WO2003024711A2 - Verfahren zur herstellung eines keramischen substrats und keramisches substrat - Google Patents
Verfahren zur herstellung eines keramischen substrats und keramisches substrat Download PDFInfo
- Publication number
- WO2003024711A2 WO2003024711A2 PCT/DE2002/003412 DE0203412W WO03024711A2 WO 2003024711 A2 WO2003024711 A2 WO 2003024711A2 DE 0203412 W DE0203412 W DE 0203412W WO 03024711 A2 WO03024711 A2 WO 03024711A2
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- WO
- WIPO (PCT)
- Prior art keywords
- layer
- sintering
- stack
- sintering aid
- layers
- Prior art date
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- 239000000758 substrate Substances 0.000 title claims abstract description 56
- 239000000919 ceramic Substances 0.000 title claims abstract description 50
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 238000005245 sintering Methods 0.000 claims abstract description 155
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims description 39
- 238000006243 chemical reaction Methods 0.000 claims description 30
- 239000011521 glass Substances 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 11
- 230000035515 penetration Effects 0.000 claims description 11
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 229910052593 corundum Inorganic materials 0.000 claims description 7
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 abstract description 4
- 239000011148 porous material Substances 0.000 description 10
- 239000011230 binding agent Substances 0.000 description 7
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 4
- 229910052791 calcium Inorganic materials 0.000 description 4
- 239000011575 calcium Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 229910052661 anorthite Inorganic materials 0.000 description 2
- GWWPLLOVYSCJIO-UHFFFAOYSA-N dialuminum;calcium;disilicate Chemical compound [Al+3].[Al+3].[Ca+2].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] GWWPLLOVYSCJIO-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- INJRKJPEYSAMPD-UHFFFAOYSA-N aluminum;silicic acid;hydrate Chemical compound O.[Al].[Al].O[Si](O)(O)O INJRKJPEYSAMPD-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000010443 kyanite Substances 0.000 description 1
- 229910052850 kyanite Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229940100890 silver compound Drugs 0.000 description 1
- 150000003379 silver compounds Chemical class 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
Classifications
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- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
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- C04B35/453—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
- C04B35/457—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates based on tin oxides or stannates
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- C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
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- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/6303—Inorganic additives
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- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/001—Joining burned ceramic articles with other burned ceramic articles or other articles by heating directly with other burned ceramic articles
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/481—Insulating layers on insulating parts, with or without metallisation
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
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- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
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- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49885—Assembling or joining with coating before or during assembling
Definitions
- a compulsory layer is arranged on the uppermost layer of the layer stack before sintering, which is attached to the layer stack by penetration of the sintering aid of the uppermost layer of the layer stack into the compulsory layer during sintering. After sintering, the constraint layer is removed again. Removing the compulsory layer can be done, for example, by scraping or sputtering.
- a rigid layer in the form of a sintered Al2O3 plate or a flexible layer in the form of a green sheet, which itself does not contain any sintering aids and which consequently does not sinter during the sintering of the layer stack, can be considered as the layer.
- a flexible constraint layer is known, for example, from the publication DE 691 06 830 T2.
- a flexible constraint layer can be, for example, a green sheet that contains Al2O3 grains and a polymeric binder.
- the use of the method according to the invention for the production of ceramic substrates in particular enables the use of layer stacks which have the shape of a plate, the plate having a base area of at least 18 cm ⁇ 18 cm and a height of 0.5 to 3 mm.
- a plate can be used to produce a large-area substrate in a single production step, or a large number of small substrates by subsequently dividing the large-area substrate.
- a reaction layer which contains sintering aids from the layer with the high proportion of unchanged residues of a sintering aid can in particular be arranged between the layer with the increased proportion of unchanged residues of sintering aid.
- the reaction layer contains ceramic material and sintering aids from the adjacent layer.
- the reaction layer can have a thickness between 10 and 50 ⁇ m. The reaction layer is thus considerably thicker than the reaction layers which are produced by the known method.
- Figure 3 shows an example of a ceramic substrate during its manufacture by the method according to the invention in a schematic cross section.
- the number of layers 3 is six.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Composite Materials (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003528391A JP2005501795A (ja) | 2001-09-14 | 2002-09-13 | セラミック基板の製造方法及びセラミック基板 |
DE50213033T DE50213033D1 (de) | 2001-09-14 | 2002-09-13 | Verfahren zur herstellung eines keramischen substrats und keramisches substrat |
EP02769946A EP1425167B1 (de) | 2001-09-14 | 2002-09-13 | Verfahren zur herstellung eines keramischen substrats und keramisches substrat |
US10/487,301 US7160406B2 (en) | 2001-09-14 | 2002-09-13 | Ceramic substrate and method for the production thereof |
US11/607,363 US20070151090A1 (en) | 2001-09-14 | 2006-12-01 | Ceramic substrate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10145363A DE10145363A1 (de) | 2001-09-14 | 2001-09-14 | Verfahren zur Herstellung eines keramischen Substrats und keramisches Substrat |
DE10145363.9 | 2001-09-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003024711A2 true WO2003024711A2 (de) | 2003-03-27 |
WO2003024711A3 WO2003024711A3 (de) | 2003-06-26 |
Family
ID=7699049
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2002/003412 WO2003024711A2 (de) | 2001-09-14 | 2002-09-13 | Verfahren zur herstellung eines keramischen substrats und keramisches substrat |
Country Status (7)
Country | Link |
---|---|
US (2) | US7160406B2 (de) |
EP (1) | EP1425167B1 (de) |
JP (1) | JP2005501795A (de) |
CN (1) | CN1291834C (de) |
AT (1) | ATE414605T1 (de) |
DE (2) | DE10145363A1 (de) |
WO (1) | WO2003024711A2 (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102491738A (zh) * | 2011-11-24 | 2012-06-13 | 江苏省晶石磁性材料与器件工程技术研究有限公司 | 一种高导磁率锰锌铁氧体的生产方法 |
CN104446422A (zh) * | 2014-12-24 | 2015-03-25 | 宜宾盈泰光电有限公司 | 致密化气氛加锌锭烧结锰锌铁氧体磁芯的方法 |
WO2020120289A1 (de) * | 2018-12-10 | 2020-06-18 | Tdk Electronics Ag | Substrat und verfahren zur herstellung des substrats |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10145363A1 (de) * | 2001-09-14 | 2003-04-10 | Epcos Ag | Verfahren zur Herstellung eines keramischen Substrats und keramisches Substrat |
DE102006000935B4 (de) * | 2006-01-05 | 2016-03-10 | Epcos Ag | Monolithisches keramisches Bauelement und Verfahren zur Herstellung |
DE112009000006T5 (de) * | 2008-03-03 | 2010-01-21 | Murata Manufacturing Co. Ltd., Nagaokakyo-shi | Verfahren zum Herstellen eines Keramiksubstrats und Keramiksubstrat |
KR101214749B1 (ko) * | 2011-04-25 | 2012-12-21 | 삼성전기주식회사 | 적층형 파워 인덕터 |
CN102491759A (zh) * | 2011-11-24 | 2012-06-13 | 江苏省晶石磁性材料与器件工程技术研究有限公司 | 一种锰锌铁氧体叠烧工艺 |
JP6624282B2 (ja) * | 2016-04-28 | 2019-12-25 | 株式会社村田製作所 | 多層セラミック基板 |
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2001
- 2001-09-14 DE DE10145363A patent/DE10145363A1/de not_active Ceased
-
2002
- 2002-09-13 US US10/487,301 patent/US7160406B2/en not_active Expired - Lifetime
- 2002-09-13 CN CNB028178580A patent/CN1291834C/zh not_active Expired - Lifetime
- 2002-09-13 WO PCT/DE2002/003412 patent/WO2003024711A2/de active Application Filing
- 2002-09-13 JP JP2003528391A patent/JP2005501795A/ja active Pending
- 2002-09-13 AT AT02769946T patent/ATE414605T1/de active
- 2002-09-13 EP EP02769946A patent/EP1425167B1/de not_active Expired - Lifetime
- 2002-09-13 DE DE50213033T patent/DE50213033D1/de not_active Expired - Lifetime
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- 2006-12-01 US US11/607,363 patent/US20070151090A1/en not_active Abandoned
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102491738A (zh) * | 2011-11-24 | 2012-06-13 | 江苏省晶石磁性材料与器件工程技术研究有限公司 | 一种高导磁率锰锌铁氧体的生产方法 |
CN102491738B (zh) * | 2011-11-24 | 2014-03-12 | 江苏省晶石磁性材料与器件工程技术研究有限公司 | 一种高导磁率锰锌铁氧体的生产方法 |
CN104446422A (zh) * | 2014-12-24 | 2015-03-25 | 宜宾盈泰光电有限公司 | 致密化气氛加锌锭烧结锰锌铁氧体磁芯的方法 |
CN104446422B (zh) * | 2014-12-24 | 2016-08-24 | 宜宾盈泰光电有限公司 | 致密化气氛加锌锭烧结锰锌铁氧体磁芯的方法 |
WO2020120289A1 (de) * | 2018-12-10 | 2020-06-18 | Tdk Electronics Ag | Substrat und verfahren zur herstellung des substrats |
US11958271B2 (en) | 2018-12-10 | 2024-04-16 | Tdk Electronics Ag | Substrate and method for producing the substrate |
Also Published As
Publication number | Publication date |
---|---|
DE50213033D1 (de) | 2009-01-02 |
WO2003024711A3 (de) | 2003-06-26 |
US20070151090A1 (en) | 2007-07-05 |
EP1425167A2 (de) | 2004-06-09 |
CN1553855A (zh) | 2004-12-08 |
ATE414605T1 (de) | 2008-12-15 |
JP2005501795A (ja) | 2005-01-20 |
CN1291834C (zh) | 2006-12-27 |
DE10145363A1 (de) | 2003-04-10 |
US7160406B2 (en) | 2007-01-09 |
EP1425167B1 (de) | 2008-11-19 |
US20040206546A1 (en) | 2004-10-21 |
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