WO1998026114A1 - Verfahren zur elektrolytischen abscheidung von kupferschichten - Google Patents
Verfahren zur elektrolytischen abscheidung von kupferschichten Download PDFInfo
- Publication number
- WO1998026114A1 WO1998026114A1 PCT/EP1997/006786 EP9706786W WO9826114A1 WO 1998026114 A1 WO1998026114 A1 WO 1998026114A1 EP 9706786 W EP9706786 W EP 9706786W WO 9826114 A1 WO9826114 A1 WO 9826114A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- deposition
- copper
- bath
- copper layers
- compounds
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
Definitions
- the invention relates to a method for the electrolytic deposition of copper layers with a short training period, in particular for the production of printed circuit boards.
- the copper layers must meet certain requirements regarding the material properties. For example, no cracks should form in the layers under thermal shock conditions (immersion in liquid tin / lead solder at 288 ° C for at least one time). Furthermore, the copper layers must be shiny and smooth and also as uniformly thick as possible at all points on the surfaces to be coated. In addition, the deposition process must be easy to control and economical.
- Anodes consisting of copper, which dissolve during electrolytic deposition, are usually used for electrolytic copper deposition. These anodes are used in the form of plates, bars or balls. The plates and bars are attached to the power supply lines using suitable fastening means. The balls are held in specially made baskets, usually made of titanium, which are in turn attached to the power supply lines by means of suitable fastening means. Since these anodes dissolve during the deposition process approximately to the extent that copper is deposited from the deposition bath, the copper content in the deposition solution remains approximately constant. It is therefore not necessary to supplement the deposited copper.
- additives are added to the deposition bath in small quantities. These are predominantly organic substances, which are generally used slightly under the deposition conditions that are normally set in the manufacture of printed circuit boards. The loss of organic additives caused by this is supplemented accordingly to maintain specified quality characteristics.
- the additives only improve the metal scattering, i.e. the uniformity of the copper layer thickness on all surfaces to be coated, only slightly.
- anode is insoluble anodes, whose outer geometric shape does not change during the deposition process.
- These anodes consist of inert metals, for example titanium or lead, which, however, can be coated with catalytically active metals, for example platinum, to avoid high anodic overvoltages.
- insoluble anodes are used, suitable measures must be taken to maintain the copper ion concentration in the deposition bath, for example by tracking through suitable solutions containing the copper ions in concentrated form.
- a recently proposed addition option consists in supplementing the copper ions by chemically dissolving copper parts in a separate treatment container by means of additionally added iron (III) ions or other metal ions which have an oxidizing effect on copper (DD 21 5 589 B5, DD 261 61 3 A1, DE-P 43 44 387 A1).
- the copper dissolving Solution formed iron (II) ions are reoxidized at the anodes to iron (III) ions and the solution enriched with copper ions is transported to the substrate for copper deposition.
- a constant equilibrium of the copper ion concentration is established by continuous circulation of the separation solution between the separation container and the treatment container in which the copper parts are located.
- the added iron ions also suppress the oxidative decomposition of the organic compounds, which are added to control the material properties of the deposited copper layers. If the baths are operated with insoluble anodes without these ions, these compounds decompose very quickly, so that useful metal layers cannot be obtained at all
- Insoluble anodes require a precise adjustment of the concentration of the iron ions, the circulation speed of the deposition solution, the surface of the copper parts and their morphology, as well as other parameters depending on the selected copper deposition current, in order to keep the copper ion concentration constant
- Insoluble anodes under unfavorable conditions also decompose the additives added to the deposition bath to influence the material properties of the copper layers, so that these properties cannot be reliably achieved.
- the addition of the iron ions deteriorates the uniformity of the copper layer thickness on the outside of the printed circuit board and the jacket surfaces of the drilled holes under the conditions described in the aforementioned publications. It is therefore preferable to use a soluble anode.
- Printed circuit boards are achieved even in small boreholes of sufficiently thick metal layers, even though the local current density is low there.
- a disadvantage is that when the bath is prepared, despite the addition of organic additives to improve the material properties of the copper layers, only rough copper can be obtained during the deposition, sometimes with a dendrite structure.
- the surface of the layers deposited in this way feels rough and looks matt and unevenly piebald.
- the ductility of these layers is very low, so that cracks occur in the copper layer even during thermal shock, as occurs during soldering.
- the invention is therefore based on the problem of finding a method with which the disadvantages of the known methods are avoided and with which, in particular, an economical method of operation is possible.
- the deposited copper layers should be as uniformly thick as possible at all points on the surfaces to be coated as well have sufficiently good optical and mechanical material properties (for example with regard to gloss, elongation at break, tensile strength). It should also be possible to produce layers with a thickness of approximately 25 ⁇ m on the outside and in the drill holes of printed circuit boards, which can also be immersed several times for 1 second into a 288 ° C hot
- the incorporation time of a deposition bath with copper ions, at least one compound influencing the material properties of the deposited metal and at least one solvent or solvent mixture that is to say the period in which usable copper layers cannot be deposited from the deposition bath after the new preparation, when using at least one soluble anode, for example made of copper, and using a pulse current or pulse voltage process can be drastically shortened ver, so that useful layers are obtained after a charge exchange of 1 0 Ah / 1 and preferably 5 Ah / 1 small amounts of iron ions can be added to the deposition solution. Under these conditions, less than 1 Ah / 1 is often required to incorporate the bath in order to achieve good copper plating of the circuit boards.
- the training period can also be completely omitted in favorable cases.
- the effect according to the invention can also be observed when compounds of other redox systems are present in small amounts.
- compounds of the elements arsenic, cerium, chromium, cobalt, gold, manganese, molybdenum, platinum, ruthenium, samarium, titanium, vanadin, tungsten and tin are also suitable.
- An iron compound is preferably added to the bath. It does not matter whether iron (II) or iron (III) ions are added to the bath. From the iron (II) or iron (11) compounds added to the bath, an equilibrium of both compounds is established after a short operating time. If, as described below, the usual gloss additives and wetting agents and other conventional additives are then added to the electrolyte, the incorporation time is drastically reduced when using pulse currents, or it is omitted. The addition prevents the formation of roughness and matt copper surfaces. In addition, the copper layers deposited from these baths also withstand a repeated solder shock test (10 seconds at 288 ° C.) without the occurrence of cracks. The process also has the advantage that the deposited copper layers are uniformly thick at all points on the coated surfaces and do not have an uneven thickness as in the known processes with the addition of iron ions to the copper bath.
- the acetates, bromides, carbonates, chlorides, fluorides, sulfates, tetrafluoroborates, phosphates, perchlorates, citrates, fumarates, gluconates, methanesulfonates and oxalates of iron (II) or iron (III) -ions or the other aforementioned elements can be used.
- the basic composition of the copper bath can vary within wide limits.
- An aqueous solution of the following composition is generally used: Copper sulfate (C1-SO4.5H2O) 20 to 250 g / 1, preferably 80 to 1 40 g / 1 or
- Chloride ions 0.01 to 0.18 g / 1, preferably 0.03 to 0.10 g / 1
- copper sulfate instead of copper sulfate, other copper salts can also be used, at least in part.
- Some or all of the sulfuric acid can be replaced by fluoroboric acid, methanesulfonic acid or other acids.
- the chlo ⁇ dions are used as alka chlo ⁇ d (e.g. Nat ⁇ umchlo- ⁇ d) or in the form of hydrochloric acid p.A. added.
- the addition of sodium chloride can be omitted in whole or in part if already in the additives
- Halide ions are included.
- customary brighteners, levelers, wetting agents or other customary additives can be contained in the bath.
- the bath In order to obtain shiny copper deposits with certain material properties, the
- Deposition bath at least one water-soluble sulfur compound, preferably a water-soluble organic sulfur compound, and an oxygen-containing, high-molecular compound added.
- Additives such as nitrogen-containing sulfur compounds, polymeric nitrogen compounds and / or polymeric phenazonium compounds can also be used
- Table 3 shows examples of high-molecular compounds containing oxygen.
- Table 4 shows some sulfur compounds that can be used. Corresponding functional groups are contained in the compounds for solubility in water
- Thiourea derivatives and / or polymeric phenazonium compounds and / or polymeric nitrogen compounds are used in the following concentrations:
- the pulse current is generated by a suitable pulse generator.
- the pulse current method the current between the workpieces polarized as cathodes, for example printed circuit boards, and the anodes is set galvanostatically and modulated in time using suitable means. The voltage between the cathodes and the anodes then adjusts itself automatically.
- the piss voltage method a voltage between the workpieces and the anodes is set potentiostatically and the voltage is modulated over time, so that a voltage that changes over time is established. In this case, the current is set automatically.
- cathodic current pulses and anodic current pulses can be generated and the current can also be briefly set to zero.
- the anodic pulses should be at least as high as the cathodic pulses. However, the anodic pulses should preferably be two to three times higher than the cathodic current pulses. Overall, the amount of charge that flows during the (cathodic) deposition phase must be significantly greater than the amount of charge in the anodic phase.
- the pulses should have a duration of 0.1 msec to 1 sec.
- Preferred pulse durations are 0.3 msec to 30 msec, whereby the cathodic Pul ⁇ se preferably a length of 1 0 msec to 30 msec and the anodic current pulses a duration of 0.3 msec to 1 msec 0, in particular from 0.3 msec to 3 msec.
- a particularly favorable current modulation is as follows: the cathodic phase lasts 10 msec, the anodic 0.5 msec. An improved setting occurs if there is an alternate pause (duration 5 msec) between a cathodic pulse (duration 5 msec), during which the current is set to zero, or an anodic pulse (duration 1 msec). You can have several in one cycle cathodic or anodic pulses of different heights can be set. Devices for generating these forms of modulation are known.
- the separating bath is moved by strong inflow and possibly by blowing clean air in such a way that the bath surface is in strong motion. This maximizes mass transfer near the cathodes and anodes, allowing greater current densities. Movement of the cathodes also improves the mass transfer on the respective surfaces. Due to the increased convection and electrode movement, a constant diffusion-controlled deposition is achieved.
- the substrates can be moved horizontally, vertically and / or by vibration. A combination with the air injection into the separation bath is particularly effective.
- the copper consumed in the deposition process is supplemented electrochemically via the copper anodes. Copper with a content of 0.02 to 0.067% by weight of phosphorus is used for the anodes.
- filters for removing mechanical and / or chemical residues can be provided in the electrolyte circuits.
- the requirement is lower compared to electrolytic cells with soluble anodes because the sludge produced by the phosphorus content of the anodes is not formed.
- Coating systems are usually used in which the material to be treated is kept in a vertical or horizontal position during the deposition process.
- the method is preferably used for the production of printed circuit boards.
- Another possible application is the coppering of parts for decorative purposes, for example of sanitary fittings, automotive parts and furniture fittings.
- a copper bath with the following composition was used in an electrolysis cell with soluble, phosphorus-containing copper anodes:
- Comparative Example 1 was repeated. However, the deposition from the bath was continued for a long time and then copper was deposited from this finished bath on a printed circuit board (charge throughput 20 A-h / 1 deposition bath). The appearance of the copper layer improved remarkably compared to the test according to Comparative Example 1. The copper layer on the circuit board now looked shiny and no longer showed any roughness. The breaking elongation of one from the finished bathroom improved to 18%
- printed circuit boards were copper-plated in a deposition bath with the following composition:
- the copper layers were deposited with pulsating current with the following parameters:
- Phase Cathodic current: Height: 6 A / dm 2 Duration: 5 msec
- 3rd phase current cathodic: height: 6 A / dm 2 duration: 5 msec 4th phase: current anodic: height: 10 A / dm 2 duration: 1 msec.
- electrolyte temperature 34 ° C
- copper layers with a matt surface were obtained on brushed copper laminate, which felt very rough.
- a printed circuit board separated from it did not survive a two solder shock test.
- Metal scattering in a 0.6 mm diameter borehole was only 62%
- Iron (III) chloride hexahydrate and its anhydrous form Iron (III) citrate hydrate and its anhydrous form
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/319,423 US6129830A (en) | 1996-12-13 | 1997-12-04 | Process for the electrolytic deposition of copper layers |
CA002275214A CA2275214C (en) | 1996-12-13 | 1997-12-04 | Process to electrolytically deposit copper layers |
EP97952879A EP0944749B1 (de) | 1996-12-13 | 1997-12-04 | Verfahren zur elektrolytischen abscheidung von kupferschichten |
AT97952879T ATE204035T1 (de) | 1996-12-13 | 1997-12-04 | Verfahren zur elektrolytischen abscheidung von kupferschichten |
DE59704260T DE59704260D1 (de) | 1996-12-13 | 1997-12-04 | Verfahren zur elektrolytischen abscheidung von kupferschichten |
JP52618198A JP4221064B2 (ja) | 1996-12-13 | 1997-12-04 | 銅層の電解析出方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19653681.2 | 1996-12-13 | ||
DE19653681A DE19653681C2 (de) | 1996-12-13 | 1996-12-13 | Verfahren zur elektrolytischen Abscheidung von Kupferschichten mit gleichmäßiger Schichtdicke und guten optischen und metallphysikalischen Eigenschaften und Anwendung des Verfahrens |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1998026114A1 true WO1998026114A1 (de) | 1998-06-18 |
Family
ID=7815786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP1997/006786 WO1998026114A1 (de) | 1996-12-13 | 1997-12-04 | Verfahren zur elektrolytischen abscheidung von kupferschichten |
Country Status (8)
Country | Link |
---|---|
US (1) | US6129830A (de) |
EP (1) | EP0944749B1 (de) |
JP (1) | JP4221064B2 (de) |
KR (1) | KR100546989B1 (de) |
AT (1) | ATE204035T1 (de) |
CA (1) | CA2275214C (de) |
DE (2) | DE19653681C2 (de) |
WO (1) | WO1998026114A1 (de) |
Cited By (5)
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EP1249517A1 (de) * | 2000-01-20 | 2002-10-16 | Nikko Materials Company, Limited | Kupferlektroplattierungsflüssigkeit, vorbehandlungsflüssigkeit für kupferelektroplattierung und verfahren zum kupferelektroplattieren |
EP1477588A1 (de) * | 2003-02-19 | 2004-11-17 | Rohm and Haas Electronic Materials, L.L.C. | Kupfer Galvanisierungszusammensetzung für wafers |
DE102008031003A1 (de) | 2008-06-30 | 2009-12-31 | Siemens Aktiengesellschaft | Verfahren zum Erzeugen einer CNT enthaltenen Schicht aus einer ionischen Flüssigkeit |
EP2518187A1 (de) | 2011-04-26 | 2012-10-31 | Atotech Deutschland GmbH | Wässriges Säurebad zur elektrolytischen Ablagerung von Kupfer |
CN110191977A (zh) * | 2017-01-18 | 2019-08-30 | 株式会社杰希优 | 着色用镀敷液以及着色方法 |
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DE19915146C1 (de) * | 1999-01-21 | 2000-07-06 | Atotech Deutschland Gmbh | Verfahren zum galvanischen Bilden von Leiterstrukturen aus hochreinem Kupfer bei der Herstellung von integrierten Schaltungen |
US6503375B1 (en) * | 2000-02-11 | 2003-01-07 | Applied Materials, Inc | Electroplating apparatus using a perforated phosphorus doped consumable anode |
JP2001267726A (ja) * | 2000-03-22 | 2001-09-28 | Toyota Autom Loom Works Ltd | 配線基板の電解メッキ方法及び配線基板の電解メッキ装置 |
US6491806B1 (en) * | 2000-04-27 | 2002-12-10 | Intel Corporation | Electroplating bath composition |
US6776893B1 (en) * | 2000-11-20 | 2004-08-17 | Enthone Inc. | Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect |
JP4806498B2 (ja) * | 2001-08-01 | 2011-11-02 | 凸版印刷株式会社 | プリント配線基板の製造装置および製造方法 |
EP1310582A1 (de) * | 2001-11-07 | 2003-05-14 | Shipley Company LLC | Verfahren zur elektrolytischen Kupfer Plattierung |
US8002962B2 (en) | 2002-03-05 | 2011-08-23 | Enthone Inc. | Copper electrodeposition in microelectronics |
US7316772B2 (en) * | 2002-03-05 | 2008-01-08 | Enthone Inc. | Defect reduction in electrodeposited copper for semiconductor applications |
DE10259362A1 (de) * | 2002-12-18 | 2004-07-08 | Siemens Ag | Verfahren zum Abscheiden einer Legierung auf ein Substrat |
EP1598449B1 (de) * | 2004-04-26 | 2010-08-04 | Rohm and Haas Electronic Materials, L.L.C. | Verbessertes Plattierungsverfahren |
TW200632147A (de) * | 2004-11-12 | 2006-09-16 | ||
EP1717351A1 (de) * | 2005-04-27 | 2006-11-02 | Enthone Inc. | Galvanikbad |
US20070158199A1 (en) * | 2005-12-30 | 2007-07-12 | Haight Scott M | Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps |
US20070178697A1 (en) * | 2006-02-02 | 2007-08-02 | Enthone Inc. | Copper electrodeposition in microelectronics |
CN101416569B (zh) * | 2006-03-30 | 2011-04-06 | 埃托特克德国有限公司 | 用金属填充孔和凹处的电解方法 |
US7887693B2 (en) * | 2007-06-22 | 2011-02-15 | Maria Nikolova | Acid copper electroplating bath composition |
US7905994B2 (en) | 2007-10-03 | 2011-03-15 | Moses Lake Industries, Inc. | Substrate holder and electroplating system |
JP2009167506A (ja) * | 2008-01-21 | 2009-07-30 | Ebara Udylite Kk | 酸性電解銅めっき液およびこれを用いる微細配線回路の作製方法 |
US20100206737A1 (en) * | 2009-02-17 | 2010-08-19 | Preisser Robert F | Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv) |
US8262894B2 (en) | 2009-04-30 | 2012-09-11 | Moses Lake Industries, Inc. | High speed copper plating bath |
EP2392694A1 (de) * | 2010-06-02 | 2011-12-07 | ATOTECH Deutschland GmbH | Verfahren zur Ätzung von Kupfer und Kupferlegierungen |
PL2620529T3 (pl) * | 2012-01-25 | 2014-09-30 | Atotech Deutschland Gmbh | Sposób wytwarzania matowych warstw miedzianych |
JP6216522B2 (ja) * | 2013-03-14 | 2017-10-18 | 大日本印刷株式会社 | インターポーザー基板の製造方法。 |
PL3417096T3 (pl) | 2016-05-19 | 2019-10-31 | Atotech Deutschland Gmbh | Sposób monitorowania całkowitej ilości wybłyszczaczy w kwaśnej kąpieli galwanicznej zawierającej miedź/stop miedzi i kontrolowany proces powlekania galwanicznego |
KR20210062369A (ko) * | 2019-11-21 | 2021-05-31 | 에스케이넥실리스 주식회사 | 찢김 또는 주름 불량을 방지할 수 있는 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법 |
TW202342827A (zh) * | 2022-03-31 | 2023-11-01 | 日商奧野製藥工業股份有限公司 | Pr脈衝電解用銅鍍敷液、及利用pr脈衝電解法之銅鍍敷方法 |
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1996
- 1996-12-13 DE DE19653681A patent/DE19653681C2/de not_active Expired - Fee Related
-
1997
- 1997-12-04 CA CA002275214A patent/CA2275214C/en not_active Expired - Fee Related
- 1997-12-04 EP EP97952879A patent/EP0944749B1/de not_active Expired - Lifetime
- 1997-12-04 JP JP52618198A patent/JP4221064B2/ja not_active Expired - Lifetime
- 1997-12-04 KR KR1019997004258A patent/KR100546989B1/ko not_active IP Right Cessation
- 1997-12-04 AT AT97952879T patent/ATE204035T1/de active
- 1997-12-04 DE DE59704260T patent/DE59704260D1/de not_active Expired - Lifetime
- 1997-12-04 WO PCT/EP1997/006786 patent/WO1998026114A1/de not_active Application Discontinuation
- 1997-12-04 US US09/319,423 patent/US6129830A/en not_active Expired - Lifetime
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GB662217A (en) * | 1948-10-13 | 1951-12-05 | Westinghouse Electric Int Co | Improvements in or relating to the electrodeposition of copper |
EP0402896A2 (de) * | 1989-06-13 | 1990-12-19 | LeaRonal (UK) plc | Verfahren zur Stabilisierung eines organischen Zusatzmittels in einer sauren Kupfer-Elektroplattierungslösung |
JPH0967693A (ja) * | 1995-08-29 | 1997-03-11 | Nikko Gould Foil Kk | 電解銅箔の製造方法 |
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Title |
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PATENT ABSTRACTS OF JAPAN vol. 097, no. 007 31 July 1997 (1997-07-31) * |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1249517A1 (de) * | 2000-01-20 | 2002-10-16 | Nikko Materials Company, Limited | Kupferlektroplattierungsflüssigkeit, vorbehandlungsflüssigkeit für kupferelektroplattierung und verfahren zum kupferelektroplattieren |
EP1249517A4 (de) * | 2000-01-20 | 2003-05-02 | Nikko Materials Co Ltd | Kupferlektroplattierungsflüssigkeit, vorbehandlungsflüssigkeit für kupferelektroplattierung und verfahren zum kupferelektroplattieren |
EP1477588A1 (de) * | 2003-02-19 | 2004-11-17 | Rohm and Haas Electronic Materials, L.L.C. | Kupfer Galvanisierungszusammensetzung für wafers |
DE102008031003A1 (de) | 2008-06-30 | 2009-12-31 | Siemens Aktiengesellschaft | Verfahren zum Erzeugen einer CNT enthaltenen Schicht aus einer ionischen Flüssigkeit |
EP2518187A1 (de) | 2011-04-26 | 2012-10-31 | Atotech Deutschland GmbH | Wässriges Säurebad zur elektrolytischen Ablagerung von Kupfer |
WO2012146591A1 (en) | 2011-04-26 | 2012-11-01 | Atotech Deutschland Gmbh | Aqueous acidic bath for electrolytic deposition of copper |
CN110191977A (zh) * | 2017-01-18 | 2019-08-30 | 株式会社杰希优 | 着色用镀敷液以及着色方法 |
CN110191977B (zh) * | 2017-01-18 | 2022-04-26 | 株式会社杰希优 | 着色用镀敷液以及着色方法 |
Also Published As
Publication number | Publication date |
---|---|
ATE204035T1 (de) | 2001-08-15 |
EP0944749A1 (de) | 1999-09-29 |
DE59704260D1 (de) | 2001-09-13 |
CA2275214C (en) | 2007-10-02 |
KR20000053278A (ko) | 2000-08-25 |
DE19653681A1 (de) | 1998-06-18 |
US6129830A (en) | 2000-10-10 |
DE19653681C2 (de) | 2000-04-06 |
JP2001505955A (ja) | 2001-05-08 |
KR100546989B1 (ko) | 2006-01-26 |
EP0944749B1 (de) | 2001-08-08 |
CA2275214A1 (en) | 1998-06-18 |
JP4221064B2 (ja) | 2009-02-12 |
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