JP5085081B2 - 電子部品実装構造体 - Google Patents
電子部品実装構造体 Download PDFInfo
- Publication number
- JP5085081B2 JP5085081B2 JP2006256667A JP2006256667A JP5085081B2 JP 5085081 B2 JP5085081 B2 JP 5085081B2 JP 2006256667 A JP2006256667 A JP 2006256667A JP 2006256667 A JP2006256667 A JP 2006256667A JP 5085081 B2 JP5085081 B2 JP 5085081B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- resin
- rubber
- mounting structure
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/23907—Pile or nap type surface or component
- Y10T428/23957—Particular shape or structure of pile
- Y10T428/23964—U-, V-, or W-shaped or continuous strand, filamentary material
- Y10T428/23971—Continuous strand with adhesive bond to backing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31525—Next to glass or quartz
Description
2 基板
3 電子部品
4 半田ボール
5 樹脂
Claims (5)
- 電子部品と基板との間に面配置された複数の半田ボールを溶融させて前記電子部品と前記基板を接合させるとともに前記電子部品と前記基板との隙間に接合補強用の樹脂を充填して硬化させた電子部品実装構造体であって、
前記樹脂が、熱硬化性を有するエポキシ樹脂を主成分としこれに可撓性樹脂を含む樹脂接着剤が硬化した樹脂であり、前記電子部品の少なくとも四隅にあたる箇所に充填されるとともに硬化後の引張伸び率が5%〜40%である電子部品実装構造体。 - 前記可撓性樹脂が、カルダノールエポキシ化物、ポリプロピレングリコールジグリシジルエーテル、ビスフェノールA−アルキレンオキサイド付加物のジグリシジルエーテル、重合脂肪酸ポリグリシジルエステル、ウレタンプレポリマーのうち少なくとも何れかを含む請求項1に記載の電子部品実装構造体。
- 前記樹脂がゴムをさらに含み、前記ゴムが、天然ゴム、スチレンゴム、ブタジエンゴム、クロロプレンゴム、ブチルゴム、ニトリルゴム、エチレンプロピレンゴム、シリコーンゴム、ウレタンゴムのうち少なくとも何れかを含む請求項1または2に記載の電子部品実装構造体。
- 硬化後の前記樹脂が前記電子部品と前記基板との間に面配置された複数の半田ボールの何れにも接触していない請求項1乃至3の何れかに記載の電子部品実装構造体。
- 前記樹脂のチキソ比が2以上である請求項1乃至4の何れかに記載の電子部品実装構造体。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006256667A JP5085081B2 (ja) | 2006-09-22 | 2006-09-22 | 電子部品実装構造体 |
DE200760010479 DE602007010479D1 (de) | 2006-09-22 | 2007-09-21 | Montagestruktur für elektronische bauteile |
PCT/JP2007/069123 WO2008035819A2 (en) | 2006-09-22 | 2007-09-21 | Electronic component mounting structure |
US12/159,837 US8759688B2 (en) | 2006-09-22 | 2007-09-21 | Electronic component mounting structure |
EP20070828864 EP2064930B1 (en) | 2006-09-22 | 2007-09-21 | Electronic component mounting structure |
TW96135339A TW200819014A (en) | 2006-09-22 | 2007-09-21 | Electronic component mounting structure |
CN2007800018643A CN101366325B (zh) | 2006-09-22 | 2007-09-21 | 电子部件安装结构 |
KR1020087015317A KR20090053748A (ko) | 2006-09-22 | 2007-09-21 | 전자 부품 실장 구조체 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006256667A JP5085081B2 (ja) | 2006-09-22 | 2006-09-22 | 電子部品実装構造体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008078431A JP2008078431A (ja) | 2008-04-03 |
JP5085081B2 true JP5085081B2 (ja) | 2012-11-28 |
Family
ID=39081670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006256667A Active JP5085081B2 (ja) | 2006-09-22 | 2006-09-22 | 電子部品実装構造体 |
Country Status (8)
Country | Link |
---|---|
US (1) | US8759688B2 (ja) |
EP (1) | EP2064930B1 (ja) |
JP (1) | JP5085081B2 (ja) |
KR (1) | KR20090053748A (ja) |
CN (1) | CN101366325B (ja) |
DE (1) | DE602007010479D1 (ja) |
TW (1) | TW200819014A (ja) |
WO (1) | WO2008035819A2 (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5273797B2 (ja) * | 2009-02-13 | 2013-08-28 | 株式会社メガチップス | 衝撃検知装置 |
US20110108997A1 (en) | 2009-04-24 | 2011-05-12 | Panasonic Corporation | Mounting method and mounting structure for semiconductor package component |
JP5445340B2 (ja) * | 2010-06-10 | 2014-03-19 | 富士通株式会社 | 基板補強構造、基板組立体、及び電子機器 |
WO2012006258A2 (en) | 2010-07-05 | 2012-01-12 | Glasspoint Solar, Inc. | Oilfield application of solar energy collection |
JP2012054417A (ja) * | 2010-09-01 | 2012-03-15 | Panasonic Corp | 電子部品の実装構造体及びその製造方法 |
JP5853146B2 (ja) * | 2011-08-24 | 2016-02-09 | パナソニックIpマネジメント株式会社 | 熱硬化性樹脂組成物及び回路基板 |
CN103329645B (zh) | 2011-12-08 | 2016-04-06 | 松下知识产权经营株式会社 | 电子零件安装线及电子零件安装方法 |
KR20140099178A (ko) | 2011-12-08 | 2014-08-11 | 파나소닉 주식회사 | 전자 부품 실장 라인 및 전자 부품 실장 방법 |
US8673685B1 (en) | 2011-12-22 | 2014-03-18 | Panasonic Corporation | Electronic component mounting line and electronic component mounting method |
US9874359B2 (en) | 2013-01-07 | 2018-01-23 | Glasspoint Solar, Inc. | Systems and methods for selectively producing steam from solar collectors and heaters |
CN106465549A (zh) * | 2014-04-09 | 2017-02-22 | 通用汽车环球科技运作有限责任公司 | 用于增强的粘合剂结合的系统和方法 |
JP6013406B2 (ja) * | 2014-07-24 | 2016-10-25 | 株式会社タムラ製作所 | 接着剤組成物および電子部品の接合方法 |
US10236267B2 (en) * | 2014-08-01 | 2019-03-19 | Kyocera International, Inc. | Methods of forming flip chip systems |
WO2017040682A1 (en) | 2015-09-01 | 2017-03-09 | Glasspoint Solar, Inc. | Variable rate steam injection, including via solar power for enhanced oil recovery, and associated systems and methods |
JP6753725B2 (ja) * | 2016-08-08 | 2020-09-09 | 株式会社フジクラ | 実装体 |
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-
2006
- 2006-09-22 JP JP2006256667A patent/JP5085081B2/ja active Active
-
2007
- 2007-09-21 CN CN2007800018643A patent/CN101366325B/zh active Active
- 2007-09-21 EP EP20070828864 patent/EP2064930B1/en not_active Expired - Fee Related
- 2007-09-21 TW TW96135339A patent/TW200819014A/zh unknown
- 2007-09-21 US US12/159,837 patent/US8759688B2/en active Active
- 2007-09-21 WO PCT/JP2007/069123 patent/WO2008035819A2/en active Application Filing
- 2007-09-21 KR KR1020087015317A patent/KR20090053748A/ko not_active Application Discontinuation
- 2007-09-21 DE DE200760010479 patent/DE602007010479D1/de active Active
Also Published As
Publication number | Publication date |
---|---|
JP2008078431A (ja) | 2008-04-03 |
CN101366325B (zh) | 2012-05-23 |
KR20090053748A (ko) | 2009-05-27 |
EP2064930B1 (en) | 2010-11-10 |
TW200819014A (en) | 2008-04-16 |
US20100000773A1 (en) | 2010-01-07 |
WO2008035819A3 (en) | 2008-05-22 |
EP2064930A2 (en) | 2009-06-03 |
CN101366325A (zh) | 2009-02-11 |
US8759688B2 (en) | 2014-06-24 |
WO2008035819A2 (en) | 2008-03-27 |
DE602007010479D1 (de) | 2010-12-23 |
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