを使用する硬化方法 |
| JPH11158454A (ja) * | 1997-11-28 | 1999-06-15 | Toshiba Silicone Co Ltd | 接着剤および接着方法 |
| JP4214609B2 (ja) * | 1998-04-17 | 2009-01-28 | 日油株式会社 | トナー用樹脂の製造方法 |
| JP2001049149A (ja) * | 1999-08-09 | 2001-02-20 | Nof Corp | 塗料用ワニスの製造方法 |
| JP2001279196A (ja) * | 2000-03-30 | 2001-10-10 | Sliontec Corp | 無基材熱伝導性粘着テープ・シート及びその製造方法 |
-
2004
- 2004-05-21 TW TW093114425A patent/TW200427806A/zh unknown
- 2004-05-24 KR KR1020057020054A patent/KR20060013641A/ko not_active Ceased
- 2004-05-24 JP JP2005506431A patent/JPWO2004104129A1/ja active Pending
- 2004-05-24 WO PCT/JP2004/007408 patent/WO2004104129A1/ja not_active Ceased
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0688061A (ja) * | 1992-04-15 | 1994-03-29 | Minnesota Mining & Mfg Co <3M> | 熱伝導電気絶縁テープ |
| JPH07157736A (ja) * | 1993-12-03 | 1995-06-20 | Mitsui Toatsu Chem Inc | 情報担体シート用感圧接着剤 |
| JPH10316953A (ja) * | 1997-05-16 | 1998-12-02 | Nitto Denko Corp | 剥離可能な熱伝導性感圧接着剤とその接着シ―ト類 |
| JPH11181381A (ja) * | 1997-12-19 | 1999-07-06 | Toyo Kagaku Kk | 剥離可能な接着剤、及び、剥離可能な接着シート |
| JPH11181368A (ja) * | 1997-12-22 | 1999-07-06 | Nitto Denko Corp | 熱伝導性感圧接着シ―ト類およびこれを用いた電子部品と放熱部材との固定方法 |
| JPH11269438A (ja) * | 1998-03-25 | 1999-10-05 | Dainippon Ink & Chem Inc | 熱伝導難燃性感圧接着剤及び感圧接着テープ |
| JP2000281997A (ja) * | 1999-03-30 | 2000-10-10 | Dainippon Ink & Chem Inc | 熱伝導難燃性感圧接着剤及び感圧接着テープ |
| JP2002285121A (ja) * | 2001-03-27 | 2002-10-03 | Nippon Zeon Co Ltd | 感圧接着性組成物およびそれを用いたシート |
| JP2002294192A (ja) * | 2001-03-29 | 2002-10-09 | Three M Innovative Properties Co | 熱伝導性難燃性感圧接着剤及びシート |
| JP2002322449A (ja) * | 2001-04-24 | 2002-11-08 | Sekisui Chem Co Ltd | 熱伝導性感圧接着剤 |
| JP2002322447A (ja) * | 2001-04-27 | 2002-11-08 | Nippon Zeon Co Ltd | 感圧接着性組成物およびそれを用いたシート |
| JP2003105299A (ja) * | 2001-09-28 | 2003-04-09 | Sekisui Chem Co Ltd | 熱伝導性感圧接着剤、熱伝導性感圧接着シート及びその積層体 |
| JP2003160775A (ja) * | 2001-11-28 | 2003-06-06 | Dainippon Ink & Chem Inc | 熱伝導難燃性感圧接着テープ |
| JP2003201306A (ja) * | 2001-12-28 | 2003-07-18 | Clariant Polymer Kk | 合成樹脂エマルジョン、それを含んでなる易水膨潤性粘着剤組成物、および合成樹脂エマルジョンの製造方法 |
| JP2003321658A (ja) * | 2002-04-30 | 2003-11-14 | Dainippon Ink & Chem Inc | 難燃性熱伝導電気絶縁粘着シート |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006213845A (ja) * | 2005-02-04 | 2006-08-17 | Nippon Zeon Co Ltd | 熱伝導性感圧接着性シート状発泡成形体及びその製造方法 |
| JP2006348236A (ja) * | 2005-06-20 | 2006-12-28 | Fujicopian Co Ltd | 基材レス両面粘着テープ |
| JP2006348234A (ja) * | 2005-06-20 | 2006-12-28 | Fujicopian Co Ltd | 感圧接着テープ |
| JP2007217478A (ja) * | 2006-02-15 | 2007-08-30 | Nippon Zeon Co Ltd | 熱伝導性感圧接着性発泡シート及びその製造方法 |
| WO2012132656A1 (ja) * | 2011-03-29 | 2012-10-04 | 日本ゼオン株式会社 | 熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート状成形体、これらの製造方法、及び電子部品 |
| CN102321444A (zh) * | 2011-05-30 | 2012-01-18 | 天津安品有机硅材料有限公司 | 导热性丙烯酸压敏胶组合物和丙烯酸导热贴片 |
| CN102321444B (zh) * | 2011-05-30 | 2012-11-07 | 天津安品有机硅材料有限公司 | 导热性丙烯酸压敏胶组合物和丙烯酸导热贴片 |
| DE102018009870A1 (de) | 2018-12-19 | 2020-06-25 | Lohmann Gmbh & Co. Kg | Thermisch leitfähiges Klebeband |
| DE102018009870B4 (de) | 2018-12-19 | 2022-03-24 | Lohmann Gmbh & Co. Kg | Klebeband sowie Verfahren zur Herstellung des Klebebands |
| CN113528042A (zh) * | 2021-08-02 | 2021-10-22 | 合肥乐凯科技产业有限公司 | 一种聚酯薄膜保护膜 |
| CN113528042B (zh) * | 2021-08-02 | 2024-01-05 | 合肥乐凯科技产业有限公司 | 一种聚酯薄膜保护膜 |
Also Published As
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|---|---|
| JPWO2004104129A1 (ja) | 2006-07-20 |
| KR20060013641A (ko) | 2006-02-13 |
| TW200427806A (en) | 2004-12-16 |
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