MY183884A - Electronic component test apparatus - Google Patents

Electronic component test apparatus

Info

Publication number
MY183884A
MY183884A MYPI2014002833A MYPI2014002833A MY183884A MY 183884 A MY183884 A MY 183884A MY PI2014002833 A MYPI2014002833 A MY PI2014002833A MY PI2014002833 A MYPI2014002833 A MY PI2014002833A MY 183884 A MY183884 A MY 183884A
Authority
MY
Malaysia
Prior art keywords
module
electronic components
test module
lower section
electronic component
Prior art date
Application number
MYPI2014002833A
Inventor
Pit Fong Jong
Original Assignee
Visdynamics Res Sdn Bhd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Visdynamics Res Sdn Bhd filed Critical Visdynamics Res Sdn Bhd
Priority to MYPI2014002833A priority Critical patent/MY183884A/en
Priority to PCT/MY2015/050113 priority patent/WO2016053082A1/en
Priority to PH12017500590A priority patent/PH12017500590A1/en
Publication of MY183884A publication Critical patent/MY183884A/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2893Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

An apparatus (2) for testing electronic components comprising a test module; an orientation module (I 0) for delivering electronic components to the test module, at least one input module for feeding electronic components to the orientation module; at least one output module for receiving electronic components that are approved by the test module; and a reject module (16) for receiving electronic components that are rejected by the test module; characterised in that one or more of the modules comprises an upper section (22; 86) connected to a lower section (24; 88) via interengagement means (30; 36), the upper section being held to the lower section via a force provided by biasing means (34), the upper section being selectively detachable from the lower section by overcoming the force provided by the biasing means.
MYPI2014002833A 2014-10-02 2014-10-02 Electronic component test apparatus MY183884A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
MYPI2014002833A MY183884A (en) 2014-10-02 2014-10-02 Electronic component test apparatus
PCT/MY2015/050113 WO2016053082A1 (en) 2014-10-02 2015-09-30 Electronic component test apparatus
PH12017500590A PH12017500590A1 (en) 2014-10-02 2017-03-30 Electronic component test apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI2014002833A MY183884A (en) 2014-10-02 2014-10-02 Electronic component test apparatus

Publications (1)

Publication Number Publication Date
MY183884A true MY183884A (en) 2021-03-17

Family

ID=55631021

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014002833A MY183884A (en) 2014-10-02 2014-10-02 Electronic component test apparatus

Country Status (3)

Country Link
MY (1) MY183884A (en)
PH (1) PH12017500590A1 (en)
WO (1) WO2016053082A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI614196B (en) * 2017-02-13 2018-02-11 華邦電子股份有限公司 Turret handler and testing method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0775817B2 (en) * 1989-02-27 1995-08-16 富士機械製造株式会社 Electronic component holding position detector
US6825680B1 (en) * 2000-06-20 2004-11-30 Nortel Networks Limited Automated semiconductor probing device
WO2003075025A1 (en) * 2002-03-07 2003-09-12 Advantest Corporation Electronic component testing apparatus
US8278951B2 (en) * 2006-11-17 2012-10-02 Cascade Microtech, Inc. Probe station for testing semiconductor substrates and comprising EMI shielding
US8749249B2 (en) * 2008-10-17 2014-06-10 Asm Assembly Automation Ltd Test handler for electronic devices

Also Published As

Publication number Publication date
WO2016053082A1 (en) 2016-04-07
PH12017500590A1 (en) 2017-08-30

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