US7910216B2 - Process for the production of organosilsesquioxanes - Google Patents
Process for the production of organosilsesquioxanes Download PDFInfo
- Publication number
- US7910216B2 US7910216B2 US11/424,513 US42451306A US7910216B2 US 7910216 B2 US7910216 B2 US 7910216B2 US 42451306 A US42451306 A US 42451306A US 7910216 B2 US7910216 B2 US 7910216B2
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- United States
- Prior art keywords
- hydrolysable
- monomer precursors
- inorganic
- composition
- process according
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 80
- 230000008569 process Effects 0.000 title claims abstract description 78
- 238000004519 manufacturing process Methods 0.000 title description 10
- 239000000178 monomer Substances 0.000 claims abstract description 146
- 239000000203 mixture Substances 0.000 claims abstract description 127
- 239000002243 precursor Substances 0.000 claims abstract description 116
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 86
- 238000009833 condensation Methods 0.000 claims abstract description 64
- 230000005494 condensation Effects 0.000 claims abstract description 62
- 239000007788 liquid Substances 0.000 claims abstract description 50
- 238000006460 hydrolysis reaction Methods 0.000 claims abstract description 39
- 230000007062 hydrolysis Effects 0.000 claims abstract description 37
- 125000000962 organic group Chemical group 0.000 claims abstract description 16
- 229910008051 Si-OH Inorganic materials 0.000 claims abstract description 14
- 229910008326 Si-Y Inorganic materials 0.000 claims abstract description 14
- 229910006358 Si—OH Inorganic materials 0.000 claims abstract description 14
- 229910006773 Si—Y Inorganic materials 0.000 claims abstract description 14
- 238000001035 drying Methods 0.000 claims abstract description 12
- 230000003301 hydrolyzing effect Effects 0.000 claims abstract description 12
- 238000010791 quenching Methods 0.000 claims abstract description 10
- 230000000171 quenching effect Effects 0.000 claims abstract description 10
- 238000000576 coating method Methods 0.000 claims description 40
- 239000011248 coating agent Substances 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 27
- 238000002156 mixing Methods 0.000 claims description 19
- 125000000217 alkyl group Chemical group 0.000 claims description 16
- 239000012467 final product Substances 0.000 claims description 15
- 238000004132 cross linking Methods 0.000 claims description 14
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- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
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- 239000004411 aluminium Substances 0.000 claims description 5
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- 125000003342 alkenyl group Chemical group 0.000 claims description 4
- 125000003118 aryl group Chemical group 0.000 claims description 4
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 4
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- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
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- 125000005843 halogen group Chemical group 0.000 claims description 3
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- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 3
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- NHNBFGGVMKEFGY-UHFFFAOYSA-N nitrate group Chemical group [N+](=O)([O-])[O-] NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 claims description 2
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- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 21
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- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical class OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 7
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 6
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- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 6
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- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- AHGFXGSMYLFWEC-UHFFFAOYSA-N [SiH4].CC(=C)C(O)=O Chemical compound [SiH4].CC(=C)C(O)=O AHGFXGSMYLFWEC-UHFFFAOYSA-N 0.000 description 3
- MWGMEGAYPPQWFG-UHFFFAOYSA-N [SiH4].OC(=O)C=C Chemical compound [SiH4].OC(=O)C=C MWGMEGAYPPQWFG-UHFFFAOYSA-N 0.000 description 3
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- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 3
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- 206010035148 Plague Diseases 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 241000607479 Yersinia pestis Species 0.000 description 2
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- GKXVJHDEWHKBFH-UHFFFAOYSA-N [2-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC=C1CN GKXVJHDEWHKBFH-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
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- 125000001931 aliphatic group Chemical group 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
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- 239000000460 chlorine Substances 0.000 description 2
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- 150000001875 compounds Chemical class 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate group Chemical group [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- PLONEVHFXDFSLA-UHFFFAOYSA-N ethyl hexanoate;tin(2+) Chemical compound [Sn+2].CCCCCC(=O)OCC PLONEVHFXDFSLA-UHFFFAOYSA-N 0.000 description 2
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- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 2
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- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 2
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 2
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- 0 *[Si]([Y])([Y])O[Si](*)([Y])O[Si](*)([Y])[Y].*[Si]([Y])([Y])O[Si](*)([Y])[Y] Chemical compound *[Si]([Y])([Y])O[Si](*)([Y])O[Si](*)([Y])[Y].*[Si]([Y])([Y])O[Si](*)([Y])[Y] 0.000 description 1
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- DVNPFNZTPMWRAX-UHFFFAOYSA-N 2-triethoxysilylethanethiol Chemical compound CCO[Si](CCS)(OCC)OCC DVNPFNZTPMWRAX-UHFFFAOYSA-N 0.000 description 1
- ZHQZOAIVXBJRID-UHFFFAOYSA-N 3-[methyl-bis[(5-methyl-2-propan-2-ylcyclohexyl)oxy]silyl]propane-1-thiol Chemical compound CC(C)C1CCC(C)CC1O[Si](C)(CCCS)OC1C(C(C)C)CCC(C)C1 ZHQZOAIVXBJRID-UHFFFAOYSA-N 0.000 description 1
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- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 1
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- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
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- 125000003368 amide group Chemical group 0.000 description 1
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- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- BSDOQSMQCZQLDV-UHFFFAOYSA-N butan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] BSDOQSMQCZQLDV-UHFFFAOYSA-N 0.000 description 1
- AQWQNOHMVQOYGN-UHFFFAOYSA-N butoxy-diethyl-(2-isocyanatoethyl)silane Chemical compound CCCCO[Si](CC)(CC)CCN=C=O AQWQNOHMVQOYGN-UHFFFAOYSA-N 0.000 description 1
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- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
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- AEAHGYRFZRBAPR-UHFFFAOYSA-N di(propan-2-yl)-propan-2-yloxysilane Chemical compound CC(C)O[SiH](C(C)C)C(C)C AEAHGYRFZRBAPR-UHFFFAOYSA-N 0.000 description 1
- YEMJITXWLIHJHJ-UHFFFAOYSA-N di(propan-2-yloxy)silane Chemical compound CC(C)O[SiH2]OC(C)C YEMJITXWLIHJHJ-UHFFFAOYSA-N 0.000 description 1
- ZMAPKOCENOWQRE-UHFFFAOYSA-N diethoxy(diethyl)silane Chemical compound CCO[Si](CC)(CC)OCC ZMAPKOCENOWQRE-UHFFFAOYSA-N 0.000 description 1
- ZZNQQQWFKKTOSD-UHFFFAOYSA-N diethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OCC)(OCC)C1=CC=CC=C1 ZZNQQQWFKKTOSD-UHFFFAOYSA-N 0.000 description 1
- APUUFJCSYXHJEI-UHFFFAOYSA-N diethoxy-bis(3-isocyanatopropyl)silane Chemical compound O=C=NCCC[Si](OCC)(CCCN=C=O)OCC APUUFJCSYXHJEI-UHFFFAOYSA-N 0.000 description 1
- OOISEBIWKZXNII-UHFFFAOYSA-N diethoxy-ethyl-(3-isocyanatopropyl)silane Chemical compound CCO[Si](CC)(OCC)CCCN=C=O OOISEBIWKZXNII-UHFFFAOYSA-N 0.000 description 1
- ZXPDYFSTVHQQOI-UHFFFAOYSA-N diethoxysilane Chemical compound CCO[SiH2]OCC ZXPDYFSTVHQQOI-UHFFFAOYSA-N 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- PKTOVQRKCNPVKY-UHFFFAOYSA-N dimethoxy(methyl)silicon Chemical compound CO[Si](C)OC PKTOVQRKCNPVKY-UHFFFAOYSA-N 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- YQGOWXYZDLJBFL-UHFFFAOYSA-N dimethoxysilane Chemical compound CO[SiH2]OC YQGOWXYZDLJBFL-UHFFFAOYSA-N 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- CTCOPPBXAFHGRB-UHFFFAOYSA-N ethanolate;germanium(4+) Chemical compound [Ge+4].CC[O-].CC[O-].CC[O-].CC[O-] CTCOPPBXAFHGRB-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- MBGQQKKTDDNCSG-UHFFFAOYSA-N ethenyl-diethoxy-methylsilane Chemical compound CCO[Si](C)(C=C)OCC MBGQQKKTDDNCSG-UHFFFAOYSA-N 0.000 description 1
- DFJDZTPFNSXNAX-UHFFFAOYSA-N ethoxy(triethyl)silane Chemical compound CCO[Si](CC)(CC)CC DFJDZTPFNSXNAX-UHFFFAOYSA-N 0.000 description 1
- JWUYLPBBRZEABA-UHFFFAOYSA-N ethoxy-bis(3-isocyanatopropyl)-methylsilane Chemical compound O=C=NCCC[Si](C)(OCC)CCCN=C=O JWUYLPBBRZEABA-UHFFFAOYSA-N 0.000 description 1
- DOTCGKDDRPVXDY-UHFFFAOYSA-N ethoxy-diethyl-(3-isocyanatopropyl)silane Chemical compound CCO[Si](CC)(CC)CCCN=C=O DOTCGKDDRPVXDY-UHFFFAOYSA-N 0.000 description 1
- HHBOIIOOTUCYQD-UHFFFAOYSA-N ethoxy-dimethyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(C)CCCOCC1CO1 HHBOIIOOTUCYQD-UHFFFAOYSA-N 0.000 description 1
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000008240 homogeneous mixture Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 125000001261 isocyanato group Chemical group *N=C=O 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate group Chemical group C(C(=C)C)(=O)[O-] CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- MDLRQEHNDJOFQN-UHFFFAOYSA-N methoxy(dimethyl)silicon Chemical compound CO[Si](C)C MDLRQEHNDJOFQN-UHFFFAOYSA-N 0.000 description 1
- POPACFLNWGUDSR-UHFFFAOYSA-N methoxy(trimethyl)silane Chemical compound CO[Si](C)(C)C POPACFLNWGUDSR-UHFFFAOYSA-N 0.000 description 1
- BKXVGDZNDSIUAI-UHFFFAOYSA-N methoxy(triphenyl)silane Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(OC)C1=CC=CC=C1 BKXVGDZNDSIUAI-UHFFFAOYSA-N 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- FVZVCSNXTFCBQU-UHFFFAOYSA-N phosphanyl Chemical group [PH2] FVZVCSNXTFCBQU-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- LJTHRDIGXSIYMM-UHFFFAOYSA-N propan-1-olate tantalum(5+) Chemical compound [Ta+5].CCC[O-].CCC[O-].CCC[O-].CCC[O-].CCC[O-] LJTHRDIGXSIYMM-UHFFFAOYSA-N 0.000 description 1
- XPGAWFIWCWKDDL-UHFFFAOYSA-N propan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCC[O-].CCC[O-].CCC[O-].CCC[O-] XPGAWFIWCWKDDL-UHFFFAOYSA-N 0.000 description 1
- ZGSOBQAJAUGRBK-UHFFFAOYSA-N propan-2-olate;zirconium(4+) Chemical compound [Zr+4].CC(C)[O-].CC(C)[O-].CC(C)[O-].CC(C)[O-] ZGSOBQAJAUGRBK-UHFFFAOYSA-N 0.000 description 1
- YHNFWGSEMSWPBF-UHFFFAOYSA-N propan-2-yl-tri(propan-2-yloxy)silane Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)C(C)C YHNFWGSEMSWPBF-UHFFFAOYSA-N 0.000 description 1
- IEKMLKYASCBALX-UHFFFAOYSA-N propoxy(tripropyl)silane Chemical compound CCCO[Si](CCC)(CCC)CCC IEKMLKYASCBALX-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000003586 protic polar solvent Substances 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- UQMOLLPKNHFRAC-UHFFFAOYSA-N tetrabutyl silicate Chemical compound CCCCO[Si](OCCCC)(OCCCC)OCCCC UQMOLLPKNHFRAC-UHFFFAOYSA-N 0.000 description 1
- ZUEKXCXHTXJYAR-UHFFFAOYSA-N tetrapropan-2-yl silicate Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)OC(C)C ZUEKXCXHTXJYAR-UHFFFAOYSA-N 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 239000012974 tin catalyst Substances 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- WOZZOSDBXABUFO-UHFFFAOYSA-N tri(butan-2-yloxy)alumane Chemical compound [Al+3].CCC(C)[O-].CCC(C)[O-].CCC(C)[O-] WOZZOSDBXABUFO-UHFFFAOYSA-N 0.000 description 1
- RLMZPBSDFCTFOU-UHFFFAOYSA-N tri(propan-2-yl)-propan-2-yloxysilane Chemical compound CC(C)O[Si](C(C)C)(C(C)C)C(C)C RLMZPBSDFCTFOU-UHFFFAOYSA-N 0.000 description 1
- DEKZKCDJQLBBRA-UHFFFAOYSA-N tributoxy(butyl)silane Chemical compound CCCCO[Si](CCCC)(OCCCC)OCCCC DEKZKCDJQLBBRA-UHFFFAOYSA-N 0.000 description 1
- MYWQGROTKMBNKN-UHFFFAOYSA-N tributoxyalumane Chemical compound [Al+3].CCCC[O-].CCCC[O-].CCCC[O-] MYWQGROTKMBNKN-UHFFFAOYSA-N 0.000 description 1
- MLXDKRSDUJLNAB-UHFFFAOYSA-N triethoxy(3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,10-heptadecafluorodecyl)silane Chemical compound CCO[Si](OCC)(OCC)CCC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F MLXDKRSDUJLNAB-UHFFFAOYSA-N 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- XVYIJOWQJOQFBG-UHFFFAOYSA-N triethoxy(fluoro)silane Chemical compound CCO[Si](F)(OCC)OCC XVYIJOWQJOQFBG-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- USLHPQORLCHMOC-UHFFFAOYSA-N triethoxygallane Chemical compound CCO[Ga](OCC)OCC USLHPQORLCHMOC-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- JLGNHOJUQFHYEZ-UHFFFAOYSA-N trimethoxy(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)F JLGNHOJUQFHYEZ-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 239000005051 trimethylchlorosilane Substances 0.000 description 1
- VUWVDNLZJXLQPT-UHFFFAOYSA-N tripropoxy(propyl)silane Chemical compound CCCO[Si](CCC)(OCCC)OCCC VUWVDNLZJXLQPT-UHFFFAOYSA-N 0.000 description 1
- OZWKZRFXJPGDFM-UHFFFAOYSA-N tripropoxysilane Chemical compound CCCO[SiH](OCCC)OCCC OZWKZRFXJPGDFM-UHFFFAOYSA-N 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/21—Cyclic compounds having at least one ring containing silicon, but no carbon in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31507—Of polycarbonate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Definitions
- the present invention relates to a process for the production of organosilsesquioxanes, and to the use of a composition comprising organosilsesquioxanes to provide a protective coating on a substrate so as to impart to the substrate resistance to mechanical and chemical damage, while at the same time maintaining excellent optical properties, and as a bulk material.
- Organosilsesquioxanes are silicon-oxygen based frameworks having the general formula (RSiO 1.5 ) n , in which n is an even number ⁇ 4.
- Organosilsesquioxanes which have a very specific structure, for example a compound having the formula (RSiO 1.5 ) 8 has an octahedral cage structure, are referred to in the field as organooligosilsequioxanes or polyhedral oligomeric silsesquiloxanes (or POSS®).
- Organosilsesquioxanes have the potential to offer good mechanical properties, for example as coatings with good abrasion resistance, and can be formulated to have good chemical resistance, for instance as embodied by hydrolytic stability or stability to UV degradation. These and other properties render the organosilsesquioxanes useful as protective coatings for a wide variety of substrates, particularly polymer-based materials, such as acrylic polymers and polycarbonates, which are routinely used as alternatives to glass in many situations where the weight, tendency to shatter or expense of glass contraindicates its use.
- a process for preparing a composition comprising organosilsesquioxanes comprising the following steps:
- each Y group is the same as or different to each other Y group and is selected from chemically-reactive groups such that each Si—Y bond is hydrolysable to form a Si—OH bond, to form inorganic monomers, and allowing partial condensation of the inorganic monomers to form a liquid composition comprising inorganic oligomers;
- compositions may comprise organosilsesquioxanes having one or more organic functionalities and/or having completely or incompletely condensed structures. Furthermore, the compositions may or may not comprise only organo-oligosesquioxanes.
- composition comprising organosilsesquioxanes are obtainable by the above-described process.
- compositions include the application of the above-described compositions to a variety of substrates, the coated substrates themselves, articles made from the above-described compositions, and use of the above-described compositions as bonding agents.
- compositions of the present invention are capable of providing coatings that confer abrasion resistance, hydrolytic stability and stability to UV degradation to a wide variety of substrates, particularly plastics substrates, and can be fine tuned to have other properties depending upon the nature of the functionalities incorporated therein and the conditions utilised in their preparation.
- the process of the present invention involves a two-step hydrolysis/condensation reaction and subsequent drying, and optionally curing, of the resulting composition.
- hydrolysable inorganic monomer precursors of which at least 50 mole % have the formula RSiY 3 (referred to as “first” hydrolysable monomer precursors”), are partially hydrolysed and allowed to undergo some condensation, but not complete condensation, to form inorganic oligomers that will form the building blocks for the final organosilsesquioxanes molecules.
- the inorganic oligomers are quenched by addition to, or addition thereto, of a relatively large amount of water, which has the effect of causing rapid condensation of the inorganic oligomers.
- degree of condensation may vary somewhat, up to essentially complete condensation of those oligomers.
- composition produced is a matter for conjecture, but is not important given the beneficial mechanical and chemical properties achieved.
- an “hydrolysable inorganic monomer precursor” we mean any inorganic molecule which is activated by hydrolysis to a polymerisable inorganic monomer, which, on polycondensation with similar hydrolysed or partially hydrolysed monomers, forms inorganic oligomers, and ultimately an inorganic network.
- the term “inorganic” is used to denote the presence in the precursor molecule of an inorganic element, typically one giving rise to an oxide ceramic material, e.g. silicon, aluminium, titanium, zirconium, yttrium, or other transition metals.
- the first hydrolysable inorganic monomer precursors, RSiY 3 may be selected from a variety of materials. However, it is critical that the R—Si bond should not be hydrolysable, as otherwise the organic group R may be lost to the final structure. It is preferred that group R itself is chemically stable, and in particular that it is stable to hydrolysis in the presence of water or moisture.
- Suitable examples of the group R include hydrogen, and optionally substituted (cyclo)alkyl, aryl, alkenyl, amido, epoxy, (meth)acrylic, styrenic, nitrile, anhydride, ester, phosphino, halide, amino, mercapto and cyanate groups, and mixtures thereof.
- Preferred R groups are selected from (cyclo)alkyl, aryl and alkenyl groups, optionally substituted with groups selected tram epoxy, vinyl, (meth)acrylic and cyanate groups.
- the size of the R group be selected so that the final composition is liquid in nature, enabling its application as a coating composition.
- the Y groups in the first hydrolysable inorganic monomer precursors may be the same as or different to one another, although typically they are the same.
- the Si—Y bond is a highly reactive bond which readily undergoes hydrolysis to form a silanol group, ie. Si—OH.
- Suitable examples of Y groups are alkoxy, acetoxy groups, amine and nitrate groups and halogen atoms.
- condensation may proceed in a heterofunctional manner when different hydrolysable inorganic monomer precursors are present, as is discussed in more detail below, such as shown in the following two reaction sequences: —Si—OH+ClSi— ⁇ —Si—O—Si—+HCl —Si—OH+ROSi— ⁇ —Si—O—Si—+ROH
- the process of the present invention may involve the use of a single type of hydrolysable inorganic monomer precursor, having the formula RSiY 3 .
- different hydrolysable inorganic monomer precursors may be used, for instance differing in the nature and/or number of organic groups R and/or the nature and/or number of the hydrolysable groups Y.
- first hydrolysable inorganic monomer precursors may be used having different R groups, for instance RSiY 3 , R 1 SiY 3 , etc., the R and R 1 groups being selected to provide particular mechanical and/or chemical properties in the final product.
- the present invention is not limited to the use of two different types of first hydrolysable monomer precursors, but may involve the use of more than two different types of the monomer precursors, provided that adequate control over the process is maintained so as to achieve the desired level of incorporation of the different R groups into the final product.
- the process may involve the use of hydrolysable inorganic monomer precursors differing in the number of hydrolysable groups Y.
- hydrolysable inorganic monomer precursors having the general formula R n SiY 4-n , in which n is 0, 2 or 3, R is an organic group, for instance selected from those groups given for R above, the R—Si bond is a non-hydrolysable bond, and the R groups are the same as or different to one another, and each Y group is the same as or different to each other Y group and is selected from chemically-reactive groups such that each Si—Y bond is hydrolysable to form a Si—OH bond, and mixtures of such monomer precursors, may be used in addition to the first hydrolysable monomer precursors, RSiY 3 .
- these additional monomer precursors are termed “second hydrolysable inorganic monomer precursors”.
- the nature of the groups R and Y are as defined above for the first organic monomer precursors.
- the groups R and/or Y in the second hydrolysable inorganic monomer precursors may be the same as or different to the groups R and/or Y in the first hydrolysable inorganic monomer precursors.
- first hydrolysable inorganic monomer precursors and second hydrolysable inorganic monomer precursors having the formula RSiY 2 or R 3 SiY include:
- alkyl group may be replaced by cycloalkyl group, an aryl group or an alkenyl group, and may optionally be substituted preferably with a (meth)acrylate group or an epoxy group.
- hydrolytic stability is desired in the final product, those hydrolysable monomer precursors having hydrolysable R groups should be avoided.
- Suitable examples of second hydrolysable inorganic monomer precursors having the formula SiY include silicon tetra-alkoxides, such as tetramethoxysilane, tetramethoxysilane, tetraisopropoxy-silane and tetrabutoxysilane.
- the process may also, or alternatively, involve the use of hydrolysable inorganic monomer precursors containing an inorganic atom other than silicon, for instance having the formula MY n , in which M is typically a metal, n is the valency of the metal, and each Y group is the same or different to one another and is selected from chemically-reactive groups such that each M-Y bond is hydrolysable to a M-OH bond.
- Suitable examples of such materials include:
- the process may also, or alternatively, involve the use of hydrolysable inorganic monomer precursors of the generic formula (R 2 Si) x Y 2 , in which x ⁇ 1, the R—Si bond is a non-hydrolysable bond and R is defined above (and each R group may be the as as or different to each other R group) and Y is a chemically reactive group with each Si—Y bond being hydrolysable to Si—OH.
- Suitable examples of the group Y include chlorine, acetoxy, amine, oxime (ie., R 2 C ⁇ NOSi) and alkoxy,
- the integer x may vary from 1 to a large number, for instance up to or even greater than 100, giving rise no multi-silicon polymers.
- hydrolysable inorganic monomer precursors which differ in the number of hydrolysable groups present
- the hydrophilic/hydrophobic character of the R groups(s) will determine the behaviour of the final product when exposed to water. This behaviour can be modified by appropriate selection of solvent. For example, the tendency towards the repulsion of water of an aliphatic hydrocarbon can be changed by the use of a protic solvent, such as alcohol, compared to an aprotic one, such as tetrahydrofuran.
- a protic solvent such as alcohol
- hydrolysis of the different hydrolysable inorganic monomer precursors be conducted separately so as to avoid competition for the water molecules present, which may otherwise result in an inhomogeneous or undesirable distribution or monomers, and in particular the organic groups associated therewith, in the final product.
- the different inorganic oligomers formed are mixed together prior to subjecting to the quenching step that is to follow.
- water is either added to the hydrolysable inorganic monomer precursors, or is synthesised in situ.
- hydrolysis is achieved by formation of an homogeneous mixture with water and, optionally, an organic solvent.
- the precursors may be dissolved in an organic solvent and water added to the resulting solution in a controlled manner, to avoid the uncontrolled development of agglomerations of partially-hydrolysed molecules.
- Suitable organic solvents include low boiling point organic liquids, for instance having a boiling point lower than 100° C., such as alcohols.
- the mixture of water and hydrolysable monomer precursors is mixed to ensure that as many precursor molecules are exposed to water as possible, thereby achieving as homogeneous hydrolysis and condensation as possible.
- water is to be synthesized in situ in the reaction mixture, this can be achieved, for example, by adding an alcohol to the hydrolysable inorganic monomer precursors and then a weak acid, for example acetic acid, again in a controlled manner.
- a weak acid for example acetic acid
- a catalyst may be used to initiate hydrolysis of the hydrolysable inorganic monomer precursors, provided that the catalyst does not react with the inorganic monomer precursors, or affect the nature of the species formed on hydrolysis.
- Suitable catalysts include mineral acids such as hydrochloric acid, sulphuric acid and nitric acid. Only a small amount of acid is needed for this purpose. Although, depending upon the nature of the inorganic monomer precursors, hydrolysis may proceed spontaneously.
- the amount of water used for hydrolysis should generally be sufficient to hydrolyse at least one of the hydrolysable bonds present in each of the inorganic monomer precursor molecules. However, preferably the amount of water, and the conditions of the hydrolysis reaction, are selected so as to achieve hydrolysis of only one or at most two of the hydrolysable bonds present in the first hydrolysable inorganic monomer precursors, as this will dictate the types or structure that are achieved in the second step of the process.
- part of the first step of the process involves at least partial condensation, but not complete condensation, of the monomers formed on hydrolysis to form inorganic oligomers.
- the degree of condensation which takes place may be determined by, for example, NMR.
- the degree of condensation is such that the majority of oligomers formed from first hydrolysable monomer precursors have one of the following formulae in which each or some of the R groups may be the same or different:
- oligomers More preferably a majority of the oligomers have the formula (I), and most preferably most (for instance at least 80 mole % or even at least 90 mole %) of the oligomers have the formula (I).
- the first, hydrolysis, step of the process can vary in duration, for instance it may take less than an hour or many days, depending upon the properties required in the final product. Longer durations are believed no result in greater connectivity of the resulting inorganic network, and thus greater molecular weight.
- the mixture is quenched into water to fully hydrolyse the species present and to create conditions that favour complete hydrolysis and further condensation.
- the detailed nature of the structures created depends upon the nature and concentration of the hydrolysable inorganic monomer precursors used, the solvent, the initial hydrolysing conditions and the co-condensation conditions (time, temperature, pH).
- the hydrolysis and condensation reactions of the first step of the process may be allowed to proceed for a period ranging from a matter of minutes, typically at least 10 minutes, to 24 hours or more.
- Quenching can be achieved either by adding water to the liquid composition obtained in the first step of the process, or by adding the liquid composition to water, preferably in a single step.
- the volume of water used in the quenching step, in combination with any water used in the first step of the process and any water liberated as a result or condensation in than step, should be greater than the stoichiometric amount of water required to achieve total hydrolysis (ie. of all hydrolysable bonds) of all the hydrolysable inorganic monomer precursors.
- the amount of water is at least twice, and more preferably at least five times, this stoichiometric amount. Further condensation is then allowed to proceed, with stirring, typically for a matter of hours up to a number of days, depending upon the properties required in the final product, and whether it is desired that this product should be only partially condensed or essentially completely condensed.
- drying includes the removal of any free water and volatiles, for instance by heating to elevated temperature, typically in the range 40 co 80° C.
- the dried product is then ready for use, for instance as a coating composition, or in bulk form, or it may be further modified prior to use.
- the product may be cross-linked (or cured) and/or modified to include further organic character to thereby modify the properties of the final product, and/or it may be dehydrated, to reduce or prevent further reaction during use.
- Solvent may be added to the composition, to improve shelf-life.
- Cross-linking, or curing, of the product may be achieved through the dependent organic R groups, and/or via residual silanols, to form a variety of 3-dimensional structures.
- Cross-linking of the organic groups may be achieved by any of the conventional means, for instance by the use of suitable cross-linking reagents or processing conditions, or both, selected to promote intermolecular cross-linking rather than intramolecular cross-linking.
- suitable cross-linking reagents or processing conditions, or both selected to promote intermolecular cross-linking rather than intramolecular cross-linking.
- epoxy-containing R groups may be cross-linked, or further polymerised, using reagents which act as accelerators or hardeners, for instance amines, or using Lewis acids.
- the residual silanols can be made to undergo self-condensation by the use of suitable condensation catalysts, such as triethylamine or tin catalysts, such as tin (II) ethyl hexanoate, or by the selection of suitable reaction conditions known in the art.
- suitable condensation catalysts such as triethylamine or tin catalysts, such as tin (II) ethyl hexanoate, or by the selection of suitable reaction conditions known in the art.
- condensation of residual silanols may be achieved by the addition of further silanol-containing species or other species condensable with the residual silanols already present in the product.
- Suitable materials are those having the generic formula R n SiY′ 4-n , in which n is 0 to 3, R is an organic group as defined above, with each R—Si bond being a non-hydrolysable bond and each R group being the same as or different to each other R group, and Y′ is a species that will allow siloxane formation through silanol condensation or other routes, with each Y′ group being the same as or different to each other Y′ group.
- silanol-containing species for use in said condensation may be prepared by hydrolysis of hydrolysable inorganic monomer precursors having the generic formula R n SiY′ 4-n , in which each Si—Y′ bond is hydrolysable to Si—OH, with Y′ being selected, for instance, from those groups given for Y above in the context of first hydrolysable inorganic monomer precursors.
- Such hydrolysis results in species such as, but not limited to, R 2 Si(OH) 2 and R 3 Si(OH).
- these silanol-containing species will be added to the dried product in the presence of a condensation agent, such as tin (II) ethyl hexanoate, to promote condensation.
- a condensation agent such as tin (II) ethyl hexanoate
- Another option mentioned above to effect condensation of the residual silanols is to add other species condensable with those silanols and having the generic formula R n SiY′ 4-n , in which the Si—Y′ bond might not be hydrolysable directly, or at all, to Si—OH.
- species include materials commonly used as derivatising agents to render glass surfaces hydrophobic, and examples of such materials are well known in the art.
- materials having the generic formula R 3 SiY′ are suitable for this purpose, in which R is as defined above and Y′ is, for instance, chlorine.
- one particular example or such a derivatising agent is trimethylchlorosilane.
- Yet another option to effect silanol condensation is to use a material having the generic formula (R 2 Si) x Y 2 , as defined above in the context of the second hydrolysable inorganic monomer precursors, and to hydrolyse this prior to addition to the dried product.
- this may be achieved via at least partial dehydration, and preferably substantially complete dehydration.
- Dehydration is achieved by any of the conventional methods known in the art.
- the dried product may be dissolved in any suitable solvent, for instance tetrahydrofuran (THF), and free water removed via a molecular sieve.
- THF tetrahydrofuran
- dehydration can be further aided by the use of a condensation catalyst, such as triethylamine dissolved in THF and placed over a molecular sieve. After a period of dehydrating the dried product, the volatile solvent is evaporated off to leave a fully or partially dehydrated product.
- dehydration has been described above as conducted on the dried product, at least partial dehydration may be conducted at earlier stages in the process.
- the process of the present invention is capable of giving rise to a wide variety of product structures.
- the tendency towards a “cage” or “ladder” structure in the final product is controlled by the process parameters, for instance the type and/or concentration of the oligomers formed; the solvent employed; the time and temperature of the mixing step; the concentration during the quenching step; the time and temperature under which quenching is carried out; and the method of recovering the final product.
- the product can still be considered to be reactive, which may or may not be acceptable according co the application to which the material is to be put. If this is unacceptable, various options to achieve further cross-linking, and to reduce reactivity, are described above.
- cross-linking through organic (ie. R) groups may be initiated prior to coating, and taken to completion either prior to coating or after coating, on to a substrate, for instance using known irradiation (eg. UV), thermal or chemical methods. If cross-linking is taken to completion prior to coating it may be desirable to dissolve the composition in a solvent in order to coat the composition on to a substrate, and then to evaporate the solvent in order to dry the coated composition.
- organic (ie. R) groups may be initiated prior to coating, and taken to completion either prior to coating or after coating, on to a substrate, for instance using known irradiation (eg. UV), thermal or chemical methods.
- the product obtained on drying may be mixed with an organic monomer or oligomer (generally referred to in the following as “polymerisable organic species”), which may then be further polymerised, or an organic polymer, such as a latex.
- an organic monomer or oligomer generally referred to in the following as “polymerisable organic species”
- the nature of the polymerisable organic species is selected according to the properties required in the final product. Typically, the polymerisable organic species will be selected co provide strength and abrasion-resistance and, where desired, transparency. Furthermore, if chemical resistance is required, for instance resistance to swelling or other damage on contact with a solvent, it is desirable to employ polymerisable organic species capable of forming two-dimensional or three-dimensional, i.e. cross-linked, polymer networks. Such polymerisable organic species may be considered as having difunctional or trifunctional reactivity, in that they possess two or more reactive sites available for polymerization.
- preferred polymerisable organic species are those which, upon polymerization, form thermosetting polymers.
- suitable polymerisable organic species include carbonates, esters such as terephthalates, epoxy-containing materials, methyl(meth)acrylates, urethanes, and other difunctional or trifunctional monomers such as some urethane acrylates, unsaturated aliphatic hydrocarbons, and mixtures thereof.
- Urethane precursors, such as isocyanates or diisocyanates and polyols, and urethane acrylates are particularly preferred, Organometallic monomers may also be used, but in this case they will not contain hydrolysable bonds.
- the polymerisable organic species polymerise at relatively low temperature, e.g. lower than 150° C., after addition of a suitable initiator, or by irradiation, e.g. with UV or IR light, or bombardment with X-rays or electron beams, so as to be applicable as coatings for thermoplastic materials or thermosetting materials having low melting points.
- Polymerisation of the polymerisable organic species may be initiated in any conventional manner, which will be determined by the nature of the polymerisable organic species. It will normally involve the use of a polymerization initiator.
- thermoplastic or thermosetting substrates relatively low temperatures should be used, typically lower than 150° C., and more typically in the range 30 to 80° C. Where a chemical polymerization initiator is used, this may mean delaying addition of this until just prior to, or possibly during, the coating operation.
- the proportion of organic polymer incorporated into the final product depends on the properties required in the final products.
- the properties of the final product may be further adjusted through the use of additives conventional in the art.
- the composition When used as a coating composition, the composition may be applied to a substrate by any conventional means, for example dipping, spraying, roll coating or brushing.
- the composition may be applied to a wide variety of substrates, and is particularly suitable coating polymeric materials having relatively low melting points, for example of 150° C. or lower.
- suitable coating polymeric materials include thermoplastic materials and thermosetting materials such as polycarbonates, polyesters such as polyacrylates and polyterephthalates, polyurethanes, and polyacrylics.
- the enhanced scratch/abrasion and chemical resistance imparted no these materials by way of the coatings of the present invention allows them to be considerably more widely utilised than they are at present.
- the coating composition may also be used to coat substrates selected from glass, metals including soft metals such as aluminium, brass and silver, ceramic materials, and natural materials such as leather and wood, or synthetic substitutes for these materials. It finds particular use as a coating for glass, and glass substitutes. For example, it may be used to coat building or vehicle, windows and windscreens, e.g. for automobile, aircraft and trains; spectacle lenses; camera lenses; protective visors; optical filters and light casings, e.g. headlamp clusters; compact discs; display screens, e.g. in personal computers and mobile phones; and to protect white goods, e.g. refrigerators and washing machines, and brown goods e.g. audiovisual equipment.
- composition of the present invention also finds use as a catalyst coating on a variety of substrates.
- the composition should not be cross-linked, so as to maintain its liquid nature.
- composition of the present invention also finds use in bonding together at least two articles.
- the composition may be applied to the surface of one or each article, the surfaces to be bonded brought together, and the composition cured to form a secure bond.
- the process of the present invention is also capable of producing materials which rind use as bulk materials rather than as coatings.
- the material may be shaped, for instance by moulding, or otherwise formed into a wide variety of different articles.
- the present invention is further illustrated by the following Examples.
- Example 1 10.0 g of the resin produced in Example 1 was diluted with 30.0 g of IMS and 0.1 g of the photoinitiator Irgacure 184 was added. After thorough mixing this solution was flow coated onto a Lexan polycarbonate plaque. The coated plaque was dried in an air atmosphere for 5 minutes at 50° C. and then cured using UV light.
- Example 1 9.0 g of the resin produced in Example 1 was diluted with 27.0 g of industrial methylated spirit and stirred to give an homogeneous solution. To this solution 1.0 g of aliphatic urethane acrylate 260GP25 was added and 0.1 g of the photoinitiator Irgacure 184. After stirring to achieve an homogeneous solution, the liquid was deposited by flow coating onto a Lexan polycarbonate plaque. The coated plaque was dried in an air atmosphere for 5 minutes at 50° C. and then cured using UV light.
- Example 4 10.0 g of the resin produced in Example 4 was diluted with 30.0 g of IMS and 0.1 g of the photoinitiator Irgacure 184 was added, as was 0.1 g of FC4430 (from 3M Corporation) as a flow agent. After thorough mixing this solution was flow coated onto a Lexan polycarbonate plaque. The coated plaque was dried in an air atmosphere for 5 minutes at 50° C. and then cured using UV light.
- Example 7 5.0 g of the resin produced in Example 7 was diluted in 15.0 g of IMS and stirred to give an homogeneous liquid. To this liquid was added 1.08 g of diaminooctane. The mixture was vigorously stirred for 5 minutes and then deposited as a coating onto a Lexan polycarbonate plaque. The coated plague was then dried and cured in an air atmosphere at 130° C. for 18 hours.
- Example 7 5.0 g of the resin produced in Example 7 was diluted in 15.0 g of IMS and stirred to give an homogeneous liquid. To this liquid was added 1.02 g of xylylenediamine. The mixture was vigorously stirred for 5 minutes and then deposited as a coating onto a Lexan polycarbonate plaque. The coated plaque was then dried and cured in an air atmosphere at 130° C. for 18 hours.
- Component A and Component B were separately made up.
- Component A 7.0 g of 3-glycidoxypropyltrimethoxysilane was placed in a beaker, and an intimate mixture of 5.5 g of IMS and 0.80 g of water was added thereto.
- Component B 40.0 g of phenyltrimethoxysilane was placed in a beaker, and an intimate mixture of 37.1 g of IMS and 5.45 g of water was added thereto.
- Components A and B were the stirred, separately, in sealed beakers for about one hour, after which they were combined and stirred for about 4 hours, again in a sealed beaker. This mixture was stirred vigorously for 4 hours, and was then poured (or quenched) into 192 g of distilled water. The quenched mixture was stirred vigorously for at least 18 hours before being poured into a large polypropylene container and heated at approximately 50° C. for approximately 6 hours to remove the water. The remaining viscous liquid (resin) was then recovered.
- Example 10 5.0 g of the resin produced in Example 10 was diluted in 15.0 g of IMS and stirred to give an homogeneous liquid. To this liquid was added 0.17 g of diaminooctane. The mixture was vigorously stirred for 5 minutes and then deposited as a coating onto a Lexan polycarbonate plaque. The coated plaque was then dried and cured in an air atmosphere at 130° C. for 18 hours.
- Example 12 5.0 g of the resin produced in Example 12 was diluted in 15.0 g of IMS and stirred to give an homogeneous liquid. To this liquid was added 0.20 g of diaminooctane. The mixture was vigorously stirred for 5 minutes and then deposited as a coating onto a Lexan polycarbonate plaque. The coated plaque was then dried and cured in an air atmosphere at 130° C. for 18 hours.
- Component A and Component B were separately made up.
- Component A 40.0 g of 3-glycidoxypropyltrimethoxy-silane was placed in a beaker, and an intimate mixture of 31.1 g of IMS and 4.57 g of water was added thereto.
- Component B 5.0 g of tetraethoxysilane was placed in a beaker, and an intimate mixture of 4.4 g of IMS and 0.65 g of water was added thereto.
- Components A and B were the stirred, separately, in sealed beakers for about one hour, after which they were combined and stirred for about 4 hours, again in a sealed beaker. This mixture was stirred vigorously for 4 hours, and was then poured (or quenched) into 172 g of distilled water. The quenched mixture was stirred vigorously for at least 18 hours before being poured into a large polypropylene container and heated at approximately 50° C. for approximately 6 hours to remove the water. The remaining viscous liquid (resin) was then recovered.
- Example 4 1.5 g of the resin produced in Example 4 was dissolved in a mixture of 0.25 g triethylamine and 4.59 of THF. The solution was then placed over dried 4A type molecular sieve. After 24 hours, the solvent was evaporated off and the dehydrated resin was dissolved in 4.5 g IMS and 0.1 g of photoinitiator Irgacure 184 was added. After thorough mixing, the solution was then deposited by flow coating onto a Lexan polycarbonate plague. The coated plaque was air dried for five minutes and then cured using UV light.
- Example 4 1.5 g of the resin produced in Example 4 was dissolved in a mixture of 0.25 g triethylamine, 4.5 g of THF and 0.25 g of chlorotrimethylsilane. After 24 hours, the mixture was filtered through a 1 ⁇ m filter to remove the solid chloride salt. The solvent was evaporated off and the resin was dissolved in 4.5 g IMS and 0.1 g of photoinitiator Irgacure 184 was added. After thorough mixing the solution was then deposited by flow coating onto a Lexan polycarbonate plaque. The coated plaque was air dried for five minutes and then cured using UV light.
- Example 4 1.5 g of the resin produced in Example 4 was dissolved in a mixture of 0.25 g triethylamine, 4.5 g of THF and 0.5 g of diethoxydimethylsilane. The solution was then placed over dried 4A type molecular sieve. After 24 hours, the solvent was evaporated off and the resin was dissolved in 4.5 g IMS and 0.1 g or photoinitiator Irgacure 184 was added. After thorough mixing the solution was then deposited by flow coating onto a Lexan polycarbonate plaque. The coated plaque was air dried for five minutes and then cured using UV light.
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Priority Applications (14)
Application Number | Priority Date | Filing Date | Title |
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EP06794701A EP1957563B1 (en) | 2005-11-28 | 2006-10-09 | Process for the production of organosilsesquioxanes |
PCT/GB2006/003750 WO2007060387A1 (en) | 2005-11-28 | 2006-10-09 | Process for the production of organosilsesquioxanes |
CN2006800514850A CN101365736B (zh) | 2005-11-28 | 2006-10-09 | 制备有机硅倍半氧烷的方法 |
BRPI0619047-2A BRPI0619047A2 (pt) | 2005-11-28 | 2006-10-09 | processo para a formação de uma composição que compreende organossilsesquioxanos, composição, e, processos para fornecer um revestimento sobre um substrato, e para a união de pelo menos dois artigos |
AT06794701T ATE466041T1 (de) | 2005-11-28 | 2006-10-09 | Verfahren zur herstellung von organosilsesquioxanen |
RU2008126275A RU2414484C2 (ru) | 2005-11-28 | 2006-10-09 | Способ получения органосилсесквиоксанов |
CA2632254A CA2632254C (en) | 2005-11-28 | 2006-10-09 | Process for the production of organosilsesquioxanes |
KR1020087015575A KR20080072751A (ko) | 2005-11-28 | 2006-10-09 | 유기실세스퀴옥산의 제조방법 |
DE602006014021T DE602006014021D1 (de) | 2005-11-28 | 2006-10-09 | Verfahren zur herstellung von organosilsesquioxanen |
JP2008541804A JP5089602B2 (ja) | 2005-11-28 | 2006-10-09 | オルガノシルセスキオキサンの製造方法 |
PL06794701T PL1957563T3 (pl) | 2005-11-28 | 2006-10-09 | Sposób wytwarzania organosilseskwioksanów |
AU2006318931A AU2006318931B2 (en) | 2005-11-28 | 2006-10-09 | Process for the production of organosilsesquioxanes |
TW95140014A TWI401295B (zh) | 2005-11-28 | 2006-10-30 | 用以製造有機倍半矽氧烷的方法 |
JP2012117582A JP2012197443A (ja) | 2005-11-28 | 2012-05-23 | オルガノシルセスキオキサンの製造方法 |
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GB0524189A GB0524189D0 (en) | 2005-11-28 | 2005-11-28 | Process for the production of organosilsesquioxanes |
GB0524189.8 | 2005-11-28 |
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US20070122636A1 US20070122636A1 (en) | 2007-05-31 |
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US (1) | US7910216B2 (ja) |
EP (1) | EP1957563B1 (ja) |
JP (2) | JP5089602B2 (ja) |
KR (1) | KR20080072751A (ja) |
CN (1) | CN101365736B (ja) |
AT (1) | ATE466041T1 (ja) |
AU (1) | AU2006318931B2 (ja) |
BR (1) | BRPI0619047A2 (ja) |
CA (1) | CA2632254C (ja) |
DE (1) | DE602006014021D1 (ja) |
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PL (1) | PL1957563T3 (ja) |
RU (1) | RU2414484C2 (ja) |
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US20130131284A1 (en) * | 2010-03-01 | 2013-05-23 | Evonik Degussa Gmbh | Polyhedral oligomeric silsesquioxane (poss)-linked ligands |
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US20100003493A1 (en) * | 2007-10-10 | 2010-01-07 | Ppg Industries Ohio, Inc. | Radiation curable coating compositions, related coatings and methods |
US20110045725A1 (en) * | 2009-08-24 | 2011-02-24 | Ppg Industries Ohio, Inc. | Film-forming compositions, related processes and coated substrates |
GB0922285D0 (en) | 2009-12-22 | 2010-02-03 | Rolls Royce Plc | Hydrophobic surface |
GB0922308D0 (en) | 2009-12-22 | 2010-02-03 | Rolls Royce Plc | Hydrophobic surface |
US8927652B2 (en) * | 2012-12-07 | 2015-01-06 | Ppg Industries Ohio, Inc. | Coating compositions for food and beverage containers |
JP6213126B2 (ja) * | 2012-10-25 | 2017-10-18 | セントラル硝子株式会社 | 接着性組成物およびその接着方法、および接着後の剥離方法 |
WO2014119282A1 (ja) * | 2013-01-29 | 2014-08-07 | 日本曹達株式会社 | 有機シラン系組成物 |
ES2819077T3 (es) | 2013-08-09 | 2021-04-14 | Leibniz Institut Fuer Neue Mat Gemeinnuetzige Gmbh | Formación de coloides metálicos modificados en superficie |
KR102035831B1 (ko) | 2016-03-17 | 2019-11-18 | 주식회사 엘지화학 | 다면체 올리고머 실세스퀴옥산 및 그 제조 방법 |
RU2643367C1 (ru) * | 2017-05-11 | 2018-02-01 | Акционерное общество "Государственный Ордена Трудового Красного Знамени научно-исследовательский институт химии и технологии элементоорганических соединений" (АО "ГНИИХТЭОС") | Способ получения метил(фенил) силоксановых олигомеров с концевыми трифенилсилильными группами |
CN109880561A (zh) * | 2017-12-06 | 2019-06-14 | 上海本诺电子材料有限公司 | 一种环氧树脂灌封胶组合物及其制备方法 |
CN109111124A (zh) * | 2018-09-12 | 2019-01-01 | 江苏世泰实验器材有限公司 | 一种防粘连盖玻片及其制备方法 |
US20210187781A1 (en) * | 2019-12-19 | 2021-06-24 | Woodholdings Environmental, Inc. | Method of improving the hydrophobic properties of cellulosic materials without leaving an acidic residue |
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- 2005-11-28 GB GB0524189A patent/GB0524189D0/en not_active Ceased
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- 2006-10-09 AU AU2006318931A patent/AU2006318931B2/en not_active Ceased
- 2006-10-09 EP EP06794701A patent/EP1957563B1/en not_active Not-in-force
- 2006-10-09 DE DE602006014021T patent/DE602006014021D1/de active Active
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- 2006-10-09 PL PL06794701T patent/PL1957563T3/pl unknown
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US9029483B2 (en) * | 2010-03-01 | 2015-05-12 | Evonik Degussa Gmbh | Polyhedral oligomeric silsesquioxane (POSS)-linked ligands |
Also Published As
Publication number | Publication date |
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CA2632254A1 (en) | 2007-05-31 |
ATE466041T1 (de) | 2010-05-15 |
WO2007060387A1 (en) | 2007-05-31 |
GB0524189D0 (en) | 2006-01-04 |
US20070122636A1 (en) | 2007-05-31 |
RU2008126275A (ru) | 2010-01-10 |
KR20080072751A (ko) | 2008-08-06 |
JP5089602B2 (ja) | 2012-12-05 |
JP2012197443A (ja) | 2012-10-18 |
TWI401295B (zh) | 2013-07-11 |
CA2632254C (en) | 2015-11-17 |
AU2006318931A1 (en) | 2007-05-31 |
AU2006318931B2 (en) | 2011-01-20 |
EP1957563B1 (en) | 2010-04-28 |
BRPI0619047A2 (pt) | 2012-07-03 |
JP2009517493A (ja) | 2009-04-30 |
PL1957563T3 (pl) | 2010-10-29 |
CN101365736B (zh) | 2012-06-20 |
CN101365736A (zh) | 2009-02-11 |
DE602006014021D1 (de) | 2010-06-10 |
RU2414484C2 (ru) | 2011-03-20 |
EP1957563A1 (en) | 2008-08-20 |
TW200722481A (en) | 2007-06-16 |
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