WO2003075023A1 - Electronic part test apparatus - Google Patents

Electronic part test apparatus Download PDF

Info

Publication number
WO2003075023A1
WO2003075023A1 PCT/JP2002/012663 JP0212663W WO03075023A1 WO 2003075023 A1 WO2003075023 A1 WO 2003075023A1 JP 0212663 W JP0212663 W JP 0212663W WO 03075023 A1 WO03075023 A1 WO 03075023A1
Authority
WO
WIPO (PCT)
Prior art keywords
alignment
tested
contact arm
side contact
movable portion
Prior art date
Application number
PCT/JP2002/012663
Other languages
English (en)
French (fr)
Inventor
Hiroshi Okuda
Toshiyuki Kiyokawa
Haruki Nakajima
Original Assignee
Advantest Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corporation filed Critical Advantest Corporation
Priority to JP2003573431A priority Critical patent/JP4008886B2/ja
Priority to US10/505,959 priority patent/US7298156B2/en
Priority to AU2002349755A priority patent/AU2002349755A1/en
Priority to KR1020047013756A priority patent/KR100687498B1/ko
Priority to DE10297660T priority patent/DE10297660T5/de
Priority to TW092124175A priority patent/TWI228599B/zh
Priority to MYPI20033363A priority patent/MY134579A/en
Publication of WO2003075023A1 publication Critical patent/WO2003075023A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
PCT/JP2002/012663 2002-03-07 2002-12-03 Electronic part test apparatus WO2003075023A1 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2003573431A JP4008886B2 (ja) 2002-03-07 2002-12-03 電子部品試験装置
US10/505,959 US7298156B2 (en) 2002-03-07 2002-12-03 Electronic part test apparatus
AU2002349755A AU2002349755A1 (en) 2002-03-07 2002-12-03 Electronic part test apparatus
KR1020047013756A KR100687498B1 (ko) 2002-03-07 2002-12-03 전자부품 시험장치
DE10297660T DE10297660T5 (de) 2002-03-07 2002-12-03 Prüfgerät für elektronische Bauelemente
TW092124175A TWI228599B (en) 2002-03-07 2003-09-02 Electronic component tester
MYPI20033363A MY134579A (en) 2002-03-07 2003-09-05 Electronic device testing apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPPCT/JP02/02141 2002-03-07
PCT/JP2002/002141 WO2003075025A1 (fr) 2002-03-07 2002-03-07 Dispositif d'essai de composants electroniques

Publications (1)

Publication Number Publication Date
WO2003075023A1 true WO2003075023A1 (en) 2003-09-12

Family

ID=27773242

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/JP2002/002141 WO2003075025A1 (fr) 2002-03-07 2002-03-07 Dispositif d'essai de composants electroniques
PCT/JP2002/012663 WO2003075023A1 (en) 2002-03-07 2002-12-03 Electronic part test apparatus

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/002141 WO2003075025A1 (fr) 2002-03-07 2002-03-07 Dispositif d'essai de composants electroniques

Country Status (9)

Country Link
US (1) US7298156B2 (ja)
JP (1) JP4008886B2 (ja)
KR (1) KR100687498B1 (ja)
CN (1) CN100376901C (ja)
AU (2) AU2002237553A1 (ja)
DE (1) DE10297660T5 (ja)
MY (1) MY134579A (ja)
TW (1) TWI228599B (ja)
WO (2) WO2003075025A1 (ja)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008190907A (ja) * 2007-02-01 2008-08-21 Fujitsu Ltd 温度試験装置およびその温度調整方法
WO2008102581A1 (ja) * 2007-02-23 2008-08-28 Advantest Corporation 電子部品押圧装置および電子部品試験装置
JP2011226806A (ja) * 2010-04-15 2011-11-10 Advantest Corp 電子部品ハンドリング装置、電子部品試験装置及び電子部品試験方法
US8232815B2 (en) 2007-10-05 2012-07-31 Multitest Elektronische Systeme Gmbh Plunger for holding and moving electronic components in particular ICS
US8294759B2 (en) 2006-06-19 2012-10-23 Advantest Corporation Calibration method of electronic device test apparatus
KR101365848B1 (ko) * 2011-07-26 2014-02-25 세이코 엡슨 가부시키가이샤 전자 부품 반송 장치 및 전자 부품 반송 방법
US8816709B2 (en) 2010-05-14 2014-08-26 Seiko Epson Corporation Electronic component testing device and electronic component transport method
US9778283B2 (en) 2012-10-24 2017-10-03 Advantest Corporation Electronic component handling apparatus, electronic component testing apparatus, and electronic component testing method
TWI657728B (zh) * 2017-02-13 2019-04-21 日商芝浦機械電子裝置股份有限公司 電子元件的安裝裝置及顯示用構件的製造方法
US10324127B2 (en) 2017-06-08 2019-06-18 Advantest Corporation Electronic component handling apparatus, electronic component testing apparatus, and electronic component testing method
KR20190129695A (ko) 2018-05-11 2019-11-20 주식회사 아도반테스토 시험용 캐리어 및 캐리어 조립장치

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CN1954202A (zh) * 2004-06-08 2007-04-25 株式会社爱德万测试 图像传感器用试验装置
US8029186B2 (en) * 2004-11-05 2011-10-04 International Business Machines Corporation Method for thermal characterization under non-uniform heat load
WO2006059360A1 (ja) * 2004-11-30 2006-06-08 Advantest Corporation 電子部品ハンドリング装置
EP1752778A3 (en) * 2005-08-09 2008-10-29 Mirae Corporation IC Sorter
WO2007023557A1 (ja) * 2005-08-25 2007-03-01 Advantest Corporation 電子部品試験装置および電子部品試験装置における温度制御方法
KR100792728B1 (ko) * 2006-05-12 2008-01-11 미래산업 주식회사 번인 테스트용 소팅 핸들러의 트레이 반송장치
US7583100B2 (en) * 2006-11-30 2009-09-01 Sts Instruments, Inc. Test head for testing electrical components
KR100934029B1 (ko) * 2007-06-18 2009-12-28 (주)테크윙 테스트핸들러의 로딩방법
ITUD20070239A1 (it) * 2007-12-18 2009-06-19 Baccini S P A Dispositivo di collaudo per collaudare piastre per circuiti elettronici e relativo procedimento
JP5088167B2 (ja) * 2008-02-22 2012-12-05 東京エレクトロン株式会社 プローブ装置、プロービング方法及び記憶媒体
US7924033B2 (en) * 2008-03-21 2011-04-12 Electro Scientific Industries, Inc. Compensation tool for calibrating an electronic component testing machine to a standardized value
DE102008020558B4 (de) * 2008-04-24 2010-07-01 Multitest Elektronische Systeme Gmbh Plunger mit Rückzentrierung
TWI416652B (zh) * 2010-08-20 2013-11-21 Chroma Ate Inc With a single through the shuttle shuttle of the semiconductor components test machine
US9571211B2 (en) * 2010-11-05 2017-02-14 Atc Logistics & Electronics, Inc. Wireless enclosure for testing electronic devices
JP2013053991A (ja) 2011-09-06 2013-03-21 Seiko Epson Corp ハンドラー及び部品検査装置
JP2013057572A (ja) * 2011-09-07 2013-03-28 Seiko Epson Corp ハンドラー及び部品検査装置
US20130162809A1 (en) * 2011-12-27 2013-06-27 Ya-Chen Hsu Light-homogenizing imaging device for a bead sorting machine
JP2013145132A (ja) * 2012-01-13 2013-07-25 Advantest Corp ハンドラ装置、試験方法
JP2013145140A (ja) * 2012-01-13 2013-07-25 Advantest Corp ハンドラ装置および試験装置
TWI456213B (zh) * 2013-01-18 2014-10-11 Hon Tech Inc 電子元件作業單元、作業方法及其應用之作業設備
FI124900B (fi) * 2013-04-19 2015-03-13 Pkc Electronics Oy Testausadapteri
CN104670892B (zh) * 2013-11-29 2017-02-08 鸿富锦精密工业（深圳）有限公司 取放料装置
KR101748239B1 (ko) * 2014-03-25 2017-06-16 가부시키가이샤 어드밴티스트 액추에이터, 핸들러 장치 및 시험 장치
JP6185872B2 (ja) 2014-03-28 2017-08-23 積水化成品工業株式会社 高密度ポリエチレン系樹脂粒子、複合樹脂粒子、発泡粒子及び発泡成形体
MY183884A (en) * 2014-10-02 2021-03-17 Visdynamics Res Sdn Bhd Electronic component test apparatus
JP2016188781A (ja) * 2015-03-30 2016-11-04 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
CN107176450A (zh) * 2016-03-09 2017-09-19 精工爱普生株式会社 电子部件运送装置、以及电子部件检查装置
US10297043B2 (en) * 2017-04-07 2019-05-21 Advantest Corporation Detector for detecting position of IC device and method for the same
TWI679428B (zh) * 2019-02-01 2019-12-11 迅得機械股份有限公司 訊號接通裝置及訊號接通方法
TWI720766B (zh) * 2019-12-27 2021-03-01 致茂電子股份有限公司 具備受力平衡組件之支撐載台及具備該支撐載台之電子元件測試設備
TWI777740B (zh) * 2021-08-23 2022-09-11 鴻勁精密股份有限公司 校正裝置、校正方法及其應用之作業機

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Publication number Priority date Publication date Assignee Title
JPH0228545A (ja) * 1988-07-18 1990-01-30 Tokyo Electron Ltd プローブ装置
JPH05275518A (ja) * 1992-03-30 1993-10-22 Advantest Corp Ｉｃ試験装置のｉｃ測定部位置認識装置
JPH06249915A (ja) * 1993-02-26 1994-09-09 Ando Electric Co Ltd Ｑｆｐ型ｉｃのｉｃソケットへの接触・位置決め装置
US5523678A (en) * 1994-02-28 1996-06-04 Ando Electric Co., Ltd. Contact mechanism for transportation comprising suction unit equipped with floating mechanism

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Publication number Priority date Publication date Assignee Title
JPH0228545A (ja) * 1988-07-18 1990-01-30 Tokyo Electron Ltd プローブ装置
JPH05275518A (ja) * 1992-03-30 1993-10-22 Advantest Corp Ｉｃ試験装置のｉｃ測定部位置認識装置
JPH06249915A (ja) * 1993-02-26 1994-09-09 Ando Electric Co Ltd Ｑｆｐ型ｉｃのｉｃソケットへの接触・位置決め装置
US5523678A (en) * 1994-02-28 1996-06-04 Ando Electric Co., Ltd. Contact mechanism for transportation comprising suction unit equipped with floating mechanism

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8294759B2 (en) 2006-06-19 2012-10-23 Advantest Corporation Calibration method of electronic device test apparatus
JP2008190907A (ja) * 2007-02-01 2008-08-21 Fujitsu Ltd 温度試験装置およびその温度調整方法
WO2008102581A1 (ja) * 2007-02-23 2008-08-28 Advantest Corporation 電子部品押圧装置および電子部品試験装置
US8164355B2 (en) 2007-02-23 2012-04-24 Advantest Corporation Electronic component pressing device and electronic component test apparatus
KR101153734B1 (ko) 2007-02-23 2012-06-08 가부시키가이샤 어드밴티스트 전자부품 압압 장치 및 전자부품 시험장치
JP5328638B2 (ja) * 2007-02-23 2013-10-30 株式会社アドバンテスト 電子部品押圧装置および電子部品試験装置
US8232815B2 (en) 2007-10-05 2012-07-31 Multitest Elektronische Systeme Gmbh Plunger for holding and moving electronic components in particular ICS
US8941729B2 (en) 2010-04-15 2015-01-27 Advantest Corporation Electronic component handling apparatus, electronic component testing apparatus, and electronic component testing method
JP2011226806A (ja) * 2010-04-15 2011-11-10 Advantest Corp 電子部品ハンドリング装置、電子部品試験装置及び電子部品試験方法
US8816709B2 (en) 2010-05-14 2014-08-26 Seiko Epson Corporation Electronic component testing device and electronic component transport method
KR101365848B1 (ko) * 2011-07-26 2014-02-25 세이코 엡슨 가부시키가이샤 전자 부품 반송 장치 및 전자 부품 반송 방법
US9778283B2 (en) 2012-10-24 2017-10-03 Advantest Corporation Electronic component handling apparatus, electronic component testing apparatus, and electronic component testing method
TWI657728B (zh) * 2017-02-13 2019-04-21 日商芝浦機械電子裝置股份有限公司 電子元件的安裝裝置及顯示用構件的製造方法
US10324127B2 (en) 2017-06-08 2019-06-18 Advantest Corporation Electronic component handling apparatus, electronic component testing apparatus, and electronic component testing method
KR20190129695A (ko) 2018-05-11 2019-11-20 주식회사 아도반테스토 시험용 캐리어 및 캐리어 조립장치
US11531043B2 (en) 2018-05-11 2022-12-20 Advantest Corporation Test carrier and carrier assembling apparatus

Also Published As

Publication number Publication date
MY134579A (en) 2007-12-31
AU2002237553A1 (en) 2003-09-16
JP4008886B2 (ja) 2007-11-14
WO2003075025A1 (fr) 2003-09-12
CN1623096A (zh) 2005-06-01
CN100376901C (zh) 2008-03-26
US7298156B2 (en) 2007-11-20
KR20040086850A (ko) 2004-10-12
TWI228599B (en) 2005-03-01
DE10297660T5 (de) 2005-04-07
AU2002349755A1 (en) 2003-09-16
TW200409929A (en) 2004-06-16
KR100687498B1 (ko) 2007-02-27
US20050151551A1 (en) 2005-07-14
JPWO2003075023A1 (ja) 2005-06-30

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