AU2003235919A1 - Lapping device and lapping work method - Google Patents

Lapping device and lapping work method

Info

Publication number
AU2003235919A1
AU2003235919A1 AU2003235919A AU2003235919A AU2003235919A1 AU 2003235919 A1 AU2003235919 A1 AU 2003235919A1 AU 2003235919 A AU2003235919 A AU 2003235919A AU 2003235919 A AU2003235919 A AU 2003235919A AU 2003235919 A1 AU2003235919 A1 AU 2003235919A1
Authority
AU
Australia
Prior art keywords
lapping
work method
lapping device
lapping work
work
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003235919A
Other languages
English (en)
Inventor
Kazumasa Ohnishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of AU2003235919A1 publication Critical patent/AU2003235919A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AU2003235919A 2002-05-09 2003-05-09 Lapping device and lapping work method Abandoned AU2003235919A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002170668 2002-05-09
JP2002-170668 2002-05-09
JP2002199269 2002-06-05
JP2002-199269 2002-06-05
PCT/JP2003/005843 WO2003095144A1 (fr) 2002-05-09 2003-05-09 Dispositif de rodage et procede de travail de rodage

Publications (1)

Publication Number Publication Date
AU2003235919A1 true AU2003235919A1 (en) 2003-11-11

Family

ID=29422480

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003235919A Abandoned AU2003235919A1 (en) 2002-05-09 2003-05-09 Lapping device and lapping work method

Country Status (3)

Country Link
JP (1) JPWO2003095144A1 (fr)
AU (1) AU2003235919A1 (fr)
WO (1) WO2003095144A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102211297B (zh) * 2011-05-31 2013-12-25 北京航空航天大学 一种基于超声高频气动低频复合型振动磨削的方法和装置
KR102116510B1 (ko) * 2019-03-08 2020-05-28 에스케이실트론 주식회사 웨이퍼 랩핑 장치
CN111482347B (zh) * 2020-04-15 2021-08-10 南京航空航天大学 一种用于大型零件加工的超声振动平台及其操作工艺

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3112542B2 (ja) * 1992-01-24 2000-11-27 オリンパス光学工業株式会社 超音波研磨装置
JP3353510B2 (ja) * 1994-04-21 2002-12-03 ソニー株式会社 化学的機械研磨方法および化学的機械研磨装置とそれを用いた半導体装置の製造方法
JPH10156706A (ja) * 1996-11-27 1998-06-16 Speedfam Co Ltd 研磨装置及び研磨方法
JPH11129155A (ja) * 1997-10-30 1999-05-18 Nikon Corp Ｃｍｐ研磨装置
JP2000218514A (ja) * 1999-02-02 2000-08-08 Nikon Corp 研磨装置及び研磨方法

Also Published As

Publication number Publication date
WO2003095144A1 (fr) 2003-11-20
JPWO2003095144A1 (ja) 2005-09-08

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase
TH Corrigenda

Free format text: IN VOL 18, NO 2, PAGE(S) 563 UNDER THE HEADING APPLICATIONS OPI - NAME INDEX UNDER THE NAME OHNISHI, K., APPLICATION NO. 2003235919, UNDER INID (43) CORRECT THE PUBLICATION DATE TO READ 24.11.2003