WO2004086421A1 - 有機質正特性サーミスタ - Google Patents
有機質正特性サーミスタ Download PDFInfo
- Publication number
- WO2004086421A1 WO2004086421A1 PCT/JP2004/004197 JP2004004197W WO2004086421A1 WO 2004086421 A1 WO2004086421 A1 WO 2004086421A1 JP 2004004197 W JP2004004197 W JP 2004004197W WO 2004086421 A1 WO2004086421 A1 WO 2004086421A1
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- Prior art keywords
- epoxy resin
- resistance
- thermistor
- temperature coefficient
- positive temperature
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/06—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material including means to minimise changes in resistance with changes in temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
Definitions
- the present invention is used for, for example, a temperature sensor or a heating or overcurrent protection element, and has a PTC (PositiVeTernperature Coefficient: positive temperature coefficient) characteristic in which a resistance value increases with a rise in temperature.
- PTC PulsitiVeTernperature Coefficient: positive temperature coefficient
- An organic positive temperature coefficient thermistor is composed of a resistor (thermistor element) in which conductive particles are dispersed in a high molecular weight organic compound, and a pair of electrodes facing each other and sandwiching the resistor. By passing current between a pair of electrodes, it is used as an overcurrent / overheat protection element, a self-regulating heating element, and a temperature sensor.
- No. 4,966,729 discloses an organic positive temperature coefficient thermistor using a thermosetting resin.
- Patent Document 4 discloses an organic positive temperature coefficient thermistor using conductive particles having spike-shaped protrusions as the conductive particles.
- Japanese Patent Application Laid-Open No. 5-198404 discloses an organic positive temperature coefficient thermistor using conductive short fibers.
- Japanese Patent Application Laid-Open No. 5-198404 discloses that a metal powder having spike-like protrusions or a flake-like metal powder is used as conductive particles, and a low molecular weight trifunctional or higher alcohol is used as a high molecular organic compound. Low room temperature by mixing Pamine It is said that a resistance value and a large resistance change rate can be obtained. Further, it discloses that an organic positive temperature coefficient thermistor having high resistance value reproducibility with a small change in room temperature resistance value after heating and cooling can be obtained.
- the downsizing of the organic positive temperature coefficient thermistor is mainly achieved by downsizing in the electrode surface direction, that is, by reducing the electrode area.
- the room temperature resistance tends to increase.
- the proportion of the thermistor element that comes into contact with the outside air increases, the quality of the thermistor element deteriorates, accelerating the reliability.
- the alteration of the high-molecular-weight organic compound contained in the thermistor body is accelerated, and the room temperature resistance value cannot be restored. The decline was becoming noticeable.
- the first method is achieved by reducing the distance between the electrodes.
- the second method is achieved by increasing the proportion of conductive particles in the thermistor body.
- each of these two methods has a problem that the rate of change in resistance of the organic positive temperature coefficient thermistor decreases for the following reasons.
- the resistance of the organic positive temperature coefficient thermistor is the sum of the resistance of the thermistor body and the contact resistance between the electrode and the thermistor body. For this reason, when the distance between the electrodes is reduced, the contact resistance between the electrode and the thermistor element cannot be ignored at low temperatures, that is, in a low resistance state. As a result, the rate of resistance change of the organic positive temperature coefficient thermistor decreases.
- the second method the ratio of the high-molecular-weight organic compound decreases, so that the resistance change rate decreases.
- the present invention provides an organic positive temperature coefficient thermistor that maintains a low room temperature resistance value and a high resistance change rate and has high resistance value reproducibility in order to solve the above-mentioned problems. Aim.
- an organic positive temperature coefficient thermistor includes a pair of electrodes disposed to face each other, and a positive resistance disposed between the electrodes. And a cured product of a mixture containing an epoxy resin containing a flexible epoxy resin, a curing agent, and conductive particles.
- an organic positive temperature coefficient thermistor that maintains a low room temperature resistance value and a high resistance change rate and has high resistance value reproducibility can be obtained.
- the flexible epoxy resin in the present invention is an epoxy resin having a chain structure, a rubber-modified epoxy resin, a silicone-modified epoxy resin, an epoxy-modified polyolefin, a urethane-modified epoxy resin, Polythiol-based epoxy resin, polyol-based epoxy resin, and epoxy resin having a polycarboxyl compound structure.
- the flexible epoxy resin is contained in an amount of 3 to 100% by mass based on the total mass of the epoxy resin.
- the organic positive temperature coefficient thermistor of the present invention is disposed to face each other.
- It may be made of a cured product of a mixture containing a flexible epoxy resin and conductive particles.
- the flexural modulus (MPa) in the present invention refers to a value measured in accordance with JISK6911. From the viewpoint of further exhibiting the effects of the present invention, the bending modulus is preferably 255 OMPa or less.
- the conductive particles have protrusions on the surface. In this way, the room temperature resistance of the organic positive temperature coefficient thermistor can be kept lower. Further, since the distance between the centers of the particles is larger than that of the truly spherical conductive particles, a sharper PTC characteristic can be exhibited.
- FIG. 1 is a schematic perspective view of an organic positive temperature coefficient thermistor.
- FIG. 1 is a perspective view schematically showing a preferred embodiment of the organic positive temperature coefficient thermistor of the present invention.
- the organic positive temperature coefficient thermistor shown in FIG. 1 (hereinafter, also referred to as “thermistor” in some cases) 1 is a pair of electrodes 3 arranged in a state of facing each other and this electrode 3 And a thermistor body 2 having a positive resistance-temperature characteristic (hereinafter, also referred to as “thermistor body” in some cases) disposed therebetween. Further, a lead (not shown) electrically connected to the electrode 3 may be provided as necessary.
- the shape and material of the electrode 3 are not particularly limited as long as it has an electron conductivity functioning as an electrode of a thermistor.
- the lead is an electron transfer capable of discharging or injecting charges from the electrodes 2 and 3 to the outside, respectively.
- the shape and material are not particularly limited as long as they have conductivity.
- the thermistor body 2 is formed from a cured product of a mixture containing an epoxy resin containing a flexible epoxy resin, a curing agent and conductive particles.
- examples of the flexible epoxy resin include an epoxy resin having a chain structure, a rubber-modified epoxy resin, a silicone-modified epoxy resin, an epoxidized polyolefin, a urethane-modified epoxy resin, and a polythiol-based epoxy resin.
- examples include polyol-based epoxy resins and epoxy resins obtained from polycarboxyl compounds.
- the epoxy resin having a chain structure means, on average, two or more epoxy groups (glycidyl ether groups) per molecule, and the skeleton thereof is represented by the following formulas (i) to (vi).
- Epoxy resin having a divalent organic group as defined above that is, an epoxy resin having a divalent organic group represented by the following formulas (i) to ( Vi ) bonded to a glycidyl ether group Means
- Rubber-modified epoxy resins include, for example, epoxy in which fine particles of liquid rubber are dispersed. Resins.
- liquid rubber for example, examples include polybutylene (BR), polybutadiene (PBR), and butadiene-acrylonitrile (NBR) having a sil group, a hydroxyl group, or an epoxy group.
- the weight average molecular weight (Mw) of the liquid rubber is, for example, about 1000.
- Mw means a weight average molecular weight in terms of standard polystyrene measured by gel permeation chromatography (GPC).
- the silicone-modified epoxy resin includes, for example, an epoxy resin containing fine particles of a silicone rubber having a reactive group at a terminal, and a siloxane bond (one Si-O-Si one bond) in the molecule.
- Epoxy resin examples include those obtained by the methods described in 1) to 4) below.
- a silicone oil having a reactive group is dispersed in an epoxy resin using a dispersant as an oil droplet, and the silicone oil is subjected to a cross-linking reaction in the oil droplet into fine particles.
- Examples of the urethane-modified epoxy resin include an epoxy resin having a urethane bond in the molecule.
- examples of the epoxy resin include those obtained by reacting a urethane prepolymer obtained by reacting polyisocyanate with polyether polyol or polyester polyol, and an epoxy resin having a hydroxyl group in the molecule.
- Examples of the epoxy resin having a polycarboxyl compound structure include, for example, those obtained by reacting epichlorohydrin with a polycarboxylic acid such as dimer acid. Are included.
- Rubber-modified epoxy resins, urethane-modified epoxy resins, and silicone-modified epoxy resins are preferred. Rubber-modified epoxy resins, urethane-modified epoxy resins, and silicone-modified epoxy resins can undergo a dehydration condensation reaction between the hydroxyl groups of these modified resins and the epoxy groups of the epoxy resin. Thereby, since these modified resins can form a chemical bond with the epoxy resin, the change in the room temperature resistance value particularly in the intermittent load test can be reduced.
- the thermistor body 2 may be formed using an epoxy resin having an alicyclic structure instead of the above-mentioned flexible epoxy resin.
- the epoxy resin having an alicyclic structure is, for example, an epoxy resin having a cyclohexane skeleton ⁇ a cyclopentagen skeleton and having an average of two or more epoxy groups per molecule. No.
- the content of the above-mentioned flexible epoxy resin and the epoxy resin having an alicyclic structure is preferably 3 to 100% by mass based on the total mass of the epoxy resin.
- the content of these resins is less than 3% by mass, the room temperature resistance and the rate of change in resistance tend to decrease, and the resistance reproducibility tends to be insufficient.
- the thermistor body 2 may be formed using a flexible epoxy resin having a flexural modulus of preferably 270 OMPa or less, more preferably 2550 MPa or less.
- Strong flexible epoxy resins are commercially available, for example, Ricaresin B PO 20E, Jamaicaresin BPO60E, Ricaresin DME
- EP4005 All made by Asahi Denka Kogyo Co., Ltd., trade name
- the thermistor body 2 may contain an epoxy resin other than the flexible epoxy resin.
- Average for epoxy resin other than flexible epoxy resin The molecular weight, skeletal structure and the like are not particularly limited as long as they have two or more epoxy groups per molecule.
- polyglycidyl ether obtained by reacting a polyhydric phenol such as bisphenol A, bisphenol, bisphenol AD, catechol, resorcinol, or a polyhydric alcohol such as glycerin / polyethylene glycol with epihydryl hydrin is used. No.
- glycidyl ether esters obtained by reacting hydroxycanolevonic acid such as p-hydroxybenzoic acid or] 3-hydroxynaphthoic acid with epipicrylhydrin, or polyphenols such as phthalic acid-terephthalic acid And polyglycidyl esters obtained by reacting an acid with epipicryl hydrin.
- hydroxycanolevonic acid such as p-hydroxybenzoic acid or] 3-hydroxynaphthoic acid
- polyphenols such as phthalic acid-terephthalic acid
- polyglycidyl esters obtained by reacting an acid with epipicryl hydrin obtained by reacting an acid with epipicryl hydrin.
- epoxidized phenol nopolak resin epoxidized cresol novolak resin
- the curing agent used for forming the thermistor body 2 a commonly used curing agent may be used, and among them, the curing agent has an effect of lowering the initial resistance value than the amine-based curing agent.
- Acid anhydrides are preferred.
- the acid anhydride curing agent include hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, phthalic anhydride, succinic anhydride, anhydrous trimetic acid, and anhydrous anhydride.
- a hardening accelerator may be added when forming the thermistor body 2.
- a curing accelerator By adding a curing accelerator, it is possible to lower the curing temperature and shorten the time required for curing during production.
- the curing accelerator is not particularly limited, and examples thereof include tertiary amines, amine adduct compounds, imidazole adduct compounds, borate esters, Lewis acids, organometallic compounds, organic acid metal salts, and imidazole. Can be
- additives such as a reactive diluent and a plasticizer can be used to impart flexibility to the epoxy resin.
- the reactive diluent include a monoepoxide compound.
- Monoepoxide compounds include n-butyl glycidyl ether, aryl glycidyl ether,
- 2-Ethynolehexynoleglycidinoleatene, styrene oxide, pheninoleglycidylateneole, cresinoleglycidinoleatene, sec-butylinolefeginoleregisyl ether, glycidyl methacrylate, tertiary carboxylate glycidyl ester can be examples of the plasticizer include polyhydric alcohols such as polyethylene glycol and propylene glycol.
- the content of the curing agent is an equivalent ratio to the epoxy resin (epoxy resin: curing agent), preferably 1: 0.5 to: L: 1.5, more preferably 1: 0. 8 to 1: 1 If the content of the curing agent is less than 1: 0.5, the curing reaction tends to be insufficient due to the shortage of the curing agent, whereas if the content ratio exceeds 1: 1.5, the unreacted curing agent will be reduced. The residual resin tends to make it difficult to obtain a cured product of an epoxy resin having a desired function.
- the conductive particles constituting the thermistor body 2 it is preferable to use conductive particles having projections on the surface.
- the shape of the projection is preferably a spike shape.
- the tunnel current flows easily, so that the room temperature resistance can be kept low.
- the center-to-center distance of the particles is larger than that of the truly spherical conductive particles, steep PTC characteristics can be exhibited.
- variation in resistance can be suppressed as compared with the case where a fibrous conductive substance described in the above-mentioned Japanese Patent Application Laid-Open No. 5-198404 is used.
- the material of the conductive particles is preferably a metal from the viewpoint of conductivity, and particularly preferably a nickel metal from the viewpoint of chemical stability.
- the particle size of the conductive particles is preferably 0.5 to 4 / im in consideration of the compatibility with the polymer organic compound, the temperature-resistance characteristic, and the reduction in resistance at room temperature. If it is less than 0.5 m, the rate of change in resistance decreases, and if it exceeds 4 / z m, the dispersibility of the conductive particles decreases and the room temperature resistance increases, which makes it unsuitable for practical use.
- the content ratio of the conductive particles is preferably 50 to 90% by mass, more preferably 60 to 80% by mass, based on the total mass of the mixture.
- the content ratio of the conductive particles is less than 50% by mass, the conductive path is hardly formed and the resistance value tends to increase.
- the content ratio exceeds 90% by mass the conductive path is hardly cut and the operating temperature is increased. Resistance changes tend to be less likely to occur.
- a predetermined amount of an epoxy resin, a curing agent, conductive particles, and if necessary, additives such as a curing accelerator are mixed (mixing step).
- Devices used in the mixing step include known devices such as various stirrers, dispersers, and mills.
- the mixing time is not particularly limited, but usually each component can be dispersed by mixing for 10 to 60 minutes.
- the obtained mixture is applied on a metal foil as an electrode by a method such as screen printing. Furthermore, it is sandwiched between different metal foils and pressed to form a sheet. Alternatively, the mixture may be formed into a sheet by flowing the mixture between metal foil electrodes of nickel, copper, or the like.
- the curing treatment can be performed by heating at 100 to 180 ° C in an oven for 30 to 300 minutes.
- an electrode may be formed by forming only the mixture into a sheet by a doctor blade method, a screen printing method, or the like, and applying a conductive paste or the like to the cured product.
- the obtained sheet-shaped cured product was formed into a desired shape (for example, 3.6 mm X
- Thermistor can be obtained by punching to 9 mm) (punching step).
- the method of punching can be used without particular limitation as long as it is a method of punching a normal organic positive temperature coefficient thermistor.
- a thermistor having a lead can be produced by bonding the lead to the surface of the electrode of the thermistor obtained by the punching step.
- the lead bonding method is not particularly limited as long as it is used in a method for manufacturing a normal organic positive temperature coefficient thermistor.
- the organic positive temperature coefficient thermistor of the present embodiment includes at least one pair of opposing electrodes 3 and a thermistor body 2 disposed between the electrodes as shown in FIG.
- OMP a OMP a
- flexible epoxy resin trade name E 4005 (Asahi Epoxy equivalent 5110 gZe q) and rubber-modified epoxy resin (trade name) manufactured by Denka Kogyo Co., Ltd.EPR4 023 (Epoxy equivalent 2 22 gZe q) and trade name EP of Asahi Denka Kogyo Co., Ltd. R-21 (produced by Asahi Denka Kogyo Co., Ltd., epoxy equivalent: 210 g / eq) was used.
- a methyl tetrahydrophthalic anhydride-based product name of B570 (manufactured by Dainippon Ink and Chemicals, acid anhydride equivalent: 168 g / eq) was used as a curing agent, and a product name of PN- was used as a curing accelerator. 40 J (manufactured by Ajinomoto Fine Techno) was used. Further, as the conductive individual particles, trade name of filament-like nickel particles having spike-like protrusions Type 255 Nickel powder (manufactured by INCO, average particle size 2.2 to 2.8 ⁇ m, apparent density 0 5 to 0.65 g / cm 3 and a specific surface area of 0.68 m 2 Z g) were used.
- An epoxy resin containing a flexible epoxy resin, a curing agent having an equivalent ratio of 1: 1 to the epoxy resin, and a curing accelerator of 1% by mass with respect to the epoxy resin were stirred.
- the mixture was stirred and mixed using a machine to prepare a mixture.
- 60% by mass of conductive particles were added to this mixture, and the mixture was again mixed and stirred to produce a raw material for a thermistor body.
- the raw material of the thermistor body was applied on a Ni foil, and another Ni foil was further laminated thereon, and heated to 150 ° C to obtain a sheet-like cured product.
- the sheet-shaped cured product was punched into a shape of 3.6 X 9. Omm to produce an organic positive temperature coefficient thermistor of this example.
- the thickness of the thermistor body was finely adjusted so that the initial room temperature resistance was 5-6 ⁇ . At this time, the thickness of the thermistor body was about 0.5 mm.
- the organic positive temperature coefficient thermistor was subjected to resistance measurement by the four-terminal method, and the resistance was monitored. From 5 ° C) to 180 ° C, it was heated at 2 ° C / min, then cooled to room temperature at 2 ° C / min, and the temperature-resistance curve was measured. From this measurement, before heating The resistance (initial resistance) and the rate of change in resistance (the resistance t at 180 ° C with respect to the initial resistance) in the room temperature state were calculated.
- the device was left at a high temperature of about 200 ° C, taken out at room temperature, and observed for deformation of the device. No deformation was observed in any of the examples and comparative examples.
- Table 1 shows detailed conditions and evaluation results of the organic positive temperature coefficient thermistors of Examples 1 to 12 and Comparative Examples 1 to 7.
- Example 2 EP4005 EPICL0N850 25 5.5 1 0 26
- Example 3 EP4005 EPICL0N850 5.2.5.595 55
- Example 4 EP4005 EPICL0N850 3 5.5 8 70
- Example 5 EPR4023-1 00 5.5 1 0 35
- Example 6 EPR4023 EPICL0N850 25 5.5 1 0 59
- Example 7 EPR4Q23 EPICL0N850 5.2 2.5.4 1083
- Example 8 EPR4023 EPICL0N850 3 5.3 9 89
- Example 9 EPR-21-1 00 5.6 1 0 33
- Example 10 EPR-21 EPICL0N850 25 5.4 1 0 53
- the rate of change in resistance of the organic positive temperature coefficient thermistors of Examples and Comparative Examples shown in Table 1 was 10 7 or more.
- the resistance after the intermittent load test decreased as the blending ratio (mass) of the flexible epoxy resin increased.
- the blending ratio (mass) of the flexible epoxy resin is 3% by mass or more
- Comparative Examples 1 to 7 in which the ratio is 2% by mass or less
- the difference in the resistance value after the intermittent load test is small. It was remarkable. From this, it can be seen that blending a flexible epoxy resin with an epoxy resin increases the resistance value reproducibility regardless of the type of the flexible epoxy resin. Further, when the blending ratio is 3% by mass or more, The effect was found to be significant.
- the resistance change rate was 10 7 or more.
- the resistance change rates of Comparative Examples 8 to 13 were 10 to the sixth power, and sufficient characteristics were not obtained. This is because the rate of change in resistance is changed depending on the thermal expansion of the epoxy resin, which is the main component of the high molecular organic compound contained in the thermistor body, and the compounding ratio of the flexible epoxy resin is changed. This is considered to be caused by the fact that the rate of change in resistance increases due to the thermal expansion property of the flexible epoxy resin when it increases.
- the resistance value after the intermittent load test was reduced as the blending ratio (mass) of the flexible epoxy resin was increased.
- the mixing ratio (mass) of the flexible epoxy resin is 3 mass. /. Examples 13 to 18 and 2 masses above.
- the difference in resistance value after the intermittent load test was remarkable between Comparative Examples 8 to 13 of / 0 or less. From this, it can be seen that when a flexible epoxy resin is blended with the epoxy resin, the reproducibility of the resistance value is increased irrespective of the type of epoxy resin, and the blending ratio is 3 mass ° / 0 or more. From the above Examples 1 to 18, it was found that if the organic positive temperature coefficient thermistor of the present invention is a flexible epoxy resin, the epoxy listed in the present example can be used. Not only resin but also flexible structure, for example
- epoxy resin having a chain structure in the molecule rubber-modified epoxy resin, silicone-modified epoxy resin, epoxidized polyolefin, urethane-modified epoxy resin, polythiol, polyol, and polycarboxyl compound. It can be easily inferred that the same effect can be obtained with an epoxy resin.
- the organic positive temperature coefficient thermistor of the present invention is not limited to the epoxy resin and can obtain the same effect as long as it is a high molecular weight organic compound having flexibility.
- EPIC LON 850 (trade name of bisphenol A type resin, manufactured by Dainippon Ink & Chemicals, epoxy equivalent: 190 g / eq, flexural modulus: 280 OMPa) was used as the epoxy resin.
- epoxy resin having an alicyclic structure trade name E 4080 (made by Asahi Denka Kogyo, epoxy equivalent 240 g / eq), trade name E 4088 S (made by Asahi Denka Kogyo, epoxy equivalent 167 g / eq), and, Product name AK-601 (153 gZeq, manufactured by Nippon Kayaku Co., Ltd.) was used.
- methyl tetrahydrophthalic anhydride (trade name: B570, manufactured by Dainippon Ink and Chemicals, acid anhydride equivalent: 168 gZeq) was used as a hardening agent, and PN-40 J (Ajinomoto) was used as a hardening accelerator. Fine Techno) was used. Furthermore, trade name T y P e 255 Nickel Powder of filamentary nickel particles as conductive particles children (
- the organic positive temperature coefficient thermistors of Examples 19 to 30 and Comparative Examples 14 to 19 exhibited a resistance change rate of 10 7 or more.
- the resistance value after the intermittent load test decreased as the mixing ratio (mass) of the epoxy resin having an alicyclic structure increased.
- the resistance after the intermittent load test was The difference between the values was significant.
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Abstract
Description
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Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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EP04723320A EP1548758A4 (en) | 2003-03-25 | 2004-03-25 | ORGANIC THERMISTANCE HAVING POSITIVE TEMPERATURE COEFFICIENT |
JP2005504103A JPWO2004086421A1 (ja) | 2003-03-25 | 2004-03-25 | 有機質正特性サーミスタ |
US10/531,478 US7314583B2 (en) | 2003-03-25 | 2004-03-25 | Organic positive temperature coefficient thermistor device |
Applications Claiming Priority (2)
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JP2003-083638 | 2003-03-25 | ||
JP2003083638 | 2003-03-25 |
Publications (1)
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WO2004086421A1 true WO2004086421A1 (ja) | 2004-10-07 |
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PCT/JP2004/004197 WO2004086421A1 (ja) | 2003-03-25 | 2004-03-25 | 有機質正特性サーミスタ |
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US (1) | US7314583B2 (ja) |
EP (1) | EP1548758A4 (ja) |
JP (1) | JPWO2004086421A1 (ja) |
KR (1) | KR20050115444A (ja) |
CN (1) | CN100487826C (ja) |
TW (1) | TWI257631B (ja) |
WO (1) | WO2004086421A1 (ja) |
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EP1585145A1 (en) * | 2004-03-31 | 2005-10-12 | TDK Corporation | Organic positive temperature coefficient thermistor |
US7270776B2 (en) | 2004-06-29 | 2007-09-18 | Tdk Corporation | Resin composition for forming thermistor body, and thermistor |
US7403092B2 (en) | 2004-12-28 | 2008-07-22 | Tdk Corporation | Thermistor |
JP2012059731A (ja) * | 2010-09-03 | 2012-03-22 | Kyocera Chemical Corp | サーミスタセンサ注形用樹脂組成物及びサーミスタセンサ |
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DE102006060784A1 (de) * | 2005-12-28 | 2007-07-05 | Tdk Corp. | PTC Element |
JP5085081B2 (ja) * | 2006-09-22 | 2012-11-28 | パナソニック株式会社 | 電子部品実装構造体 |
US20090224213A1 (en) * | 2008-03-06 | 2009-09-10 | Polytronics Technology Corporation | Variable impedance composition |
TWI464755B (zh) * | 2012-11-29 | 2014-12-11 | Polytronics Technology Corp | 表面黏著型過電流保護元件 |
JP6589219B2 (ja) * | 2014-02-06 | 2019-10-16 | 国立研究開発法人科学技術振興機構 | 温度センサー用樹脂組成物、温度センサー用素子、温度センサーおよび温度センサー用素子の製造方法 |
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2004
- 2004-03-25 US US10/531,478 patent/US7314583B2/en not_active Expired - Fee Related
- 2004-03-25 KR KR1020047019334A patent/KR20050115444A/ko not_active Application Discontinuation
- 2004-03-25 EP EP04723320A patent/EP1548758A4/en not_active Ceased
- 2004-03-25 CN CNB200480000638XA patent/CN100487826C/zh not_active Expired - Fee Related
- 2004-03-25 JP JP2005504103A patent/JPWO2004086421A1/ja active Pending
- 2004-03-25 WO PCT/JP2004/004197 patent/WO2004086421A1/ja active Application Filing
- 2004-09-24 TW TW093129075A patent/TWI257631B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11337419A (ja) * | 1998-05-22 | 1999-12-10 | Matsushita Electric Ind Co Ltd | 感温センサおよびそれを用いた電子機器 |
JP2000223304A (ja) * | 1999-01-28 | 2000-08-11 | Tdk Corp | 有機質正特性サーミスタ |
Non-Patent Citations (1)
Title |
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See also references of EP1548758A4 * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1585145A1 (en) * | 2004-03-31 | 2005-10-12 | TDK Corporation | Organic positive temperature coefficient thermistor |
US7241402B2 (en) | 2004-03-31 | 2007-07-10 | Tdk Corporation | Organic positive temperature coefficient thermistor |
US7270776B2 (en) | 2004-06-29 | 2007-09-18 | Tdk Corporation | Resin composition for forming thermistor body, and thermistor |
US7403092B2 (en) | 2004-12-28 | 2008-07-22 | Tdk Corporation | Thermistor |
JP2012059731A (ja) * | 2010-09-03 | 2012-03-22 | Kyocera Chemical Corp | サーミスタセンサ注形用樹脂組成物及びサーミスタセンサ |
Also Published As
Publication number | Publication date |
---|---|
EP1548758A4 (en) | 2007-07-11 |
US20060097231A1 (en) | 2006-05-11 |
EP1548758A1 (en) | 2005-06-29 |
TWI257631B (en) | 2006-07-01 |
KR20050115444A (ko) | 2005-12-07 |
CN1698140A (zh) | 2005-11-16 |
CN100487826C (zh) | 2009-05-13 |
JPWO2004086421A1 (ja) | 2006-06-29 |
US7314583B2 (en) | 2008-01-01 |
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