WO1999049521A1 - Verfahren zur einseitigen dotierung eines halbleiterkörpers - Google Patents
Verfahren zur einseitigen dotierung eines halbleiterkörpers Download PDFInfo
- Publication number
- WO1999049521A1 WO1999049521A1 PCT/EP1999/002038 EP9902038W WO9949521A1 WO 1999049521 A1 WO1999049521 A1 WO 1999049521A1 EP 9902038 W EP9902038 W EP 9902038W WO 9949521 A1 WO9949521 A1 WO 9949521A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- doping
- doped
- substrate
- layer
- oxide layer
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- 239000002019 doping agent Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 238000009792 diffusion process Methods 0.000 claims abstract description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 4
- 239000010703 silicon Substances 0.000 claims abstract description 4
- 235000012431 wafers Nutrition 0.000 claims abstract description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 7
- 229910052796 boron Inorganic materials 0.000 claims description 7
- 239000008186 active pharmaceutical agent Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 32
- 239000011241 protective layer Substances 0.000 description 7
- 239000004922 lacquer Substances 0.000 description 6
- 238000009826 distribution Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
- H01L21/2251—Diffusion into or out of group IV semiconductors
- H01L21/2254—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides
- H01L21/2255—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides the applied layer comprising oxides only, e.g. P2O5, PSG, H3BO3, doped oxides
- H01L21/2256—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides the applied layer comprising oxides only, e.g. P2O5, PSG, H3BO3, doped oxides through the applied layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/914—Doping
- Y10S438/923—Diffusion through a layer
Definitions
- the present invention relates to a method for one-sided doping of a semiconductor body, in particular for one-sided doping of silicon wafers.
- a targeted doping of the substrate or a semiconductor layer is necessary in order to set the desired conductivity properties.
- a highly doped layer is applied to the back of the solar cell in order to create a field that counteracts the diffusion of minority charge carriers (back surface field).
- a known method for one-sided doping is based on the fact that a protective layer (for example a protective lacquer) is first applied to the side of the semiconductor body which is not to be doped, or a thermal oxide is applied to both sides is woken up, which is then etched off on one side. The unprotected side of the semiconductor body can then be doped out of the gas phase, for example in a diffusion furnace.
- a doping lacquer can also be applied to the side to be doped, which is not covered by a protection. The dopant contained in the dopant then diffuses in a temperature step. After the diffusion process, the protective layer is removed by etching.
- One possibility to enable one-sided doping of a semiconductor body is to apply a protective layer on both sides, for example by thermally oxidizing the semiconductor body, and then detaching the protective film located on the side of the semiconductor body to be doped.
- This side can then, as described above, be doped from the gas phase in a diffusion furnace or a doping layer (e.g. doping lacquer or doping paste) can be applied to the side of the semiconductor body to be doped and diffused in by a subsequent temperature treatment.
- the protective layer is also removed by etching.
- the present invention is therefore based on the object of providing a method for one-sided doping of a semiconductor body, in particular of silicon wafers, which enables reliable homogeneous doping of the desired side while at the same time reliably protecting the side which is not to be doped.
- a central idea here is that the dopant contained in the doping layer passes through a conventional oxide layer during the diffusion process and diffuses into the side to be doped, the oxide layer on the non-doping side simultaneously serving as a protective layer and penetration of the dopant into this side prevented.
- the doping lacquer By applying the doping lacquer to a previously applied oxide layer, a better lateral distribution of the dopant is achieved and "doping through" through the oxide layer supports homogeneous doping in a positive manner.
- the method according to the invention has the advantage that in the case of an inhomogeneous dopant distribution Treatment or coating, in particular on rough surfaces (for example in the case of textured solar cells), also ensures homogeneous doping.
- 1 to 3 show the individual method steps of the one-sided doping according to the invention, using cross-sectional layers of a semiconductor structure.
- the semiconductor substrate (1) shown in FIG. 1 has a side (DS) to be doped and an opposite side (GS) not to be doped.
- an oxide layer (2, 3) is applied to both sides of the substrate (1).
- This oxide layer is preferably grown thermally.
- the substrate (1) is heated in a furnace in an oxygen atmosphere to a temperature between 950 ° C and 1050 ° C, so that an oxide layer forms on the surfaces DS and GS of the substrate.
- a doping layer (4) of high dopant concentration is then applied to the oxide layer (3), which is located on the side of the semiconductor substrate (1) to be doped, in a second method step. This is shown in Fig. 2.
- the doping layer (4) is applied, for example, as a doping lacquer by spin-on or as a doping paste by printing. However, the doping layer can also be applied with a brush or by means of a one-sided CVD deposition of a doping oxide. Before the actual diffusion process, the liquid applied doping layer is dried. By applying the doping layer (4) to the oxide layer (3), the Diffusion achieves a very good homogeneous or uniform lateral distribution of the dopant, which is necessary for uniform doping.
- the third process step, the actual diffusion process, is shown schematically in FIG. 3.
- the doping layer (4) typically contains boron as a dopant.
- the boron is driven in from the doping layer (4) in an oven at temperatures between 900 and 1200 ° C., preferably in a temperature range between 1000 and 1100 ° C.
- the dopant first diffuses from the laterally homogeneously distributed doping layer (4) through the oxide layer (3) before it penetrates into the substrate (1).
- the oxide layer (3) lying between the doping layer (4) and the substrate (1) does not act as a protective layer in the conventional sense, but as a layer that supports the diffusion process, quasi as a creeping oxide, which supports a uniform diffusion of the dopant.
- volatile boron which may gas out into the atmosphere during heating and thus also reach the area of the substrate side (GS) that is not to be doped, is absorbed by the oxide layer (2) formed on this side.
- the applied oxide layer (2) acts as a protective layer in the conventional sense and, with the low supply of dopants, provides adequate protection against unwanted doping.
- the temperature of the diffusion process can be adapted in certain areas to the concentration of the dopant in the doping layer, for example if different dopants are to be diffused in.
- An application example for this method is, for example, the generation of a so-called BSF (back surface field) on the back of solar cells by one-sided boron doping by means of a boron doping lacquer and subsequent diffusion, avoiding disadvantageous boron doping of the solar cells on the front.
- the method according to the invention is not limited to the production of such solar cells, but can also be used for the coating of other semiconductor layers.
- the method according to the invention is characterized here essentially by improved homogeneous doping with simultaneous reliable protection of the side not to be doped, which can be integrated in a simple manner into a conventional production method for solar cells.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000538392A JP2002508597A (ja) | 1998-03-25 | 1999-03-25 | 半導体本体の片面にドープする方法 |
EP99914540A EP1068646A1 (de) | 1998-03-25 | 1999-03-25 | Verfahren zur einseitigen dotierung eines halbleiterkörpers |
US09/647,046 US6448105B1 (en) | 1998-03-25 | 1999-03-25 | Method for doping one side of a semiconductor body |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19813188.7 | 1998-03-25 | ||
DE19813188A DE19813188A1 (de) | 1998-03-25 | 1998-03-25 | Verfahren zur einseitigen Dotierung eines Halbleiterkörpers |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1999049521A1 true WO1999049521A1 (de) | 1999-09-30 |
Family
ID=7862308
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP1999/002038 WO1999049521A1 (de) | 1998-03-25 | 1999-03-25 | Verfahren zur einseitigen dotierung eines halbleiterkörpers |
Country Status (5)
Country | Link |
---|---|
US (1) | US6448105B1 (de) |
EP (1) | EP1068646A1 (de) |
JP (1) | JP2002508597A (de) |
DE (1) | DE19813188A1 (de) |
WO (1) | WO1999049521A1 (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1396880A2 (de) * | 2002-09-06 | 2004-03-10 | National Institute of Advanced Industrial Science and Technology | Dotierungsverfahren und nach diesem Verfahren hergestellte Halbleiteranordnung |
CN103594560A (zh) * | 2013-11-27 | 2014-02-19 | 奥特斯维能源(太仓)有限公司 | 一种n型硅太阳能电池的双面扩散工艺 |
CN109713084A (zh) * | 2018-12-29 | 2019-05-03 | 江苏日托光伏科技股份有限公司 | 一种改善太阳能电池扩散工艺中方阻均匀性的方法 |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10045249A1 (de) * | 2000-09-13 | 2002-04-04 | Siemens Ag | Photovoltaisches Bauelement und Verfahren zum Herstellen des Bauelements |
DE10058031B4 (de) * | 2000-11-23 | 2007-11-22 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren zur Bildung leicht dotierter Halogebiete und Erweiterungsgebiete in einem Halbleiterbauelement |
DE102004036220B4 (de) * | 2004-07-26 | 2009-04-02 | Jürgen H. Werner | Verfahren zur Laserdotierung von Festkörpern mit einem linienfokussierten Laserstrahl |
US7790574B2 (en) | 2004-12-20 | 2010-09-07 | Georgia Tech Research Corporation | Boron diffusion in silicon devices |
US7824579B2 (en) * | 2005-06-07 | 2010-11-02 | E. I. Du Pont De Nemours And Company | Aluminum thick film composition(s), electrode(s), semiconductor device(s) and methods of making thereof |
US7771623B2 (en) * | 2005-06-07 | 2010-08-10 | E.I. du Pont de Nemours and Company Dupont (UK) Limited | Aluminum thick film composition(s), electrode(s), semiconductor device(s) and methods of making thereof |
JP2009507397A (ja) * | 2005-08-22 | 2009-02-19 | キュー・ワン・ナノシステムズ・インコーポレイテッド | ナノ構造およびそれを実施する光起電力セル |
US7718092B2 (en) * | 2005-10-11 | 2010-05-18 | E.I. Du Pont De Nemours And Company | Aluminum thick film composition(s), electrode(s), semiconductor device(s) and methods of making thereof |
JP2007266265A (ja) * | 2006-03-28 | 2007-10-11 | Toshiba Corp | 不純物拡散方法及び半導体装置の製造方法 |
US8507337B2 (en) | 2008-07-06 | 2013-08-13 | Imec | Method for doping semiconductor structures and the semiconductor device thereof |
TWI390756B (zh) * | 2008-07-16 | 2013-03-21 | Applied Materials Inc | 使用摻質層遮罩之混合異接面太陽能電池製造 |
US20100051932A1 (en) * | 2008-08-28 | 2010-03-04 | Seo-Yong Cho | Nanostructure and uses thereof |
WO2010068331A1 (en) | 2008-12-10 | 2010-06-17 | Applied Materials, Inc. | Enhanced vision system for screen printing pattern alignment |
US9202954B2 (en) * | 2010-03-03 | 2015-12-01 | Q1 Nanosystems Corporation | Nanostructure and photovoltaic cell implementing same |
DE102012203445A1 (de) * | 2012-03-05 | 2013-09-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Erzeugen eines Dotierbereiches in einer Halbleiterschicht |
CN102769069B (zh) * | 2012-07-16 | 2015-11-04 | 苏州阿特斯阳光电力科技有限公司 | 一种晶体硅太阳能电池的硼扩散方法 |
US9082911B2 (en) | 2013-01-28 | 2015-07-14 | Q1 Nanosystems Corporation | Three-dimensional metamaterial device with photovoltaic bristles |
US20140264998A1 (en) | 2013-03-14 | 2014-09-18 | Q1 Nanosystems Corporation | Methods for manufacturing three-dimensional metamaterial devices with photovoltaic bristles |
US9954126B2 (en) | 2013-03-14 | 2018-04-24 | Q1 Nanosystems Corporation | Three-dimensional photovoltaic devices including cavity-containing cores and methods of manufacture |
JP2016066771A (ja) * | 2014-09-17 | 2016-04-28 | 日立化成株式会社 | 太陽電池素子の製造方法 |
CN112635592A (zh) * | 2020-12-23 | 2021-04-09 | 泰州隆基乐叶光伏科技有限公司 | 一种太阳能电池及其制作方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61121326A (ja) * | 1984-11-19 | 1986-06-09 | Oki Electric Ind Co Ltd | 半導体装置の製造方法 |
JPS63226920A (ja) * | 1987-03-16 | 1988-09-21 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置の製造方法 |
WO1991019323A1 (en) * | 1990-05-30 | 1991-12-12 | Yakov Safir | A method of making semiconductor components as well as a solar cell made therefrom |
WO1996028851A1 (de) * | 1995-03-10 | 1996-09-19 | Siemens Solar Gmbh | Solarzelle mit back-surface-field und verfahren zur herstellung |
WO1997004480A1 (de) * | 1995-07-18 | 1997-02-06 | Siemens Aktiengesellschaft | Verfahren zur herstellung eines mos-transistors |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS552727A (en) * | 1978-06-21 | 1980-01-10 | Hitachi Ltd | Vacuum evaporation apparatus |
-
1998
- 1998-03-25 DE DE19813188A patent/DE19813188A1/de not_active Withdrawn
-
1999
- 1999-03-25 WO PCT/EP1999/002038 patent/WO1999049521A1/de not_active Application Discontinuation
- 1999-03-25 US US09/647,046 patent/US6448105B1/en not_active Expired - Fee Related
- 1999-03-25 JP JP2000538392A patent/JP2002508597A/ja active Pending
- 1999-03-25 EP EP99914540A patent/EP1068646A1/de not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61121326A (ja) * | 1984-11-19 | 1986-06-09 | Oki Electric Ind Co Ltd | 半導体装置の製造方法 |
JPS63226920A (ja) * | 1987-03-16 | 1988-09-21 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置の製造方法 |
WO1991019323A1 (en) * | 1990-05-30 | 1991-12-12 | Yakov Safir | A method of making semiconductor components as well as a solar cell made therefrom |
WO1996028851A1 (de) * | 1995-03-10 | 1996-09-19 | Siemens Solar Gmbh | Solarzelle mit back-surface-field und verfahren zur herstellung |
WO1997004480A1 (de) * | 1995-07-18 | 1997-02-06 | Siemens Aktiengesellschaft | Verfahren zur herstellung eines mos-transistors |
Non-Patent Citations (3)
Title |
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KRYGOWSKI T ET AL: "A SIMULTANEOUSLY DIFFUSED, TEXTURED, IN SITU OXIDE AR-COATED SOLAR CELL PROCESS (STAR PROCESS) FOR HIGH-EFFICIENCY SILICON SOLAR CELLS", IEEE TRANSACTIONS ON ELECTRON DEVICES, vol. 45, no. 1, 1 January 1998 (1998-01-01), pages 194 - 199, XP000787879, ISSN: 0018-9383 * |
PATENT ABSTRACTS OF JAPAN vol. 010, no. 306 (E - 446) 17 October 1986 (1986-10-17) * |
PATENT ABSTRACTS OF JAPAN vol. 013, no. 023 (E - 705) 19 January 1989 (1989-01-19) * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1396880A2 (de) * | 2002-09-06 | 2004-03-10 | National Institute of Advanced Industrial Science and Technology | Dotierungsverfahren und nach diesem Verfahren hergestellte Halbleiteranordnung |
EP1396880A3 (de) * | 2002-09-06 | 2006-07-12 | National Institute of Advanced Industrial Science and Technology | Dotierungsverfahren und nach diesem Verfahren hergestellte Halbleiteranordnung |
US7138688B2 (en) | 2002-09-06 | 2006-11-21 | National Institute Of Advanced Industrial Science And Technology | Doping method and semiconductor device fabricated using the method |
CN103594560A (zh) * | 2013-11-27 | 2014-02-19 | 奥特斯维能源(太仓)有限公司 | 一种n型硅太阳能电池的双面扩散工艺 |
CN109713084A (zh) * | 2018-12-29 | 2019-05-03 | 江苏日托光伏科技股份有限公司 | 一种改善太阳能电池扩散工艺中方阻均匀性的方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2002508597A (ja) | 2002-03-19 |
US6448105B1 (en) | 2002-09-10 |
DE19813188A1 (de) | 1999-10-07 |
EP1068646A1 (de) | 2001-01-17 |
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