WO2004061032A1 - 粘着シートおよびその製造方法 - Google Patents
粘着シートおよびその製造方法 Download PDFInfo
- Publication number
- WO2004061032A1 WO2004061032A1 PCT/JP2003/015458 JP0315458W WO2004061032A1 WO 2004061032 A1 WO2004061032 A1 WO 2004061032A1 JP 0315458 W JP0315458 W JP 0315458W WO 2004061032 A1 WO2004061032 A1 WO 2004061032A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pressure
- sensitive adhesive
- adhesive sheet
- hole
- adhesive layer
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/18—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet characterized by perforations in the adhesive tape
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1056—Perforating lamina
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
Definitions
- the present invention relates to a pressure-sensitive adhesive sheet that can prevent or remove prestar if air is trapped, and a method for producing such a pressure-sensitive adhesive sheet.
- the pressure-sensitive adhesive sheet can be replaced with another pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet can be peeled off and re-attached, or the swollen part of the pressure-sensitive adhesive sheet can be Holes are evacuated by opening holes.
- replacing the adhesive sheet is not only labor-intensive, but also increases the cost.
- the adhesive sheet may be torn or wrinkled on the surface. Problems such as a decrease in adhesiveness often occur.
- the method of making a hole with a needle impairs the appearance of the adhesive sheet.
- resin materials such as acrylic resin, ABS resin, polystyrene resin, and polycarbonate resin may generate gas either by heating or without heating, but are made of such resin materials.
- adhesive sheet is affixed to the adherend, blisters are generated on the adhesive sheet due to the gas generated from the adherend.
- the actual No. 2 5 0 3 7 1 7 publication and the actual No. 2 5 8 7 1 9 8 publication have a number of independent on the adhesive surface of the adhesive layer.
- a pressure-sensitive adhesive sheet in which small convex portions are arranged in a dotted pattern has been proposed.
- the tip of the small convex part of the adhesive layer is in close contact with the adherend, and the basic flat surface of the adhesive layer is held away from the adherend, thereby Since there is a gap communicating between the flat surface and the adherend to the outside, air or gas is removed from the gap to prevent air accumulation or prestar in the adhesive sheet.
- the present invention has been made in view of such circumstances, and is a pressure-sensitive adhesive sheet capable of preventing or removing air pockets and prestars without impairing the appearance of the pressure-sensitive adhesive sheet and ensuring sufficient adhesive force.
- An object of the present invention is to provide a method for producing such an adhesive sheet.
- the present invention is a pressure-sensitive adhesive sheet comprising a base material and a pressure-sensitive adhesive layer, wherein a plurality of through-holes penetrating from one surface to the other surface are formed, The hole diameter in the base material and the adhesive layer of the through hole is
- sheet includes the concept of film and tape
- film includes the concept of sheet and tape.
- air between the adherend and the pressure-sensitive adhesive surface escapes from the through hole to the outside of the surface of the pressure-sensitive adhesive sheet. It is difficult to prevent air from being trapped. Even if air is trapped by air entrainment, the air can be re-pressurized around the air reservoir or the air reservoir surrounding area including the air reservoir so that air can escape from the through hole to the outside of the adhesive sheet surface. The air pocket disappears. Moreover, even if gas is generated from the adherend after being attached to the adherend, the gas escapes from the through hole to the outside of the surface of the pressure-sensitive adhesive sheet, thereby preventing the occurrence of prestar.
- the hole diameter of the through hole is 300 Xm or less, the surface of the pressure-sensitive adhesive sheet is not noticeable, and the appearance of the pressure-sensitive adhesive sheet is not impaired.
- the hole density of the through holes is 50, 0 0 0 1 0 0 ( : 111 2 or less, the mechanical strength of the adhesive sheet is maintained.
- the diameter of the through hole may gradually decrease from the pressure-sensitive adhesive sheet back surface to the pressure-sensitive adhesive sheet surface (Invention 2).
- the through-hole becomes less noticeable on the surface of the pressure-sensitive adhesive sheet, and the appearance of the pressure-sensitive adhesive sheet can be kept good.
- the through hole is preferably formed by laser processing (Invention 3).
- Laser processing it is possible to easily form fine through holes with good air evacuation at a desired hole density ( however, the method of forming the through holes is not limited to this, for example, water It may be formed by a jet, a micro drill, a precision press, a hot needle, a molten hole, or the like.
- the present invention provides a punching process in a pressure-sensitive adhesive sheet comprising a base material, a pressure-sensitive adhesive layer, and optionally a release material, and the pore diameter force S 0.1 to 1 in the base material and the pressure-sensitive adhesive layer
- a method for producing a pressure-sensitive adhesive sheet characterized in that 30 to 50 m through-holes are formed at a hole density of 30 to 50,000 Zl 0 0 cm 2 (Invention 4).
- the pressure-sensitive adhesive sheet is capable of preventing or removing air accumulation and prestar by extracting the air between the adherend and the adhesive surface and the gas generated from the adherend from the through hole. Can be manufactured.
- the drilling is preferably laser processing (Invention 5), and in that case, laser processing is preferably performed from the back side of the adhesive sheet (Invention 6).
- the “back surface of the adhesive sheet” refers to the surface opposite to the surface of the adhesive sheet.
- the through-holes are often tapered, so by applying laser processing from the back side of the pressure-sensitive adhesive sheet, the diameter of the through-hole is larger than the back side of the pressure-sensitive adhesive sheet. Is smaller Therefore, the through holes are less noticeable on the surface of the pressure-sensitive adhesive sheet, and the appearance of the pressure-sensitive adhesive sheet can be kept good.
- invention 6 it is preferable to directly irradiate the pressure-sensitive adhesive layer with a laser (Invention 7).
- a release material is laminated on the pressure-sensitive adhesive layer, it is laminated on the pressure-sensitive adhesive layer. It is preferable to peel the release material from the pressure-sensitive adhesive layer and directly irradiate the pressure-sensitive adhesive layer with laser, and then laminate the release material on the pressure-sensitive adhesive layer again (Invention 8).
- a third layer such as a release material
- the pressure-sensitive adhesive layer is irradiated with a laser through the third layer, depending on the material of the third layer, the third layer is formed.
- the melted material may widen the through hole opening of the pressure-sensitive adhesive layer, and therefore the accuracy of the hole diameter and the hole density of the through-hole formed in the pressure-sensitive adhesive sheet may be lowered.
- the through-hole opening of the pressure-sensitive adhesive layer expands as described above, the internal space of the through-hole increases, and after the adhesive sheet is applied to the adherend, it enters the air in the through-hole or the through-hole. Water may have some effect on the surface of the adhesive sheet.
- the through hole opening of the pressure-sensitive adhesive layer is prevented from expanding due to the third layer, and the hole diameter is high in accuracy of the hole density and the through hole having a small internal space is formed. Can be formed. Also, by not interposing the third layer, the laser irradiation time can be shortened or the laser output energy can be reduced. If the laser output energy is small, the thermal effect on the adhesive sheet will be small, and it will be possible to form well-shaped through-holes with little dross.
- the “process material” is an auxiliary material for forming a certain layer.
- a certain layer is formed by a casting method. Is used as a support for a resin liquid for film formation.
- the process material is generally formed by peeling paper or resin film, and is peeled from the adhesive sheet after the manufacture of the adhesive sheet or when the adhesive sheet is used.
- the “peelable protective sheet” is a protective sheet that can be peeled off after laser processing.
- an adhesive protective sheet comprising a substrate and a releasable adhesive layer is used. be able to.
- dross When a through hole is formed by laser processing, a melt by heat, so-called dross, may adhere to the periphery of the opening of the through hole, but if a process material or a protective sheet is laminated on the surface of the substrate The dross adheres not to the base material but to the process material or the protective sheet, so that the appearance of the adhesive sheet can be kept better.
- the through hole tapers, so the hole diameter of the through hole on the substrate surface is smaller than when no process material or protective sheet is used. Due to the synergistic effect with adhesion prevention, the appearance of the adhesive sheet surface can be kept even better.
- the holes formed by laser processing do not necessarily have to penetrate the process material or the protective sheet.
- FIG. 1 is a cross-sectional view of an adhesive sheet according to an embodiment of the present invention.
- FIG. 2 is a partially enlarged cross-sectional view of an adhesive sheet according to an embodiment of the present invention.
- FIG. 3 is a cross-sectional view showing an example of a method for producing an adhesive sheet according to an embodiment of the present invention.
- FIG. 4 is a cross-sectional view showing another example of a method for producing an adhesive sheet according to an embodiment of the present invention.
- FIG. 5 is a cross-sectional view showing another example of a method for producing an adhesive sheet according to an embodiment of the present invention.
- FIG. 6 is a partially enlarged sectional view of the pressure-sensitive adhesive sheet according to one embodiment of the present invention.
- FIG. 1 is a cross-sectional view of an adhesive sheet according to an embodiment of the present invention.
- the pressure-sensitive adhesive sheet 1 As shown in FIG. 1, the pressure-sensitive adhesive sheet 1 according to this embodiment is formed by laminating a base material 1 1, a pressure-sensitive adhesive layer 1 2, and a release material 1 3. However, the release material 1 3 is peeled off when the adhesive sheet 1 is used.
- this pressure-sensitive adhesive sheet 1 a plurality of through-holes 2 that penetrate through the base material 11, the pressure-sensitive adhesive layer 12, and the release material 13 and extend from the pressure-sensitive adhesive sheet surface 1 A to the pressure-sensitive adhesive sheet back surface 1 B are formed.
- the adhesive sheet 1 is used, the air between the adherend and the adhesive surface of the adhesive layer 1 2 and the gas generated from the adherend escape from the through hole 2 to the outside of the adhesive sheet surface 1 A. As will be described later, blisters can be prevented or removed if air is trapped.
- the cross-sectional shape of the through hole 2 is not particularly limited, but the hole diameter of the through hole 2 in the base material 11 and the adhesive layer 12 is 0.1 to 300 zm, preferably 0.5. ⁇ 1 5 0 ⁇ . If the hole diameter of the through hole 2 is less than 0.1 m, it is difficult for air or gas to escape, and if the hole diameter of the through hole 2 exceeds 300 m, the through hole 2 becomes conspicuous, and the appearance of the adhesive sheet 1 Damage.
- the hole diameter on the adhesive sheet surface 1A of the through hole 2 is 40 m or less, the hole itself (internal space of the through hole 2) may not be visible to the naked eye.
- the upper limit of the hole diameter on the pressure-sensitive adhesive sheet surface 1 A of the through hole 2 is 40 ⁇ .
- the upper limit of the hole diameter in the base material 11 of the through hole 2 and the pressure-sensitive adhesive layer 12 be 60 ⁇ .
- the hole diameter of the through-hole 2 may be constant in the thickness direction of the pressure-sensitive adhesive sheet 1 or may vary in the thickness direction of the pressure-sensitive adhesive sheet 1, but the hole diameter of the through-hole 2 is the same as that of the pressure-sensitive adhesive sheet 1.
- the diameter of the through-hole 2 gradually decreases from the adhesive sheet back surface 1 ⁇ to the adhesive sheet surface 1 ⁇ .
- the hole diameters of the through-hole 2 in the base material 11 and the pressure-sensitive adhesive layer 12 need to be in the above range (0.1 to 300 / m).
- Hole density of the through-holes 2 is a 3 0-5 0, 0 0 0/1 0 0 cm 2, the good Mashiku is 1 0 0-1 0 0 0 0 Z 1 0 0 cm 2 .
- the through hole 2 is preferably formed by laser processing described later. According to the laser processing, it is possible to easily form a fine through hole having a good air release property with a desired hole density.
- the method of forming the through hole 2 is not limited to this, and may be formed by, for example, a water jet, a micro drill, a precision press, a hot needle, a molten hole, or the like.
- the material of the substrate 11 is not particularly limited as long as it is a material that can form the through-hole 2 as described above.
- the base material 1 1 may be opaque or transparent, but generally the base material 1 1 is opaque and the through-hole 2 is conspicuous. hard.
- the resin film examples include polyethylene such as polyethylene and polypropylene, polyester such as polyethylene terephthalate and polybutylene terephthalate, polyvinyl chloride, polystyrene, polyurethane, polycarbonate, polyamide, Polyimide, Polymethyl methacrylate, Polybutene, Polybutadiene, Polymethylene pentene, Ethylene acetate Bull copolymer, Ethylene (meth) acrylic acid copolymer, Ethylene (meth) acrylate copolymer
- a film made of a resin such as ABS resin or ionomer resin, a foamed film, or a laminated film thereof can be used.
- a commercially available resin film may be used, or a resin film formed by a casting method using process materials may be used.
- the paper for example, high-quality paper, glassine paper, coated paper, laminated paper, and the like can be used.
- the process material is not particularly limited as long as it is made of a material capable of forming the through hole 2 by a desired drilling method.
- a material capable of forming the through hole 2 by a desired drilling method for example, various kinds of paper, polyethylene terephthalate, polypropylene Pyrene, polie
- a resin film made of a resin such as styrene which has been treated with a release agent such as silicone, polyester, acryl, alkyd, urethane, or a synthetic resin.
- the thickness of the process material is usually about 10 to 200 ⁇ m, preferably about 2 5 to 1 5 0 // m.
- the thickness of the substrate 11 is usually 1 to 50 0 ⁇ , preferably about 3 to 300 ⁇ m, but can be appropriately changed depending on the application of the pressure-sensitive adhesive sheet 1.
- the type of the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 12 is not particularly limited as long as it is a material capable of forming the through-hole 2 as described above. Acrylic-based, polyester-based, polyurethane-based Any of rubber, silicone, etc. may be used.
- the pressure-sensitive adhesive may be any of emulsion type, solvent type or non-solvent type, and may be either a crosslinked type or a non-crosslinked type. Further, the pressure-sensitive adhesive may be any of a strong and strong adhesive type, a weak and weak adhesive type, and a re-peeling type capable of repeating adhesion and peeling.
- the thickness of the pressure-sensitive adhesive layer 12 is usually 1 to 300 ⁇ m, preferably about 5 to 100 ⁇ m, but can be appropriately changed depending on the application of the pressure-sensitive adhesive sheet 1.
- the material of the release material 1 3 is not particularly limited as long as it is a material that can form the through-hole 2 as described above.
- a film made of a resin such as polyethylene terephthalate, polypropylene, or polyethylene.
- foamed films or papers such as dalasin paper, coated paper, and laminated paper that have been treated with a release agent such as a silicone, fluorine, or long-chain alkyl group-containing strength rubamate may be used. it can.
- the thickness of the release material 13 is usually about 10 to 2500 ⁇ m, and preferably about 20 to 2200; zm. Also, the thickness of the release agent in release material 1 3 Is usually from 0.05 to 5 ⁇ , and preferably from 0.1 to 3 / xm.
- an adhesive layer 12 is formed on the release treatment surface of the release material 13.
- a coating agent containing the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 1 2 and, if necessary, further a solvent is prepared, and a roll coater, knife coater, roll knife knife coater It may be applied to the release treatment surface of the release material 13 by a coating machine such as a knife coater, die coater, no coater, gravure coater, curtain coater or the like and dried.
- the through hole 2 is formed in the obtained laminate.
- the through hole 2 is formed by laser processing. This laser processing is preferably performed from the surface on the release material 13 side.
- the through hole 2 often has a taper.
- the hole diameter of the hole 2 is smaller on the base material 1 1 side than the release material 1 3 side, and therefore the through-hole 2 is less conspicuous on the surface of the pressure-sensitive adhesive sheet 1, and the appearance of the pressure-sensitive adhesive sheet 1 is kept good. Can do.
- Type of laser to be used for laser processing is not particularly limited, for example, carbon dioxide (C_ ⁇ 2) laser, T EA- C 0 2 laser, YAG lasers, UV-YAG laser, excimer laser, a semiconductor laser YV0 4 laser, YLF laser, etc. can be used.
- the release material 1 3 is peeled off from the adhesive layer 1 2 when the adhesive sheet 1 is used. Is done.
- a peelable protective sheet may be laminated on the surface of the base material 11 at an arbitrary stage before laser processing.
- a protective sheet for example, a known adhesive protective sheet comprising a base material and a releasable adhesive layer can be used.
- the through hole 2 is formed by laser processing, a melt by heat, so-called dross, may adhere to the periphery of the opening of the through hole 2, but by laminating a protective sheet on the surface of the substrate 1 1
- the dross adheres to the protective sheet, not the base material 11, and therefore the appearance of the adhesive sheet 1 can be kept better.
- the through hole 2 is tapered, so that the hole diameter of the through hole 2 on the surface of the base material 11 is larger than when the protective sheet is not used. It gets smaller.
- the protective sheet is usually peeled off from the substrate 11 1 after the production of the adhesive sheet 1 or before the adhesive sheet 1 is applied, but the adhesive sheet 1 is applied to the adherend in a state where the protective sheets are laminated. After that, the protective sheet may be peeled off.
- the through hole 2 penetrates the protective sheet together with the adhesive layer 1 2 and the base material 1 1.
- the through hole 2 does not necessarily have to penetrate the protective sheet. That is, when laser processing is performed from the surface of the release material 13, a hole penetrating the release material 1 3, the pressure-sensitive adhesive layer 1 2 and the base material 1 1 is formed partway through the protection sheet. You may irradiate with laser.
- FIG. Explanation will be made with reference to (e).
- the base material 11 is formed on the release treatment surface of the process material 3.
- a coating agent containing a resin constituting the base material 1 1 and, if desired, further a solvent is prepared.
- a roll coater, a knife coater, a roll knife coater, an air knife coater, a tape ,, Coater, nor coater, cup, rabia coater, force coater, etc. may be applied onto process material 3. and dried.
- the pressure-sensitive adhesive layer 12 is formed on the release-treated surface of the release material 1 3 in the same manner as the pressure-sensitive adhesive layer forming method in the pressure-sensitive adhesive sheet manufacturing method (1) described above. .
- the process material 3 is changed so that the base material 11 formed on the process material 3 and the adhesive layer 12 formed on the release material 13 are in close contact with each other.
- the through hole 2 is formed in the obtained laminate.
- the through hole 2 is formed by laser processing. This laser processing is preferably performed from the surface on the side of the release material 13 for the same reason as the pressure-sensitive adhesive sheet manufacturing method (1) described above, but even if it is applied from the surface on the side of the process material 3 By tapering the hole 2, the diameter of the through-hole 2 on the surface of the base material 11 becomes smaller than when the process material 3 is not used.
- dross may adhere to the periphery of the opening of the through hole 2.
- the process material 3 is laminated on the surface of the base material 11. Therefore, dross adheres to the base material 1 1 Instead, it becomes the process material 3, so that the appearance of the pressure-sensitive adhesive sheet 1 can be kept better.
- the release material 13 is peeled off from the pressure-sensitive adhesive layer 12 when the pressure-sensitive adhesive sheet 1 is used.
- the process material 3 is usually peeled off from the base material 11 after the production of the pressure-sensitive adhesive sheet 1 or before the pressure-sensitive adhesive sheet 1 is applied, but the pressure-sensitive adhesive sheet 1 is adhered in a state where the process material 3 is stacked. After applying to the body, the process material 3 may be peeled off.
- the through hole 2 penetrates the process material 3 together with the adhesive layer 1 2 and the base material 1 1.
- the through hole 2 does not necessarily have to pass through the process material 3.
- laser processing is performed from the surface of the release material 13, the hole penetrating the release material 1 3, the pressure-sensitive adhesive layer 1 2, and the base material 1 1 is in the middle of the process material 3 in the process material 3. You may irradiate a laser so that it may be formed.
- the substrate 11, the pressure-sensitive adhesive layer 12, and the release material 1 3 are formed in the same manner as the pressure-sensitive adhesive sheet production method (1) described above.
- the release material 13 is peeled off from the adhesive layer 12, and as shown in FIG. 5 (e), the adhesive layer 12 is exposed to the adhesive layer 12 from the side of the adhesive layer 12. Then, after direct laser irradiation, as shown in FIG. 5 (f), the release material 13 is attached to the adhesive layer 1 2 again.
- the release material 1 3 When the release material 1 3 is laminated on the adhesive layer 1 2 and the laser is irradiated from the release material 1 3 side, depending on the material of the release material 1 3, as shown in Fig. 6 (a)
- the dross formed at the periphery of the opening 2 of the release material 1 3 may expand the opening 2 of the adhesive layer 1 2.
- the dross is formed on the adhesive sheet 1.
- the hole diameter of the through hole 2 is less accurate.
- the opening of the through-hole 2 of the adhesive layer 1 2 expands, the internal space of the through-hole 2 increases, and after the adhesive sheet 1 is applied to the adherend, the air in the through-hole 2 and the through-hole 2
- the water etc. inside may have some influence on the surface of the adhesive sheet 1. Such a problem is likely to occur when the release material 13 is made of a resin such as polyethylene terephthalate or polypropylene.
- the release material 13 is peeled off as in this manufacturing method and the adhesive layer 12 is directly irradiated with a laser, as shown in FIG. 6 (b), the adhesive layer 1 2 through-hole 2
- the opening does not expand, and the hole diameter is high in accuracy of the hole density, and the through-hole 2 with a small internal space can be formed.
- the laser irradiation time can be shortened or the laser output energy can be reduced. If the output energy of the laser is small, the thermal effect on the adhesive layer 12 'and the base material 11 is reduced, and it is possible to form a well-shaped through hole 2 with little dross and the like.
- the pressure-sensitive adhesive layer 12 was formed on the release material 13 and the formed pressure-sensitive adhesive layer 12 and the substrate 11 were bonded together.
- the present invention is not limited to this, and the pressure-sensitive adhesive layer 12 may be directly formed on the base material 11, and the formed pressure-sensitive adhesive layer 12 and the release material 1 3 may be bonded together.
- the release material 1 3 When affixing the adhesive sheet 1 to the adherend, the release material 1 3 is peeled off from the adhesive layer 1 2, and the adhesive surface of the exposed adhesive layer 1 2 is adhered to the adherend. Press the sheet 1 against the adherend. At this time, adherend and adhesive The air between the adhesive surface of the layer 1 2 escapes from the through-hole 2 formed in the adhesive sheet 1 to the outside of the adhesive sheet surface 1 A, so that there is an air gap between the adherend and the adhesive surface. It is difficult to be trapped and it is possible to prevent air from being trapped. Even if air is trapped and air is trapped, the air can be re-compressed around the air reservoir or the air reservoir including the air reservoir. 1 Goes out of A and the air pocket disappears. Such removal of air pockets is possible even after a long time has passed since the adhesive sheet 1 was applied.
- the through hole 2 passes through the release material 1 3, but the present invention is not limited to this, and the through hole 2 includes the base material 1 1 and the pressure-sensitive adhesive layer 1. Only 2 may be penetrated.
- the pressure-sensitive adhesive sheet 1 according to the above embodiment includes the release material 13, but the present invention is not limited to this, and the release material 13 may not be provided. In these cases, the material of the release material 13 need not be a material that can form the through hole 2. Furthermore, the magnitude
- the pressure-sensitive adhesive sheet 1 is composed only of the base material 1 1 and the pressure-sensitive adhesive layer 1 2. It may be a tape-like (adhesive tape) that can be scraped off into a mouth shape to form a scraped body.
- the pressure-sensitive adhesive layer 12 overlaps the surface of the base material 11 (the surface on which the pressure-sensitive adhesive layer 12 is not laminated), but when the pressure-sensitive adhesive tape is unwound from the scraped body.
- the surface of the substrate 11 has releasability so that the pressure-sensitive adhesive layer 12 wound on the surface of the substrate 11 1 can be smoothly peeled off from the surface of the substrate 11 1.
- Examples of such a base material 11 include: (1) The surface of the resin film described above is treated with a release agent such as a silicone, fluorine, or long-chain alkyl group-containing strength rubamate; (2) Materials having peelability per se, for example, films made of polyolefin resin such as polyethylene resin, polypropylene resin, etc. (3) Materials having the above peelability and materials having low peelability, for example, polyethylene terephthalate A laminated film formed by laminating a film or the like can be used.
- a release agent such as a silicone, fluorine, or long-chain alkyl group-containing strength rubamate
- Materials having peelability per se for example, films made of polyolefin resin such as polyethylene resin, polypropylene resin, etc.
- Materials having the above peelability and materials having low peelability for example, polyethylene terephthalate
- a laminated film formed by laminating a film or the like can be used.
- the treatment for improving the adhesiveness with the pressure-sensitive adhesive layer 12 on the back surface of the base material 11 For example, corona discharge treatment, flame treatment, ultraviolet irradiation treatment, primer treatment, solvent treatment and the like are preferably performed.
- the pressure-sensitive adhesive tape as described above can be manufactured, for example, by the following manufacturing method.
- An adhesive is applied to the surface of the substrate 11 1, and the adhesive is wiped off in the form of a mouth, and at the same time, the adhesive is transferred from the surface of the substrate 11 1 to the back surface of the substrate 11 1. Then, a laminate composed of the base material 1 1 and the adhesive layer 1 2 laminated on the back surface of the base material 11 1 is unwound from the winding body, and the through-hole 2 is formed by irradiating a laser from the adhesive layer 1 2 side. Form and then roll again into a roll.
- Adhesive is applied to the back surface of the substrate 11 and dried to form the adhesive layer 12. Then, a laser is irradiated from the adhesive layer 12 side to form the through hole 2, and then the adhesive layer 12 is formed. And take up in a roll.
- the through-hole 2 is formed in the laminate composed of the base material 1 1 and the pressure-sensitive adhesive layer 1 2, air is blown in even when it is rolled up. It is difficult to easily form a scraped body without air accumulation.
- Acrylic adhesive manufactured by Nippon Synthetic Chemical Industry Co., Ltd., Coponil N-2 14 7 7, solid content: 35% by weight
- ethyl acetate 25 parts by weight
- isocyanate-based crosslinking 1 part by weight of an agent (manufactured by Nippon Polyurethane Industry Co., Ltd., Coronate L) was mixed and stirred thoroughly to obtain an adhesive coating agent.
- Both sides of the fine paper were laminated with polyethylene, and the release treatment surface of the release material (Lintec, FPM-1 1 1, thickness: 1 75 ⁇ m) coated with a silicone release agent on one side was The adhesive coating agent was applied with a knife coater so that the thickness after drying was 30 ⁇ m, and dried at 90 ° C. for 1 minute.
- a black opaque base material (thickness: 100 ⁇ ⁇ ) made of polyvinyl chloride was pressure-bonded to the pressure-sensitive adhesive layer thus formed to obtain a laminate having a three-layer structure. Irradiate the obtained laminate with UV-YAG laser from the release material side.
- through holes having a hole diameter of 15 to 35 / Xm on the surface of the base material were formed with a hole density of 1, 15 6 Z 10 cm 2 , and this was used as an adhesive sheet.
- a pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that the hole diameter on the substrate surface of the through hole was 40 to 50 / i Hi, and the hole density was 490 0 1 100 cm 2 . . ⁇
- the pore diameter on the substrate surface is 0.5 to 10 ⁇ m, and the pore diameter on the adhesive surface is 20 to 30 Aim.
- Through-holes (the hole diameter on the adhesive surface is the maximum diameter in the base material and the adhesive layer) are formed with a hole density of 10 0,100 0 2 and formed into an adhesive sheet It was.
- a pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except that laser irradiation was performed from the substrate side and the diameter of the through hole on the substrate surface was about 60 ra.
- a pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that a CO 2 laser was used for laser processing, laser irradiation was performed from the substrate side, and the hole diameter on the substrate surface of the through hole was about 100 ⁇ m. did.
- Example 6 1 4 0 ⁇ 1 5 0 ⁇ a pore size on the surface of a substrate having a through hole, except that the pore density 1 0 0/1 0 0 cm 2, were created made adhesive sheet in the same manner as in Example 1.
- An adhesive sheet was prepared in the same manner as in Example 1 except that the release material was peeled off and laser irradiation was performed from the adhesive surface side, and the hole diameter on the substrate surface of the through hole was about 50 ⁇ m.
- Example 2 As in Example 1, except that a transparent polyethylene terephthalate film (Toray Industries, Lumirror T 60, thickness: 50 jum) was used instead of polyvinyl chloride as the substrate. A layered laminate was obtained.
- a transparent polyethylene terephthalate film Toray Industries, Lumirror T 60, thickness: 50 jum
- a through-hole (base) having a pore size of about 70 ⁇ on the substrate surface and a pore size of about 80 ⁇ m on the adhesive surface was obtained.
- the hole diameter on the pressure-sensitive adhesive surface was the maximum diameter), and was formed with a hole density of 1, 15 6 holes / 100 cm 2 , and this was used as a pressure-sensitive adhesive sheet.
- a polyethylene terephthalate film (Teijin DuPont Films, U 4 Z—50, thickness: 50 ⁇ ) on one side was prepared as a process material.
- the coating material for the base material was applied to the release material surface of the process material with a knife coater so that the thickness after drying was 10 ⁇ ⁇ ⁇ , and 1 minute at 140 ° C. for 1 minute. It was dried at ° C for 2 minutes to form a black opaque substrate.
- a pressure-sensitive adhesive layer is formed on the release material in the same manner as in Example 1, and the pressure-sensitive adhesive layer and the base material formed on the above-mentioned process materials are pressure-bonded to form a four-layer laminate. Got the body.
- Example 10 The same as in Example 10 except that UV-Y AG laser was used for laser processing, laser irradiation was performed from the side of the release material, and the hole diameter on the substrate surface of the through hole was 20 to 40 ⁇ . An adhesive sheet was prepared.
- the release material was peeled from the adhesive layer, and the laminate was irradiated with a CO 2 laser from the adhesive layer side. Through-holes having a hole diameter of about 40 m on the substrate surface and a hole diameter of about 80 ⁇ m on the adhesive surface were formed at a hole density of 2,500 holes / 100 cm 2 . Then, the release material was pressure-bonded again to the pressure-sensitive adhesive layer, and this was used as a pressure-sensitive adhesive sheet.
- an adhesive protective sheet (manufactured by Panac Co., Ltd.) consisting of a substrate and a releasable adhesive layer was formed on the surface of the substrate in the laminate.
- the release material is peeled off from the pressure-sensitive adhesive layer in the laminate, and the laminate is irradiated with a C 0 2 laser from the pressure-sensitive adhesive layer side to form through-holes having a pore diameter of 35 ⁇ m on the substrate surface. It was formed with a pore density of 0 pieces / 100 cm 2 .
- the release material was pressure-bonded to the pressure-sensitive adhesive layer again, and the pressure-sensitive adhesive protective sheet was peeled off from the base material.
- a transparent polyethylene terephthalate film (made by Toyo Metallizing Co., Ltd., BK (T), thickness: 38 ⁇ m), one side of which was peeled with a silicone-based release agent, was prepared as the base material.
- the adhesive coating agent obtained in Example 1 was applied to the release-treated surface of the base material with a knife coater so that the thickness after drying was 30 ⁇ m, and then at 90 ° C. for 1 minute. It was dried to obtain a laminated tape (A) having a two-layer structure comprising a brazing material and a pressure-sensitive adhesive layer laminated on the release surface of the substrate.
- the laminate tape (A) is scraped off into a roll shape, and at the same time, the pressure-sensitive adhesive layer is transferred from the release treatment surface of the substrate to the non-release treatment surface and laminated on the substrate and the non-release treatment surface of the substrate.
- a laminated tape (B) having a two-layer structure composed of the adhesive layer thus prepared was obtained.
- the obtained laminated tape (B) is driven out of the scraper and irradiated with a C 0 2 laser from the pressure-sensitive adhesive layer side, so that the pore diameter on the substrate surface is about 50 m, Through holes with a pore size of about 95 m on the adhesive surface (the maximum diameter on the adhesive surface) were formed at a hole density of 2,500 pieces / 100 cm 2 .
- the laminated tape (B) in which the through-hole was formed was again rolled up, and it was set as the adhesive tape (adhesive sheet).
- the release material was peeled off from the adhesive layer, and the laminate was irradiated with C 0 2 laser from the adhesive layer side.
- C 0 2 laser There are 2, 5 0 0 through-holes with a hole diameter of about 35 m and a hole diameter of about 85 / m on the adhesive surface (the maximum hole diameter on the adhesive surface).
- a laminate having a three-layer structure was produced in the same manner as in Example 1, and this was used as an adhesive sheet without forming through holes.
- a pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that the hole density of the through holes was 4 / l OO c in 2 .
- a pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except that laser irradiation was performed from the base material side and the diameter of the through hole was about 5 ° to 0 ⁇ m.
- transparent polyethylene terephthalate film (Lumirror T 60, thickness: 50 ⁇ ) made of transparent polyethylene terephthalate is used instead of polychlorinated bur. 3 0 to 1 4 0 ⁇ ⁇ , and the hole density is
- a pressure-sensitive adhesive sheet was produced in the same manner as in Example 2, except that the number of pieces was 1 0 2, 400 pieces Z 1 0 0 cm 2 .
- Air retention disappearance test An adhesive sheet cut to 50 mm x 50 mm was attached to a melamine coating plate so that a circular air reservoir with a diameter of about 15 mm was formed, and the adhesive sheet was pressed with a squeegee. As a result, ⁇ indicates that the air reservoir has disappeared, ⁇ indicates that the air reservoir has shrunk, and X indicates that the air reservoir has remained.
- Adhesive sheet (tape) that was cut into a width of 10 mm and a length of 150 mm and peeled off the release material, and a tensile strength tester (manufactured by Orientec, Tensilon) at a gripping distance of 100 mm Attached to the wire and pulled with 200 mm Z mi ⁇ , the one that did not break within 10 seconds is shown as ⁇ , and the one that broke down is shown as X.
- Hole visibility inspection Adhesive sheet (with release material peeled off release material) is pasted on a white melamine painted plate, and through-holes are formed on the adhesive sheet surface with the naked eye under indoor fluorescent light.
- Table 1 shows the results of each test. [table 1 ]
- the pressure-sensitive adhesive sheets obtained in Examples 1 to 16 have an air strength that can be easily removed, and have sufficient strength. The view is also good.
- the pressure-sensitive adhesive sheets obtained in Examples 1, 3, 11 and 14 are such that the through holes themselves cannot be seen on the surface of the pressure-sensitive adhesive sheet.
- the pressure-sensitive adhesive sheet of the present invention and the pressure-sensitive adhesive sheet obtained by the production method of the present invention generally have a tendency that blisters are easily generated if air is trapped in the pressure-sensitive adhesive sheet, for example, when the area of the pressure-sensitive adhesive sheet is large, It can be preferably used when gas is generated from the gas.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Description
Claims
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT03777190T ATE435898T1 (de) | 2002-12-27 | 2003-12-03 | Verfahren zur herstellung eines druckempfindlichen klebeblatts |
BRPI0317736-0A BR0317736B1 (pt) | 2002-12-27 | 2003-12-03 | folha adesiva sensÍvel À pressço e mÉtodo para produÇço da mesma. |
MXPA05006894A MXPA05006894A (es) | 2002-12-27 | 2003-12-03 | Hoja adhesiva, sensible a la presion, y metodo para su produccion. |
DE60328312T DE60328312D1 (de) | 2002-12-27 | 2003-12-03 | Verfahren zur Herstellung eines druckempfindlichen Klebeblatts |
CA2510054A CA2510054C (en) | 2002-12-27 | 2003-12-03 | Adhesive sheet and method for manufacturing same |
AU2003289133A AU2003289133B2 (en) | 2002-12-27 | 2003-12-03 | Adhesive sheet and method for manufacturing same |
EP03777190A EP1577358B1 (en) | 2002-12-27 | 2003-12-03 | Method for production of pressure-sensitive adhesive sheet |
JP2005506709A JP4898221B2 (ja) | 2002-12-27 | 2003-12-03 | 粘着シートおよびその製造方法 |
US10/539,300 US20060222813A1 (en) | 2002-12-27 | 2003-12-03 | Adhesive sheet and method for manaufacturing same |
US12/588,229 US8101884B2 (en) | 2002-12-27 | 2009-10-08 | Method for production of a pressure-sensitive adhesive sheet |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002-379279 | 2002-12-27 | ||
JP2002379279 | 2002-12-27 | ||
JP2003-304028 | 2003-08-28 | ||
JP2003304028 | 2003-08-28 | ||
PCT/JP2003/013866 WO2004061031A1 (ja) | 2002-12-27 | 2003-10-29 | 粘着シートおよびその製造方法 |
JPPCT/JP03/13866 | 2003-10-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004061032A1 true WO2004061032A1 (ja) | 2004-07-22 |
Family
ID=32716309
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/013866 WO2004061031A1 (ja) | 2002-12-27 | 2003-10-29 | 粘着シートおよびその製造方法 |
PCT/JP2003/015458 WO2004061032A1 (ja) | 2002-12-27 | 2003-12-03 | 粘着シートおよびその製造方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/013866 WO2004061031A1 (ja) | 2002-12-27 | 2003-10-29 | 粘着シートおよびその製造方法 |
Country Status (14)
Country | Link |
---|---|
US (2) | US20060222813A1 (ja) |
EP (2) | EP1964901B1 (ja) |
JP (1) | JP4898221B2 (ja) |
KR (1) | KR101023190B1 (ja) |
AT (1) | ATE435898T1 (ja) |
AU (2) | AU2003280606A1 (ja) |
BR (1) | BR0317736B1 (ja) |
CA (1) | CA2510054C (ja) |
DE (1) | DE60328312D1 (ja) |
MX (1) | MXPA05006894A (ja) |
MY (1) | MY149892A (ja) |
RU (1) | RU2344150C2 (ja) |
TW (1) | TW200420705A (ja) |
WO (2) | WO2004061031A1 (ja) |
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1719807A1 (en) * | 2004-02-27 | 2006-11-08 | Lintec Corporation | Pressure-sensitive adhesive sheet |
EP1728842A1 (en) * | 2004-02-27 | 2006-12-06 | Lintec Corporation | Pressure-sensitive adhesive sheet |
JP2007008995A (ja) * | 2005-06-28 | 2007-01-18 | Lintec Corp | 貫通孔形成粘着シートの製造方法および製造装置 |
WO2007011063A1 (en) * | 2005-07-20 | 2007-01-25 | Lintec Corporation | Pressure-sensitive adhesive sheet |
JP2007070440A (ja) * | 2005-09-06 | 2007-03-22 | Lintec Corp | 貫通孔形成粘着シートおよびその製造方法 |
EP1767605A1 (en) * | 2004-06-21 | 2007-03-28 | Lintec Corporation | Adhesive sheet |
EP1767606A1 (en) * | 2004-06-22 | 2007-03-28 | Lintec Corporation | Adhesive sheet manufacturing method |
EP1767604A1 (en) * | 2004-06-14 | 2007-03-28 | Lintec Corporation | Adhesive sheet |
JP2007119655A (ja) * | 2005-10-31 | 2007-05-17 | Lintec Corp | 貫通孔形成粘着シートおよびその製造方法 |
JP2007224252A (ja) * | 2006-02-27 | 2007-09-06 | Lintec Corp | 貫通孔形成粘着シートの製造方法および製造装置ならびに粘着シート支持具 |
EP1916284A1 (en) * | 2005-08-01 | 2008-04-30 | Lintec Corporation | Adhesive sheet |
WO2010100978A1 (ja) * | 2009-03-02 | 2010-09-10 | リンテック株式会社 | 粘着シート |
WO2011108442A1 (ja) * | 2010-03-04 | 2011-09-09 | リンテック株式会社 | 粘着シート |
JP2011207950A (ja) * | 2010-03-29 | 2011-10-20 | Lintec Corp | 粘着シートおよび粘着シートの製造方法 |
JP2012057131A (ja) * | 2010-09-13 | 2012-03-22 | Fujifilm Corp | 機能性フィルムの製造方法 |
GB2491329A (en) * | 2011-02-24 | 2012-11-28 | Lintec Corp | Pressure sensitive adhesive sheet |
JP2013014012A (ja) * | 2011-06-30 | 2013-01-24 | Three M Innovative Properties Co | 貫通孔を有する窓貼り用積層フィルム |
US8455083B2 (en) | 2010-03-29 | 2013-06-04 | Lintec Corporation | Pressure-sensitive adhesive sheet |
WO2014017235A1 (ja) | 2012-07-27 | 2014-01-30 | 日産自動車株式会社 | 接合シート、およびシート部材の接合方法 |
JP2016027135A (ja) * | 2014-06-27 | 2016-02-18 | 日東電工株式会社 | 長尺状の粘着フィルムの製造方法 |
US9536639B2 (en) | 2015-02-16 | 2017-01-03 | Sumitomo Wiring Systems, Ltd. | Wire harness |
JP2019065187A (ja) * | 2017-09-29 | 2019-04-25 | 積水化学工業株式会社 | 粘着テープ及び建築用面構造 |
JP2019513096A (ja) * | 2016-03-14 | 2019-05-23 | スリーエム イノベイティブ プロパティズ カンパニー | 表面保護フィルム及び関連方法 |
JP2021523975A (ja) * | 2018-02-01 | 2021-09-09 | アンシャー リュー | 応力引き裂きテープ |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004061031A1 (ja) | 2002-12-27 | 2004-07-22 | Lintec Corporation | 粘着シートおよびその製造方法 |
WO2004096483A1 (ja) * | 2003-04-25 | 2004-11-11 | Nitto Denko Corporation | レーザー加工品の製造方法、およびそれに用いるレーザー加工用粘着シート |
US7446940B2 (en) | 2004-09-02 | 2008-11-04 | 3M Innovative Properties Company | Substrates with multiple images and methods of use |
US7404997B2 (en) | 2004-09-02 | 2008-07-29 | 3M Innovative Properties Company | Substrates with multiple images |
US8114502B2 (en) | 2004-09-02 | 2012-02-14 | 3M Innovative Properties Company | Substrates with multiple images |
US7416776B2 (en) | 2004-09-02 | 2008-08-26 | 3M Innovative Properties Company | Substrates with multiple images |
JP4873863B2 (ja) * | 2005-01-14 | 2012-02-08 | 日東電工株式会社 | レーザー加工品の製造方法及びレーザー加工用粘着シート |
JP4854061B2 (ja) * | 2005-01-14 | 2012-01-11 | 日東電工株式会社 | レーザー加工品の製造方法及びレーザー加工用保護シート |
US7594976B2 (en) | 2005-05-13 | 2009-09-29 | 3M Innovative Properties Company | Methods of manufacturing substrates |
JP5074701B2 (ja) * | 2006-03-30 | 2012-11-14 | リンテック株式会社 | 塗膜保護シート |
JP5231774B2 (ja) * | 2007-09-07 | 2013-07-10 | リンテック株式会社 | 両面粘着シート |
US20090092819A1 (en) * | 2007-10-09 | 2009-04-09 | Adhesives Research, Inc. | Porous pressure sensitive adhesive and tapes |
US20090169795A1 (en) * | 2007-12-26 | 2009-07-02 | Andre Fiechter | Poster as well as methods and materials for its manufacture |
CA2736165C (en) | 2008-09-05 | 2016-11-01 | Bell Helicopter Textron Inc. | Method and apparatus for reticulating an adhesive to the surface network of a cellular core structure |
JP5662664B2 (ja) * | 2008-12-19 | 2015-02-04 | 東京応化工業株式会社 | 加工基板及びその製造方法 |
JP5180990B2 (ja) * | 2010-05-14 | 2013-04-10 | 株式会社佐々木コーティング | 粘着性シート及びその製造方法 |
JP5874343B2 (ja) * | 2011-11-18 | 2016-03-02 | 富士通株式会社 | 積層回路基板の製造方法、積層回路基板、および電子機器 |
JP6075978B2 (ja) | 2012-06-25 | 2017-02-08 | 日東電工株式会社 | 粘着フィルム |
CA2878834C (en) * | 2012-07-10 | 2016-01-05 | Nissan Motor Co., Ltd. | Membrane electrode assembly |
JP6214594B2 (ja) | 2014-04-25 | 2017-10-18 | 日東電工株式会社 | 偏光子、偏光板および画像表示装置 |
JP6215864B2 (ja) | 2014-04-25 | 2017-10-18 | 日東電工株式会社 | 偏光子、偏光板および画像表示装置 |
JP6215261B2 (ja) | 2014-06-27 | 2017-10-18 | 日東電工株式会社 | 長尺状の偏光子、長尺状の偏光板および画像表示装置 |
JP6154856B2 (ja) * | 2014-06-27 | 2017-06-28 | 日東電工株式会社 | 長尺状の粘着フィルム |
JP6713189B2 (ja) * | 2014-06-27 | 2020-06-24 | 日東電工株式会社 | 長尺状の偏光フィルム積層体 |
KR101598445B1 (ko) * | 2015-02-13 | 2016-03-02 | 김만현 | 자동차용 통기 시트 커버 및 그 제조 방법 |
JP6142045B2 (ja) * | 2015-06-25 | 2017-06-07 | 日東電工株式会社 | 粘着フィルムの製造方法および偏光子の製造方法 |
JP7163000B2 (ja) | 2015-06-25 | 2022-10-31 | 日東電工株式会社 | 非偏光部を有する偏光子 |
JP6422415B2 (ja) | 2015-09-28 | 2018-11-14 | 日東電工株式会社 | 偏光子、偏光板および画像表示装置 |
CN109628000A (zh) * | 2018-12-17 | 2019-04-16 | 武汉华星光电半导体显示技术有限公司 | 一种各向异性导电胶 |
JP7461301B2 (ja) * | 2018-12-28 | 2024-04-03 | 日東電工株式会社 | 通気性粘着シート及び通気性製品 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6281473A (ja) * | 1985-10-05 | 1987-04-14 | Sanoyasu:Kk | ミシン目をもつ感圧接着テ−プ及びその製造方法と製造装置 |
JPH02107628A (ja) * | 1988-09-09 | 1990-04-19 | Goodyear Tire & Rubber Co:The | 高モジュラスゴム組成物 |
JPH04100235U (ja) * | 1991-02-07 | 1992-08-31 | ||
JPH07164873A (ja) * | 1993-12-17 | 1995-06-27 | Chuo Yohin Kk | 車両のガラス面に貼着する日除用カーフィルム |
JPH10195395A (ja) * | 1997-01-09 | 1998-07-28 | Sliontec:Kk | 易裂性両面粘着テープ又はシート |
JP2002002777A (ja) * | 2000-06-26 | 2002-01-09 | Asahi Kasei Corp | 粘着ラッピングフィルム |
JP2002294044A (ja) * | 2001-03-30 | 2002-10-09 | Unitika Ltd | 貼付材用基材フィルムおよびそれからなる貼付材 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3085024A (en) * | 1959-05-19 | 1963-04-09 | Johnson & Johnson | Porous extensible pressure-sensitive adhesive tape in which perforations arearrangedto facilitate tearing |
EP0307101B1 (en) * | 1987-09-09 | 1994-02-02 | Zeneca Limited | Chemical process |
JPH01125345U (ja) * | 1988-02-16 | 1989-08-25 | ||
JPH02107682A (ja) * | 1988-10-18 | 1990-04-19 | Nichiban Co Ltd | マーキングシート |
JPH0455489A (ja) | 1990-06-22 | 1992-02-24 | Sekisui Chem Co Ltd | 表面保護フィルム |
US5275856A (en) * | 1991-11-12 | 1994-01-04 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive web |
JP3209641B2 (ja) * | 1994-06-02 | 2001-09-17 | 三菱電機株式会社 | 光加工装置及び方法 |
JPH08287523A (ja) | 1995-02-17 | 1996-11-01 | Fuji Photo Film Co Ltd | テープ状光学的情報記録媒体 |
US5810756A (en) * | 1995-05-23 | 1998-09-22 | Lectec Corporation | Method of producing a perforated medical adhesive tape |
US6388231B1 (en) * | 2000-06-15 | 2002-05-14 | Xerox Corporation | Systems and methods for controlling depths of a laser cut |
US7122235B2 (en) | 2001-06-11 | 2006-10-17 | Eastman Kodak Company | Tack free cauterized edge for pressure sensitive adhesive web |
US6627844B2 (en) * | 2001-11-30 | 2003-09-30 | Matsushita Electric Industrial Co., Ltd. | Method of laser milling |
WO2004061031A1 (ja) | 2002-12-27 | 2004-07-22 | Lintec Corporation | 粘着シートおよびその製造方法 |
JP4100235B2 (ja) * | 2003-04-18 | 2008-06-11 | トヨタ自動車株式会社 | 情報提供方法、情報提供システムおよび情報端末装置 |
JP4795942B2 (ja) * | 2004-06-14 | 2011-10-19 | リンテック株式会社 | 粘着シート |
-
2003
- 2003-10-29 WO PCT/JP2003/013866 patent/WO2004061031A1/ja active Application Filing
- 2003-10-29 AU AU2003280606A patent/AU2003280606A1/en not_active Abandoned
- 2003-12-03 JP JP2005506709A patent/JP4898221B2/ja not_active Expired - Lifetime
- 2003-12-03 US US10/539,300 patent/US20060222813A1/en not_active Abandoned
- 2003-12-03 AT AT03777190T patent/ATE435898T1/de not_active IP Right Cessation
- 2003-12-03 EP EP08006171.6A patent/EP1964901B1/en not_active Expired - Lifetime
- 2003-12-03 RU RU2005122176/04A patent/RU2344150C2/ru not_active IP Right Cessation
- 2003-12-03 MX MXPA05006894A patent/MXPA05006894A/es active IP Right Grant
- 2003-12-03 DE DE60328312T patent/DE60328312D1/de not_active Expired - Lifetime
- 2003-12-03 BR BRPI0317736-0A patent/BR0317736B1/pt not_active IP Right Cessation
- 2003-12-03 AU AU2003289133A patent/AU2003289133B2/en not_active Ceased
- 2003-12-03 CA CA2510054A patent/CA2510054C/en not_active Expired - Lifetime
- 2003-12-03 WO PCT/JP2003/015458 patent/WO2004061032A1/ja active Application Filing
- 2003-12-03 KR KR1020057011725A patent/KR101023190B1/ko active IP Right Grant
- 2003-12-03 EP EP03777190A patent/EP1577358B1/en not_active Expired - Lifetime
- 2003-12-23 MY MYPI20034966A patent/MY149892A/en unknown
- 2003-12-23 TW TW092136516A patent/TW200420705A/zh not_active IP Right Cessation
-
2009
- 2009-10-08 US US12/588,229 patent/US8101884B2/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6281473A (ja) * | 1985-10-05 | 1987-04-14 | Sanoyasu:Kk | ミシン目をもつ感圧接着テ−プ及びその製造方法と製造装置 |
JPH02107628A (ja) * | 1988-09-09 | 1990-04-19 | Goodyear Tire & Rubber Co:The | 高モジュラスゴム組成物 |
JPH04100235U (ja) * | 1991-02-07 | 1992-08-31 | ||
JPH07164873A (ja) * | 1993-12-17 | 1995-06-27 | Chuo Yohin Kk | 車両のガラス面に貼着する日除用カーフィルム |
JPH10195395A (ja) * | 1997-01-09 | 1998-07-28 | Sliontec:Kk | 易裂性両面粘着テープ又はシート |
JP2002002777A (ja) * | 2000-06-26 | 2002-01-09 | Asahi Kasei Corp | 粘着ラッピングフィルム |
JP2002294044A (ja) * | 2001-03-30 | 2002-10-09 | Unitika Ltd | 貼付材用基材フィルムおよびそれからなる貼付材 |
Cited By (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1728842A4 (en) * | 2004-02-27 | 2009-03-11 | Lintec Corp | PRESSURE-SENSITIVE ADHESIVE SHEET |
EP1728842A1 (en) * | 2004-02-27 | 2006-12-06 | Lintec Corporation | Pressure-sensitive adhesive sheet |
JP5057508B2 (ja) * | 2004-02-27 | 2012-10-24 | リンテック株式会社 | 粘着シート |
EP1719807A1 (en) * | 2004-02-27 | 2006-11-08 | Lintec Corporation | Pressure-sensitive adhesive sheet |
EP1719807A4 (en) * | 2004-02-27 | 2009-03-11 | Lintec Corp | PRESSURE-SENSITIVE ADHESIVE SHEET |
US7727615B2 (en) | 2004-06-14 | 2010-06-01 | Lintec Corporation | Pressure-sensitive adhesive sheet |
EP1767604A4 (en) * | 2004-06-14 | 2009-03-11 | Lintec Corp | BAND-AID |
EP1767604A1 (en) * | 2004-06-14 | 2007-03-28 | Lintec Corporation | Adhesive sheet |
JP4795942B2 (ja) * | 2004-06-14 | 2011-10-19 | リンテック株式会社 | 粘着シート |
AU2005252530B2 (en) * | 2004-06-14 | 2010-02-18 | Lintec Corporation | Adhesive sheet |
EP1767605A1 (en) * | 2004-06-21 | 2007-03-28 | Lintec Corporation | Adhesive sheet |
EP1767605A4 (en) * | 2004-06-21 | 2009-03-11 | Lintec Corp | ADHESIVE SHEET |
EP1767606A4 (en) * | 2004-06-22 | 2009-03-11 | Lintec Corp | PROCESS FOR PRODUCING ADHESIVE SHEET |
US7968039B2 (en) | 2004-06-22 | 2011-06-28 | Lintec Corporation | Method of producing pressure-sensitive adhesive sheet |
EP1767606A1 (en) * | 2004-06-22 | 2007-03-28 | Lintec Corporation | Adhesive sheet manufacturing method |
JP4850063B2 (ja) * | 2004-06-22 | 2012-01-11 | リンテック株式会社 | 粘着シートの製造方法 |
JP2007008995A (ja) * | 2005-06-28 | 2007-01-18 | Lintec Corp | 貫通孔形成粘着シートの製造方法および製造装置 |
WO2007011063A1 (en) * | 2005-07-20 | 2007-01-25 | Lintec Corporation | Pressure-sensitive adhesive sheet |
AU2006270740B2 (en) * | 2005-07-20 | 2011-09-01 | Lintec Corporation | Pressure-sensitive adhesive sheet |
EP1916284A1 (en) * | 2005-08-01 | 2008-04-30 | Lintec Corporation | Adhesive sheet |
EP1916284A4 (en) * | 2005-08-01 | 2009-03-11 | Lintec Corp | ADHESIVE SHEET |
JP2007070440A (ja) * | 2005-09-06 | 2007-03-22 | Lintec Corp | 貫通孔形成粘着シートおよびその製造方法 |
JP2007119655A (ja) * | 2005-10-31 | 2007-05-17 | Lintec Corp | 貫通孔形成粘着シートおよびその製造方法 |
JP2007224252A (ja) * | 2006-02-27 | 2007-09-06 | Lintec Corp | 貫通孔形成粘着シートの製造方法および製造装置ならびに粘着シート支持具 |
GB2480595B (en) * | 2009-03-02 | 2013-12-18 | Lintec Corp | Pressure-sensitive adhesive sheet |
JPWO2010100978A1 (ja) * | 2009-03-02 | 2012-09-06 | リンテック株式会社 | 粘着シート |
WO2010100978A1 (ja) * | 2009-03-02 | 2010-09-10 | リンテック株式会社 | 粘着シート |
GB2480595A (en) * | 2009-03-02 | 2011-11-23 | Lintec Corp | Pressure-sensitive adhesive sheet |
WO2011108442A1 (ja) * | 2010-03-04 | 2011-09-09 | リンテック株式会社 | 粘着シート |
US8980399B2 (en) | 2010-03-04 | 2015-03-17 | Lintec Corporation | Pressure-sensitive adhesive sheet |
US8455083B2 (en) | 2010-03-29 | 2013-06-04 | Lintec Corporation | Pressure-sensitive adhesive sheet |
JP2011207950A (ja) * | 2010-03-29 | 2011-10-20 | Lintec Corp | 粘着シートおよび粘着シートの製造方法 |
JP2012057131A (ja) * | 2010-09-13 | 2012-03-22 | Fujifilm Corp | 機能性フィルムの製造方法 |
GB2491329A (en) * | 2011-02-24 | 2012-11-28 | Lintec Corp | Pressure sensitive adhesive sheet |
JP2013014012A (ja) * | 2011-06-30 | 2013-01-24 | Three M Innovative Properties Co | 貫通孔を有する窓貼り用積層フィルム |
US9331345B2 (en) | 2012-07-27 | 2016-05-03 | Nissan Motor Co., Ltd. | Bonded sheet and sheet-member bonding method |
WO2014017235A1 (ja) | 2012-07-27 | 2014-01-30 | 日産自動車株式会社 | 接合シート、およびシート部材の接合方法 |
JP2016027135A (ja) * | 2014-06-27 | 2016-02-18 | 日東電工株式会社 | 長尺状の粘着フィルムの製造方法 |
US9536639B2 (en) | 2015-02-16 | 2017-01-03 | Sumitomo Wiring Systems, Ltd. | Wire harness |
JP2019513096A (ja) * | 2016-03-14 | 2019-05-23 | スリーエム イノベイティブ プロパティズ カンパニー | 表面保護フィルム及び関連方法 |
JP7141949B2 (ja) | 2016-03-14 | 2022-09-26 | スリーエム イノベイティブ プロパティズ カンパニー | 表面保護フィルム及び関連方法 |
JP2019065187A (ja) * | 2017-09-29 | 2019-04-25 | 積水化学工業株式会社 | 粘着テープ及び建築用面構造 |
JP2021523975A (ja) * | 2018-02-01 | 2021-09-09 | アンシャー リュー | 応力引き裂きテープ |
JP7491530B2 (ja) | 2018-02-01 | 2024-05-28 | アンシャー リュー | 応力引き裂きテープ |
Also Published As
Publication number | Publication date |
---|---|
JPWO2004061032A1 (ja) | 2006-05-11 |
KR101023190B1 (ko) | 2011-03-18 |
MXPA05006894A (es) | 2005-11-23 |
MY149892A (en) | 2013-10-31 |
CA2510054A1 (en) | 2004-07-22 |
EP1577358A4 (en) | 2006-03-29 |
JP4898221B2 (ja) | 2012-03-14 |
US8101884B2 (en) | 2012-01-24 |
EP1577358A1 (en) | 2005-09-21 |
AU2003289133B2 (en) | 2009-11-19 |
US20060222813A1 (en) | 2006-10-05 |
EP1964901B1 (en) | 2016-10-26 |
EP1964901A1 (en) | 2008-09-03 |
TW200420705A (en) | 2004-10-16 |
ATE435898T1 (de) | 2009-07-15 |
WO2004061031A1 (ja) | 2004-07-22 |
CA2510054C (en) | 2012-02-21 |
BR0317736A (pt) | 2005-11-22 |
DE60328312D1 (de) | 2009-08-20 |
AU2003289133A1 (en) | 2004-07-29 |
RU2344150C2 (ru) | 2009-01-20 |
BR0317736B1 (pt) | 2013-03-05 |
AU2003280606A1 (en) | 2004-07-29 |
KR20050085865A (ko) | 2005-08-29 |
TWI333502B (ja) | 2010-11-21 |
US20100032088A1 (en) | 2010-02-11 |
EP1577358B1 (en) | 2009-07-08 |
RU2005122176A (ru) | 2006-02-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2004061032A1 (ja) | 粘着シートおよびその製造方法 | |
JP4795942B2 (ja) | 粘着シート | |
JP5057508B2 (ja) | 粘着シート | |
JP4748941B2 (ja) | 粘着シート | |
JP4850063B2 (ja) | 粘着シートの製造方法 | |
JP2005075953A (ja) | 粘着シートおよびその製造方法 | |
JP2005336249A (ja) | 易貼付性粘着シート及びその製造方法 | |
JPWO2007015343A1 (ja) | 粘着シート | |
WO2005116156A1 (ja) | 粘着シートおよびその製造方法 | |
JP2008037060A (ja) | アプリケーションシートおよび粘着シート | |
JPWO2005123859A1 (ja) | 粘着シート | |
JP2005075966A (ja) | 粘着シートの製造方法および粘着シート | |
JP2006001951A (ja) | 粘着シートおよびその製造方法 | |
JP2004002805A (ja) | 粘着加工シート | |
JP6495703B2 (ja) | アプリケーションシートおよびアプリケーションシート付き粘着シート | |
JP5527889B2 (ja) | 粘着シートおよび粘着シートの製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): BW GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2005506709 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2510054 Country of ref document: CA |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2643/DELNP/2005 Country of ref document: IN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020057011725 Country of ref document: KR Ref document number: 2003289133 Country of ref document: AU Ref document number: 2003777190 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: PA/a/2005/006894 Country of ref document: MX |
|
WWE | Wipo information: entry into national phase |
Ref document number: 20038A87110 Country of ref document: CN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1200500992 Country of ref document: VN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2005/05978 Country of ref document: ZA Ref document number: 200505978 Country of ref document: ZA |
|
ENP | Entry into the national phase |
Ref document number: 2005122176 Country of ref document: RU Kind code of ref document: A |
|
WWP | Wipo information: published in national office |
Ref document number: 1020057011725 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1-2005-501102 Country of ref document: PH |
|
WWP | Wipo information: published in national office |
Ref document number: 2003777190 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: PI0317736 Country of ref document: BR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2006222813 Country of ref document: US Ref document number: 10539300 Country of ref document: US |
|
WWP | Wipo information: published in national office |
Ref document number: 10539300 Country of ref document: US |