WO2003058813A1 - Dispositif de traitement des ondes acoustiques de surface, composant electronique utilisant ce dispositif et module composite - Google Patents

Dispositif de traitement des ondes acoustiques de surface, composant electronique utilisant ce dispositif et module composite Download PDF

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Publication number
WO2003058813A1
WO2003058813A1 PCT/JP2002/013544 JP0213544W WO03058813A1 WO 2003058813 A1 WO2003058813 A1 WO 2003058813A1 JP 0213544 W JP0213544 W JP 0213544W WO 03058813 A1 WO03058813 A1 WO 03058813A1
Authority
WO
WIPO (PCT)
Prior art keywords
acoustic wave
surface acoustic
electronic component
composite module
wave device
Prior art date
Application number
PCT/JP2002/013544
Other languages
English (en)
French (fr)
Inventor
Mitsuhiro Furukawa
Kiyoharu Yamashita
Hiroshi Kurotake
Hiroyoshi Sekiguchi
Original Assignee
Matsushita Electric Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co., Ltd. filed Critical Matsushita Electric Industrial Co., Ltd.
Priority to AU2002361093A priority Critical patent/AU2002361093A1/en
Priority to JP2003559017A priority patent/JP3966280B2/ja
Priority to KR1020037010502A priority patent/KR100623034B1/ko
Priority to US10/469,482 priority patent/US6937114B2/en
Priority to EP02791994A priority patent/EP1460759A4/en
Publication of WO2003058813A1 publication Critical patent/WO2003058813A1/ja

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/25Constructional features of resonators using surface acoustic waves
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/125Driving means, e.g. electrodes, coils
    • H03H9/145Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14538Formation
    • H03H9/14541Multilayer finger or busbar electrode
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02535Details of surface acoustic wave devices
    • H03H9/02637Details concerning reflective or coupling arrays
    • H03H9/02653Grooves or arrays buried in the substrate
    • H03H9/02661Grooves or arrays buried in the substrate being located inside the interdigital transducers
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46Filters
    • H03H9/64Filters using surface acoustic waves
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
PCT/JP2002/013544 2001-12-28 2002-12-25 Dispositif de traitement des ondes acoustiques de surface, composant electronique utilisant ce dispositif et module composite WO2003058813A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
AU2002361093A AU2002361093A1 (en) 2001-12-28 2002-12-25 Surface acoustic wave device, electronic component using the device, and composite module
JP2003559017A JP3966280B2 (ja) 2001-12-28 2002-12-25 弾性表面波装置
KR1020037010502A KR100623034B1 (ko) 2001-12-28 2002-12-25 탄성 표면파 장치 및 이것을 이용한 전자 부품 및 복합모듈
US10/469,482 US6937114B2 (en) 2001-12-28 2002-12-25 Surface acoustic wave device, electronic component using the device, and composite module
EP02791994A EP1460759A4 (en) 2001-12-28 2002-12-25 SURFACE ACOUSTIC WAVE PROCESSING DEVICE, ELECTRONIC COMPONENT USING THE SAME, AND COMPOSITE MODULE

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2001-400139 2001-12-28
JP2001400139 2001-12-28
JP2002-136672 2002-05-13
JP2002136672 2002-05-13

Publications (1)

Publication Number Publication Date
WO2003058813A1 true WO2003058813A1 (fr) 2003-07-17

Family

ID=26625382

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/013544 WO2003058813A1 (fr) 2001-12-28 2002-12-25 Dispositif de traitement des ondes acoustiques de surface, composant electronique utilisant ce dispositif et module composite

Country Status (7)

Country Link
US (1) US6937114B2 (ja)
EP (2) EP1460759A4 (ja)
JP (1) JP3966280B2 (ja)
KR (1) KR100623034B1 (ja)
CN (1) CN1290258C (ja)
AU (1) AU2002361093A1 (ja)
WO (1) WO2003058813A1 (ja)

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WO2007034832A1 (ja) * 2005-09-20 2007-03-29 Kyocera Corporation 弾性表面波素子及び弾性表面波装置
JP2007267117A (ja) * 2006-03-29 2007-10-11 Murata Mfg Co Ltd 弾性表面波装置及びその製造方法
JP2008079275A (ja) * 2007-02-27 2008-04-03 Kyocera Corp 弾性表面波素子及び弾性表面波装置
JP2011211460A (ja) * 2010-03-30 2011-10-20 Sae Magnetics (Hk) Ltd 弾性表面波装置
WO2011145449A1 (ja) * 2010-05-19 2011-11-24 株式会社村田製作所 弾性表面波装置
US8222972B2 (en) 2007-10-30 2012-07-17 Taiyo Yuden Co., Ltd. Acoustic wave element, duplexer, communication module, and communication apparatus
WO2015170528A1 (ja) * 2014-05-07 2015-11-12 株式会社村田製作所 弾性表面波装置
US9496846B2 (en) 2013-02-15 2016-11-15 Skyworks Filter Solutions Japan Co., Ltd. Acoustic wave device and electronic apparatus including same
WO2017013945A1 (ja) * 2015-07-17 2017-01-26 株式会社村田製作所 弾性波装置及びその製造方法
JPWO2016080444A1 (ja) * 2014-11-18 2017-08-17 京セラ株式会社 弾性波素子、フィルタ素子および通信装置
WO2020241820A1 (ja) * 2019-05-30 2020-12-03 株式会社村田製作所 配線電極
US11533040B2 (en) 2017-12-25 2022-12-20 Murata Manufacturing Co., Ltd. Elastic wave device
US11985903B2 (en) 2019-05-30 2024-05-14 Murata Manufacturing Co., Ltd. Wiring electrode

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DE10162580A1 (de) * 2001-12-19 2003-07-17 Infineon Technologies Ag Piezoelektrischer Schwingkreis, Verfahren zu dessen Herstellung und Filteranordnung
US7737612B1 (en) 2005-05-25 2010-06-15 Maxim Integrated Products, Inc. BAW resonator bi-layer top electrode with zero etch undercut
DE102005045372B4 (de) * 2005-09-22 2021-08-19 Snaptrack, Inc. Bauelement mit mindestens einem mit akustischen Wellen arbeitenden Filter
US8143681B2 (en) * 2006-04-20 2012-03-27 The George Washington University Saw devices, processes for making them, and methods of use
US20100007444A1 (en) * 2006-04-20 2010-01-14 Anis Nurashikin Nordin GHz Surface Acoustic Resonators in RF-CMOS
US7600303B1 (en) 2006-05-25 2009-10-13 Maxim Integrated Products, Inc. BAW resonator bi-layer top electrode with zero etch undercut
US20080161692A1 (en) * 2006-12-29 2008-07-03 Podmore Jonathan L Devices and methods for ablation
US7612488B1 (en) * 2007-01-16 2009-11-03 Maxim Integrated Products, Inc. Method to control BAW resonator top electrode edge during patterning
US20090124513A1 (en) * 2007-04-20 2009-05-14 Patricia Berg Multiplex Biosensor
US8018010B2 (en) * 2007-04-20 2011-09-13 The George Washington University Circular surface acoustic wave (SAW) devices, processes for making them, and methods of use
CN101765971B (zh) * 2007-07-30 2013-05-29 株式会社村田制作所 弹性波装置及其制造方法
US8249331B2 (en) 2008-04-09 2012-08-21 Applied Materials Israel, Ltd. Method and system for evaluating an object
JP5591240B2 (ja) * 2009-07-30 2014-09-17 日本碍子株式会社 複合基板及びその製造方法
WO2011018913A1 (ja) * 2009-08-10 2011-02-17 株式会社村田製作所 弾性境界波装置
US8960004B2 (en) 2010-09-29 2015-02-24 The George Washington University Synchronous one-pole surface acoustic wave resonator
US9503049B2 (en) * 2010-12-28 2016-11-22 Kyocera Corporation Acoustic wave element and acoustic wave device using same
JPWO2012102131A1 (ja) * 2011-01-27 2014-06-30 京セラ株式会社 弾性波素子およびそれを用いた弾性波装置
KR101320138B1 (ko) * 2011-11-30 2013-10-23 삼성전기주식회사 지문 인식 센서 및 그 제조 방법
US10147745B2 (en) 2015-04-01 2018-12-04 Shanghai Tianma Micro-electronics Co., Ltd. Array substrate, display panel and display device
CN104730782B (zh) * 2015-04-01 2018-03-27 上海天马微电子有限公司 一种阵列基板、显示面板和显示装置
US9973169B2 (en) * 2015-10-01 2018-05-15 Qorvo Us, Inc. Surface acoustic wave filter with a cap layer for improved reliability
KR102095213B1 (ko) * 2016-06-07 2020-03-31 가부시키가이샤 무라타 세이사쿠쇼 탄성파 장치
US10615772B2 (en) 2017-06-30 2020-04-07 Texas Instruments Incorporated Acoustic wave resonators having Fresnel surfaces
US10686425B2 (en) 2017-06-30 2020-06-16 Texas Instruments Incorporated Bulk acoustic wave resonators having convex surfaces, and methods of forming the same
US10622966B2 (en) 2017-07-26 2020-04-14 Texas Instruments Incorporated Bulk acoustic wave resonators having a phononic crystal acoustic mirror
US10855251B2 (en) 2017-08-08 2020-12-01 Texas Instruments Incorporated Unreleased plane acoustic wave resonators
JP2021141214A (ja) * 2020-03-05 2021-09-16 モレックス エルエルシー 成形回路基板とその製造方法
WO2021222409A1 (en) * 2020-04-29 2021-11-04 Resonant Inc. Transversely-excited film bulk acoustic resonator with controlled conductor sidewall angles

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JPH09148373A (ja) * 1995-11-21 1997-06-06 Murata Mfg Co Ltd 無線通信モジュール
JPH1174751A (ja) * 1997-08-28 1999-03-16 Murata Mfg Co Ltd 弾性表面波装置
JP2001085968A (ja) * 1999-09-16 2001-03-30 Murata Mfg Co Ltd 弾性表面波素子およびその製造方法
JP2001094383A (ja) * 1999-09-20 2001-04-06 Toshiba Corp 弾性表面波装置およびその製造方法
JP2001168671A (ja) * 1999-12-07 2001-06-22 Matsushita Electric Ind Co Ltd 弾性表面波デバイスとその製造方法
JP2002217672A (ja) * 2001-01-12 2002-08-02 Murata Mfg Co Ltd 弾性表面波装置およびそれを用いた通信機装置

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JPH1174751A (ja) * 1997-08-28 1999-03-16 Murata Mfg Co Ltd 弾性表面波装置
JP2001085968A (ja) * 1999-09-16 2001-03-30 Murata Mfg Co Ltd 弾性表面波素子およびその製造方法
JP2001094383A (ja) * 1999-09-20 2001-04-06 Toshiba Corp 弾性表面波装置およびその製造方法
JP2001168671A (ja) * 1999-12-07 2001-06-22 Matsushita Electric Ind Co Ltd 弾性表面波デバイスとその製造方法
JP2002217672A (ja) * 2001-01-12 2002-08-02 Murata Mfg Co Ltd 弾性表面波装置およびそれを用いた通信機装置

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Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007282294A (ja) * 2005-09-20 2007-10-25 Kyocera Corp 弾性表面波素子及び弾性表面波装置
US7893597B2 (en) 2005-09-20 2011-02-22 Kyocera Corporation Surface acoustic wave element and surface acoustic wave device
WO2007034832A1 (ja) * 2005-09-20 2007-03-29 Kyocera Corporation 弾性表面波素子及び弾性表面波装置
JP2012034418A (ja) * 2005-09-20 2012-02-16 Kyocera Corp 弾性表面波素子及び弾性表面波装置
JP2007267117A (ja) * 2006-03-29 2007-10-11 Murata Mfg Co Ltd 弾性表面波装置及びその製造方法
JP2008079275A (ja) * 2007-02-27 2008-04-03 Kyocera Corp 弾性表面波素子及び弾性表面波装置
US8222972B2 (en) 2007-10-30 2012-07-17 Taiyo Yuden Co., Ltd. Acoustic wave element, duplexer, communication module, and communication apparatus
US8829762B2 (en) 2010-03-30 2014-09-09 Sae Magnetics (H.K.) Ltd. Surface acoustic wave device
JP2011211460A (ja) * 2010-03-30 2011-10-20 Sae Magnetics (Hk) Ltd 弾性表面波装置
US9368712B2 (en) 2010-05-19 2016-06-14 Murata Manufacturing Co., Ltd. Surface acoustic wave device
WO2011145449A1 (ja) * 2010-05-19 2011-11-24 株式会社村田製作所 弾性表面波装置
JPWO2011145449A1 (ja) * 2010-05-19 2013-07-22 株式会社村田製作所 弾性表面波装置
US9496846B2 (en) 2013-02-15 2016-11-15 Skyworks Filter Solutions Japan Co., Ltd. Acoustic wave device and electronic apparatus including same
US11863156B2 (en) 2013-02-15 2024-01-02 Skyworks Filter Solutions Japan Co., Ltd. Acoustic wave device including multi-layer interdigital transducer electrodes
US10439585B2 (en) 2013-02-15 2019-10-08 Skyworks Filter Solutions Japan Co., Ltd. Acoustic wave device including multiple dielectric films
US10644671B2 (en) 2014-05-07 2020-05-05 Murata Manufacturing Co., Ltd. Surface acoustic wave device
WO2015170528A1 (ja) * 2014-05-07 2015-11-12 株式会社村田製作所 弾性表面波装置
JPWO2015170528A1 (ja) * 2014-05-07 2017-04-20 株式会社村田製作所 弾性表面波装置
JPWO2016080444A1 (ja) * 2014-11-18 2017-08-17 京セラ株式会社 弾性波素子、フィルタ素子および通信装置
WO2017013945A1 (ja) * 2015-07-17 2017-01-26 株式会社村田製作所 弾性波装置及びその製造方法
US10924082B2 (en) 2015-07-17 2021-02-16 Murata Manufacturing Co., Ltd. Acoustic wave device and manufacturing method for same
JPWO2017013945A1 (ja) * 2015-07-17 2018-02-08 株式会社村田製作所 弾性波装置及びその製造方法
US11533040B2 (en) 2017-12-25 2022-12-20 Murata Manufacturing Co., Ltd. Elastic wave device
WO2020241820A1 (ja) * 2019-05-30 2020-12-03 株式会社村田製作所 配線電極
JPWO2020241820A1 (ja) * 2019-05-30 2020-12-03
JP7268730B2 (ja) 2019-05-30 2023-05-08 株式会社村田製作所 配線電極
US11985903B2 (en) 2019-05-30 2024-05-14 Murata Manufacturing Co., Ltd. Wiring electrode

Also Published As

Publication number Publication date
US6937114B2 (en) 2005-08-30
EP1460759A4 (en) 2009-09-02
US20040070313A1 (en) 2004-04-15
AU2002361093A1 (en) 2003-07-24
JPWO2003058813A1 (ja) 2005-05-19
KR100623034B1 (ko) 2006-09-18
EP1460759A1 (en) 2004-09-22
KR20030074813A (ko) 2003-09-19
EP2161836B1 (en) 2012-09-26
CN1491481A (zh) 2004-04-21
CN1290258C (zh) 2006-12-13
JP3966280B2 (ja) 2007-08-29
EP2161836A1 (en) 2010-03-10

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