WO2003037576A1 - Appareil et procede de transfert de substrat - Google Patents

Appareil et procede de transfert de substrat Download PDF

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Publication number
WO2003037576A1
WO2003037576A1 PCT/JP2001/009604 JP0109604W WO03037576A1 WO 2003037576 A1 WO2003037576 A1 WO 2003037576A1 JP 0109604 W JP0109604 W JP 0109604W WO 03037576 A1 WO03037576 A1 WO 03037576A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
support
electronic component
suction
substrate transfer
Prior art date
Application number
PCT/JP2001/009604
Other languages
English (en)
Japanese (ja)
Inventor
Shinichi Ogimoto
Original Assignee
Shibaura Mechatronics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2000196542A priority Critical patent/JP4041267B2/ja
Application filed by Shibaura Mechatronics Corporation filed Critical Shibaura Mechatronics Corporation
Priority to PCT/JP2001/009604 priority patent/WO2003037576A1/fr
Priority to KR1020037016808A priority patent/KR100676384B1/ko
Priority to CNB018237657A priority patent/CN1298515C/zh
Priority to US10/480,924 priority patent/US7367601B2/en
Publication of WO2003037576A1 publication Critical patent/WO2003037576A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Definitions

  • the present invention relates to a component mounting apparatus for manufacturing a flat panel display represented by a liquid crystal panel and the like, and more particularly to a substrate transport apparatus and a substrate transport method for transferring a glass substrate or the like between processes.
  • a component mounting device for manufacturing flat panel displays such as liquid crystal panels, electronic components (flexible printed circuit (FPC), chip on film), TCP (tape)
  • FPC flexible printed circuit
  • TCP tape
  • a component mounting apparatus for mounting a carrier package on a glass substrate.
  • FIG. 6 is a diagram showing an example of a glass substrate on which electronic components are mounted by such a component mounting apparatus.
  • a glass substrate 21 is formed by laminating two types of substrates 21 a and 21 b having different sizes, and the front and rear surfaces on the outer periphery (the lower surface of the upper substrate 21 a and the lower substrate).
  • a plurality of electronic components 22 are mounted on the upper surface of 21b).
  • the glass substrate 21 on which the electronic component 22 is mounted in this way is transferred between processes by a substrate transfer device 30 as shown in FIGS. 7A and 7B.
  • the substrate transfer device 30 sucks the upper surface of the glass substrate 21 provided on the lower surface of the arm body 31 and the arm body 31 movable vertically and horizontally.
  • the electronic component 22 may collide with the glass substrate 21 due to the vibration applied during the transportation, and may damage the glass substrate 21 (FIG. 7B). Therefore, when a large glass substrate used in a flat panel display or the like is transported, as shown in FIG. In general, a method of transporting the entire tray 33 by a transport arm or a transport stage is used.
  • the present invention has been made in view of such a point, and it is possible to reliably and inexpensively transport a board on which electronic components are mounted by preventing the electronic components from dropping and damaging the board. It is an object to provide a substrate transfer device and a substrate transfer method.
  • the present invention provides a board transfer device for transferring a board on which electronic components are mounted, an arm body, a first support mechanism attached to the arm body, and supporting a board to be transferred from above. And a second support mechanism attached to the arm body and supporting the electronic component mounted on the substrate from above.
  • the first support mechanism is arranged corresponding to the substrate. It is preferable to have a plurality of first support members. Further, it is preferable that the mounting position of the first support member is adjustable on the arm body. Further, it is preferable that an impact buffer mechanism is provided between the first support member and the arm main body to absorb an impact applied to the substrate when the arm comes into contact with the substrate. Note that, as the first support member, an adsorption member that adsorbs and holds the upper surface of the substrate can be used.
  • the second support mechanism includes a plurality of second support members arranged corresponding to the electronic components. Further, it is preferable that the mounting position of the second support member be adjustable on the arm body. Further, it is preferable that an impact buffer mechanism is provided between the second support member and the arm body to absorb an impact applied to the electronic component at the time of contact with the electronic component.
  • the second support member extends from the upper side of the electronic component and adsorbs and holds the upper surface of the electronic component. The second support member extends from the upper side of the electronic component and fixes the lower surface of the electronic component.
  • a support arm that supports and supports can be used.
  • an operation state control unit that selectively controls an operation state of each of the second support members.
  • the operating state control means has a drive mechanism for raising and lowering each of the second support members, and moving each of the second support members from a support position for supporting each of the electronic components, or from each of the above electronic components.
  • the operating state of each of the second support members can be selectively controlled by moving the second support member to any of the retracted retracted positions.
  • the operating state control unit further includes a control device that controls the driving mechanism according to the type of the substrate to be transferred.
  • the operating state control unit may control the suction state to switch the suction state of each of the suction members.
  • An operating state of each of the second support members can be selectively controlled by having a state switching mechanism and switching an attraction state of each of the second support members.
  • the operation state control means may further include a control device that controls the suction state switching mechanism according to the type of the substrate to be transported. preferable.
  • the present invention also relates to a board transfer method for transferring a board on which electronic components are mounted from a first position to a second position, wherein the arm main body is positioned from the upper side toward the transfer target board positioned at the first position. And a first support mechanism attached to the arm main body and supporting the substrate from above, supporting the substrate and mounted on the substrate attached to the arm main body. A step of supporting the electronic component by a second support mechanism that supports the electronic component from above, and moving the arm body in the vertical and horizontal directions to mount the board on which the electronic component is mounted. A step of positioning the electronic component at the second position and releasing the support of the substrate by the first support mechanism and releasing the support of the electronic component by the second support mechanism. Providing a substrate transfer method, characterized in that.
  • the first support mechanism for supporting the board from above and the second support mechanism for supporting the electronic components mounted on the board from above are provided on the arm body disposed above the board. Since the electronic component is provided, it is possible to prevent the electronic component from dropping from the substrate by its own weight when the substrate on which the electronic component is mounted is transported. It can be performed inexpensively and reliably without dropping or damaging the substrate.
  • the mounting position of each of the first support members and each of the second support members can be adjusted on the arm main body, so that the arm main body can be adjusted according to the size and position of the board or the electronic component.
  • the mounting position can be adjusted above, and therefore, optimal transport can be realized for each type of flat panel display to be manufactured.
  • an impact absorbing mechanism for absorbing an impact applied to each electronic component when each second support member comes into contact with the electronic component is provided. Therefore, unnecessary impact and load can be prevented from being applied to each electronic component when each second support member comes into contact with the electronic component.
  • FIG. 1A is a front view showing an embodiment of the substrate transfer device according to the present invention
  • FIG. 1B is a plan view showing a glass substrate with electronic components transferred by the substrate transfer device shown in FIG. 1A;
  • FIG. 2 is a view showing a state in which a glass substrate is transferred between processes by the substrate transfer device shown in FIG. 1A.
  • FIG. 3 is a diagram showing a modification of the substrate transfer device shown in FIG. 1A,
  • FIG. 4 is a diagram showing another modification of the substrate transfer device shown in FIG. 1A.
  • FIG. 5 is a view showing still another modification of the substrate transfer device shown in FIG. 1A.
  • Figure 6 shows a glass substrate on which electronic components are mounted
  • FIGS. 7A and 7B are diagrams showing an example of a conventional substrate transfer device.
  • FIG. 8 is a diagram showing another example of the conventional substrate transfer device. BEST MODE FOR CARRYING OUT THE INVENTION
  • the substrate transfer apparatus 10 is for transferring a glass substrate 21 on which electronic components 22 are mounted between processes.
  • the glass substrate 21 to be transported is composed of two types of substrates 2 la and 21 b of different sizes that are bonded to each other, on both front and back sides (the lower surface of the upper substrate 21 a and the lower substrate 2 la).
  • Electronic components 22 are mounted on the upper surface of the lb).
  • the substrate transfer device 10 includes an arm body 11 that is disposed above the glass substrate 21 and that can move up and down and left and right.
  • the arm body 11 has a first support mechanism for supporting the glass substrate 21 from above, and is disposed above and corresponding to the glass substrate 21 to attract and support the upper surface of the glass substrate 21.
  • a plurality of glass substrate suction pads (first support members) 12 are provided.
  • the arm body 11 also has a second support mechanism for supporting a plurality of electronic components 22 mounted on the glass substrate 21 from above, corresponding to each of the electronic components 22 and disposed above the arm.
  • an electronic component suction pad (second support member) 13 that adsorbs and supports the upper surface of the electronic component 22 is provided.
  • each glass substrate suction pad 12 for each glass substrate and the suction pad 13 for each electronic component are connected to a vacuum source (see reference numeral 18 in FIG. 4) via a suction system (see reference numerals 16a to 6d in FIG. 4). ) It is connected to the.
  • each glass substrate suction pad 12 is provided with an adjusting mechanism (not shown) for adjusting the relative position with respect to the arm body 11, and the dimensions (length and width and thickness) of the glass substrate 21 are provided.
  • the mounting position (vertical and horizontal position and height) can be adjusted on the arm body 11 according to the position and the position.
  • Each of the electronic component suction pads 13 is provided with an adjustment mechanism (not shown) for adjusting a relative position with respect to the arm main body 11, and is provided with dimensions (width and width and thickness in the vertical and horizontal directions) of the electronic component 22. ) And its mounting position (vertical and horizontal position and height) can be adjusted according to the position. Further, each of the electronic component suction pads 13 includes a spring (impact buffering mechanism) that absorbs an impact applied to the electronic component 22 when the electronic component suction pad 13 comes into contact with the electronic component 22. 15 are provided.
  • Each electronic component suction pad 13 is provided with a sensor (not shown) for detecting the support status of electronic component 22 on each electronic component suction pad 13 (presence or absence of electronic component 22). In this case, it is possible to effectively detect a manufacturing defect due to a drop of the electronic component 22 or the like.
  • glass substrate 21 on which the electronic components 22 are mounted (hereinafter simply referred to as “glass substrate 21”) is transferred from the previous process to the next process by the substrate transfer device 10. Will be explained.
  • the substrate transfer device 10 is moved to the substrate receiving position by moving the arm body 11 to the left (FIG. 2 (a)).
  • the substrate transport stage 41 in the previous process has moved to the substrate delivery position (first position) with the glass substrate 21 placed thereon.
  • the substrate transfer device 10 is raised by moving the arm body 11 upward and rightward, and then moved to the substrate transfer position (second position) in the next process (FIG. 2 (c)). .
  • the substrate transfer stage 42 in the next process is moved to the substrate receiving position. Is moving in.
  • the substrate transport device 10 is lowered by moving the arm body 11 downward, and the glass substrate 21 is placed on the substrate transport stage 42 in the next process (FIG. 2 (d)). .
  • the substrate transfer device 10 is raised by moving the arm body 11 upward (FIG. 2 (e)).
  • the arm body 11 includes the glass substrate suction pad 12 that supports the glass substrate 21 to be transferred from the upper side, and the plurality of mounting pads mounted on the glass substrate 21. And a plurality of suction pads for electronic components 13 for supporting the electronic components 22 from above, so that when the glass substrate 21 on which the electronic components 22 are mounted is transported, the electronic components 22 This prevents the glass substrate 21 on which the electronic components 22 are mounted from being transported, which may cause the electronic components 22 to drop or damage the glass substrate 21. It can be performed cheaply and reliably without any inconvenience.
  • the mounting positions of the suction pads 12 for each glass substrate and the suction pads 13 for each electronic component can be adjusted on the arm body 11, so that the glass substrate
  • the mounting position (vertical and horizontal position and height) can be adjusted on the arm body 11 according to the dimensions (vertical and horizontal width and thickness) and the position of the electronic component 22 or electronic component 22.
  • each electronic component suction pads 13 comes into contact with the electronic component 22 between the electronic component suction pad 13 and the arm body 11, each electronic component is placed. Since a spring (impact buffering mechanism) 15 is provided to absorb the shock applied to 2 2, when the suction pad 13 for each electronic component comes into contact with the electronic component 22, it is applied to each electronic component 2 2. Unnecessary impact and load can be prevented from being applied.
  • the glass substrate on which the electronic component 22 is mounted is used.
  • All the suction pads 13 for the electronic parts provided on the arm body 11 are operated when transporting 1, but it is not limited to this.Each electronic part is selected according to the type of flat panel display to be manufactured.
  • the suction state (operating state) of the component suction pad 13 is selectively controlled, and the electronic component suction pad 13 corresponding to the position where the electronic component 22 does not exist or the position where support is not required is set to the non-suction state (non- (Operating state).
  • each of a plurality of suction pads for electronic components 13 is provided with a drive mechanism 14 for raising and lowering the suction pads for electronic components, and the control device 35 controls The suction pad 13 for each electronic component is moved to either the support position for supporting the electronic component 22 or the retracted position where the electronic component 22 is evacuated, depending on the type (type) of the substrate to be formed. It is good to The driving mechanism 14 and the control device 35 constitute operating state control means.
  • a plurality of suction systems 16a to 16d are provided between the vacuum source 18 and the suction pads 13 for each electronic component, and the vacuum is controlled by the control device 36.
  • the suction state of each electronic component suction pad 13 may be switched by switching the suction system by a suction system switching mechanism 17 such as a solenoid valve.
  • a suction system switching mechanism 17 such as a solenoid valve.
  • one suction system is assigned to each side of the glass substrate 21.
  • the present invention is not limited to this, and one system may be assigned to each of the suction pads 13 for each electronic component. It is possible.
  • the selection information of each electronic component suction pad 13 is stored in the controller 36 together with the type information of the flat panel display to be manufactured, and the controller 36 controls the type of the board to be transported.
  • the suction state of the suction pad 13 for electronic components may be automatically controlled according to (type).
  • the adsorption state switching mechanism is composed of the adsorption systems 16a to 16d and the adsorption system switching mechanism 17, and is operated by the adsorption systems 16a to 16d, the adsorption system switching mechanism 17 and the controller 36.
  • State control means is configured.
  • each electronic component 22 is sucked and supported by the electronic component suction pad 13.
  • the present invention is not limited to this, and as shown in FIG.
  • the lower surface of each electronic component 22 may be supported and supported by the support arm 19.
  • the electronic component suction pad 13 is provided with a spring 1. 5 is provided, but the invention is not limited to this, and a similar mechanism may be provided on the glass substrate suction pad 12.
  • a glass substrate used in a flat panel display has been described as an example.
  • the present invention is not limited to this and can be applied to any substrate.

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Liquid Crystal (AREA)

Abstract

L'invention concerne un appareil de transfert de substrat permettant de transférer un substrat, sur lequel des parties électroniques sont montées, de manière peu coûteuse et fiable tout en empêchant le détachement d'une partie électronique quelconque et l'endommagement dudit substrat. Ledit appareil de transfert (10) de substrat est équipé d'un corps de bras (11) pouvant se déplacer verticalement et horizontalement. Une pluralité de plaquettes de succion (12) de substrat de verre ayant un effet de ventouse et supportant la face supérieure du substrat de verre (21), et une pluralité de plaquettes de succion (13) de partie électronique agencées au-dessus des parties électroniques (22) dans des positions correspondant à celles desdites parties et conçues pour avoir un effet de ventouse et supporter les surfaces supérieures des parties électroniques (22) sont fixées au corps de bras (11). Chacune des plaquettes de succion (12, 13) est connectée à une source de vide par l'intermédiaire d'une ligne de succion; et est équipée d'un mécanisme de réglage permettant de régler sa position par rapport au corps de bras (11), de sorte que sa position de montage sur le corps de bras (11) peut être réglée en fonction de la taille et de la position du substrat de verre (21) ou des parties électroniques (22). Chaque plaquette d'aspiration (13) est équipée d'un ressort (15) destiné à absorber un choc appliqué à la partie électronique (22) lorsque ladite plaquette de succion (13) entre en contact avec ladite partie électronique (22).
PCT/JP2001/009604 2000-06-29 2001-11-01 Appareil et procede de transfert de substrat WO2003037576A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2000196542A JP4041267B2 (ja) 2000-06-29 2000-06-29 基板搬送装置および基板搬送方法
PCT/JP2001/009604 WO2003037576A1 (fr) 2000-06-29 2001-11-01 Appareil et procede de transfert de substrat
KR1020037016808A KR100676384B1 (ko) 2001-11-01 2001-11-01 기판 반송장치 및 기판 반송방법
CNB018237657A CN1298515C (zh) 2001-11-01 2001-11-01 基板输送装置和基板输送方法
US10/480,924 US7367601B2 (en) 2000-06-29 2001-11-01 Substrate transfer apparatus and substrate transfer method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000196542A JP4041267B2 (ja) 2000-06-29 2000-06-29 基板搬送装置および基板搬送方法
PCT/JP2001/009604 WO2003037576A1 (fr) 2000-06-29 2001-11-01 Appareil et procede de transfert de substrat

Publications (1)

Publication Number Publication Date
WO2003037576A1 true WO2003037576A1 (fr) 2003-05-08

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2001/009604 WO2003037576A1 (fr) 2000-06-29 2001-11-01 Appareil et procede de transfert de substrat

Country Status (2)

Country Link
JP (1) JP4041267B2 (fr)
WO (1) WO2003037576A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009073503A2 (fr) * 2007-11-30 2009-06-11 Teradyne, Inc. Manipulation d'objets assistée par le vide

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Publication number Priority date Publication date Assignee Title
US7367601B2 (en) 2000-06-29 2008-05-06 Shibaura Mechatronics Corporation Substrate transfer apparatus and substrate transfer method
JP4041267B2 (ja) * 2000-06-29 2008-01-30 芝浦メカトロニクス株式会社 基板搬送装置および基板搬送方法
JP4286562B2 (ja) * 2003-03-14 2009-07-01 シャープ株式会社 基板貼り合わせ装置
JP4704203B2 (ja) * 2005-12-09 2011-06-15 大日本印刷株式会社 梱包装置および梱包方法
JP5966956B2 (ja) * 2013-02-05 2016-08-10 トヨタ自動車株式会社 ロボットハンド
JP2016103566A (ja) * 2014-11-28 2016-06-02 パナソニックＩｐマネジメント株式会社 基板保持装置および部品圧着機
CN105666464B (zh) * 2016-03-10 2018-04-13 中国电器科学研究院有限公司 一种取放料机械手
JP6201081B1 (ja) * 2016-04-14 2017-09-20 日東電工株式会社 吸着部材および液晶セル吸着回転装置
JP6201082B1 (ja) * 2016-04-14 2017-09-20 日東電工株式会社 吸着部材、液晶セル吸着移動装置、および光学フィルム貼合せライン
CN205554727U (zh) * 2016-04-14 2016-09-07 日东电工株式会社 吸附部件、液晶单元吸附移动装置、及光学膜贴合生产线
CN205555401U (zh) * 2016-04-14 2016-09-07 日东电工株式会社 吸附部件及液晶单元吸附旋转装置
CN106553904B (zh) * 2016-11-23 2018-12-18 江苏聚泰科技有限公司 一种液晶玻璃基板搬运装置
JP6987505B2 (ja) * 2017-01-27 2022-01-05 日本電産サンキョー株式会社 パネル搬送ロボットおよびパネル搬送システム
JP6815211B2 (ja) * 2017-01-27 2021-01-20 日本電産サンキョー株式会社 パネル搬送ロボット
JP2019024127A (ja) * 2018-11-13 2019-02-14 パナソニックＩｐマネジメント株式会社 基板保持装置および部品圧着機

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JPS61173823A (ja) * 1985-01-28 1986-08-05 Nitto Kogyo Kk 電子部品等の吸着移送装置
JPS6367089U (fr) * 1986-10-20 1988-05-06
JPH0297322U (fr) * 1989-01-19 1990-08-02
JPH037487U (fr) * 1989-06-13 1991-01-24
JPH04133588U (ja) * 1991-05-30 1992-12-11 西川化成株式会社 移載装置
JPH052888U (ja) * 1991-07-02 1993-01-19 近岡工業株式会社 フイルム保持搬送装置
JPH09199577A (ja) * 1996-01-16 1997-07-31 Oki Electric Ind Co Ltd 半導体パッケージの吸着装置、半導体パッケージの搭載方法及びそのための装置
JPH10109288A (ja) * 1996-10-07 1998-04-28 Nec Eng Ltd ガラス素板取扱治具
JP2000309423A (ja) * 1999-04-27 2000-11-07 Ulvac Seimaku Kk 大型ガラス基板の搬送方法及び装置
JP2002012319A (ja) * 2000-06-29 2002-01-15 Shibaura Mechatronics Corp 基板搬送装置および基板搬送方法

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Publication number Priority date Publication date Assignee Title
JPS61173823A (ja) * 1985-01-28 1986-08-05 Nitto Kogyo Kk 電子部品等の吸着移送装置
JPS6367089U (fr) * 1986-10-20 1988-05-06
JPH0297322U (fr) * 1989-01-19 1990-08-02
JPH037487U (fr) * 1989-06-13 1991-01-24
JPH04133588U (ja) * 1991-05-30 1992-12-11 西川化成株式会社 移載装置
JPH052888U (ja) * 1991-07-02 1993-01-19 近岡工業株式会社 フイルム保持搬送装置
JPH09199577A (ja) * 1996-01-16 1997-07-31 Oki Electric Ind Co Ltd 半導体パッケージの吸着装置、半導体パッケージの搭載方法及びそのための装置
JPH10109288A (ja) * 1996-10-07 1998-04-28 Nec Eng Ltd ガラス素板取扱治具
JP2000309423A (ja) * 1999-04-27 2000-11-07 Ulvac Seimaku Kk 大型ガラス基板の搬送方法及び装置
JP2002012319A (ja) * 2000-06-29 2002-01-15 Shibaura Mechatronics Corp 基板搬送装置および基板搬送方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009073503A2 (fr) * 2007-11-30 2009-06-11 Teradyne, Inc. Manipulation d'objets assistée par le vide
WO2009073503A3 (fr) * 2007-11-30 2010-04-15 Teradyne, Inc. Manipulation d'objets assistée par le vide

Also Published As

Publication number Publication date
JP2002012319A (ja) 2002-01-15
JP4041267B2 (ja) 2008-01-30

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