Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B81—MICROSTRUCTURAL TECHNOLOGY
  • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
  • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
  • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
  • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
  • B81C1/0046—Surface micromachining, i.e. structuring layers on the substrate using stamping, e.g. imprinting
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
  • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
  • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
  • G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
  • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
  • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
  • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
  • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
  • G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
  • G01N21/3504—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing gases, e.g. multi-gas analysis
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/24—Coupling light guides
  • G02B6/36—Mechanical coupling means
  • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
  • G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
  • G02B6/3696—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier by moulding, e.g. injection moulding, casting, embossing, stamping, stenciling, printing, or with metallic mould insert manufacturing using LIGA or MIGA techniques
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/24—Coupling light guides
  • G02B6/42—Coupling light guides with opto-electronic elements
  • G02B6/4201—Packages, e.g. shape, construction, internal or external details
  • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
  • H10N10/01—Manufacture or treatment
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
  • H10N10/80—Constructional details
  • H10N10/81—Structural details of the junction
  • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W99/00—Subject matter not provided for in other groups of this subclass
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B81—MICROSTRUCTURAL TECHNOLOGY
  • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
  • B81B2201/00—Specific applications of microelectromechanical systems
  • B81B2201/02—Sensors
  • B81B2201/0214—Biosensors; Chemical sensors
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B81—MICROSTRUCTURAL TECHNOLOGY
  • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
  • B81B2203/00—Basic microelectromechanical structures
  • B81B2203/01—Suspended structures, i.e. structures allowing a movement
  • B81B2203/0136—Comb structures
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B81—MICROSTRUCTURAL TECHNOLOGY
  • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
  • B81C2201/00—Manufacture or treatment of microstructural devices or systems
  • B81C2201/03—Processes for manufacturing substrate-free structures
  • B81C2201/034—Moulding
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/24—Coupling light guides
  • G02B6/36—Mechanical coupling means
  • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
  • G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
  • G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/24—Coupling light guides
  • G02B6/42—Coupling light guides with opto-electronic elements
  • G02B6/4201—Packages, e.g. shape, construction, internal or external details
  • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
  • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
  • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/24—Coupling light guides
  • G02B6/42—Coupling light guides with opto-electronic elements
  • G02B6/4201—Packages, e.g. shape, construction, internal or external details
  • G02B6/4246—Bidirectionally operating package structures

Definitions

• the present invention relates to a method of producing an electric, electronic, optic and/or mechanical component in which the component substrate is given a three-dimensional structure or shape and the substrate then further worked to build the components
• the material can be worked micromechanically so as to give the material certain three-dimensional forms or structures. These substrates are then processed by adding material to or re- moving material from certain areas, for instance areas that have been defined with the aid of lithographic techniques.
• the disc can be subjected to such processes as lithographic processes, PVD processes (Physical Vaporised Deposition), CVD processes (Chemical Vaporised Deposition), doping, ion-implantation, or various types of etching processes (ion, chemical, plasma etching processes, etc.)
• PVD processes Physical Vaporised Deposition
• CVD processes Chemical Vaporised Deposition
• doping ion-implantation
• etching processes ion, chemical, plasma etching processes, etc.
• a disc of this nature is dimensioned to enable a plurality of components to be built-up si- multaneously on one and the same disc, which is then divided into respective components.
• the substrate used in this document is a silicon disc (Fig. 5a).
• a grating or a number of ridges is/are provided on the surface of the disc.
• the grating is provided with two mutually different conductors at mutually different oblique angles (Fig. 5c), thereby forming a num- ber of mutually sequential junctions from one conductor to the other. This procedure results in a thermopile.
• the publication also discloses the possibility of using a polyimide as material for building the three-dimensional structure (Fig. 5b).
• Swedish Patent Applications 93 02051-9 and 95 00849-6 teach methods of replicating channels that are intended to hold samples for a biochemical analyser that is based on electrophoretic separation. These channels are comprised of passive components and the electric field required for an analysis is applied with the aid of external electrodes.
• Another technical problem is one of realising how such manufacture can be achieved without needing to micromechanically work each individual component.
• Another technical problem is one of realising how certain limitations that exist in traditional substrates, such as silicon and quartz substrates, can be overcome and how components that require substrate properties that do not exist in, for instance, silicon or quartz substrates can be manufactured with the precision required and at reasonable costs.
• Still another technical problem resides in overcoming the prejudices that exist in traditional component manufacture with regard to the use of materials other than silicon and quartz in lithographic processes, metallising processes, doping processes, etching processes, etc..
• Yet another technical problem is one of realising that in addition to said component other components and/or necessary conductor paths can be produced from a three-dimensional structure by subsequent processing of said structure.
• a three-dimensional structure can be worked to provide mechanical parts, such as snap-fastener means, outwardly jutting parts or recesses by means of which said component can be fitted to a base structure, in addition to producing said component. It will also be seen that a technical problem is one of realising how a micromechanically worked structure can be divided into a number of three-dimensional structures that are intended for subsequent working and that have precise dimensions.
• Another technical problem is one of realising the manufacturing advantages and economic advantages that are afforded by transferring an exact, micromechanically manufactured three-dimensional structure in silicon or quartz to a plurality of three-dimensional structures in a polymeric material.
• thermocouples thermocouples
• pressure sensors electro-optical coupling units for optical sensors or units combined with electric signal processing or the establishment of electric contacts.
• the present invention takes as its starting point a method of producing an electric, electronic, optical and/or mechanical component where the component substrate is given a three-dimensional structure or shape and the substrate then processed or worked to form said component.
• the three-dimensional structure formed by the geometrical details can be transferred from the silicon plate or quartz plate to the polymeric plate by shaping, such as moulding, pressing, extruding or embossing, against a die or mould.
• shaping such as moulding, pressing, extruding or embossing, against a die or mould.
• the present invention proposes two basic methods of enabling a three-dimensional structure to be replicated.
• At least that part of the die or mould which corresponds to the component is produced by shaping said die to a model of the structure, e.g. by moulding or electroplating.
• the model is produced by micromechanically working a material that is suitable in this respect, wherein the three-dimensional structure and/or the configuration of the model is chosen to correspond to the desired component-associated surface parts, electric conductor paths and/or other electric and/or electronic circuits.
• At least that part of the die or mould which corresponds to the component is produced by micromechanically working directly a material that is suitable in this respect, and the three-dimensional structure of the die or mould is made comple- mentary to desired component-associated surface parts, electric conductor paths and/or other electric and/or electronic circuits.
• the original shape or structure on which the final three-dimensional structure is based may alternatively be obtained by, e.g., electron-beam lithography, thereby enabling the creation of necessary structures for building, e.g., diffractive optical elements.
• the component substrate is comprised of a polymeric material, but that the material suitable for said micro- mechanical working process is comprised of silicon or quartz.
• the material suitable for said micro- mechanical working process is comprised of silicon or quartz.
• a thus produced three-dimensional structure can be further worked with the aid of different processes, such as lithographic processes, PVD processes, CVD processes, doping, ion-implantation processes, or etching processes, such as ion, chemical, or plasma etching processes.
• Said further treatment or working processes may be comprised of a combination of one or more of the earlier described processes.
• thermocouples thermocouples
• pressure sensors electro-optical coupling units
• electro-optical coupling units a channel structure for a biochemical analyser. Examples of such components will be made more apparent in the following description of proposed embodiments.
• Those advantages that are primarily afforded by a method according to the present invention reside in the ability to produce in a cost-effective manner components whose manufacture require a three-dimensional structure that can only be obtained by a micromechanical working process and where the components include physical measurements that only permit one or a few components to be produced with each substrate plate when practising traditional techniques.
• This method opens the possibility of producing components that have hitherto been considered too costly in relation to what the components can achieve.
• the method therewith also opens a completely new field for the manufacture of components that enables components to be produced that have hitherto never been produced. The method can thus provide a decisive breakthrough in the manufacture of many different types of component.
• the present invention also provides the advantage of enabling the peripheral elements required by the component to be readily integrated therewith, such as additional components, electric conductor paths or mechanical elements such as snap-fastener means, outwardly projecting surfaces or recesses intended for mounting the component on a substrate surface.
• Figure 1 illustrates a component in the form of a detector that includes two layers of mutually different metals that form a number of series-connected thermocouples
• Figure 2 is a schematic, highly simplified illustration of a possible conductor path, electric and/or electronic circuits and connection pads that can be formed together with a component in accordance with the present invention
• Figure 3 is a schematic and highly simplified illustration of mechanical parts that can be formed together with a component in accordance with the present invention
• Figures 4a and 4b illustrate schematically and in side view how a detector-adapted base structure can be formed from a mould and a model
• Figure 5 is a schematic, somewhat enlarged side view of a detector according to the present invention.
• Figure 6 is a simplified side view illustrating how a detector can be aligned or positioned in relation to a chosen angle of incidence of incident light rays
• Figure 7 illustrates schematically and from above how a detector can be isolated electrically from a surrounding metal layer
• Figure 8 illustrates schematically and in side view how a detector can be isolated electrically from a surrounding metal layer
• Figure 9 illustrates schematically and from above a detector that includes several electrically interconnected columns of electrically conductive ridges
• Figure 10 illustrates schematically and from above a detector according to Figure 9 where the columns are interconnected electrically by means of electrically conductive surface sections;
• Figure 11 illustrates schematically and from above the manner in which electrically conductive and electrically insulating ridges co-act to form a detector that may include a plurality of columns of conductive ridges;
• Figure 12 illustrates schematically and in side view the manner in which conductive ridges can be adapted to absorb incident light rays;
• Figure 13 is a schematic, simplified illustration of a component in the form of a pressure sensor that includes a cavity and a strain gauge;
• Figure 14 is a schematic, highly simplified illustration of a component in the form of an electro-optic switching unit? and associated parts;
• Figure 15 is a schematic, highly simplified illustration of a component in the form of a test channel adapted for use with a biochemical analyser based on elec- trophoretic separation.
• Figure 1 thus shows a method of producing an electric, electronic, optical and/or mechanical component.
• thermocouple 1 As an example of a component produced in accordance with the method. Reference is made to Swedish Patent Application 98 00462-5 for a more detailed description of such a thermocouple.
• a substrate 2 for the thermocouple 1 has a three-dimensional structure or configuration 3 and is adapted for further treatment or processing so as to form the end product, i.e. the thermocouple.
• thermocouple As shown in Figure 1, the three-dimensional structure 3 for the thermocouple is produced on a delimited surface region, and that electric conductor paths and/or further electric and/or electronic components can be produced on this delimited surface region in mutually the same way.
• These further components may comprise an amplifier 1', a voltage unit 1", connection pads, connection terminals 1"', or an electric conductor path l 4 , etc., as shown in Figure 2.
• thermocouple 1, or the component may also be provided with mechanical parts, such as snap-fastener means la, projections lb or recesses lc which enable the component to be fitted to a base structure Id, in accordance with Figure 3.
• mechanical parts such as snap-fastener means la, projections lb or recesses lc which enable the component to be fitted to a base structure Id, in accordance with Figure 3.
• Figure 3 is intended solely to illustrate how the component can be provided with various mechanical parts in accordance with the invention.
• the snap-fastener means la shown in Figure 3 are difficult to form in a moulding operation.
• a component can be provided with different mechanical parts with the aid of one or more of the various processes described in the descriptive part of this document.
• the substrate 2 is produced by shaping the substrate, such moulding, pressing, extruding or embossing said substrate, against a die or mould 2' ( Figure 4a), where at least a part of the die or mould that corresponds to the component 1 is produced by shaping, such as moulding or electroplating (according to Figure 4b), against a model 2" of the structure, and where the model 2" is produced by micromechanically working a material that is suitable in this respect.
• the three-dimensional structure and/or configuration of the model 2" is chosen to correspond to desired component-associated surface parts, electric conductor paths and/or fur- ther electric and/or electronic circuits.
• the substrate 2 may alternatively be produced by shaping, such as moulding, pressing, extruding or embossing, against a die or mould 2' where at least a part of the die that corresponds to the component 2 is produced by micromechanically working a material that is suitable in this respect, and where the three-dimensional structure of the die or mould 2' is complementary in relation to desired component-associated surface parts, electric conductor paths and/or further electric and/or electronic circuits.
• the substrate 2 consists of a polymeric material.
• the advantages of a polymeric substrate is that the substrate will be electrically insulating and have a high thermal resistance, which is basically very beneficial with regard to the manufacture of certain components.
• Silicon and quartz are materials that can be conveniently worked micromechanically.
• this subsequent working or treatment of the three-dimensional structure may include lithographic processes, PVD processes, CVD processes, various types of doping processes, ion-implantation or an etching process, such as an ion etching process, a chemical etching process or a plasma etching process.
• Subsequent processing of the three-dimensional structure 3 may also include further mechanical working processes. For instance, because the substrate plate is held firmly in a vacuum chuck during certain of the processes to which it is subjected it may be convenient from a process/technical aspect to drill any holes that are required after these processes. Sawing or dividing a substrate plate into individual components is also a subsequent mechanical working operation.
• the three-dimensional structure can be worked also in other stages of the process.
• a PVD process is used to coat the three-dimensional structure with one or more metal layers.
• the metal layers are applied at a specific application angle in relation to the three-dimensional structure, whereby metal-coated surface regions and non-coated surface regions are formed by virtue of the shadowing effects that are achieved.
• This concept of employing a specific application angle in relation to the three-dimensional structure can also be used in processes other than the PVD process, in order to create processed and non-processed surface regions through the shadowing effects obtained.
• said further treatment to consist in a combination of one or more treatment processes in accordance with one of the earlier described processes.
• thermocouple can be constructed in accordance with the inventive method in accordance with the inventive method in accordance with the inventive method in accordance with the inventive method is described below, with the intention of enabling the present invention to be understood more readily.
• a first and a second layer of electrically conductive metal are applied to the surface region or surface regions of the three-dimensional structure.
• the layer of first metal Ml is applied to the three dimensional structure 3 for the non-electrically conductive substrate 2 at a first application angle "a" which is other than 90°, while the layer of said second metal M2 is applied to the three- dimensional structure 3 at a second application angle "b" which is also other than 90° but different to said first application angle "a".
• the three-dimensional structure includes a plurality of so-called conductive ridges 5, 5', 5".
• Each of the conductive ridges has a first side surface 5a, a second side surface 5b and an upper surface 5 c, and an intermediate, so-called conductive surface 6 between respective mutually adjacent ridges 5, 5'.
• conductive ridges may be slightly misleading when the topographical structure has the form of a greatly diminished “tower block area", i.e. when the structure is comprised of a plurality of narrow rods and the rods in one row (or column) are slightly offset in relation to the rods in an adjacent row with the various rods having mutually different heights.
• the first angle "a” shall be adapted so that the first side surface 5 a and at least a part of the upper surface 5 c of respective conductive ridges 5, 5', 5", and at least a part of the intermediate conductive surfaces 6 will be coated with the layer of said first metal Ml
• the second angle "b” shall be adapted so that the second side surface 5b and at least part of the upper surface 5 c of respective conductive ridges 5, 5', 5", and at least a part of the intermediate conductive surfaces 6 will be coated with the layer of said second metal M2, in accordance with Figure 1.
• the first and the second angles "a", "b” shall also be adapted so that the metal layers overlap and form the electric contact M12, M21 with the first metal layer Ml on the upper surface 5c of respective conductive ridges 5, 5' and on the intermediate conductive surfaces 6, 6', such that the metal layers Ml, M2 will form the series of electrically interconnected junctions M12, M12', M12", M21, M21', M21" between the first and the second metals Ml, M2.
• Figure 1 shows a series of thermocouples formed in this way, said thermocouples comprising a plurality of ridges.
• it is necessary to electrically isolate all thermocouples from surrounding metal layers, i.e. to isolate the metal layers Ml, M2 within the detector-associated surface electrically (at 71) from the metal layers MIR, M2R on the surrounding surface.
• the component or the detector 1 is aligned relative to the angle of incidence "c" of the incident electromagnetic radiation or the light rays 4 to be detected by the detector, by positioning the detector 1 relative to incident light rays 4 so that said rays will irradiate the upper surface 5c of respective conductive ridges and so that the intermediate conductive surfaces 6 will be shadowed from incident light rays 4 by the conductive ridges, as shown in Figure 6.
• the electrical insulation 71 between the detector 3 and surrounding metal layers MIR, M2R is achieved by virtue of so-called insulating ridges 81 having mutually adjacent so-called insulating surface 91 and belonging to the three-dimensional structure are positioned in relation to one another and also in relation to the conductive ridges 5, 5', 5" and in relation to the first and the second angles "a", "b" such that the insulated surfaces 71 will not be coated with said first and said second metals.
• Figures 7 and 8 also illustrate the formation of a column of ridges. It is desirable to provide a large number of series-connected junctions from one metal layer to the other, in order to enhance the resolution or sensitivity of the detector 1. If the number of series-connected junctions is increased, the detector surface will obtain a pronounced oblong shape. For reasons of measuring technology, however, it is desirable for the detector surface to have an essentially square shape.
• the conductive ridges are given a configuration in which they form n-number of columns of mutually parallel conductive ridges, here referenced column 1 (kl), column 2 (k2), etc., up to column “n" (kn), where each column includes m-number of conductive ridges, here referenced ridge 1 (al), ridge 2 (a2), etc., up to ridge "m” (am), and where "m" may be different for respective columns.
• Figure 10 shows an embodiment where the electrical interconnection 51 between two ridges in two mutually adjacent columns Kl, K2 can be achieved by means of an electrically conductive surface section 51' that has been prepared to make this interconnection.
• Figure 11 illustrates a method of fabricating a generally square thermocouple, by combining conductive ridges al, a2 with insulating ridges 81.
• the series of conductive ridges form the series-connected thermocouples, where the metal layer on a first or a second side surface of a first conductive ridge kl, al, or on a conductive surface adjacent said first conductive ridge, in said series of conductive ridges forms a first connecting electrode 53 on the series-connected thermocouple, and a first or a second surface belonging to a last conductive ridge kn, am, or a conductive surface on a ridge adjacent said last conductive ridge, in said series of conductive ridges forms a second connecting electrode 54 on the series-connected thermocouple.
• the three-dimensional structure can be further worked by covering the upper surface 5c of a respective conductive ridge with a heat-absorbent layer 55, and by covering the respective intermediate conductive surfaces 6 with a heat-reflecting layer 56.
• the hot solder points which form measuring points in the thermocouple and which are exposed to the incident light rays will absorb the greatest possible amount of the thermal energy contained in the incident light rays.
• the cold solder points i.e. the con- ductive surfaces between the conductive ridges, shall not be subjected to the effect of incident light rays and are therefore shadowed by the conductive ridges, as before described.
• stray light may occur in the surroundings of the detector, and consequently it is desirable to cover the cold solder points with a heat-reflecting layer.
• the heat-absorbent coating 55 is comprised of a layer of carbon
• the heat-reflecting layer 56 is comprised of the reflective metal layers Ml, M2.
• the two metals Ml, M2 used shall be appropriate both with respect to optical properties, reflection of utilised light rays, and also with respect to their thermoelectric properties.
• the first metal Ml shall differ from the second metal M2 and the metals shall provide a thermoelectrical effect in co-operation with each other.
• the two metals are gold and chromium respectively, where chromium is the first, innermost metal Ml and gold is the second metal M2.
• thermocouple in which the component is a thermocouple, it is shown by way of example that in some respects a polymeric material has more appropriate properties than silicon for instance, which does not possess the desired thermally insulating properties.
• the component illustrated in Figure 13 is a pressure sensor 11 which includes a strain gauge 112 and which is mounted on the outer surface of a wall 113 belonging to a closed cavity 114.
• the wall 113 is sufficiently thin for its projection from the cavity to change in response to the pressure difference between a gas pressure PI enclosed within the cavity and a fluctuating gas pressure P2 outside said cavity.
• the substrate and its three-dimensional structure 3' includes the body 114' that defines the cavity 114, and further treatment or processing of the substrate comprises covering the thin wall 113 with a metal strip that forms the strain gauge 112.
• the cavity in the pressure sensor 11 will often comprise two parts 1 la, 1 lb, where one part 1 la has a box-like shape and the other part 1 lb has the form of a box lid.
• the thin wall 113 will often be formed by a membrane applied to the lid l ib or to the bottom of the box 11a.
• a component produced in accordance with the present invention from consisting of several parts, for instance box and lid, of which one or more are manufactured in accordance with the present invention. Further working of the substrate will then comprise joining the component parts together. This can be achieved, for instance, by cur- ing, hardening, glue in UV light, by ultrasound welding, or by chemically or physically working the surfaces so as to enable said surfaces to be joined together more readily, said three-dimensional structure having been adapted to enable said parts to be joined together by the method used.
• An alternative, particularly advantageous method of joining the component parts together in accordance with the invention is to create surfaces that are so smooth that when coated with a metal, such as gold, they will wring together without requiring further processing.
• a wringing joint is achieved when bringing together two surfaces that are so smooth as to obtain a direct atomic bond between said surfaces.
• the flexibility possessed by a polymeric material means that any irregularities or even contaminants can be taken-up by the flexibility of the plastic, which is not possible when using a silicon or quartz substrate, for instance.
• Figure 14 is a highly simplified and schematic illustration of a component in the form of an electro-optical coupling unit 12, which may, for instance, be adapted for broadband infor- mation transmission.
• an electro-optical coupling unit 12 which may, for instance, be adapted for broadband infor- mation transmission.
• the three-dimensional structure 3" of the substrate for such a component 12 shall include mechanical alignment 121 of an optical fibre 122, and a first holder 123 for a photodiode 124 which is adapted to convert information in the optical domain to an electric signal.
• the three-dimensional structure 3" enables electrical conductor paths 125 and a connection terminal 126 to be formed, thereby enabling the electrical signals to be switched to an external unit 127, such as a computer.
• Reverse signal order will, of course, also be required when electrically carried information shall generate light pulses from a light source and the light coupled to the optical fibre.
• the three-dimensional structure 3" shall therefore also include a second holder 128 for a light source 129, said holder being adapted to align the light source 129 with the optical fi- bre 122, or the optical fibre mechanical alignment means 121.
• the illustrated component 12 may be produced in accordance with the present invention, by initially giving the substrate a three-dimensional structure 3" that fulfils all geometrical requirements with respect to the mechanical alignment 121 of the optical fibre 122, the first holder 123 for the photodiode 124, and the second holder 128 for the light source 129.
• Requisite electrical conductor paths 125 and the application of the optical fibre 122, the photodiode 124, the light source 129 and the connection terminal 126 are implemented by said further working operations with the aid of processes earlier described, with further working being made possible by virtue of appropriate dimensioning of the three-dimensional structure 3".
• the optical fibre 122 may be formed as an optical waveguide in the substrate by direct connection with the photodiode 124 and the light source 129.
• a connection between the externally arriving optical fibre and the thus formed optical waveguide is still preferred.
• Figure 15 illustrates an example of a biochemical analyser based on electrophoretic separation.
• the analyser requires a component 13 that includes a channel structure in which a separating hydrogel is placed by filling the channel with the gel in a monomer form and then polymerising appropriate regions of the gel with the aid of UV light. Separation is effected by applying an electric field and therewith causing the molecules to migrate along the channel and sieving said molecules in said gel. Different molecules will migrate at different speeds, in relation to their size and charge. In general, larger molecules will migrate more slowly than smaller molecules, while molecules having a high electrical charge will migrate more quickly.
• the relevant three-dimensional structure 3'" for this application is comprised of a mechanical channel structure 131 that has been produced by the aforedescribed replication technique.
• An anode 132 and a cathode 133 can be connected electrically at respective ends of the channel 131 by an electrode pattern that has been produced by shadow masking or lithographic technique, as described earlier with reference to other embodiments.
• the three- dimensional structure for this component will therefore include the channel 131 and enable an anode 132 and a cathode 133 with associated electric connections 134 to be formed.
• the molecules are preferably detected by optical methods, for instance by absorbence or fluorescence. In this latter case, large gains can be made if the fluorescent light 135 can be collected effectively by the intended detector 136.
• the three-dimensional structure 3' may provide possibilities of forming optical waveguides 138, so as to enable the light required for the fluorescence to be conducted to the channel 131 from an external source, for instance.
• the component 13 may also be adapted for co-action with a lid or cover that closes the channel.
• an electrophoretic separation component that includes sample channels 131, electrodes 132, 133 having connections 134, optical waveguides 135 for con- ducting light to the channel 131 from an external light source, and a diffractive optical element 137 for focusing the spread fluorescent light 135 onto an external detector 136.
• the expensive components, such as light source, normally a laser, and detector 136, with associ- ated electronics thus belong to an instrument 139 which is adapted to co-act with the cheaper components produced in accordance with the invention.
• Working of that part of the die or the model to be used in manufacturing that part of the three-dimensional structure 3'" which corresponds to the diffractive optical element 137 may, e.g., be achieved by electron beam lithography.

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• Microelectronics & Electronic Packaging (AREA)
• Biochemistry (AREA)
• General Health & Medical Sciences (AREA)
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• Investigating Or Analysing Materials By Optical Means (AREA)
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• Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
• Optical Measuring Cells (AREA)
• Optical Couplings Of Light Guides (AREA)
• Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
• Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)

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• 1998
  • 1998-02-17 SE SE9800462A patent/SE521415C2/sv unknown
• 1999
  • 1999-02-04 AU AU26494/99A patent/AU2649499A/en not_active Abandoned
  • 1999-02-04 EP EP99906637A patent/EP1057213A2/en not_active Ceased
  • 1999-02-04 DE DE69943160T patent/DE69943160D1/de not_active Expired - Lifetime
  • 1999-02-04 AU AU26493/99A patent/AU748969B2/en not_active Ceased
  • 1999-02-04 AT AT99906636T patent/ATE497156T1/de not_active IP Right Cessation
  • 1999-02-04 CN CNB998051241A patent/CN1174237C/zh not_active Expired - Fee Related
  • 1999-02-04 CA CA002320919A patent/CA2320919A1/en not_active Abandoned
  • 1999-02-04 WO PCT/SE1999/000146 patent/WO1999041772A2/en not_active Ceased
  • 1999-02-04 US US09/622,398 patent/US6372542B1/en not_active Expired - Lifetime
  • 1999-02-04 EP EP99906636A patent/EP1057006B1/en not_active Expired - Lifetime
  • 1999-02-04 JP JP2000531864A patent/JP2002503556A/ja active Pending
  • 1999-02-04 WO PCT/SE1999/000145 patent/WO1999041592A1/en not_active Ceased
  • 1999-02-04 CA CA002320920A patent/CA2320920A1/en not_active Abandoned
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