WO2003080293A1 - Dispositif et procede de rodage - Google Patents

Dispositif et procede de rodage Download PDF

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Publication number
WO2003080293A1
WO2003080293A1 PCT/JP2003/003637 JP0303637W WO03080293A1 WO 2003080293 A1 WO2003080293 A1 WO 2003080293A1 JP 0303637 W JP0303637 W JP 0303637W WO 03080293 A1 WO03080293 A1 WO 03080293A1
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WO
WIPO (PCT)
Prior art keywords
ultrasonic vibration
lapping machine
lapping
applying means
vibration applying
Prior art date
Application number
PCT/JP2003/003637
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English (en)
Japanese (ja)
Inventor
Kazumasa Ohnishi
Original Assignee
Kazumasa Ohnishi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kazumasa Ohnishi filed Critical Kazumasa Ohnishi
Priority to JP2003578105A priority Critical patent/JPWO2003080293A1/ja
Priority to AU2003221126A priority patent/AU2003221126A1/en
Publication of WO2003080293A1 publication Critical patent/WO2003080293A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency

Definitions

  • the present invention relates to a lap apparatus and a lap processing method used for high-precision polishing.
  • a lapping device is a device for polishing a surface of an object to be polished, such as a substrate used for forming an integrated circuit, with high precision.
  • FIG. 1 is a front view showing a configuration example of a conventional lapping device
  • FIG. 2 is a plan view of the lapping device of FIG.
  • the lapping apparatus shown in FIGS. 1 and 2 includes a lapping machine 13 supported by a rotating shaft 12 of a motor 11, a slurry supply device 15 for supplying an abrasive slurry 14 to the surface of the lapping machine 13,
  • the polishing object 16 comprises a polishing object holder 17 for rotatably holding the polishing object 16 in contact with the surface of the lapping machine 13 via a grain slurry.
  • a support member 18 for supporting the lapping machine 13 is fixed to a surface of the lapping machine 13 opposite to the surface to be polished 16.
  • the lapping machine 13 is connected to the rotating shaft 12 of the motor 11 via a support 18. Due to the rotation of the rotating shaft 12 of the motor 11, the lapping machine 13 rotates in a direction along the surface thereof.
  • the arrow 19 in FIG. 2 indicates the direction in which the lapping machine 13 rotates.
  • the object 16 to be polished is held (temporarily fixed) on a disk-shaped object holder 17 for polishing using wax or the like.
  • the disc-shaped polishing object holder 17 is It is supported by a pair of rollers 20.
  • Each roller 20 is rotatably supported by a roller support member 23 provided on the upper end of a support 22 erected on a base 21.
  • the polishing object holder 17 for holding the polishing object 16 rotates while being supported by the pair of rollers 20 as the lapping machine 13 rotates.
  • a slurry 14 containing abrasive grains is dropped from a slurry supply means 15.
  • the abrasive slurry 14 is moved toward the polishing object 16 with the rotation of the lapping machine 13 and is supplied between the lapping machine and the polishing object.
  • the slurry supply means 15 is fixed above a support post 24 erected on the base 21.
  • the lapping machine 13 has a function of temporarily holding the abrasive grains contained in the abrasive slurry 14 between the lapping machine 13 and the object 16 to be polished.
  • the lapping machine 13 is made of a metal material (eg, tin) that is softer than the abrasive grains.
  • a lapping machine made of tin has its surface slightly dented by the pressing of the abrasive grains, and temporarily holds the abrasive grains.
  • the surface of the lapping machine is formed from a foamed resin or a nonwoven fabric in order to temporarily hold the abrasive grains.
  • the type of the abrasive slurry is appropriately selected depending on the type of the object to be polished.
  • abrasive grains contained in the abrasive slurry alumina particles, silica particles, iron oxide particles, chromium oxide particles, or diamond particles are used.
  • a solvent for the abrasive slurry water, oil, or the like is used. It is also known that an acidic or alkaline solvent is used as a solvent for the abrasive slurry to chemically erode the surface of the object to be polished to assist polishing by the abrasive. Such polishing is called chemical-mechanical polishing (CMP).
  • CMP chemical-mechanical polishing
  • the lapping device shown in Fig. 1 is characterized by high polishing accuracy (the surface roughness of the object to be polished is small after polishing) and low polishing speed.
  • FIG. 3 is a front view showing another configuration example of the conventional wrap device.
  • the configuration of the lapping device shown in Fig. 3 consists of a motor 1 1b that rotates the polishing target 16 in a direction along the surface of the lapping machine 13, a force S, and a polishing target holder 1 that holds the polishing target 1. It is the same as the wrapping device in Fig. 1 except that it is attached to 7.
  • Grinding object holder 17 is a motor 1
  • the rotation axis of 1b is fixed to 1b.
  • the motor 11 b is fixed to a support 33 erected on the base 21 via an elastic body such as a spring 34.
  • the motor 1 1b is also arranged inside the panel 34, and is supported by a pole via a bar-shaped connecting member that expands and contracts in the vertical direction.
  • a spring 34 attached to the polishing object holder 17 via the motor 11b is used as a pressing tool for pressing the polishing object 16 against the surface of the lapping machine 13.
  • the lapping device shown in FIG. 3 is characterized in that the polishing object 16 is rotated by the motor 11b, so that the polishing speed is high, but the polishing accuracy is low.
  • the polishing accuracy of a conventional lapping device differs depending on the configuration of the device and the type of abrasive slurry solvent, but is mainly determined by the size of the abrasive particles contained in the slurry. This is similar to the fact that when the object to be polished is polished with a sandpaper, the polishing accuracy is determined by the roughness of the sandpaper. That is, in order to increase the polishing accuracy, it is necessary to use abrasive grains having a smaller size. Generally, the smaller the size of the abrasive grains, the more expensive they are, and the higher the polishing accuracy, the higher the processing cost.
  • the conventional lapping device requires a continuous or intermittent replenishment of the slurry during polishing in order to prevent the drying of the solvent of the slurry, and has a problem that a large amount of slurry is used. ing.
  • a processing method for drilling or cutting a workpiece using ultrasonic waves is known.
  • a tool that ultrasonically vibrates in a direction perpendicular to the surface of the processing object is pressed against the surface of the processing object via a solution containing abrasive grains.
  • the energy of the ultrasonic vibration of the tool is applied to the abrasive grains, and the abrasive grains repeatedly collide with the surface of the workpiece and form a powder frame on the surface of the workpiece.
  • processing The object is drilled or cut as the surface continues to be crushed by the abrasive impact.
  • a processing method for punching, cutting, or polishing an object to be processed by pressing a tool that vibrates ultrasonically through a solution containing abrasive grains on the surface of the object to be processed generally employs an ultrasonic polishing method. It is called a grain processing method. It is also known that the surface roughness of an object to be processed after ultrasonic processing is mainly determined by the size of the abrasive grains.
  • An object of the present invention is to provide a lapping device capable of reducing the occurrence of scratches on the surface of an object to be polished and realizing higher-precision polishing when using abrasive grains of the same size. It is in.
  • Another object of the present invention is to provide a lapping device capable of adjusting the polishing accuracy without replacing the slurry.
  • the present invention provides a lapping machine that is supported by a rotating shaft, a slurry supply device that supplies an abrasive slurry to the surface of the lapping machine, and a polishing object that is rotated while being brought into contact with the surface of the lapping machine via the abrasive slurry.
  • a lap apparatus including an object holder to be held so as to be capable of holding, wherein at least one of the lapping machine, a rotation axis of the lapping machine, and an object holder to be polished has a direction perpendicular to the surface of the lapping machine.
  • the lapping device is provided with an ultrasonic vibration applying means for applying ultrasonic vibration to the lapping device, and the ultrasonic vibration applying means is provided with a means for supplying electric energy.
  • the present invention realizes improvement in the efficiency and accuracy of polishing by a lapping device by utilizing the phenomenon of floating an object caused by ultrasonic waves.
  • Preferred embodiments of the wrapping device of the present invention are as follows. '
  • the polishing object holder is provided with a pressing tool for pressing the held polishing object against the surface of the lapping machine.
  • the above-mentioned ultrasonic vibration applying means is attached to the lapping machine or the rotating shaft of the lapping machine, and ultrasonic vibration is applied to the object to be polished to apply ultrasonic vibration oscillating in a direction parallel to the surface of the lapping machine.
  • a means is provided, and the ultrasonic vibration applying means is also provided with a means for supplying electric energy.
  • the above-mentioned ultrasonic vibration applying means is attached to the holder for the object to be polished, and the ultrasonic vibration is applied to the lapping machine or the rotation axis of the lapping machine to apply the ultrasonic vibration oscillating in a direction parallel to the surface of the lapping machine.
  • An applying means is provided, and the ultrasonic vibration applying means is also provided with a means for supplying electric energy.
  • the ultrasonic vibration applying means for applying the ultrasonic vibration that oscillates in the direction perpendicular to the surface of the lapping machine,
  • the ultrasonic vibration applying means is also provided with a means for supplying electric energy.
  • the means for supplying electric energy to the ultrasonic vibration applying means is provided with a mechanism for adjusting the voltage value or frequency value of the electric energy.
  • the present invention also provides the lapping device described in (5) above, wherein the voltage value of the electric energy or the voltage value of the electric energy applied to the ultrasonic vibration applying means in accordance with the progress of the polishing of the polishing target polished on the lapping surface.
  • a lapping method characterized by adjusting the frequency value.
  • the present invention also provides a lower lapping machine rotatably supported by a rotating shaft, a slurry supply device for supplying abrasive slurry to the surface of the lower lapping machine, and a lower lapping machine rotatably supported by a rotating shaft.
  • Double-sided lapping machine including an upper lapping machine that holds the surface so that it can be turned around while being in contact with the surface of the lapping machine through the abrasive slurry (however, the surface of the upper lapping machine contacts the workpiece via the abrasive slurry) At least one of the lower lapping machine, the rotation axis of the lower lapping machine, the upper lapping machine, and the rotation axis of the upper lapping machine vibrate in a direction perpendicular to the surfaces of both lapping machines.
  • a lap device which is provided with an ultrasonic vibration applying means for applying ultrasonic vibration, and wherein the ultrasonic vibration applying means is provided with a means for supplying electric energy.
  • this wrapping device is referred to as a double-sided wrapping device.
  • Preferred embodiments of the double-sided wrapping device of the present invention are as follows. (1) The above-mentioned ultrasonic vibration applying means is attached to the lower lapping machine or the rotation axis of the lower lapping machine, and the upper lapping machine or the super-vibrating machine which oscillates in the direction parallel to the surfaces of both lapping machines on the rotation axis of the upper lapping machine. Ultrasonic vibration applying means for applying ultrasonic vibration is provided, and the ultrasonic vibration applying means is also provided with means for supplying electric energy.
  • the above-mentioned ultrasonic vibration applying means is attached to the rotation axis of the upper lapping machine or the upper lapping machine, and the ultrasonic vibration is applied to the rotation axis of the lower lapping machine or the lower lapping machine in a direction parallel to the surfaces of both lapping machines.
  • Ultrasonic vibration applying means for applying ultrasonic vibration is provided, and the ultrasonic vibration applying means is also provided with means for supplying electric energy.
  • the means for supplying electric energy to the ultrasonic vibration applying means is provided with a mechanism for adjusting the voltage value or frequency value of the electric energy.
  • the present invention also provides a voltage value or a voltage value of electric energy applied to an ultrasonic vibration applying means in accordance with the progress of polishing of a polishing object polished on a lapping machine surface, using the lapping device described in (4).
  • a lapping method characterized by adjusting a frequency value.
  • FIG. 1 is a front view showing a configuration example of a conventional wrap device.
  • FIG. 2 is a plan view of the wrapping device of FIG.
  • FIG. 3 is a front view showing another configuration example of the conventional wrap device.
  • FIG. 4 is a front view showing a configuration example of the wrap device according to the present invention.
  • FIG. 5 is a cross-sectional view illustrating polishing of the lapping device of FIG.
  • FIG. 6 is a front view showing another example of the configuration of the wrapping device according to the present invention.
  • FIG. 7 is a front view showing still another configuration example of the wrap device according to the present invention.
  • FIG. 8 is a front view showing still another configuration example of the wrap device according to the present invention.
  • FIG. 9 shows another configuration example of the ultrasonic vibration applying means used in the lapping device of the present invention.
  • FIG. 10 is a view for explaining the configuration of the piezoelectric ceramics 92 c and 92 d of the ultrasonic vibration applying means in FIG. 9 and the vibration direction thereof.
  • FIG. 11 is a diagram for explaining the configuration of the piezoelectric ceramics 92 a and 92 b of the ultrasonic vibration applying means in FIG. 9 and the vibration direction thereof.
  • FIG. 12 is a view for explaining another configuration example of the piezoelectric ceramics 92a and 92b shown in FIG.
  • FIG. 13 is a view for explaining still another configuration example of the piezoelectric ceramics 92a and 92b shown in FIG.
  • FIG. 14 is a partial cross-sectional view showing still another configuration example of the wrapping device according to the present invention.
  • FIG. 4 is a front view showing a configuration example of the wrap device according to the present invention.
  • the lapping machine shown in Fig. 4 wraps a lapping machine 13 supported by a rotating shaft 12, a slurry supply device 15 that supplies abrasive slurry 14 to the surface of the lapping machine 13, and a polishing object 16. It comprises a polishing object holder 17 and the like, which are rotatably held while being brought into contact with the surface of the board 13 via an abrasive slurry.
  • the lapping machine 13 is provided with ultrasonic vibration applying means 4 1 a and 4 1 b for applying ultrasonic vibration oscillating in a direction perpendicular to the surface of the lapping machine via the support 18 of the lapping machine 13. Is attached.
  • Each ultrasonic vibration applying means is fixed to the support 18 using bolts or the like.
  • Each ultrasonic vibration applying means is preferably fixed to the support via an acoustic matching material layer such as grease in order to efficiently apply the ultrasonic vibration generated thereby to the support 18.
  • the ultrasonic vibration applying means 41a and 41b are provided with an AC power supply 47 as a means for supplying electric energy to each of them.
  • Each ultrasonic vibration applying means and the AC power supply 47 are electrically connected via a slip ring 46 provided on the rotating shaft 12 of the motor 11.
  • the configuration of the lapping device of FIG. 4 is the same as that of the lapping device of FIG. 1 except that ultrasonic vibration applying means 41 a and 41 b and an AC power supply 47 are provided.
  • As the ultrasonic vibration applying means 41a, the piezoelectric ceramics 42a and 42b and the electrode plates 43a to 43c, the upper metal member 44a and the lower metal member 44b A Langevin-type vibrator is used, which is constructed by port-tightening the vibrator in a state sandwiched between them.
  • Each of the piezoelectric ceramics 42a and 42b is formed of, for example, a lead zirconate titanate-based ceramic material.
  • Each of the electrode plates 43a to 43c is formed of, for example, phosphor bronze.
  • Each of the upper metal member 44a and the lower metal member 44 is made of, for example, aluminum.
  • Each of the piezoelectric ceramics 42a and 42b is polarized in its thickness direction. Therefore, each of the piezoelectric ceramics and the electrode plates provided on both sides thereof constitute a piezoelectric vibrator in a longitudinal vibration mode. Electrode plate 43a and electrode plate 43c are electrically connected by electric wiring 45a. When an AC voltage is applied to the electrode plate 43 b and the electrode plate 43 c by the AC power source 47 via the slip ring 46 and the electric wiring 45 b, the piezoelectric ceramics 42 a and Each of 2b generates an ultrasonic vibration that vibrates in a direction perpendicular to the plane, that is, in a direction perpendicular to the surface of the lapping machine.
  • the ultrasonic vibration applying means 41 a applies ultrasonic vibration vibrating in a direction perpendicular to the lapping machine 13 to the lapping machine via the support 18.
  • the configuration of the ultrasonic vibration applying means 41b is the same as that of the ultrasonic vibration applying means 41b.
  • the ultrasonic vibration applying means may be attached to at least one of the lapping machine 13, the lapping machine rotating shaft 12, and the object holder 17 for polishing.
  • Examples of the ultrasonic vibration applying means include an electrostrictive vibrator and a magnetostrictive vibrator.
  • Examples of the electrostrictive vibrator include a piezoelectric vibrator in which electrodes are provided on each surface of a piezoelectric ceramic, and the above-mentioned Langevin type vibrator.
  • Examples of the magnetostrictive vibrator include a metal magnetostrictive vibrator and a ferrite vibrator.
  • the object to be polished 16 is held (temporarily fixed) on the object to be polished holder 17 using wax or the like.
  • the holder 17 for holding the object to be polished holding the object 16 to be polished is placed on the surface of the lapping machine 13 so that the side surface thereof is supported by the two rollers 20.
  • the motor 11 is driven, and the lapping machine fixed to the rotating shaft 12 of the motor 11 Rotate 1 3 With the rotation of the lapping machine 13, the polishing object holder 17 supported by the rollers 20 rotates.
  • the slurry supply means 15 drops the gunshot slurry 14 on the surface of the lapping machine.
  • the abrasive slurry 14 is supplied between the polishing object 16 and the lapping machine 13.
  • the AC power supply 47 applies an AC voltage to each of the ultrasonic vibration applying means 41a and 41b.
  • each of the ultrasonic vibration applying means 41 a and 41 b generates ultrasonic vibration vibrating in a direction perpendicular to the surface of the lapping machine 13. This ultrasonic vibration propagates through the support 18 and is applied to the lapping machine 13.
  • FIG. 5 is a cross-sectional view illustrating polishing by the lapping device of FIG.
  • the abrasive grains 51 are shown in a size larger than the actual size. The description of the solvent for the abrasive slurry is omitted.
  • FIG. 5A shows a state in which the surface of the object 16 is polished by the abrasive grains 51 when no ultrasonic vibration is applied to the lapping machine 13.
  • the lapping machine 13 and the polished object 16 held by the polished object holder 17 are rotated in a state where a part of the reticule 51 is pushed into each surface. Therefore, the surface of the polishing target 16 is polished by the abrasive grains 51 '. Since no ultrasonic vibration is applied to the lapping machine, the accuracy of the surface of the object to be polished after polishing is the same as that obtained by polishing with a conventional lapping device.
  • FIG. 5B shows a state in which the surface of the polishing target 16 is polished by the abrasive grains 51 when ultrasonic vibration is applied to the lapping machine 13.
  • the lapping machine 13 vibrates in a direction perpendicular to its surface because of the ultrasonic vibration.
  • the sound pressure of the ultrasonic waves emitted from the surface of the lapping machine 13 causes the gap between the lapping machine 13 and the object 16 to be polished to be extremely small. It is presumed.
  • FIG. 5 (c) shows that when the lapping machine 13 receives an ultrasonic vibration larger than the ultrasonic vibration applied in FIG. 5 (b), the polishing object The surface is polished. Since a larger ultrasonic vibration is applied to the lapping machine 13, the distance between the lapping machine 13 and the polishing target 16 is further increased, and the polishing target 16 and the abrasive grains 51 are formed. Is smaller than that in Fig. 5 (b). Therefore, the object 16 can be polished with higher accuracy.
  • the lapping device of the present invention can use abrasive grains having a size larger than that of a conventional lapping device when polishing the surface of the object to be polished with a predetermined accuracy. As mentioned earlier, abrasives become more expensive as their size decreases. Therefore, the use of the lapping device of the present invention can reduce the processing cost required for polishing.
  • the contact area between the object to be polished and the grains that is, the friction between each other.
  • the friction between the object to be polished and the abrasive grains is reduced, the generation of scratches on the surface of the object to be polished when the solvent of the abrasive slurry is dried during polishing is reduced. Therefore, it is possible to reduce the amount of the slurry that has been replenished in order to prevent the solvent of the abrasive slurry from drying as in the related art.
  • the amount of slurry replenishment can be reduced, the processing cost required for polishing can be significantly reduced.
  • the lapping device is provided for polishing a lapping machine (or a holder for polishing object or the like) without applying ultrasonic vibration to the lapping machine.
  • a lapping machine or a holder for polishing object or the like
  • AC power supply provided in the ultrasonic vibration applying means of the lapping device according to the present invention (Electrician The energy supply means) preferably includes a mechanism for adjusting the voltage value or the frequency value of the AC voltage supplied to the ultrasonic vibration applying means.
  • the magnitude of the ultrasonic vibration generated by the ultrasonic vibration applying means can be adjusted.
  • the ultrasonic vibration applying means generates the largest ultrasonic vibration when the frequency value of the supplied AC voltage matches the resonance frequency value of the ultrasonic vibration applying means, and the frequency value is the resonance frequency value. When the value is higher or lower, an ultrasonic vibration smaller than the above is generated.
  • the voltage of the AC voltage (electric energy) to be applied to the ultrasonic vibration applying means in accordance with the progress of the polishing of the object to be polished on the lapping machine surface using the lapping device provided with such an AC power supply. It is preferable to polish the object to be polished while adjusting the value or the frequency. That is, in the roughing stage, the object to be polished is polished without applying ultrasonic vibration to the lapping machine, and as the polishing progresses, gradually larger ultrasonic vibration is applied to make the object to be polished more precise. By polishing with, the object to be polished can be polished efficiently.
  • the progress of the polishing can be detected, for example, from the magnitude of the friction between the polishing pad during polishing and the object to be polished.
  • FIG. 6 is a front view showing another configuration example of the wrap device according to the present invention.
  • the ultrasonic vibration applying means 61 may be attached to a polishing object holder 17 that holds the polishing object 16.
  • the configuration of the ultrasonic vibration applying means 61 is the same as that of the ultrasonic vibration applying means 41a of the lapping apparatus shown in FIG.
  • the ultrasonic vibration applying means 61 is provided with an AC power supply 47 as a means for supplying electric energy thereto.
  • the AC power supply 47 applies an AC voltage to the ultrasonic vibration applying means 61 via the slip ring 46.
  • the configuration of the lapping device of FIG. 6 is the same as that of the lapping device of FIG. 1 except that an ultrasonic vibration applying means 61 and an AC power supply 47 are provided.
  • the object 17 to be polished which is smaller in size than the lapping machine 13 is subjected to ultrasonic vibration, and the surface of the object 16 to be polished held by the holder 17 is superposed. Oscillate with sound waves. For this reason, the ultrasonic vibration applying means is reduced in size or The electric energy to be supplied thereto can be reduced.
  • FIG. 7 is a front view showing still another configuration example of the wrap device according to the present invention.
  • the lapping machine 13 has ultrasonic vibration applying means 71a and 71b
  • the workpiece holder 17 has ultrasonic vibration applying means 71c and 71d. It is attached.
  • the configuration of the ultrasonic vibration applying means 71a and 71b is the same as that of the ultrasonic vibration applying means 41a of the wrapping apparatus shown in FIG.
  • a piezoelectric vibrator is used as each of the ultrasonic vibration applying means 71c and 71d.
  • Each of the ultrasonic vibration applying means 71c and 71d is provided with an AC power source 47b as a means for supplying electric energy thereto.
  • the AC power supply 47 b applies an AC voltage to each of the ultrasonic vibration applying means 71 c and 71 d via the slip ring 46 b.
  • the polishing object holder 17 rotates together with the rotating shaft 12b of the motor by driving the motor 11b attached to the upper surface thereof.
  • the object to be polished 17 is provided with a spring 34 as a pressurizing tool for pressing the held object to be polished 16 onto the surface of the lapping machine 13 via a motor 12b. .
  • the configuration of the wrapping device of FIG. 7 is the same as the wrapping device of FIG. 3 except that ultrasonic vibration applying means 71 a to 71 d and AC power supplies 47 a and 47 b are provided. It is.
  • the lapping machine shown in FIG. 7 since the lapping machine 13 and the object 16 to be polished vibrate ultrasonically, and the object 16 to be polished is rotated by the motor 12b, high-speed and high-precision polishing is performed. Can be realized.
  • FIG. 8 is a front view showing still another configuration example of the wrap device according to the present invention.
  • ultrasonic vibration applying means 8 1 a and 8 1 for applying ultrasonic vibration oscillating in a direction perpendicular to the surface of the lapping machine 13. b is attached.
  • an ultrasonic vibration applying means 81c for applying ultrasonic vibration vibrating in a direction parallel to the surface of the lapping machine 13 is attached to the object holder 87 of the lapping device.
  • the ultrasonic vibration applying means 81c is also provided with an AC power supply 47b as a means for supplying electric energy.
  • the AC power supply 47 b applies an AC voltage to the ultrasonic vibration applying means 81 c via the slip ring 46 b.
  • each of the ultrasonic vibration applying means 81a to 81c is the same as that of the wrapping device shown in FIG. This is the same as the ultrasonic vibration applying means 41a. That is, each of the ultrasonic vibration applying means 81a to 81c is a Langevin type vibrator provided with a piezoelectric vibrator in the longitudinal vibration mode. Each of the ultrasonic vibration applying means 81a and 81b. Generates an ultrasonic vibration that vibrates in a direction perpendicular to the surface of the lapping machine 13 when an AC voltage is applied from the AC power supply 47a. This ultrasonic vibration is applied to the lapping machine 13.
  • the ultrasonic vibration applying means 81 c generates ultrasonic vibration that vibrates in a direction parallel to the surface of the lapping machine 13 when an AC voltage is applied from the AC power supply 47 b. This ultrasonic vibration is applied to the object 16 to be polished via the holder 87 for the object to be polished. The polishing object 16 to which such ultrasonic vibration is applied vibrates in a direction parallel to the surface of the lapping machine 13. When the surface of the object 16 is ultrasonically vibrated in a direction parallel to the surface of the lapping machine 13, the surface of the object 16 is polished at a higher speed.
  • the object holder 17 to be polished is provided with an ultrasonic vibration applying means for applying ultrasonic vibration vibrating in a direction perpendicular to the surface of the lapping machine 13, and the lapping machine 13 is provided with an ultrasonic vibration applying means.
  • Ultrasonic vibration applying means for applying ultrasonic vibration vibrating in a parallel direction may be additionally provided. For example, by attaching the ultrasonic vibration applying means 8 1 c of FIG. 8 to the side surface of the lapping machine 13, it is possible to apply the ultrasonic vibration oscillating in a direction parallel to the surface of the lapping machine. .
  • FIG. 9 is a diagram showing another example of the configuration of the ultrasonic vibration applying means used in the lapping device of the present invention.
  • the ultrasonic vibration applying means shown in FIG. 9 is composed of four piezoelectric ceramics 92a to 92d and five electrode plates 93a to 93e, an upper metal member 94a and a lower metal member. This is a Langevin-type vibrator with a port-tightened configuration sandwiched between 94b. Electrode plate 93a and electrode plate 93c are electrically connected by electric wiring 95a, and electrode plate 93c and electrode plate 93e are electrically connected by electric wiring 95b. It is connected.
  • An AC power supply 97a is connected to the electrode plates 93a and 93b as means for supplying electric energy to each of the piezoelectric ceramics 92a and 92b.
  • an AC power supply 97b is connected to the electrode plates 93d and 93e as means for supplying electric energy to the piezoelectric ceramics 92c and 92d, respectively.
  • FIG. 10 shows the structure of the piezoelectric ceramics 92 c and 92 d of the ultrasonic vibration applying means in FIG.
  • FIG. 3 is a diagram illustrating the configuration and the vibration direction.
  • Each of the piezoelectric ceramics 92c and 92d is polarized in its thickness direction (the direction indicated by the solid arrow in FIG. 10).
  • Each of the piezoelectric ceramics 92c and 92d and the electrode plates provided on both surfaces thereof constitute a piezoelectric vibrator in a longitudinal vibration mode.
  • Each piezoelectric ceramic vibrates in its thickness direction when an AC voltage is applied through electrode plates provided on both surfaces thereof.
  • the direction indicated by the dashed arrow in FIG. 10 indicates the vibration direction (the vibration direction of the ultrasonic vibration) of each piezoelectric ceramic. Therefore, when the top surface of the ultrasonic vibration applying means in FIG. 9 is fixed to the surface of the lapping machine opposite to the object to be polished, the piezoelectric ceramics 92c and 92d vibrate, and The ultrasonic vibration applying means generates ultrasonic vibration which vibrates in a direction perpendicular to the surface of the lapping machine, and applies the ultrasonic vibration to the lapping machine. When the surface of the lapping machine is ultrasonically vibrated in a direction perpendicular to the surface, the object to be polished is polished with higher precision.
  • FIG. 11 is a view for explaining the configuration of the piezoelectric ceramics 92 a and 92 b of the ultrasonic vibration applying means in FIG. 9 and the vibration direction thereof.
  • the piezoelectric ceramic 92a has a configuration in which four piezoelectric ceramics llla to llld are joined to each other by, for example, an epoxy resin 114.
  • Each of the piezoceramics 11a to l11d is the direction of the circumference of the disc-shaped piezoceramic 92a formed by joining them together (as indicated by the solid arrows in Fig. 11). Direction).
  • the configuration of the piezoelectric ceramic 9'2b is the same as that of the piezoelectric ceramic 92a.
  • Each of the piezoelectric ceramics 92a and 92b and the electrode plates attached to both sides thereof constitute a torsional vibration mode piezoelectric vibrator.
  • Each of the piezoelectric ceramics 92a and 92b vibrates in the circumferential direction when an AC voltage is applied through electrode plates attached to both surfaces thereof.
  • the directions indicated by the dashed arrows in FIG. 11 indicate the respective vibration directions (ultrasonic vibrations) of the piezoelectric ceramics 92a and 92b.
  • the piezoelectric ceramics 92 c and .92 d vibrate.
  • the ultrasonic vibration applying means generates ultrasonic vibration which vibrates in a direction parallel to the surface of the lapping machine, and applies the ultrasonic vibration to the lapping machine.
  • the surface of the lapping machine When the ultrasonic vibration is performed in the parallel direction, the object to be polished is polished at a higher speed.
  • the ultrasonic vibration applying means in FIG. 9 includes an ultrasonic vibration applying means for applying ultrasonic vibration vibrating in a direction perpendicular to the lapping machine, and an ultrasonic vibration applying means for applying ultrasonic vibration vibrating in a direction parallel to the lapping machine
  • the sonic vibration applying means has an integrated configuration.
  • FIG. 12 is a diagram illustrating another configuration example of the piezoelectric ceramics 92 a and 92 b of FIG.
  • the piezoelectric ceramic 122a has a configuration in which two piezoelectric ceramics 121a and 121b are joined to each other by, for example, an epoxy resin 114.
  • Each of the piezoelectric ceramics 12 21 a and 12 21 b is polarized in the thickness direction (the direction indicated by the solid arrow in FIG. 12).
  • the configuration of the piezoelectric ceramics 122 b is the same as that of the piezoelectric ceramics 122 a.
  • Each of the piezoelectric ceramics 122a and 122b and the electrode plates attached to both surfaces thereof constitute a piezoelectric vibrator in a flexural vibration mode.
  • Each of the piezoelectric ceramics 122a and 122b bends in the direction indicated by the dashed arrow shown in Fig. 12 when an AC voltage is applied through the electrodes provided on both sides thereof. Vibrate. Flexural vibration has an ultrasonic vibration component that vibrates in a direction horizontal to the surface of the piezoelectric ceramic.
  • a piezoelectric vibrator in the torsional vibration mode of the ultrasonic vibration applying means in FIG. 9 a piezoelectric vibrator in the flexural vibration mode is used, and the top surface of the ultrasonic vibration applying means is used as the polishing object of the lapping machine.
  • the piezoelectric ceramics 122 a and 122 b b vibrate, and the ultrasonic vibration applying means generates an ultrasonic vibration having a vibration component in a direction parallel to the surface of the lapping machine. Ultrasonic vibration is generated, and this ultrasonic vibration is applied to the lapping machine.
  • FIG. 13 is a view for explaining another configuration example of the piezoelectric ceramics 92 a and 92 b of FIG.
  • Each of the piezoelectric ceramics 1332a and 1332b is polarized in a direction parallel to the surface thereof (the direction indicated by the solid arrow in FIG. 13). Then, each of the piezoelectric ceramics 1332a and 1332b and the electrode plates attached to both surfaces thereof constitute a piezoelectric vibrator in a slip vibration mode.
  • Each of the piezoelectric ceramics 132a and 132b vibrates in a direction along the surface when an AC voltage is applied through electrode plates attached to both surfaces thereof.
  • Fig. 13 The directions indicated by the dashed arrows indicated in the above indicate the respective vibration directions (vibration directions of the ultrasonic vibration) of the piezoelectric ceramics 1332a and 132b.
  • the piezoelectric vibrator in the torsional vibration mode of the ultrasonic vibration applying means in FIG. 9 a piezoelectric vibrator in the sliding vibration mode is used, and the top surface of the ultrasonic vibration applying means is used as the polishing object of the lapping machine.
  • the piezoelectric ceramics 13 2a and 13 2b vibrate, and the ultrasonic vibration applying means generates ultrasonic vibrations in a direction parallel to the surface of the lapping machine. And the ultrasonic vibration is applied to the lapping machine.
  • the ultrasonic vibration applying means has a prismatic shape.
  • FIG. 14 is a partial cross-sectional view showing still another configuration example of the wrapping device according to the present invention.
  • the lapping machine shown in Fig. 14 has a lower lapping machine 14 supported by a rotating shaft 14a.
  • Lower lapping machine 1 4 3 A slurry supply device 15 that supplies abrasive slurry 14 to the surface of 3a, and a rotating shaft 1 4 2b that supports the object to be polished 16 on the lower lapping machine 1
  • the lower lapping machine 144b is provided with ultrasonic vibration applying means 141a and 141b for applying ultrasonic vibration oscillating in a direction perpendicular to the surfaces of both lapping machines.
  • Each of the ultrasonic vibration applying means 141a and 141b is provided with an AC power supply (not shown) for supplying electric energy to each of them.
  • the object 16 to be polished is held by the object holder 147 for polishing at a side end thereof.
  • the holder for polishing object 144 is rotatably supported by a rotating shaft 144c.
  • the slurry supply device 15 drops the abrasive slurry 14 into an annular abrasive slurry flow path 144 provided in the upper lapping machine 144 b.
  • the slurry dropped into the ring-shaped abrasive slurry flow path 1 45 is transferred to the abrasive slurry supply tube 1 4 6, the through hole 1 4 8 formed in the upper lapping machine, and the polishing object holder 1 4 7 It is supplied to the surface of the lower lapping machine 144a through the formed through holes (not shown).
  • Upper lapping machine 1 4 3b, lower lapping machine 1 4 3a, and polishing object 16 rotate, lower lapping
  • the abrasive slurry supplied to the surface of the board 144a is supplied between the object 16 to be polished and each of the lapping machines.
  • both surfaces of the object 16 can be polished with high precision.
  • the preferred embodiment of the lapping device of FIG. 14 is the same as that of the lapping device for polishing one side of the object to be polished.
  • the ultrasonic vibration applying means is used in accordance with the progress of the polishing of the object to be polished on the lapping plate surface. It is preferable that the object to be processed is polished while adjusting the voltage value or the frequency value of the electric energy given to the workpiece.
  • the surface of the object to be polished can be chemically and mechanically used by using an acidic solution or an alkaline solution as a solvent for the abrasive slurry. Polishing (CMP: Chemical-Mechanical Polishing)
  • the lapping device of the present invention can realize higher-precision polishing than a conventional lapping device when using a slurry containing abrasive grains of the same size.
  • a lapping machine or a holder for an object to be polished
  • the friction between the surface of the object to be polished and the abrasive grains is reduced, and the occurrence of scratches on the surface of the object to be polished is reduced.
  • the lapping device of the present invention can adjust the polishing accuracy, it is possible to roughly polish the object to be polished and then finish polishing without replacing the abrasive slurry.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

L'invention concerne un dispositif de rodage qui comprend une machine de rodage (13) soutenue de façon pivotante par un arbre de rotation (12), un dispositif d'alimentation de suspension (15) destiné à amener une suspension de grains abrasifs (14) à une surface de la machine de rodage (13), et un outil (17) destiné à tenir un objet devant être poli. L'outil (17) tient de façon rotative un objet (16) devant être poli, tout en gardant cet objet en contact avec la surface de la machine de rodage (13) à travers la suspension de grains abrasifs (14). Des moyens d'application de vibrations ultrasonores (41a, 41b) destinés à appliquer des vibrations ultrasonores perpendiculairement à la surface de la machine de rodage (13) sont installés sur au moins un élément parmi la machine de rodage (13), l'arbre de rotation (12) de la machine de rodage (13) et l'outil (17) destiné à tenir un objet devant être poli. Les moyens d'application de vibrations ultrasonores (41a, 41b) possèdent des moyens (47) destinés à fournir de l'énergie électrique. Ce dispositif de rodage permet d'effectuer le polissage avec une précision supérieure à celle de dispositifs de rodage conventionnels même lorsque la même suspension de grains abrasifs (14) est utilisée.
PCT/JP2003/003637 2002-03-25 2003-03-25 Dispositif et procede de rodage WO2003080293A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2003578105A JPWO2003080293A1 (ja) 2002-03-25 2003-03-25 ラップ装置及びラップ加工方法
AU2003221126A AU2003221126A1 (en) 2002-03-25 2003-03-25 Lapping device and lapping method

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2002-124972 2002-03-25
JP2002124972 2002-03-25
JP2002170668 2002-05-09
JP2002-170668 2002-05-09
JP2002199269 2002-06-05
JP2002-199269 2002-06-05

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WO2003080293A1 true WO2003080293A1 (fr) 2003-10-02

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2006137453A1 (ja) * 2005-06-21 2009-01-22 大西　一正 超音波振動を利用する研磨装置
CN102896577A (zh) * 2012-11-05 2013-01-30 辽东学院 盘式凸轮工作廓面对研机

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05200659A (ja) * 1992-01-24 1993-08-10 Olympus Optical Co Ltd 超音波研磨装置
JPH088216A (ja) * 1994-04-21 1996-01-12 Sony Corp 化学的機械研磨方法および化学的機械研磨装置
JPH1044000A (ja) * 1996-08-08 1998-02-17 Sony Corp ウエハ研磨装置及びウエハ研磨方法
JPH10156706A (ja) * 1996-11-27 1998-06-16 Speedfam Co Ltd 研磨装置及び研磨方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05200659A (ja) * 1992-01-24 1993-08-10 Olympus Optical Co Ltd 超音波研磨装置
JPH088216A (ja) * 1994-04-21 1996-01-12 Sony Corp 化学的機械研磨方法および化学的機械研磨装置
JPH1044000A (ja) * 1996-08-08 1998-02-17 Sony Corp ウエハ研磨装置及びウエハ研磨方法
JPH10156706A (ja) * 1996-11-27 1998-06-16 Speedfam Co Ltd 研磨装置及び研磨方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2006137453A1 (ja) * 2005-06-21 2009-01-22 大西　一正 超音波振動を利用する研磨装置
CN102896577A (zh) * 2012-11-05 2013-01-30 辽东学院 盘式凸轮工作廓面对研机

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AU2003221126A1 (en) 2003-10-08
JPWO2003080293A1 (ja) 2005-07-21

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