WO2003095144A1 - Dispositif de rodage et procede de travail de rodage - Google Patents

Dispositif de rodage et procede de travail de rodage Download PDF

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Publication number
WO2003095144A1
WO2003095144A1 PCT/JP2003/005843 JP0305843W WO03095144A1 WO 2003095144 A1 WO2003095144 A1 WO 2003095144A1 JP 0305843 W JP0305843 W JP 0305843W WO 03095144 A1 WO03095144 A1 WO 03095144A1
Authority
WO
WIPO (PCT)
Prior art keywords
lapping machine
ultrasonic vibration
lapping
polished
polishing
Prior art date
Application number
PCT/JP2003/005843
Other languages
English (en)
Japanese (ja)
Inventor
Kazumasa Ohnishi
Original Assignee
Kazumasa Ohnishi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kazumasa Ohnishi filed Critical Kazumasa Ohnishi
Priority to JP2004503207A priority Critical patent/JPWO2003095144A1/ja
Priority to AU2003235919A priority patent/AU2003235919A1/en
Publication of WO2003095144A1 publication Critical patent/WO2003095144A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency

Abstract

L'invention concerne un dispositif de rodage caractérisé en ce qu'il comprend une machine à roder (4), un dispositif de distribution de suspension (10) destiné à fournir une suspension abrasive (11) sur la surface d'une machine de rodage (4), un support (22b) d'objet (6) à roder, cet objet étant amené en contact avec la surface de la machine à roder (4), et rodé au moyen de la suspension d'abrasif (11), et des dispositifs de déplacement linéaire (101a, 101b) fixés sur la machine à roder (4) et/ou sur le support (22b) d'objet à roder. Le dispositif de rodage est en outre caractérisé par la mise en oeuvre de moyens d'application de vibrations ultrasonores (12) dans une direction perpendiculaire à la surface de la machine à roder (4), ces moyens étant fixés sur la machine à roder (4) et/ou sur le support (22b) d'objet à roder et alimentés par des moyens fournissant de l'énergie électrique (14). L'utilisation du dispositif de rodage réduit la quantité consommée d'abrasif et permet une meilleure précision qu'un dispositif classique lorsque la suspension contient de l'abrasif de la même granulométrie que celui habituellement utilisé.
PCT/JP2003/005843 2002-05-09 2003-05-09 Dispositif de rodage et procede de travail de rodage WO2003095144A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004503207A JPWO2003095144A1 (ja) 2002-05-09 2003-05-09 ラップ装置及びラップ加工方法
AU2003235919A AU2003235919A1 (en) 2002-05-09 2003-05-09 Lapping device and lapping work method

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2002170668 2002-05-09
JP2002-170668 2002-05-09
JP2002199269 2002-06-05
JP2002-199269 2002-06-05

Publications (1)

Publication Number Publication Date
WO2003095144A1 true WO2003095144A1 (fr) 2003-11-20

Family

ID=29422480

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2003/005843 WO2003095144A1 (fr) 2002-05-09 2003-05-09 Dispositif de rodage et procede de travail de rodage

Country Status (3)

Country Link
JP (1) JPWO2003095144A1 (fr)
AU (1) AU2003235919A1 (fr)
WO (1) WO2003095144A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102211297A (zh) * 2011-05-31 2011-10-12 北京航空航天大学 一种基于超声高频气动低频复合型振动磨削的方法和装置
KR102116510B1 (ko) * 2019-03-08 2020-05-28 에스케이실트론 주식회사 웨이퍼 랩핑 장치
WO2021208283A1 (fr) * 2020-04-15 2021-10-21 南京航空航天大学 Plate-forme de vibration ultrasonore permettant le traitement d'une grande pièce, et son procédé de fonctionnement

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05200659A (ja) * 1992-01-24 1993-08-10 Olympus Optical Co Ltd 超音波研磨装置
JPH088216A (ja) * 1994-04-21 1996-01-12 Sony Corp 化学的機械研磨方法および化学的機械研磨装置
JPH10156706A (ja) * 1996-11-27 1998-06-16 Speedfam Co Ltd 研磨装置及び研磨方法
JPH11129155A (ja) * 1997-10-30 1999-05-18 Nikon Corp Ｃｍｐ研磨装置
JP2000218514A (ja) * 1999-02-02 2000-08-08 Nikon Corp 研磨装置及び研磨方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05200659A (ja) * 1992-01-24 1993-08-10 Olympus Optical Co Ltd 超音波研磨装置
JPH088216A (ja) * 1994-04-21 1996-01-12 Sony Corp 化学的機械研磨方法および化学的機械研磨装置
JPH10156706A (ja) * 1996-11-27 1998-06-16 Speedfam Co Ltd 研磨装置及び研磨方法
JPH11129155A (ja) * 1997-10-30 1999-05-18 Nikon Corp Ｃｍｐ研磨装置
JP2000218514A (ja) * 1999-02-02 2000-08-08 Nikon Corp 研磨装置及び研磨方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102211297A (zh) * 2011-05-31 2011-10-12 北京航空航天大学 一种基于超声高频气动低频复合型振动磨削的方法和装置
CN102211297B (zh) * 2011-05-31 2013-12-25 北京航空航天大学 一种基于超声高频气动低频复合型振动磨削的方法和装置
KR102116510B1 (ko) * 2019-03-08 2020-05-28 에스케이실트론 주식회사 웨이퍼 랩핑 장치
WO2021208283A1 (fr) * 2020-04-15 2021-10-21 南京航空航天大学 Plate-forme de vibration ultrasonore permettant le traitement d'une grande pièce, et son procédé de fonctionnement

Also Published As

Publication number Publication date
AU2003235919A1 (en) 2003-11-11
JPWO2003095144A1 (ja) 2005-09-08

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