WO2008081935A1 - 弾性表面波装置およびその製造方法 - Google Patents

弾性表面波装置およびその製造方法 Download PDF

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Publication number
WO2008081935A1
WO2008081935A1 PCT/JP2007/075289 JP2007075289W WO2008081935A1 WO 2008081935 A1 WO2008081935 A1 WO 2008081935A1 JP 2007075289 W JP2007075289 W JP 2007075289W WO 2008081935 A1 WO2008081935 A1 WO 2008081935A1
Authority
WO
WIPO (PCT)
Prior art keywords
acoustic wave
surface acoustic
protective cover
wave device
manufacturing
Prior art date
Application number
PCT/JP2007/075289
Other languages
English (en)
French (fr)
Inventor
Toru Fukano
Atsuomi Fukuura
Original Assignee
Kyocera Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corporation filed Critical Kyocera Corporation
Priority to CN2007800484332A priority Critical patent/CN101573868B/zh
Priority to JP2008552186A priority patent/JPWO2008081935A1/ja
Priority to US12/521,554 priority patent/US8008837B2/en
Publication of WO2008081935A1 publication Critical patent/WO2008081935A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/058—Holders; Supports for surface acoustic wave devices
    • H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Abstract

　信頼性に優れた弾性表面波装置およびその製造方法を提供する。弾性表面波を伝搬させる圧電基板（１）と、圧電基板（１）の第１主面の上に形成されるＩＤＴ（２）と、光硬化性材料からなり、ＩＤＴ（２）の形成領域を覆うことによって第１主面とともに中空の収容空間（７）を形成する保護カバーであって、保護カバーの下端の領域に酸発生材を含む酸発生部を有する保護カバー（６）を備える。さらに前記第１主面の上に形成され、ＩＤＴ（２）に接続されるとともに保護カバー（６）の外側に端部を有するように保護カバー（６）の内側から外側にかけて引き出される接続線（３）と、絶縁材料からなり、少なくとも保護カバー（６）の酸発生部と接続線（３）との間に介在するようにして形成される接合膜（８）とを備えた構成とする。
PCT/JP2007/075289 2006-12-28 2007-12-28 弾性表面波装置およびその製造方法 WO2008081935A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2007800484332A CN101573868B (zh) 2006-12-28 2007-12-28 弹性表面波装置及其制造方法
JP2008552186A JPWO2008081935A1 (ja) 2006-12-28 2007-12-28 弾性表面波装置およびその製造方法
US12/521,554 US8008837B2 (en) 2006-12-28 2007-12-28 Surface acoustic wave device and method of manufacturing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006354039 2006-12-28
JP2006-354039 2006-12-28

Publications (1)

Publication Number Publication Date
WO2008081935A1 true WO2008081935A1 (ja) 2008-07-10

Family

ID=39588615

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/075289 WO2008081935A1 (ja) 2006-12-28 2007-12-28 弾性表面波装置およびその製造方法

Country Status (4)

Country Link
US (1) US8008837B2 (ja)
JP (1) JPWO2008081935A1 (ja)
CN (1) CN101573868B (ja)
WO (1) WO2008081935A1 (ja)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009096563A1 (ja) * 2008-01-30 2009-08-06 Kyocera Corporation 弾性波装置およびその製造方法
JP2010081006A (ja) * 2008-09-24 2010-04-08 Panasonic Corp 弾性表面波デバイス
JP2010213016A (ja) * 2009-03-10 2010-09-24 Murata Mfg Co Ltd 弾性表面波素子の製造方法及び弾性表面波素子
US7854050B2 (en) 2007-10-12 2010-12-21 Taiyo Yuden Co., Ltd. Method of manufacturing a surface acoustic wave device
JP2011023930A (ja) * 2009-07-15 2011-02-03 Panasonic Corp 弾性波素子とこれを用いた電子機器
WO2012050016A1 (ja) * 2010-10-15 2012-04-19 株式会社村田製作所 弾性表面波装置
KR101625450B1 (ko) 2014-11-05 2016-05-30 (주)와이솔 표면탄성파 소자 및 그 제조방법
JP2017017730A (ja) * 2016-08-25 2017-01-19 京セラ株式会社 弾性波装置および回路基板
KR20170111913A (ko) * 2016-03-30 2017-10-12 삼성전기주식회사 음향파 디바이스 및 그 제조방법

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JP2012160979A (ja) * 2011-02-01 2012-08-23 Taiyo Yuden Co Ltd 弾性波デバイス及びその製造方法
DE102011016554B4 (de) * 2011-04-08 2018-11-22 Snaptrack, Inc. Waferlevel-Package und Verfahren zur Herstellung
WO2013026056A1 (en) * 2011-08-18 2013-02-21 Northeastern University Electrostatically tunable magnetoelectric inductors with large inductance tunability
WO2014010197A1 (ja) * 2012-07-11 2014-01-16 パナソニック株式会社 電子部品
TWI515957B (zh) * 2013-03-21 2016-01-01 宏達國際電子股份有限公司 電子裝置
JP6242597B2 (ja) * 2013-06-03 2017-12-06 太陽誘電株式会社 弾性波デバイス及びその製造方法
WO2015046402A1 (ja) * 2013-09-26 2015-04-02 京セラ株式会社 弾性波装置および弾性波モジュール
US9793877B2 (en) * 2013-12-17 2017-10-17 Avago Technologies General Ip (Singapore) Pte. Ltd. Encapsulated bulk acoustic wave (BAW) resonator device
US10447411B2 (en) * 2015-08-25 2019-10-15 Samsung Electro-Mechanics Co., Ltd. Acoustic wave device and method of manufacturing the same
CN108292914B (zh) * 2015-12-11 2021-11-02 株式会社村田制作所 弹性波装置
KR102550176B1 (ko) * 2017-11-09 2023-07-03 삼성전기주식회사 음향파 디바이스 및 그 제조방법
CN108899414A (zh) * 2018-05-24 2018-11-27 厦门市三安集成电路有限公司 一种表面波滤波器器件结构及其制作方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000261284A (ja) * 1999-03-05 2000-09-22 Kyocera Corp 弾性表面波装置及びその製造方法
JP2002261582A (ja) * 2000-10-04 2002-09-13 Matsushita Electric Ind Co Ltd 弾性表面波デバイスおよびその製造方法ならびにそれを用いた回路モジュール
JP2005341162A (ja) * 2004-05-26 2005-12-08 Kyocera Corp デバイス装置およびその製造方法
JP2006321984A (ja) * 2005-04-19 2006-11-30 Nitto Denko Corp 感光性エポキシ樹脂接着剤組成物とその利用

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JPH10270975A (ja) 1996-03-08 1998-10-09 Matsushita Electric Ind Co Ltd 電子部品とその製造方法
JP3329175B2 (ja) 1996-03-11 2002-09-30 松下電器産業株式会社 弾性表面波デバイス及びその製造方法
JP3783299B2 (ja) 1996-10-08 2006-06-07 松下電器産業株式会社 弾性表面波デバイスの製造方法
JP2001181498A (ja) 1999-12-24 2001-07-03 Kansai Paint Co Ltd カチオン重合性組成物
US6710682B2 (en) * 2000-10-04 2004-03-23 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave device, method for producing the same, and circuit module using the same
JP2004153412A (ja) 2002-10-29 2004-05-27 Murata Mfg Co Ltd 弾性表面波装置及びその製造方法
JP2004235908A (ja) 2003-01-30 2004-08-19 Kyocera Corp 弾性表面波装置及びそれを用いた通信機
JP4419732B2 (ja) * 2003-09-02 2010-02-24 株式会社村田製作所 弾性表面波装置およびその製造方法
WO2006059564A1 (ja) 2004-11-30 2006-06-08 Daicel Chemical Industries, Ltd. 脂環式エポキシ（メタ）アクリレート及びその製造方法、並びに共重合体
US20060234159A1 (en) * 2005-04-19 2006-10-19 Nitto Denko Corporation Photosensitive epoxy resin adhesive composition and use thereof
CN101682310B (zh) * 2007-06-28 2012-11-28 京瓷株式会社 弹性表面波装置及其制造方法
JP4689704B2 (ja) * 2008-07-23 2011-05-25 日本電波工業株式会社 圧電部品及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000261284A (ja) * 1999-03-05 2000-09-22 Kyocera Corp 弾性表面波装置及びその製造方法
JP2002261582A (ja) * 2000-10-04 2002-09-13 Matsushita Electric Ind Co Ltd 弾性表面波デバイスおよびその製造方法ならびにそれを用いた回路モジュール
JP2005341162A (ja) * 2004-05-26 2005-12-08 Kyocera Corp デバイス装置およびその製造方法
JP2006321984A (ja) * 2005-04-19 2006-11-30 Nitto Denko Corp 感光性エポキシ樹脂接着剤組成物とその利用

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7854050B2 (en) 2007-10-12 2010-12-21 Taiyo Yuden Co., Ltd. Method of manufacturing a surface acoustic wave device
US8384272B2 (en) 2008-01-30 2013-02-26 Kyocera Corporation Acoustic wave device and method for production of same
WO2009096563A1 (ja) * 2008-01-30 2009-08-06 Kyocera Corporation 弾性波装置およびその製造方法
JP2010081006A (ja) * 2008-09-24 2010-04-08 Panasonic Corp 弾性表面波デバイス
JP2010213016A (ja) * 2009-03-10 2010-09-24 Murata Mfg Co Ltd 弾性表面波素子の製造方法及び弾性表面波素子
JP2011023930A (ja) * 2009-07-15 2011-02-03 Panasonic Corp 弾性波素子とこれを用いた電子機器
WO2012050016A1 (ja) * 2010-10-15 2012-04-19 株式会社村田製作所 弾性表面波装置
KR101625450B1 (ko) 2014-11-05 2016-05-30 (주)와이솔 표면탄성파 소자 및 그 제조방법
US9831849B2 (en) 2014-11-05 2017-11-28 Wisol Co., Ltd. Surface acoustic wave element and method of manufacturing the same
KR20170111913A (ko) * 2016-03-30 2017-10-12 삼성전기주식회사 음향파 디바이스 및 그 제조방법
CN107276558A (zh) * 2016-03-30 2017-10-20 三星电机株式会社 声波装置和制造该声波装置的方法
CN107276558B (zh) * 2016-03-30 2023-10-27 三星电机株式会社 声波装置和制造该声波装置的方法
KR102653201B1 (ko) * 2016-03-30 2024-04-01 삼성전기주식회사 음향파 디바이스 및 그 제조방법
JP2017017730A (ja) * 2016-08-25 2017-01-19 京セラ株式会社 弾性波装置および回路基板

Also Published As

Publication number Publication date
JPWO2008081935A1 (ja) 2010-04-30
CN101573868B (zh) 2012-05-30
US20100277037A1 (en) 2010-11-04
US8008837B2 (en) 2011-08-30
CN101573868A (zh) 2009-11-04

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