US7318322B2 - Liquid cooling system for a rack-mount server system - Google Patents

Liquid cooling system for a rack-mount server system Download PDF

Info

Publication number
US7318322B2
US7318322B2 US10/776,231 US77623104A US7318322B2 US 7318322 B2 US7318322 B2 US 7318322B2 US 77623104 A US77623104 A US 77623104A US 7318322 B2 US7318322 B2 US 7318322B2
Authority
US
United States
Prior art keywords
liquid coolant
rack
heat
server
mount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active, expires
Application number
US10/776,231
Other languages
English (en)
Other versions
US20040221604A1 (en
Inventor
Shigemi Ota
Shinji Matsushita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Assigned to HITACHI, LTD. reassignment HITACHI, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MATSUSHITA, SHINJI, OTA, SHIGEMI
Publication of US20040221604A1 publication Critical patent/US20040221604A1/en
Application granted granted Critical
Publication of US7318322B2 publication Critical patent/US7318322B2/en
Assigned to HITACHI CONSUMER ELECTRONICS CO., LTD. reassignment HITACHI CONSUMER ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HITACHI, LTD.
Assigned to HITACHI MAXELL, LTD. reassignment HITACHI MAXELL, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HITACHI CONSUMER ELECTRONICS CO, LTD., HITACHI CONSUMER ELECTRONICS CO., LTD.
Assigned to MAXELL, LTD. reassignment MAXELL, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HITACHI MAXELL, LTD.
Assigned to MAXELL HOLDINGS, LTD. reassignment MAXELL HOLDINGS, LTD. MERGER (SEE DOCUMENT FOR DETAILS). Assignors: MAXELL, LTD.
Assigned to MAXELL, LTD. reassignment MAXELL, LTD. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: MAXELL HOLDINGS, LTD.
Active legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04G—SCAFFOLDING; FORMS; SHUTTERING; BUILDING IMPLEMENTS OR AIDS, OR THEIR USE; HANDLING BUILDING MATERIALS ON THE SITE; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTING BUILDINGS
    • E04G17/00—Connecting or other auxiliary members for forms, falsework structures, or shutterings
    • E04G17/06—Tying means; Spacers ; Devices for extracting or inserting wall ties
    • E04G17/065—Tying means, the tensional elements of which are threaded to enable their fastening or tensioning
    • E04G17/0655—Tying means, the tensional elements of which are threaded to enable their fastening or tensioning the element consisting of several parts
    • E04G17/0658—Tying means, the tensional elements of which are threaded to enable their fastening or tensioning the element consisting of several parts remaining completely or partially embedded in the cast material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Definitions

  • the present invention relates to a cooling method for a rack-mount server system in which a plurality of computers are stacked. More particularly, the present invention relates to a technique effectively applied to the liquid cooling system in which a coolant is circulated.
  • the rack-mount system has been the mainstream in the system configuration, storage, and installation of a data processing system such as a server.
  • the devices with specific functions are mounted so that they are stacked on each other in a rack cabinet formed based on a particular standard, and the rack-mount system has the advantages as follows: the devices can be freely selected and arranged, the rack-mount server system is excellent in the flexibility and extensibility of the system configuration, and the space occupied by the system can be reduced.
  • FIG. 15 is a perspective view showing the state where the server modules are mounted in the rack cabinet of the conventional rack-mount server system, which is examined as a background of the present invention by the inventors.
  • a plurality of server modules are mounted in the rack cabinet 10 .
  • the rack cabinet 10 is composed of four posts to be the outer frame and four mount angles 11 on which the server modules are mounted.
  • the device housing 1 of the server module is attached to the mount angles 11 via metal brackets 8 .
  • a main substrate 2 is mounted in the device housing 1 , and heat-generating components 3 such as CPU (Central Processing Unit) and LSI (Large Scale Integrated circuit) are mounted on the main substrate 2 .
  • a heat radiation fin 4 is attached on each of the heat-generating components 3 , and cooling fans 5 are mounted on the upstream side or the downstream side of the radiation fins 4 to deliver the air to the radiation fins 4 .
  • devices 6 such as magnetic storage devices are mounted on the front face of the server module and connectors 7 to the outside are mounted on the rear face of the server module.
  • the outside air is taken by the cooling fans 5 mounted in the device housing 1 from the front face of the devices through the spaces between the devices 6 , and after cooling the heat-generating components 3 by the heat radiation fin 4 , the air is exhausted through the spaces between the connectors 7 to the rear face or the side faces of the device.
  • the conventional rack-mount server system mainly employs the forced air cooling system as described above in which the air is taken from the front face of the device by the cooling fan 5 mounted in the device housing 1 of the server module and the air is exhausted to the rear face or the side faces of the device after cooling the heat-generating components 3 .
  • the technique relating to the forced air cooling system for the rack-mount system is disclosed in Japanese Patent Laid-Open No. 2000-261172.
  • the reduction in thickness of the devices has advanced in recent years so as to achieve the higher density mounting and the space saving of the server modules in the rack cabinet, and the cooling fan mounted in the device is limited to the small cooling fan with a small flow rate.
  • devices such as magnetic storage devices are mounted on the front face of the devices and connectors to the outside are arranged on the rear face of the devices, the area for the air intake and exhaust is significantly reduced.
  • the performance of CPU or LSI is enhanced, the multiple CPU configuration is increasingly used, and devices such as the magnetic storage devices are operated at higher speed and formed into an array. As a result, the amount of heat generated therein is increased. Therefore, it becomes more and more difficult to ensure the air flow rate required in the forced air cooling.
  • an object of the present invention is to provide the cooling method capable of achieving the cooling enough to ensure the reliability of the server modules mounted in the rack cabinet without losing the advantages of the rack-mount system and capable of achieving the smooth radiation of the heat from the high-temperature components mounted on the server module particularly by adopting the liquid cooling system even in the case where the performance of the server module is advanced, the thickness the server module is reduced, and the high density mounting technology is advanced.
  • the present invention provides the configuration including a plurality of rack-mounted server modules having heat-generating components, a cooling unit for radiating heat to the outside, and a coolant circulation path which connects the plurality of server modules to the cooling unit and through which the coolant is circulated, wherein the plurality of server modules are connected to the coolant circulation path in parallel to each other.
  • the liquid cooling system is used as the cooling system of the server modules, wherein the coolant thereof is supplied to each of the devices of the server modules through the coolant circulation path, the coolant drained from each of the devices is transferred to the outside of the devices, and the coolant is cooled in the cooling unit mounted in the rack cabinet and then supplied again to each of the devices of the server modules.
  • the pipe serving as the coolant circulation path to circulate the coolant through the rack cabinet is arranged vertically along the post of the rack cabinet, and the pump functioning as coolant circulation means and the cooling section for cooling the coolant by using an heat exchanger are provided as the cooling unit on the upper side or the lower side of the rack cabinet.
  • the downstream side of the coolant circulation path from the cooling unit is defined as the downstream pipe and the upstream side of the coolant circulation path from the cooling unit is defined as the upstream pipe, and the upstream pipe and the downstream pipe are vertically formed in parallel to each other, and also, the cooled coolant is constantly supplied to the downstream pipe. In this manner, the closed circulation path is formed within the rack cabinet.
  • a supply port to supply the coolant from outside is formed and the supply port is connected to the internal pipe which is the coolant circulation path inside the device.
  • the internal pipe is extended to heat-generating components such as CPU and LSI.
  • heat receivers to receive the heat and a drain port to drain the heated coolant to the outside are provided in the server module, and the coolant is transferred by a pump serving as the circulation means incorporated in the device.
  • the downstream pipe and the upstream pipe are respectively connected to the supply port and the drain port, through which the coolant is circulated.
  • the cooled coolant is constantly supplied and a great amount of heat is radiated to the outside of the devices, and thus, the heat-generating components with a relatively high temperature of each of the devices in the server module are cooled.
  • the hybrid configuration of the liquid cooling and the air cooling is also available in which the liquid cooling system is used to cool the heat-generating components with a high temperature and the air cooling system is used to cool the heat-generating components with a relatively low temperature. Furthermore, when there are a plurality of heat-generating components with a high temperature, the pipes to circulate the coolant are connected in parallel to each other.
  • the joints with automatic valve are used to connect the pipes on the rack cabinet side to the supply ports on the side of the device of the server module.
  • joints as the supply ports and the drain ports are provided and many pairs of the supply port and the drain port are arranged vertically on the downstream pipe and the upstream pipe so that a plurality of server modules can be positioned at any desired positions.
  • a pump is incorporated in each of the devices of the server modules so that they can supply and drain the coolant from and to the pipes on the rack cabinet side by itself.
  • the function to detect the temperature of the circulating coolant and control the power of the heat exchanger is given to the cooling unit using the heat exchanger, and thus, the temperature of the coolant passing through the cooling unit can be kept at a constant temperature.
  • the configuration of the present invention is provided as the rack cabinet in which the pump, the heat exchanger, the cooling unit, the pipes, and the like constituting the liquid cooling system are incorporated.
  • a plurality of devices operated independently are mounted in the cooling unit, and when a device does not work well, the other device is operated.
  • a rack-mount server system in which a plurality of server modules having a CPU are mounted is disclosed.
  • the present invention is not limited to the server module and it is possible to apply the present invention to the HDD module having heat-generating components with a high temperature and also to a network module.
  • FIG. 1 is a schematic block diagram showing the system in which a bypass route is not provided
  • FIG. 2 is a schematic block diagram showing the system in which a bypass route is provided and a pump is not mounted on each of the devices of the server modules;
  • FIG. 3 is a schematic block diagram showing the system in which a bypass route is provided and a flow control valve is provided in each of the devices of the server modules;
  • FIG. 4 is a schematic block diagram showing the system in which a bypass route is provided and a pump is mounted on each of the devices of the server modules;
  • FIG. 5 is a perspective view showing the state of the system in which server modules are mounted in a rack cabinet
  • FIG. 6 is a perspective view showing the fluid connector of the server module
  • FIG. 7 is a perspective view showing the state where both the liquid-cooled server modules and the air-cooled server modules are mounted in the rack cabinet;
  • FIG. 8 is a perspective view showing an example of a cooling unit
  • FIG. 9 is a perspective view showing another cooling unit in accordance with another system.
  • FIG. 10 is a perspective view showing another fluid connector of the server module
  • FIG. 11 is a perspective view showing the hybrid configuration of the server module
  • FIG. 12 is a perspective view showing the configuration in the case where a plurality of heat-generating parts of the server module are liquid-cooled;
  • FIG. 13 is a schematic block diagram showing the case where the redundancy for the heat exchanger of the cooling unit is provided
  • FIG. 14 is a schematic block diagram showing the case where the redundancy for the main circulation pump of the cooling unit is provided.
  • FIG. 15 is a perspective view showing the state where the server modules are mounted in the rack cabinet of the conventional forced air cooling system.
  • FIG. 1 shows the case where the bypass route is not provided
  • FIG. 2 shows the case where the bypass route is provided and a pump is not mounted on each device of the server module
  • FIG. 3 shows the case where the bypass route is provided and a flow control valve is provided in each device of the server module
  • FIG. 4 shows the case where the bypass route is provided and the pump is mounted on each device of the server module.
  • the configuration of the cooling system for the rack-mount server system schematically shown in FIG. 1 does not have the bypass route and includes: a rack cabinet 10 ; a plurality of (1 to n) server modules 62 provided with a heat receiver 21 , an internal pipe 22 in the device, and the like; a main circulation pipe 34 composed of a downstream pipe 30 , an upstream pipe 31 , and the like; and a cooling unit 52 provided with a main circulation pump 41 , a tank 42 , a cooling section 43 , a heat exchanger 50 , and the like.
  • the coolant is supplied to each of the devices of the server modules by means of the main circulation pump 41 .
  • the flow quantity of the coolant is evenly distributed to each of the devices when the flow path resistances are equal in each of the devices. Therefore, in the case where there is one device mounted thereon, the flow quantity Q (l/min) of the main circulation pump 41 is supplied to the device, and in the case where there are two devices mounted thereon, the flow quantity Q/2 (l/min) is supplied to each of the devices. In the case where there are n devices mounted thereon, the flow quantity Q/n (l/min) is supplied to each of the n devices.
  • the flow quantity in the devices is changed depending on the number of mounted devices. The change in flow quantity causes the change in the heat quantity to be removed, and resulting in the change in the cooling performance.
  • the flow path resistances are usually different in each of the devices of the server modules 62 .
  • a quantity of coolant inversely proportional to the flow path resistance flows in each of the server modules 62 , and it becomes difficult to ensure the desired flow quantity for each of the devices.
  • the pressure in the pipe is also changed with the change in flow quantity. Since the diameter of the internal pipe 22 of the server module 62 is usually smaller than that of the main circulation pipe 34 , the great deal of pressure is applied when the number of mounted devices is small, and there is the possibility that the coolant may leak from the joint portion. For its prevention, it is necessary to increase the diameter of the internal pipe 22 so as not to apply the great amount of pressure to the pipe. However, since the increase of the diameter requires a large volume, it is unfit for the device using the high-density mounting technology. Therefore, the configuration shown in FIG. 2 is created.
  • bypass route is provided and the pump is not provided in each of the devices of the server modules.
  • the difference from the configuration in FIG. 1 is that the bypass route is provided to the main circulation pipe 34 , and a bypass flow control valve 54 is connected to the bypass route.
  • bypass route is provided and the pump is not provided in each of the devices of the server modules 62 as described above, it is possible to control the change in flow quantity in each device and the change in pressure in the pipes, which are caused by changing the number of mounted devices of the server modules 62 .
  • main circulation pipe 34 has a relatively large diameter and the internal pipe 22 has a relatively small diameter, a large quantity of coolant flows in the bypass route with low flow resistance and only a small quantity of coolant flows in each of the devices. Therefore, just providing the bypass route is insufficient.
  • bypass flow control valve 54 in the bypass route.
  • the flow quantity in the devices is increased by reducing the flow quantity in the bypass route, and the flow quantity in the devices is reduced by increasing the flow quantity in the bypass route.
  • the flow quantity and the pressure in the pipes can be adjusted in this manner.
  • the flow quantity of coolant is inversely proportional to the flow resistance of the path similar to the configuration shown in FIG. 1 , it is difficult to ensure the desired flow quantity for each of the devices. Therefore, the configuration shown in FIG. 3 is created.
  • the bypass route is provided and the flow control valve is provided in each of the devices of the server modules.
  • the difference from the configurations in FIGS. 1 and 2 is that a device flow control valve 28 is connected to each of the internal pipes 22 of the server modules 62 .
  • the flow quantity through the device is reduced by closing the valve in the device, and the flow quantity through the device is increased by opening the valve in the device in each of the server modules 62 .
  • the bypass route is provided and the pump is provided in each of the devices of the server modules.
  • the difference from the configurations in FIGS. 1 to 3 is that an internal pump 23 is connected to each of the internal pipes 22 of the server modules 62 .
  • the coolant flows through the bypass route of the main circulation pipe 34 , and when the device is connected, the coolant flows through the device.
  • the internal pump 23 is operated to supply and drain the coolant from and to the main circulation pipe 34 by itself, and the flow quantity more than necessary is sent to the bypass route.
  • the rack-mount server system shown in FIG. 4 includes: a rack cabinet 10 ; a plurality of server modules 62 provided with a heat receiver 21 , an internal pipe 22 in the device, and the like; a main circulation pipe 34 composed of a downstream pipe 30 , an upstream pipe 31 , and the like; and a cooling unit 52 provided with a main circulation pump 41 , a tank 42 , a cooling section 43 , a heat exchanger 50 , and the like, and the rack-mount server system shown in FIG. 4 has a configuration as follows.
  • the circulation system of the main circulation pipe 34 is formed in the mounting direction of the server modules 62 , and the coolant is circulated by means of the main circulation pump 41 . Furthermore, the heat of the coolant is radiated to the outside or the heat exchanger 50 cools the circulating coolant.
  • This embodiment shows the cooling system in which the tank 42 is provided as a buffer of the main circulation system, the cooling section 43 is incorporated, and the heat exchanger is used to cool the coolant. Also, the main circulation pump 41 , the tank 42 , the cooling section 43 , and the heat exchanger 50 are assembled together to form the cooling unit 52 .
  • the server module 62 is a liquid-cooled type of data processing unit, in which the internal pump 23 is incorporated, the coolant is supplied through the internal pipe 23 to a heat-generating component 3 , and the coolant is drained out to the outside after cooling the heat-generating component 3 by the heat receiver 21 .
  • the main circulation pipe 34 is divided at the cooling section 43 into the downstream pipe 30 to which the coolant is drained and into the upstream pipe 31 from which the coolant is supplied.
  • the coolant is supplied to the server module 62 from the downstream pipe 30 and drained to the upstream pipe 31 .
  • a plurality of server modules 62 are similarly connected to the main circulation pipe 34 . In this case, it is necessary that the flow quantity Q through the main circulation pipe 34 is larger than the sum of the flow quantities q through each of the server modules 62 .
  • FIG. 5 is a perspective view showing the state where the server modules are mounted in the rack cabinet
  • FIG. 6 is a perspective view showing the fluid connector of the server module
  • FIG. 7 is a perspective view showing the state where both the liquid-cooled server modules and the air-cooled server modules are mounted in the rack cabinet.
  • the rack cabinet 10 has a box shape and is provided with four posts serving as mount angles 11 at the four corners thereof to which the server modules are attached.
  • the main circulation pipe 34 is arranged vertically along the post forming the rack cabinet 10 , and the coolant is circulated by the main circulation pump 41 .
  • the tank 42 is arranged as the buffer of the coolant in the upstream of the main circulation pump 41 , and the main circulation pipe 34 is arranged outside the mount angles 11 .
  • the heat exchanger 50 employs the system using a cooling medium, in which the evaporated cooling medium is compressed to high pressure in a compressor 45 and delivered to a radiator 48 for cooling medium, and then, cooled by a cooling fan 47 for cooling medium.
  • This cooled cooling medium is liquidized and delivered to an expansion valve 44 , in which the cooling medium is evaporated again to cool the cooling section 43 , and then, returned to the compressor 45 again.
  • the cooling section 43 is incorporated in the tank 42 and cools the coolant in this tank 42 .
  • the cooling section 43 also has a function to detect the temperature of the circulating coolant and control the cooling power by using a cooling control circuit 46 .
  • the main circulation pump 41 , the tank 42 , the cooling section 43 , and the heat exchanger 50 are mounted in a cooling unit housing 40 and form the independent cooling unit 52 .
  • the main circulation pipe 34 is divided at the cooling section 43 into the downstream pipe 30 from which the coolant is drained and the upstream pipe 31 to which the coolant is supplied, and they are arranged in parallel to each other.
  • Downstream joints 32 are provided on the downstream pipe 30 and upstream joints 33 are provided on the upstream pipe 31 so that they are positioned at almost the same height. Furthermore, many pairs of the downstream joint 32 and the upstream joint 33 are arranged vertically.
  • downstream joints 32 and upstream joints 33 have the automatic valve therein, and when the fluid joint is not connected, the valve is automatically closed to prevent the leakage of the liquid.
  • the joint with automatic valve has its valve in the connecting joints, and such a valve is formed in each of the male side and the female side of the joints. When the joints are connected, the valves are pushed to each other and the valves are opened, and when the joints are disconnected, the valves are closed by the spring force.
  • a main board 2 is provided in the device housing 1 and heat-generating components 3 such as CPU and LSI are mounted on the main board 2 .
  • a supply joint 24 serving as a supply port of the coolant from outside is provided on the rear face of the device housing 1 , and the internal pipe 22 is laid to the heat-generating components 3 , for example, CPU and LSI.
  • the heat receiver 21 for receiving the heat is provided, and the pipe is extended to a drain port to drain the heated coolant to the outside.
  • a drain joint 25 is provided at the drain port.
  • the supply joint 24 and the drain joint 25 are the joints with automatic valve.
  • the heat receiver 21 is formed of the material with high heat conductivity and the meandering flow path is formed therein so as to make the contact area to the coolant as large as possible.
  • the flow path is closely contacted to the heat-generating component 3 .
  • the internal pump 23 to deliver the coolant in the device is provided in the middle of the internal pipe 22 .
  • connection method of the internal pipe 22 in the case of cooling a plurality of heat-generating components 3 in the server module 62 , there are the serial connection and the parallel connection.
  • the coolant is heated by the heat-generating components 3 on the upstream side and the cooling of the heat-generating components 3 on the downstream side is adversely affected. Therefore, the internal pipe 22 is connected to a plurality of heat-generating components 3 by using the parallel connection.
  • the internal pump 23 provided in the middle of the internal pipe 22 is arranged on the upstream side of the heat-generating components 3 because the heated coolant is sent to the pump 23 and the lifetime and performance of the pump 23 are adversely affected when the pump is arranged on the downstream side of the heat-generating components 3 .
  • the server module 62 is mounted on the mount angles 11 of the rack cabinet 10 via metal brackets 8 , and the downstream joint 32 of the downstream pipe 30 and the supply joint 24 of the device are connected via a supply tube 26 . Also, the upstream joint 33 of the upstream pipe 31 and the drain joint 25 of the device are connected via a drain tube 27 . In addition, it is possible to connect a plurality of server modules 62 in the same manner.
  • the coolant is circulated through the main circulation pipe 34 by the main circulation pump 41 regardless of the connection of the server module 62 . Also, the cold coolant is constantly supplied to the downstream pipe 30 by the cooling section 43 arranged on the upstream side of the main circulation pump 41 . By detecting the temperature of the coolant and adjusting the power of the heat exchanger 50 in the cooling control circuit 46 , the coolant with a constant temperature can be supplied to the downstream pipe 30 .
  • the coolant flows in the server module 62 by connecting the server module 62 to the downstream pipe 30 and the upstream pipe 31 of the main circulation pipe 34 .
  • the server module 62 is connected after filling the coolant. Since the internal pump 23 is incorporated in the server module 62 , the coolant is fed to the server module 62 by the operation of the internal pump 23 not by the operation of the main circulation pump 41 .
  • the flow quantity is controlled by the internal pump 23 so that the temperature of the heat-generating components 3 can be a uniform temperature, and a constant flow quantity of the coolant in accordance with the performance of the internal pump 23 can be supplied.
  • the flow quantity through the main circulation pipe 34 is larger than the sum of the flow quantities through each of the server modules 62 .
  • the coolant in the downstream pipe 30 of the main circulation pipe 34 is introduced into the device by the internal pump 23 incorporated in the server module 62 , and the coolant reaches the heat-generating component 3 and receives its heat in the heat receiver 21 to cool the heat-generating component 3 . Then, the coolant is heated and this heated coolant is drained to the upstream pipe 31 of the main circulation pipe 34 .
  • the supply ports are all connected to the downstream pipe 30 and the drain ports are all connected to the upstream pipe 31 . Therefore, the coolant with the same temperature by the cooling section 43 is introduced into all of the devices. In addition, the heated coolant is brought together to the upstream pipe 31 and returned to the cooling portion 43 , and then, cooled to a predetermined temperature again.
  • FIG. 8 is a perspective view showing another cooling unit.
  • a cooling fan 47 for cooling the cooling medium is provided in the cooling unit 52 of this configuration, in which the air is taken from the front face of the cooling unit housing 40 and delivered to the radiator 48 for cooling medium, and then, exhausted to the outside.
  • the upstream pipe 31 is led into the cooling unit housing 40 and extended to the front face of the device, and then, led into a coolant radiator 49 provided in the air-intake section on the front face of the device. Thereafter, the pipe is led into the tank 42 which incorporates the cooling section 43 and extended to the downstream pipe 30 through the main circulation pump 41 .
  • FIG. 9 is a perspective view showing still another cooling unit in accordance with another system.
  • a coolant cooling fan 51 is arranged in the cooling unit housing 40 so that the air is delivered to the coolant radiator 49 , and the upstream pipe 31 is led into the coolant radiator 49 and extended to the downstream pipe 30 via the main circulation pump 41 .
  • the temperature of the heated coolant passing through the upstream pipe 31 can be reduced by the air delivered by the coolant cooling fan 51 in the coolant radiator 49 .
  • the simplified system as shown in FIG. 9 can also be used as the coolant cooling unit 52 in this embodiment.
  • FIG. 10 is a perspective view showing another fluid connector of the server module.
  • the server module 62 with this fluid connector is mounted on the mount angles 11 via metal brackets 8 and slide rails 61 so that it can be pulled out to the front.
  • the metal bracket 8 or the slide rail 61 is provided with a supply/drain tube holder 60 in parallel to the supply/drain face of the device, and one ends of the supply/drain tubes 26 and 27 are attached to the supply/drain tube holder 60 so that the supply/drain tubes 26 and 27 can be connected to the supply/drain joints 24 and 25 of the server module 62 when the server module 62 is installed into the rack cabinet 10 .
  • the other ends thereof are connected to the upstream/downstream pipes 30 and 31 .
  • These supply/drain joints 24 and 25 incorporate the automatic valves.
  • the supply/drain joints 24 and 25 of the server module 62 are automatically connected to the upstream/downstream pipes 30 and 31 when the server module 62 is installed into the rack cabinet 10 , and the supply/drain joints 24 and 25 are automatically disconnected from the upstream/downstream pipes 30 and 31 when the server module 62 is pulled out.
  • FIG. 11 is a perspective view showing the hybrid configuration of the server module.
  • heat-generating components 3 with a high temperature such as CPU and LSI generating a relatively large amount of heat and other heat-generating portions 9 with a low temperature generating a relatively small amount of heat are mounted on the main substrate 2 .
  • the liquid cooling system in which the heat is received by the heat receiver 21 is used to cool the heat-generating components 3 with a high temperature
  • the air cooling system in which the air is delivered by the cooling fan 5 mounted on the front face of the device of the server module 62 is used to cool the heat-generating portions 9 with a low temperature.
  • the liquid cooling system and the air cooling system are simultaneously used, and the heat-generating components 3 with a high temperature are cooled by the liquid cooling system and the heat-generating portions 9 with a low temperature are cooled by the air cooling system.
  • FIG. 12 is a perspective view showing the configuration in which a plurality of heat-generating parts of the server module are liquid-cooled.
  • the heat-generating components 3 with a high temperature generating a relatively large amount of heat and other heat-generating portions 9 with a low temperature generating a relatively small amount of heat are mounted on the main substrate 2 .
  • heat-generating portions of devices 6 such as magnetic storage devices generating a relatively large amount of heat are mounted on the front face of the device of the server module 62 .
  • the heat-generating portions of the devices 6 are also cooled by circulating the coolant through the internal pipes 22 connected in parallel and receiving its heat in the heat receivers 21 b . More specifically, it is possible to cool a plurality of heat-generating parts by the liquid cooling system.
  • the internal pipe 22 is laid in parallel to the heat-generating components 3 and the heat-generating portions of the devices 6 , it is possible to supply the coolant with the same temperature to each of the heat-generating parts.
  • the serial connection is also applicable to the parts in which the amount of heat generation is small.
  • the cooling fan as shown in FIG. 12 is unnecessary.
  • FIG. 13 is a schematic block diagram showing the case where the redundancy for the heat exchanger of the cooling unit is provided.
  • the two cooling sections 43 are incorporated in the tank 42 and the two heat exchangers 50 a and 50 b to cool each of the cooling sections 43 are provided in parallel so that they are operated independently.
  • the coolant can be cooled by the two heat exchanges 50 a and 50 b and the coolant can be cooled even when either of the heat exchangers does not work.
  • FIG. 14 is a schematic block diagram showing the case where the redundancy for the main circulation pump of the cooling unit is provided.
  • cooling unit 52 In the cooling unit 52 with this configuration, internal pipes are connected in parallel at an outlet of the tank 42 , and two main circulation pumps 41 a and 41 b for circulating the coolant in the internal pipes are provided in parallel so that they are operated independently. In addition, a check valve 55 is attached to each of the main circulation pumps 41 a and 41 b . In this configuration, the coolant is circulated by the two main circulation pumps 41 a and 41 b , and the coolant can be circulated even when either of the main circulation pumps does not work.
  • the check valve 55 is attached to each of the main circulation pumps 41 a and 41 b , the circulation of the coolant in the pumps caused when one of the main circulation pumps 41 a and 41 b is broken can be prevented even when the main circulation pumps 41 a and 41 b are connected in parallel.
  • the adoption of the liquid cooling system makes it possible to receive the heat of the heat-generating components 3 with a high temperature by the coolant and to radiate the heat to the outside of the device of the server module 62 , and also, the coolant can be smoothly cooled in the cooling unit 52 mounted in the rack cabinet 10 .
  • the coolant is circulated by the main circulation pump 41 provided in the main circulation pipe 34 and the server module 62 to be mounted is provided with the internal pump 23 to circulate the coolant in the devices thereof, even in the case where the number of server modules to be mounted (connected) is increased, the flow quantity of the coolant passing through each of the devices can be kept uniform as long as the flow quantity through the main circulation pipe 34 is larger than the sum of the flow quantities through the mounted devices.
  • the cooling system according to the present invention can be easily introduced without preparing any special rack cabinet 10 .
  • the cooling unit 52 can be operated independently. Therefore, the redundancy configuration can be provided in which, when one exchanger or one main circulation pump is broken, the other exchanger or the other main circulation pump is operated.
  • the cooling enough to ensure the reliability of the server modules mounted in the rack cabinet can be achieved without losing the advantages of the rack-mount system.
  • the rack-mount server system since the advantages of the rack-mount system are not lost, it is possible to form the rack-mount server system in which the easiness of mounting and the operationality inherent in the conventional devices other than the liquid-cooled device are not impaired.
  • the closed cooling unit is formed within the rack cabinet, and the cooling configuration for each of the server modules can be simplified. Therefore, it is possible to achieve the size reduction of the server module and the size reduction of the rack-mount server system.
US10/776,231 2003-02-14 2004-02-12 Liquid cooling system for a rack-mount server system Active 2024-10-15 US7318322B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003-036255 2003-02-14
JP2003036255A JP4199018B2 (ja) 2003-02-14 2003-02-14 ラックマウントサーバシステム

Publications (2)

Publication Number Publication Date
US20040221604A1 US20040221604A1 (en) 2004-11-11
US7318322B2 true US7318322B2 (en) 2008-01-15

Family

ID=32677629

Family Applications (1)

Application Number Title Priority Date Filing Date
US10/776,231 Active 2024-10-15 US7318322B2 (en) 2003-02-14 2004-02-12 Liquid cooling system for a rack-mount server system

Country Status (7)

Country Link
US (1) US7318322B2 (fr)
EP (1) EP1448040B1 (fr)
JP (1) JP4199018B2 (fr)
KR (1) KR100582612B1 (fr)
CN (1) CN1276326C (fr)
DE (1) DE602004030965D1 (fr)
TW (1) TWI237174B (fr)

Cited By (77)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070095507A1 (en) * 2005-09-16 2007-05-03 University Of Cincinnati Silicon mems based two-phase heat transfer device
US20070256957A1 (en) * 2006-05-06 2007-11-08 Schroff Gmbh Sub-rack with housing for receiving plug-in modules
US20080174962A1 (en) * 2007-01-24 2008-07-24 Christian Belady System and method for cooling an electronic component
US20080212265A1 (en) * 2007-01-23 2008-09-04 Paul Mazura Switchgear Cabinet for Accommodating Electronic Plug-In Modules with a Heat Exchanger
US20090086432A1 (en) * 2007-09-27 2009-04-02 International Business Machines Corporation Docking station with closed loop airlfow path for facilitating cooling of an electronics rack
US20090126910A1 (en) * 2007-11-19 2009-05-21 International Businiess Machines Corporation Apparatus and method for facilitating servicing of a liquid-cooled electronics rack
US20090262495A1 (en) * 2008-04-16 2009-10-22 Julius Neudorfer High efficiency heat removal system for rack mounted computer equipment
US20090290299A1 (en) * 2008-05-20 2009-11-26 Pei-Hsi Lin Frame-type computer cooling device
US20100118494A1 (en) * 2008-11-12 2010-05-13 International Business Machines Corporation Hybrid immersion cooled server with integral spot and bath cooling
US20100132404A1 (en) * 2008-12-03 2010-06-03 Progressive Cooling Solutions, Inc. Bonds and method for forming bonds for a two-phase cooling apparatus
US20100317279A1 (en) * 2007-12-17 2010-12-16 Yatskov Alexander I Cooling systems and heat exchangers for cooling computer components
US20110132579A1 (en) * 2008-08-11 2011-06-09 Green Revolution Cooling, Inc. Liquid Submerged, Horizontal Computer Server Rack and Systems and Method of Cooling such a Server Rack
US8188595B2 (en) 2008-08-13 2012-05-29 Progressive Cooling Solutions, Inc. Two-phase cooling for light-emitting devices
US20120318492A1 (en) * 2010-06-23 2012-12-20 Inertech Ip Llp Cooling systems for electrical equipment
US20130043775A1 (en) * 2011-08-19 2013-02-21 Inventec Corporation Server cabinet coolant distribution system
US20130094146A1 (en) * 2008-04-21 2013-04-18 Liquidcool Solutions, Inc. Liquid submersion cooled network electronics
US20140085821A1 (en) * 2012-09-25 2014-03-27 Liquidcool Solutions, Inc. Method and apparatus to manage coolant pressure and flow for an array of liquid submerged electronic devices
WO2014074233A1 (fr) * 2012-11-08 2014-05-15 Silicon Graphics International Corp. Serveurs lames jumelles pour système informatique en grappe à haute densité
US20140334092A1 (en) * 2013-05-09 2014-11-13 Hon Hai Precision Industry Co., Ltd. Heat dissipation system and rack-mount server using the same
US20150070844A1 (en) * 2013-09-06 2015-03-12 Msi Computer (Shenzhen) Co., Ltd. Liquid-cooling module and electronic device using the same
US9089078B2 (en) 2010-08-26 2015-07-21 Asetek Danmark A/S Liquid cooling system for a server
US9155230B2 (en) 2011-11-28 2015-10-06 Asetek Danmark A/S Cooling system for a server
US9310856B2 (en) 2010-04-20 2016-04-12 Cray Inc. Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use
US9398731B1 (en) 2014-09-23 2016-07-19 Google Inc. Cooling electronic devices in a data center
US9496200B2 (en) 2011-07-27 2016-11-15 Coolit Systems, Inc. Modular heat-transfer systems
US9504190B2 (en) 2013-05-06 2016-11-22 Green Revolution Cooling, Inc. System and method of packaging computing resources for space and fire-resistance
US9529395B2 (en) 2012-03-12 2016-12-27 Hewlett Packard Enterprise Development Lp Liquid temperature control cooling
US20170017277A1 (en) * 2014-04-11 2017-01-19 Hewlett Packard Enterprise Development Lp Liquid coolant supply
US20170127549A1 (en) * 2015-10-30 2017-05-04 Silicon Graphics International Corp. Configurable node expansion space
US9648784B2 (en) 2013-03-15 2017-05-09 Inertech Ip Llc Systems and assemblies for cooling server racks
US9655281B2 (en) 2015-06-26 2017-05-16 Seagate Technology Llc Modular cooling system
US9693479B2 (en) 2013-03-14 2017-06-27 Hewlett Packard Enterprise Development Lp Support member
US9756766B2 (en) 2014-05-13 2017-09-05 Green Revolution Cooling, Inc. System and method for air-cooling hard drives in liquid-cooled server rack
US9788452B2 (en) 2012-10-31 2017-10-10 Hewlett Packard Enterprise Development Lp Modular rack system
US9803937B2 (en) 2013-01-31 2017-10-31 Hewlett Packard Enterprise Development Lp Liquid cooling
US9927187B2 (en) 2012-09-28 2018-03-27 Hewlett Packard Enterprise Development Lp Cooling assembly
US9943014B2 (en) 2013-03-15 2018-04-10 Coolit Systems, Inc. Manifolded heat exchangers and related systems
US20180279510A1 (en) * 2017-03-27 2018-09-27 Dell Products, Lp Server Chassis with a Liquid Cooling Enablement Module in an Input/Output Module Bay
US10123464B2 (en) 2012-02-09 2018-11-06 Hewlett Packard Enterprise Development Lp Heat dissipating system
US10185375B2 (en) 2015-02-13 2019-01-22 Hewlett Packard Enterprise Development Lp Thermal bus bar
US10349561B2 (en) 2016-04-15 2019-07-09 Google Llc Cooling electronic devices in a data center
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
US10364809B2 (en) 2013-03-15 2019-07-30 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
US20190281730A1 (en) * 2018-03-10 2019-09-12 Baidu Usa Llc Design for cold plate assembly for server liquid cooling of electronic racks of a data center
US10433459B2 (en) * 2017-01-20 2019-10-01 Guangdong Hi-1 New Materials Technology Research Institute Co., Ltd Data centre cabinet and gravity spray system thereof
US10448543B2 (en) 2015-05-04 2019-10-15 Google Llc Cooling electronic devices in a data center
US10462935B2 (en) 2015-06-23 2019-10-29 Google Llc Cooling electronic devices in a data center
US10488061B2 (en) 2016-03-16 2019-11-26 Inertech Ip Llc System and methods utilizing fluid coolers and chillers to perform in-series heat rejection and trim cooling
US10588246B2 (en) 2008-02-11 2020-03-10 Cray, Inc. Systems and associated methods for controllably cooling computer components
US10667437B2 (en) * 2018-04-12 2020-05-26 Baidu Usa Llc Liquid distribution unit design for liquid cooling of electronic racks of a data center
US10775860B2 (en) * 2018-05-07 2020-09-15 Hewlett Packard Enterprise Development Lp Base management controller interface
US10785892B1 (en) * 2019-05-27 2020-09-22 Auras Technology Co., Ltd. Heat dissipation system and coolant distribution module thereof
US10905030B1 (en) * 2019-07-24 2021-01-26 Facebook, Inc. Liquid-cooling within an air-cooled facility
US10925187B1 (en) 2019-08-30 2021-02-16 Dell Products, L.P. Remote heat exchanger arm for direct contact liquid cooling for rack mounted equipment
US11044832B2 (en) * 2019-02-01 2021-06-22 Taiwan Microloops Corp. Water-cooled distributive heat dissipation system for rack
US11044833B2 (en) * 2019-02-01 2021-06-22 Taiwan Microloops Corp. Water-cooled pressurized distributive heat dissipation system for rack
US11083111B2 (en) 2016-10-10 2021-08-03 Bull Sas Compact liquid cooling module for computer server
US11102915B1 (en) * 2015-12-04 2021-08-24 Nautilus True, Llc Self-sustained, scalable, efficient data center facility and method
US11129304B2 (en) * 2016-10-24 2021-09-21 Fujitsu Limited Electronic device
US20220039296A1 (en) * 2020-07-30 2022-02-03 Calyos Sa System for cooling server boards in a data center
US11359865B2 (en) 2018-07-23 2022-06-14 Green Revolution Cooling, Inc. Dual Cooling Tower Time Share Water Treatment System
US11395443B2 (en) 2020-05-11 2022-07-19 Coolit Systems, Inc. Liquid pumping units, and related systems and methods
US11452243B2 (en) 2017-10-12 2022-09-20 Coolit Systems, Inc. Cooling system, controllers and methods
US20220304190A1 (en) * 2021-03-18 2022-09-22 NANNING FuLian FuGui Precision Industrial Co. Ltd. Electronic apparatus with cooling system
US20220330459A1 (en) * 2021-04-13 2022-10-13 Dell Products L.P. Modular and highly available cooling distribution unit for information handling systems
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
US20220408608A1 (en) * 2019-11-13 2022-12-22 Nec Platforms, Ltd. Cooling system and electronic device
US20230065556A1 (en) * 2021-09-02 2023-03-02 Baidu Usa Llc Two phase system for enclosure systems
USD982145S1 (en) 2020-10-19 2023-03-28 Green Revolution Cooling, Inc. Cooling system enclosure
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US20230221781A1 (en) * 2022-01-12 2023-07-13 Dell Products L.P. Insert to replace a fan in hybrid liquid cooling of an information handling system
US11755084B2 (en) 2021-07-20 2023-09-12 Quanta Computer Inc. Cooling circuits for cooling a computing system and flow control methods thereof
USD998770S1 (en) 2020-10-19 2023-09-12 Green Revolution Cooling, Inc. Cooling system enclosure
US11805624B2 (en) 2021-09-17 2023-10-31 Green Revolution Cooling, Inc. Coolant shroud
US11832422B2 (en) 2017-07-26 2023-11-28 Sung Kyun Lee Computing rack apparatus using cooling unit
US11910575B2 (en) 2021-09-02 2024-02-20 Baidu Usa Llc Rack systems and packaging for servers
US11925946B2 (en) 2022-03-28 2024-03-12 Green Revolution Cooling, Inc. Fluid delivery wand

Families Citing this family (241)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9119705B2 (en) 1998-06-08 2015-09-01 Thermotek, Inc. Method and system for thermal and compression therapy relative to the prevention of deep vein thrombosis
US7836597B2 (en) * 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
DE10393588T5 (de) 2002-11-01 2006-02-23 Cooligy, Inc., Mountain View Optimales Ausbreitungssystem, Vorrichtung und Verfahren für flüssigkeitsgekühlten, mikroskalierten Wärmetausch
US8464781B2 (en) 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
US8100956B2 (en) 2006-05-09 2012-01-24 Thermotek, Inc. Method of and system for thermally augmented wound care oxygenation
US8574278B2 (en) 2006-05-09 2013-11-05 Thermotek, Inc. Wound care method and system with one or both of vacuum-light therapy and thermally augmented oxygenation
US8128672B2 (en) 2006-05-09 2012-03-06 Thermotek, Inc. Wound care method and system with one or both of vacuum-light therapy and thermally augmented oxygenation
US8778005B2 (en) 2003-07-18 2014-07-15 Thermotek, Inc. Method and system for thermal and compression therapy relative to the prevention of deep vein thrombosis
EP1646351B1 (fr) 2003-07-18 2011-03-30 Thermotek, Inc. Systeme thermique destine a une couverture
US7591302B1 (en) 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
JP4272503B2 (ja) * 2003-12-17 2009-06-03 株式会社日立製作所 液冷システム
US7810341B2 (en) * 2004-04-22 2010-10-12 Hewlett-Packard Development Company, L.P. Redundant upgradeable, modular data center cooling apparatus
US7011143B2 (en) * 2004-05-04 2006-03-14 International Business Machines Corporation Method and apparatus for cooling electronic components
US7616444B2 (en) * 2004-06-04 2009-11-10 Cooligy Inc. Gimballed attachment for multiple heat exchangers
US7187549B2 (en) * 2004-06-30 2007-03-06 Teradyne, Inc. Heat exchange apparatus with parallel flow
US10765785B2 (en) 2004-07-19 2020-09-08 Thermotek, Inc. Wound care and infusion method and system utilizing a therapeutic agent
US10016583B2 (en) 2013-03-11 2018-07-10 Thermotek, Inc. Wound care and infusion method and system utilizing a thermally-treated therapeutic agent
USD679023S1 (en) 2004-07-19 2013-03-26 Thermotek, Inc. Foot wrap
US20060034053A1 (en) 2004-08-12 2006-02-16 Thermotek, Inc. Thermal control system for rack mounting
US7355852B2 (en) * 2004-09-30 2008-04-08 Amphenol Corporation Modular liquid cooling of electronic assemblies
FR2876812B1 (fr) * 2004-10-15 2006-12-22 J C C Chereau Aeronautique Dispositif a fluide de refroidissement pour ordinateur
US7408775B2 (en) * 2004-10-19 2008-08-05 Honeywell International Inc. Electrical module and support therefor with integrated cooling
DE102004054337B4 (de) * 2004-11-09 2007-01-11 Rittal Res Electronic Systems Gmbh & Co. Kg Kühlanordnung
DE102004054311B4 (de) * 2004-11-09 2007-01-11 Rittal Res Electronic Systems Gmbh & Co. Kg Kühlanordnung
CN100371854C (zh) * 2004-12-24 2008-02-27 富准精密工业(深圳)有限公司 液冷式散热装置
US7599761B2 (en) * 2005-01-19 2009-10-06 Hewlett-Packard Development Company, L.P. Cooling assist module
US7895854B2 (en) * 2005-06-01 2011-03-01 Hewlett-Packard Development Company, L.P. Refrigeration system with parallel evaporators and variable speed compressor
US7342789B2 (en) * 2005-06-30 2008-03-11 International Business Machines Corporation Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling
US7219714B1 (en) * 2005-08-04 2007-05-22 Sun Microsystems, Inc. Multiple component field-replaceable active integrated liquid pump heat sink module for thermal management of electronic components
US7909861B2 (en) 2005-10-14 2011-03-22 Thermotek, Inc. Critical care thermal therapy method and system
US7730731B1 (en) 2005-11-01 2010-06-08 Hewlett-Packard Development Company, L.P. Refrigeration system with serial evaporators
US20070119572A1 (en) 2005-11-30 2007-05-31 Raytheon Company System and Method for Boiling Heat Transfer Using Self-Induced Coolant Transport and Impingements
DE102005061599A1 (de) * 2005-12-22 2007-06-28 Airbus Deutschland Gmbh Modulares Kühlsystem und Kälteerzeugungseinrichtung für ein solches Kühlsystem
WO2007098078A2 (fr) * 2006-02-16 2007-08-30 Cooligy, Inc. Boucles de refroidissement par liquide pour applications de serveurs
US20090317694A1 (en) * 2006-03-06 2009-12-24 Abb Research Ltd. Temperature controller
US20070209782A1 (en) * 2006-03-08 2007-09-13 Raytheon Company System and method for cooling a server-based data center with sub-ambient cooling
US20070213881A1 (en) * 2006-03-08 2007-09-13 Belady Christian L Liquid cooling of electronic device environments
DE202006003754U1 (de) * 2006-03-09 2006-05-04 Knürr AG Wärmetauscher
WO2007120530A2 (fr) 2006-03-30 2007-10-25 Cooligy, Inc. Liquide integre dans un module d'amenee d'air
US20070227709A1 (en) * 2006-03-30 2007-10-04 Girish Upadhya Multi device cooling
US7832461B2 (en) * 2006-04-28 2010-11-16 Hewlett-Packard Development Company, L.P. Cooling systems and methods
US20070256815A1 (en) * 2006-05-04 2007-11-08 Cooligy, Inc. Scalable liquid cooling system with modular radiators
US7403392B2 (en) * 2006-05-16 2008-07-22 Hardcore Computer, Inc. Liquid submersion cooling system
US7701714B2 (en) * 2006-05-26 2010-04-20 Flextronics Ap, Llc Liquid-air hybrid cooling in electronics equipment
CN101467317B (zh) 2006-06-13 2013-02-06 图伦有限公司 电子装置的存储单元
US20080013278A1 (en) * 2006-06-30 2008-01-17 Fredric Landry Reservoir for liquid cooling systems used to provide make-up fluid and trap gas bubbles
US7420808B2 (en) * 2006-10-10 2008-09-02 International Business Machines Corporation Liquid-based cooling system for cooling a multi-component electronics system
US7641101B2 (en) * 2006-10-10 2010-01-05 International Business Machines Corporation Method of assembling a cooling system for a multi-component electronics system
US20080092577A1 (en) * 2006-10-23 2008-04-24 Liebert Corporation Thermal load locator
DE102006054560A1 (de) * 2006-11-20 2008-05-21 Airbus Deutschland Gmbh Kühlsystem und Verfahren zur Kühlung einer Flugzeugeinrichtung
CA2668663A1 (fr) 2006-11-20 2008-05-29 Airbus Deutschland Gmbh Systeme de refroidissement et procede pour le refroidissement d'un dispositif d'aeronef
CN101547832B (zh) * 2006-11-20 2012-06-20 空中客车德国运营有限责任公司 飞机电子部件的多级冷却
US7751918B2 (en) * 2007-01-05 2010-07-06 International Business Machines Corporation Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates
JP2008191996A (ja) * 2007-02-06 2008-08-21 Hitachi Ltd ディスクアレイ装置および電子装置
US8011200B2 (en) 2007-02-19 2011-09-06 Liebert Corporation Cooling fluid flow regulation distribution system and method
US20080216493A1 (en) * 2007-03-08 2008-09-11 Liebert Corporation Microchannel cooling condenser for precision cooling applications
DE102007013520B4 (de) * 2007-03-21 2011-05-05 Rittal Gmbh & Co. Kg Anordnung zum Führen von Kühlmittel für einen Schaltschrank oder ein Rack Schaltschrank oder Rack damit und Anreihanordnung mit mindestens zwei solchen Schaltschränken oder Racks
US8651172B2 (en) 2007-03-22 2014-02-18 Raytheon Company System and method for separating components of a fluid coolant for cooling a structure
USD664260S1 (en) 2007-04-10 2012-07-24 Thermotek, Inc. Calf wrap
US20080266726A1 (en) * 2007-04-27 2008-10-30 Vance Murakami Cooling system for electrical devices
WO2008137143A1 (fr) * 2007-05-02 2008-11-13 Cooligy Inc. Conception de radiateur à contre-courant à microtube/multivoies pour applications de refroidissement électronique
US8699210B2 (en) * 2007-05-31 2014-04-15 Siemens Industry, Inc. Integrated water current connection for motor drive
US7602609B2 (en) * 2007-05-31 2009-10-13 Liebert Corporation Cooling system and method of use
US7430118B1 (en) * 2007-06-04 2008-09-30 Yahoo! Inc. Cold row encapsulation for server farm cooling system
US8144458B2 (en) * 2007-06-13 2012-03-27 Hewlett-Packard Development Company, L.P. Component layout in an enclosure
US8094452B1 (en) 2007-06-27 2012-01-10 Exaflop Llc Cooling and power grids for data center
TW200924625A (en) 2007-08-07 2009-06-01 Cooligy Inc Deformable duct guides that accommodate electronic connection lines
US20150083368A1 (en) * 2007-08-09 2015-03-26 Coolit Systems Inc. Data center cooling systems and associated methods
WO2009031415A1 (fr) * 2007-09-06 2009-03-12 Advantest Corporation Appareil de refroidissement de composant électronique, et tête d'essai et appareil de test de composant électronique comportant l'appareil de refroidissement de composant électronique
US7921655B2 (en) 2007-09-21 2011-04-12 Raytheon Company Topping cycle for a sub-ambient cooling system
US9025330B2 (en) * 2007-09-30 2015-05-05 Alcatel Lucent Recirculating gas rack cooling architecture
US8351200B2 (en) * 2007-11-19 2013-01-08 International Business Machines Corporation Convergence of air water cooling of an electronics rack and a computer room in a single unit
US7757506B2 (en) * 2007-11-19 2010-07-20 International Business Machines Corporation System and method for facilitating cooling of a liquid-cooled electronics rack
EP2232968A1 (fr) * 2007-12-19 2010-09-29 Clustered Systems Company Système de refroidissement pour des modules électroniques refroidis par contact
US8037644B2 (en) * 2008-01-07 2011-10-18 International Business Machines Corporation Fire-code-compatible, collapsible partitions to prevent unwanted airflow between computer-room cold aisles and hot aisles
US8758419B1 (en) 2008-01-31 2014-06-24 Thermotek, Inc. Contact cooler for skin cooling applications
US7934386B2 (en) 2008-02-25 2011-05-03 Raytheon Company System and method for cooling a heat generating structure
US7907409B2 (en) 2008-03-25 2011-03-15 Raytheon Company Systems and methods for cooling a computing component in a computing rack
US7660116B2 (en) * 2008-04-21 2010-02-09 International Business Machines Corporation Rack with integrated rear-door heat exchanger
US20090260384A1 (en) * 2008-04-21 2009-10-22 International Business Machines Corporation Coolant Distribution System For A Rack Having A Rear-Door Heat Exchanger
EP2117288A1 (fr) * 2008-05-07 2009-11-11 3M Innovative Properties Company Système de gestion thermique pour armoire contenant un équipement électronique
CN102112840A (zh) * 2008-08-04 2011-06-29 集群系统公司 接触式冷却的电子外壳
US8254422B2 (en) 2008-08-05 2012-08-28 Cooligy Inc. Microheat exchanger for laser diode cooling
US9072200B2 (en) 2008-09-10 2015-06-30 Schneider Electric It Corporation Hot aisle containment panel system and method
US20100058798A1 (en) * 2008-09-11 2010-03-11 Der-Yin Hsieh Coolant-circulation cooling device for computer servo
US20110162818A1 (en) * 2008-09-23 2011-07-07 Tyrell Kyle Kumlin Providing Connection Elements For Connecting Fluid Pipes To Carry Cooling Fluid In A System
US8081459B2 (en) * 2008-10-17 2011-12-20 Cray Inc. Air conditioning systems for computer systems and associated methods
US8184435B2 (en) 2009-01-28 2012-05-22 American Power Conversion Corporation Hot aisle containment cooling system and method
US9904331B2 (en) * 2009-04-01 2018-02-27 Schneider Electric It Corporation Method for computing cooling redundancy at the rack level
US8208250B2 (en) * 2009-04-08 2012-06-26 Intel Corporation External thermal solution for a mobile computing device
US9811097B2 (en) * 2009-04-16 2017-11-07 Darpa Environmental control of liquid cooled electronics
US10212858B2 (en) 2009-04-21 2019-02-19 Excalibur Ip, Llc Cold row encapsulation for server farm cooling system
US7800900B1 (en) 2009-04-21 2010-09-21 Yahoo! Inc. Cold row encapsulation for server farm cooling system
US8054625B2 (en) * 2009-04-21 2011-11-08 Yahoo! Inc. Cold row encapsulation for server farm cooling system
US20100275618A1 (en) * 2009-04-30 2010-11-04 Abdlmonem Beitelmal System and method for cooling fluid distribution
US8369090B2 (en) 2009-05-12 2013-02-05 Iceotope Limited Cooled electronic system
JP5863643B2 (ja) * 2009-05-12 2016-02-16 アイセオトープ リミテッド 冷却される電子システム
DE202009006916U1 (de) * 2009-05-13 2009-09-17 Pfannenberg Gmbh Kühlgerät
US7944692B2 (en) 2009-06-12 2011-05-17 American Power Conversion Corporation Method and apparatus for installation and removal of overhead cooling equipment
US9036351B2 (en) 2009-06-22 2015-05-19 Xyber Technologies, Llc Passive cooling system and method for electronics devices
US8582298B2 (en) 2009-06-22 2013-11-12 Xyber Technologies Passive cooling enclosure system and method for electronics devices
US7907406B1 (en) * 2009-09-28 2011-03-15 International Business Machines Corporation System and method for standby mode cooling of a liquid-cooled electronics rack
JP5460362B2 (ja) * 2010-02-04 2014-04-02 株式会社日立製作所 電子機器の冷却システム
JP2011247506A (ja) * 2010-05-27 2011-12-08 Fujikura Ltd データセンタの冷却システム
US9271429B2 (en) 2010-04-12 2016-02-23 Fujikura Ltd. Cooling device, cooling system, and auxiliary cooling device for datacenter
US20130135811A1 (en) * 2010-07-21 2013-05-30 Birchbridge Incorporated Architecture For A Robust Computing System
US8441792B2 (en) 2010-07-21 2013-05-14 Birchbridge Incorporated Universal conduction cooling platform
US8259450B2 (en) 2010-07-21 2012-09-04 Birchbridge Incorporated Mobile universal hardware platform
US8410364B2 (en) 2010-07-21 2013-04-02 Birchbridge Incorporated Universal rack cable management system
US8411440B2 (en) 2010-07-21 2013-04-02 Birchbridge Incorporated Cooled universal hardware platform
US8441793B2 (en) 2010-07-21 2013-05-14 Birchbridge Incorporated Universal rack backplane system
US8248801B2 (en) * 2010-07-28 2012-08-21 International Business Machines Corporation Thermoelectric-enhanced, liquid-cooling apparatus and method for facilitating dissipation of heat
US8472182B2 (en) 2010-07-28 2013-06-25 International Business Machines Corporation Apparatus and method for facilitating dissipation of heat from a liquid-cooled electronics rack
WO2012030473A2 (fr) * 2010-08-30 2012-03-08 Hardcore Computer, Inc. Boîtier de serveur à entrée/sortie optique et/ou alimentation électrique sans fil
JP2012054499A (ja) * 2010-09-03 2012-03-15 Sohki:Kk 電子機器の冷却システム
TWI422318B (zh) 2010-10-29 2014-01-01 Ind Tech Res Inst 數據機房
JP2012098916A (ja) * 2010-11-02 2012-05-24 Kawamura Electric Inc サーバー冷却装置
TW201221036A (en) 2010-11-05 2012-05-16 Inventec Corp Server rack
CN102467201A (zh) * 2010-11-12 2012-05-23 英业达股份有限公司 服务器的冷却循环系统
US8514575B2 (en) 2010-11-16 2013-08-20 International Business Machines Corporation Multimodal cooling apparatus for an electronic system
US8274790B2 (en) 2010-11-16 2012-09-25 International Business Machines Corporation Automatically reconfigurable liquid-cooling apparatus for an electronics rack
CN102480902B (zh) * 2010-11-23 2014-08-27 英业达股份有限公司 可调式冷却液快速接头
TW201222219A (en) * 2010-11-25 2012-06-01 Hon Hai Prec Ind Co Ltd Data center
CN102478935A (zh) * 2010-11-29 2012-05-30 英业达股份有限公司 机架式服务器系统
CN102478936A (zh) * 2010-11-30 2012-05-30 英业达股份有限公司 一种服务器架构
CN102573384B (zh) * 2010-12-09 2016-05-04 中山市云创知识产权服务有限公司 液冷散热系统
AU2011355562B2 (en) 2011-01-11 2017-03-30 Schneider Electric It Corporation Cooling unit and method
JP5396416B2 (ja) * 2011-02-25 2014-01-22 株式会社日立製作所 サーバ装置及び電子機器冷却システム
KR20140015416A (ko) 2011-03-02 2014-02-06 이너테크 아이피 엘엘씨 모듈식 it 랙 냉각 어셈블리들 및 어셈블리 방법들
US8724322B2 (en) * 2011-03-23 2014-05-13 Rackspace Us, Inc. Targeted liquid cooling for a system
US9832913B2 (en) 2011-06-27 2017-11-28 Ebullient, Inc. Method of operating a cooling apparatus to provide stable two-phase flow
US9854714B2 (en) 2011-06-27 2017-12-26 Ebullient, Inc. Method of absorbing sensible and latent heat with series-connected heat sinks
US9854715B2 (en) * 2011-06-27 2017-12-26 Ebullient, Inc. Flexible two-phase cooling system
US9848509B2 (en) 2011-06-27 2017-12-19 Ebullient, Inc. Heat sink module
US9901008B2 (en) 2014-10-27 2018-02-20 Ebullient, Inc. Redundant heat sink module
US9901013B2 (en) 2011-06-27 2018-02-20 Ebullient, Inc. Method of cooling series-connected heat sink modules
US10512587B2 (en) 2011-07-27 2019-12-24 Thermotek, Inc. Method and apparatus for scalp thermal treatment
JP5836029B2 (ja) * 2011-09-20 2015-12-24 株式会社日立製作所 サーバラックの冷却システム及びサーバ機器
US8817474B2 (en) 2011-10-31 2014-08-26 International Business Machines Corporation Multi-rack assembly with shared cooling unit
US8760863B2 (en) 2011-10-31 2014-06-24 International Business Machines Corporation Multi-rack assembly with shared cooling apparatus
TWI445493B (zh) 2011-11-11 2014-07-11 Inventec Corp 散熱系統
CN103162979B (zh) * 2011-12-08 2015-08-05 英业达股份有限公司 测试液冷式热交换器的方法
TWI457069B (zh) * 2011-12-19 2014-10-11 Inventec Corp 伺服器及散熱模組
SG11201404916VA (en) * 2012-02-14 2014-12-30 Nec Corp Cooling device and cooling system
JP2013187251A (ja) * 2012-03-06 2013-09-19 Sohki:Kk 電子装置の冷却システムおよび方法
DE102012205870B3 (de) * 2012-04-11 2013-02-21 Trumpf Laser- Und Systemtechnik Gmbh Kühlanordnung für einen Gaslaser, Gaslaser damit, sowie Verfahren zum Kühlen von Lasergas
US10149927B2 (en) 2012-04-24 2018-12-11 Thermotek, Inc. Method and system for therapeutic use of ultra-violet light
JP5807718B2 (ja) * 2012-05-31 2015-11-10 富士通株式会社 ラック型情報処理装置
US9273906B2 (en) 2012-06-14 2016-03-01 International Business Machines Corporation Modular pumping unit(s) facilitating cooling of electronic system(s)
US9879926B2 (en) 2012-06-20 2018-01-30 International Business Machines Corporation Controlled cooling of an electronic system for reduced energy consumption
US9110476B2 (en) 2012-06-20 2015-08-18 International Business Machines Corporation Controlled cooling of an electronic system based on projected conditions
US8925333B2 (en) 2012-09-13 2015-01-06 International Business Machines Corporation Thermoelectric-enhanced air and liquid cooling of an electronic system
US8961708B2 (en) * 2012-11-13 2015-02-24 Plexaire, Llc Condensate management system and methods
US9313930B2 (en) 2013-01-21 2016-04-12 International Business Machines Corporation Multi-level redundant cooling system for continuous cooling of an electronic system(s)
US9292057B2 (en) * 2013-02-22 2016-03-22 International Business Machines Corporation System for mounting and cooling a computer component
EP2964534B1 (fr) * 2013-03-08 2018-07-18 Rolls-Royce North American Technologies, Inc. Avion et système d'alimentation en électricité d'une charge électrique d'avion
US10300180B1 (en) 2013-03-11 2019-05-28 Thermotek, Inc. Wound care and infusion method and system utilizing a therapeutic agent
CN104144592B (zh) * 2013-05-09 2016-12-07 鸿富锦精密工业（深圳）有限公司 散热系统及设有该散热系统的机柜式服务器
GB2514799A (en) 2013-06-04 2014-12-10 Ibm Scalable panel cooling system
US9538687B2 (en) * 2013-06-12 2017-01-03 Menara Network, Inc. High-density rack unit systems and methods
CN103399624B (zh) * 2013-07-17 2017-11-03 曙光信息产业(北京)有限公司 用于刀片式服务器的冷却组件、刀片式服务器
JP2015033182A (ja) * 2013-08-01 2015-02-16 富士電機株式会社 半導体電力変換器の冷却システム
WO2015070144A1 (fr) 2013-11-11 2015-05-14 Thermotek, Inc. Méthode et système de soin des plaies
WO2015077561A1 (fr) 2013-11-22 2015-05-28 Liquidcool Solutions, Inc. Système de refroidissement par immersion dans un liquide extensible
US10297339B2 (en) * 2014-02-19 2019-05-21 Advantest Corporation Integrated cooling system for electronics testing apparatus
CN103838336A (zh) * 2014-02-20 2014-06-04 北京德能恒信科技有限公司 一种新型服务器冷却机柜
KR101448515B1 (ko) * 2014-02-27 2014-10-13 주식회사 삼광엔지니어링 계측기를 위한 캐비닛
KR200473249Y1 (ko) * 2014-02-27 2014-06-25 주식회사 삼광엔지니어링 계측기를 위한 캐비닛
CN103997879B (zh) * 2014-05-19 2016-05-25 上海理工大学 散热器
US9351428B2 (en) 2014-08-29 2016-05-24 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Blind docking apparatus to enable liquid cooling in compute nodes
TWI575212B (zh) * 2014-09-24 2017-03-21 台達電子工業股份有限公司 可翻轉使用之液冷散熱裝置及其翻轉配置方法
US10576589B2 (en) * 2014-09-30 2020-03-03 The Boeing Company Cooling system for use with a power electronics assembly and method of manufacturing thereof
WO2016053273A1 (fr) * 2014-09-30 2016-04-07 Hewlett Packard Enterprise Development Lp Refroidissement modulaire
JP6299551B2 (ja) * 2014-10-01 2018-03-28 富士通株式会社 発熱装置の冷却装置
US10184699B2 (en) 2014-10-27 2019-01-22 Ebullient, Inc. Fluid distribution unit for two-phase cooling system
KR101718414B1 (ko) 2014-10-27 2017-03-22 주식회사 두비컴퓨팅 랙 마운트 서버 시스템 및 그 제어방법
US20160120059A1 (en) 2014-10-27 2016-04-28 Ebullient, Llc Two-phase cooling system
US9852963B2 (en) 2014-10-27 2017-12-26 Ebullient, Inc. Microprocessor assembly adapted for fluid cooling
US20160116218A1 (en) 2014-10-27 2016-04-28 Ebullient, Llc Heat exchanger with helical passageways
AU2015339648A1 (en) * 2014-10-27 2017-06-15 Ebullient, Llc Flexible two-phase cooling system
CN104519722B (zh) * 2014-12-11 2017-08-29 吕梁市军民融合协同创新研究院 液体冷却装置及具有该装置的服务器
FR3030708B1 (fr) * 2014-12-22 2018-02-16 Airbus Operations Sas Plaque froide, formant notamment partie structurale d'un equipement a composants generateurs de chaleur
CN104597972A (zh) * 2014-12-31 2015-05-06 曙光信息产业(北京)有限公司 服务器
CN105988546A (zh) * 2015-02-10 2016-10-05 鸿富锦精密工业(武汉)有限公司 散热模组
EP3076109B1 (fr) * 2015-03-30 2021-07-07 Viessmann Refrigeration Solutions GmbH Systeme de refroidissement et procede de fonctionnement du systeme de refroidissement
CN104703447B (zh) * 2015-03-31 2018-01-12 广东申菱环境系统股份有限公司 自然冷却冷水装置和液冷装置结合的服务器散热系统
CN104703448B (zh) * 2015-03-31 2018-01-02 广东申菱环境系统股份有限公司 门式冷水换热装置和液冷装置结合的服务器机柜散热系统
CN104883857A (zh) * 2015-04-29 2015-09-02 浪潮电子信息产业股份有限公司 一种刀片服务器的散热方法及散热装置
US9766668B2 (en) * 2015-08-21 2017-09-19 Corsair Memory, Inc. Forced and natural convection liquid cooler for personal computer
CN105302182B (zh) * 2015-11-02 2018-03-02 张存勇 一种服务器液冷散热节能控制系统和方法
US10156873B2 (en) 2015-12-21 2018-12-18 Dell Products, L.P. Information handling system having fluid manifold with embedded heat exchanger system
US10064314B2 (en) * 2015-12-21 2018-08-28 Dell Products, L.P. Runtime service of liquid cooled servers operating under positive hydraulic pressure without impacting component performance
US9839164B2 (en) 2015-12-21 2017-12-05 Dell Products, L.P. Rack information handling system having modular liquid distribution (MLD) conduits
US10206312B2 (en) 2015-12-21 2019-02-12 Dell Products, L.P. Liquid cooled rack information handling system having storage drive carrier for leak containment and vibration mitigation
US10010013B2 (en) 2015-12-21 2018-06-26 Dell Products, L.P. Scalable rack-mount air-to-liquid heat exchanger
US9795065B2 (en) 2015-12-21 2017-10-17 Dell Products, L.P. Integrated air-spring for hydraulic force damping of a rigid liquid cooling subsystem
US10146231B2 (en) 2015-12-21 2018-12-04 Dell Products, L.P. Liquid flow control based upon energy balance and fan speed for controlling exhaust air temperature
WO2017127109A1 (fr) * 2016-01-22 2017-07-27 Hewlett Packard Enterprise Development Lp Routage d'un élément de refroidissement le long d'une carte
DE102016204175A1 (de) * 2016-03-14 2017-09-14 Thomas-Krenn.AG System, vorzugsweise für eine Temperaturregulierung eines Volumens
CN108827491A (zh) * 2016-05-18 2018-11-16 惠安县信达友工业设计有限公司 温度监测装置
JP6652018B2 (ja) * 2016-09-01 2020-02-19 富士通株式会社 液浸槽及び液浸冷却装置
JP2018125497A (ja) * 2017-02-03 2018-08-09 富士通株式会社 電子機器、電子機器用の冷却制御装置及び冷却制御方法
JP6907592B2 (ja) * 2017-02-28 2021-07-21 富士通株式会社 冷却装置及び電子機器システム
US10609840B2 (en) * 2017-04-18 2020-03-31 Baidu Usa Llc Modular quick-release liquid heat removal coupling system for electronic racks
JP7036416B2 (ja) * 2017-10-18 2022-03-15 Ｎｅｃプラットフォームズ株式会社 装置
JP6579633B2 (ja) * 2017-10-20 2019-09-25 Ｎｅｃプラットフォームズ株式会社 装置
CN109757062B (zh) * 2017-11-03 2021-06-11 阿里巴巴集团控股有限公司 冷却设备
CN107920455B (zh) * 2017-11-15 2019-08-20 常州信息职业技术学院 一种具有散热功能的通信机柜
US10813253B2 (en) * 2017-12-07 2020-10-20 Hewlett Packard Enterprise Development Lp Chassis cooling
KR102034552B1 (ko) 2017-12-22 2019-10-21 주식회사 씨엔씨알 서버랙의 비상 보호장치
CN108304054B (zh) * 2018-03-26 2023-07-21 广东西江数据科技有限公司 一种自封式回油结构
AT521040B1 (de) 2018-05-25 2019-10-15 Miba Energy Holding Gmbh Leistungsbaugruppe mit tragendem Kühlkörper
CN108697042A (zh) * 2018-08-27 2018-10-23 河南省云乐科技有限公司 一种计算机中心机房服务器机柜
US11147191B2 (en) * 2018-10-29 2021-10-12 Quanta Computer Inc. Liquid cooling with outdoor chiller rack system
CN109743869B (zh) * 2019-01-30 2020-04-14 全亿大科技（佛山）有限公司 液冷散热器及伺服器系统
CN111615289A (zh) * 2019-02-22 2020-09-01 迈萪科技股份有限公司 用于机柜的水冷式加压均流散热系统
US10701838B1 (en) * 2019-03-25 2020-06-30 Amazon Technologies, Inc. Self-installing connections for rack liquid cooling
US11116114B2 (en) * 2019-06-18 2021-09-07 Baidu Usa Llc Cooling system design for data centers
CN110413081B (zh) * 2019-06-25 2021-04-09 苏州浪潮智能科技有限公司 一种散热装置及用于服务器的液冷方法
US10912229B1 (en) * 2019-08-15 2021-02-02 Baidu Usa Llc Cooling system for high density racks with multi-function heat exchangers
US10761577B1 (en) * 2019-08-29 2020-09-01 Google Llc Liquid soluble gas sealed cooling system
US11089715B2 (en) * 2019-09-17 2021-08-10 Baidu Usa Llc Cooling chassis design for server liquid cooling of electronic racks of a data center
IT201900023076A1 (it) * 2019-12-05 2021-06-05 Provides Metalmeccanica S R L Sistema di raffreddamento per data center
US11871546B2 (en) 2019-12-05 2024-01-09 Wieland Provides SRL Cooling system of electronic systems, in particular for data centre
DE102020200306A1 (de) * 2020-01-13 2021-07-15 Zf Friedrichshafen Ag Kühlkörper, Leistungsmodulzusammenstellung und Wechselrichter
KR102166154B1 (ko) * 2020-04-06 2020-10-15 (주)영재컴퓨터 수냉과 공냉을 결합한 서버용 냉각 장치
CN111542200A (zh) * 2020-04-09 2020-08-14 金亚斌 一种信息技术用数据柜
US11252844B2 (en) * 2020-06-08 2022-02-15 Baidu Usa Llc Liquid distribution for electronic racks
CN114076341B (zh) * 2020-08-12 2023-10-27 富联精密电子(天津)有限公司 数据中心热回收系统
US20220071063A1 (en) * 2020-09-02 2022-03-03 Nvidia Corporation Redundant liquid distribution units for datacenter racks
CN114340297A (zh) 2020-09-29 2022-04-12 台达电子工业股份有限公司 水冷装置及其集流器
TWI756925B (zh) * 2020-11-18 2022-03-01 緯創資通股份有限公司 主動式分流裝置與包含其之電子設備
CN112904982A (zh) * 2021-02-02 2021-06-04 深圳市智微智能科技股份有限公司 一种服务器硬盘水冷组件及方法
US11582888B2 (en) * 2021-03-25 2023-02-14 Baidu Usa Llc Hybrid cooling device for acceleration hardware
TWI783678B (zh) * 2021-04-30 2022-11-11 廣達電腦股份有限公司 冷卻電腦系統之冷卻迴路及冷卻系統
CN113645805B (zh) * 2021-07-29 2023-02-24 苏州浪潮智能科技有限公司 一种液冷散热器和服务器
CN113677159B (zh) * 2021-08-23 2023-09-19 联想长风科技(北京)有限公司 一种水冷风冷兼容的散热装置
CN116419533A (zh) * 2021-12-31 2023-07-11 华为技术有限公司 一种散热模组、计算设备
TWI808780B (zh) * 2022-06-08 2023-07-11 英業達股份有限公司 機櫃液冷系統
CN115782097B (zh) * 2022-11-23 2024-04-09 阜阳冈奇精密科技有限公司 一种注塑模具循环降温装置
CN117092947B (zh) * 2023-07-20 2024-03-26 广州崇实自动控制科技有限公司 一种机房控制装置及运维监测系统

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2651015B1 (de) 1976-11-09 1978-05-11 Electroacustic Gmbh, 2300 Kiel Chassis für einen elektrischen Leistungsverstärker
EP0231456A1 (fr) 1985-12-13 1987-08-12 Ascom Hasler AG Procédé et dispositif d'évacuation de la chaleur dissipée par au moins un élement d'une armoire électrique
JP2000261172A (ja) 1999-03-11 2000-09-22 Pfu Ltd ラックマウント装置の冷却構造
US20020124585A1 (en) 2001-03-09 2002-09-12 Bash Cullen E. Multi-load refrigeration system with multiple parallel evaporators
US6473297B1 (en) * 1999-04-23 2002-10-29 Inclose Design, Inc. Memory storage device docking adapted having a laterally mounted fan
JP2002374086A (ja) 2001-06-15 2002-12-26 Hitachi Ltd ラックマウント搭載型情報処理装置の冷却方法
US6525937B2 (en) * 2001-03-22 2003-02-25 Kabushiki Kaisha Toshiba Information processing apparatus having cooling air passage with a plurality of heat generating components interposed
US6657121B2 (en) * 2001-06-27 2003-12-02 Thermal Corp. Thermal management system and method for electronics system

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2651015B1 (de) 1976-11-09 1978-05-11 Electroacustic Gmbh, 2300 Kiel Chassis für einen elektrischen Leistungsverstärker
EP0231456A1 (fr) 1985-12-13 1987-08-12 Ascom Hasler AG Procédé et dispositif d'évacuation de la chaleur dissipée par au moins un élement d'une armoire électrique
JP2000261172A (ja) 1999-03-11 2000-09-22 Pfu Ltd ラックマウント装置の冷却構造
US6473297B1 (en) * 1999-04-23 2002-10-29 Inclose Design, Inc. Memory storage device docking adapted having a laterally mounted fan
US20020124585A1 (en) 2001-03-09 2002-09-12 Bash Cullen E. Multi-load refrigeration system with multiple parallel evaporators
US6525937B2 (en) * 2001-03-22 2003-02-25 Kabushiki Kaisha Toshiba Information processing apparatus having cooling air passage with a plurality of heat generating components interposed
JP2002374086A (ja) 2001-06-15 2002-12-26 Hitachi Ltd ラックマウント搭載型情報処理装置の冷却方法
US6657121B2 (en) * 2001-06-27 2003-12-02 Thermal Corp. Thermal management system and method for electronics system

Cited By (141)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7692926B2 (en) * 2005-09-16 2010-04-06 Progressive Cooling Solutions, Inc. Integrated thermal systems
US20080110598A1 (en) * 2005-09-16 2008-05-15 Progressive Cooling Solutions, Inc. System and method of a heat transfer system and a condensor
US20080115912A1 (en) * 2005-09-16 2008-05-22 Henderson H Thurman Semiconductor-based porous structure
US20080115913A1 (en) * 2005-09-16 2008-05-22 Henderson H Thurman Method of fabricating semiconductor-based porous structure
US20080128898A1 (en) * 2005-09-16 2008-06-05 Progressive Cooling Solutions, Inc. Integrated thermal systems
US20070095507A1 (en) * 2005-09-16 2007-05-03 University Of Cincinnati Silicon mems based two-phase heat transfer device
US7723760B2 (en) 2005-09-16 2010-05-25 University Of Cincinnati Semiconductor-based porous structure enabled by capillary force
US7723845B2 (en) 2005-09-16 2010-05-25 University Of Cincinnati System and method of a heat transfer system with an evaporator and a condenser
US7705342B2 (en) 2005-09-16 2010-04-27 University Of Cincinnati Porous semiconductor-based evaporator having porous and non-porous regions, the porous regions having through-holes
US20070256957A1 (en) * 2006-05-06 2007-11-08 Schroff Gmbh Sub-rack with housing for receiving plug-in modules
US20080212265A1 (en) * 2007-01-23 2008-09-04 Paul Mazura Switchgear Cabinet for Accommodating Electronic Plug-In Modules with a Heat Exchanger
US7551440B2 (en) * 2007-01-24 2009-06-23 Hewlett-Packard Development Company, L.P. System and method for cooling an electronic component
US20080174962A1 (en) * 2007-01-24 2008-07-24 Christian Belady System and method for cooling an electronic component
US20090086432A1 (en) * 2007-09-27 2009-04-02 International Business Machines Corporation Docking station with closed loop airlfow path for facilitating cooling of an electronics rack
US8857057B2 (en) 2007-11-19 2014-10-14 International Business Machines Corporation Apparatus and method for facilitating servicing of a liquid-cooled electronics rack
US8387249B2 (en) 2007-11-19 2013-03-05 International Business Machines Corporation Apparatus and method for facilitating servicing of a liquid-cooled electronics rack
US20090126910A1 (en) * 2007-11-19 2009-05-21 International Businiess Machines Corporation Apparatus and method for facilitating servicing of a liquid-cooled electronics rack
US9288935B2 (en) 2007-12-17 2016-03-15 Cray Inc. Cooling systems and heat exchangers for cooling computer components
US10082845B2 (en) 2007-12-17 2018-09-25 Cray, Inc. Cooling systems and heat exchangers for cooling computer components
US8820395B2 (en) 2007-12-17 2014-09-02 Cray Inc. Cooling systems and heat exchangers for cooling computer components
US9596789B2 (en) 2007-12-17 2017-03-14 Cray Inc. Cooling systems and heat exchangers for cooling computer components
US20100317279A1 (en) * 2007-12-17 2010-12-16 Yatskov Alexander I Cooling systems and heat exchangers for cooling computer components
US10588246B2 (en) 2008-02-11 2020-03-10 Cray, Inc. Systems and associated methods for controllably cooling computer components
US8164901B2 (en) * 2008-04-16 2012-04-24 Julius Neudorfer High efficiency heat removal system for rack mounted computer equipment
US20090262495A1 (en) * 2008-04-16 2009-10-22 Julius Neudorfer High efficiency heat removal system for rack mounted computer equipment
US9128681B2 (en) 2008-04-21 2015-09-08 Liquidcool Solutions, Inc. Liquid submersion cooled power supply system
US9086859B2 (en) 2008-04-21 2015-07-21 Liquidcool Solutions, Inc. Liquid submersion cooled electronic system
US9223360B2 (en) 2008-04-21 2015-12-29 Liquidcool Solutions, Inc. Rack mounted liquid submersion cooled electronic system
US20130094146A1 (en) * 2008-04-21 2013-04-18 Liquidcool Solutions, Inc. Liquid submersion cooled network electronics
US8654529B2 (en) * 2008-04-21 2014-02-18 Liquidcool Solutions, Inc. Liquid submersion cooled network electronics
US9176547B2 (en) 2008-04-21 2015-11-03 Liquidcool Solutions, Inc. Liquid submersion cooled data storage or memory system
US20090290299A1 (en) * 2008-05-20 2009-11-26 Pei-Hsi Lin Frame-type computer cooling device
US7675751B2 (en) * 2008-05-20 2010-03-09 Thermaltake Technology Co., Ltd. Frame-type computer cooling device
US9992914B2 (en) 2008-08-11 2018-06-05 Green Revolution Cooling, Inc. Commmonly submersed servers with velocity augmentation and partial recirculation in tank
US20110132579A1 (en) * 2008-08-11 2011-06-09 Green Revolution Cooling, Inc. Liquid Submerged, Horizontal Computer Server Rack and Systems and Method of Cooling such a Server Rack
US10123463B2 (en) * 2008-08-11 2018-11-06 Green Revolution Cooling, Inc. Liquid submerged, horizontal computer server rack and systems and method of cooling such a server rack
US8188595B2 (en) 2008-08-13 2012-05-29 Progressive Cooling Solutions, Inc. Two-phase cooling for light-emitting devices
US20100118494A1 (en) * 2008-11-12 2010-05-13 International Business Machines Corporation Hybrid immersion cooled server with integral spot and bath cooling
US7724524B1 (en) * 2008-11-12 2010-05-25 International Business Machines Corporation Hybrid immersion cooled server with integral spot and bath cooling
US20100132404A1 (en) * 2008-12-03 2010-06-03 Progressive Cooling Solutions, Inc. Bonds and method for forming bonds for a two-phase cooling apparatus
US9310856B2 (en) 2010-04-20 2016-04-12 Cray Inc. Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use
US20120318492A1 (en) * 2010-06-23 2012-12-20 Inertech Ip Llp Cooling systems for electrical equipment
US9282684B2 (en) * 2010-06-23 2016-03-08 Inertech Ip Llc Cooling systems for electrical equipment
US9089078B2 (en) 2010-08-26 2015-07-21 Asetek Danmark A/S Liquid cooling system for a server
US10136551B2 (en) 2010-08-26 2018-11-20 Asetek Danmark A/S Liquid cooling system for server
US9907206B2 (en) 2010-08-26 2018-02-27 Asetek Danmark A/S Liquid cooling system for a server
US10820450B2 (en) 2011-07-27 2020-10-27 Coolit Systems, Inc. Modular heat-transfer systems
US9496200B2 (en) 2011-07-27 2016-11-15 Coolit Systems, Inc. Modular heat-transfer systems
US11714432B2 (en) 2011-08-11 2023-08-01 Coolit Systems, Inc. Flow-path controllers and related systems
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
US20130043775A1 (en) * 2011-08-19 2013-02-21 Inventec Corporation Server cabinet coolant distribution system
US8654532B2 (en) * 2011-08-19 2014-02-18 Inventec Corporation Server cabinet coolant distribution system
US9155230B2 (en) 2011-11-28 2015-10-06 Asetek Danmark A/S Cooling system for a server
US10212857B2 (en) 2011-11-28 2019-02-19 Asetek Danmark A/S Cooling system for a server
US9717166B2 (en) 2011-11-28 2017-07-25 Asetek Danmark A/S Cooling system for a server
US10123464B2 (en) 2012-02-09 2018-11-06 Hewlett Packard Enterprise Development Lp Heat dissipating system
US9529395B2 (en) 2012-03-12 2016-12-27 Hewlett Packard Enterprise Development Lp Liquid temperature control cooling
US9451726B2 (en) * 2012-09-25 2016-09-20 Liquidcool Solutions, Inc. Method and apparatus to manage coolant pressure and flow for an array of liquid submerged electronic devices
US20140085821A1 (en) * 2012-09-25 2014-03-27 Liquidcool Solutions, Inc. Method and apparatus to manage coolant pressure and flow for an array of liquid submerged electronic devices
US9918408B2 (en) 2012-09-25 2018-03-13 Liquidcool Solutions, Inc. Method and apparatus to manage coolant pressure and flow for an array of liquid submerged electronic devices
US10571206B2 (en) 2012-09-28 2020-02-25 Hewlett Packard Enterprise Development Lp Cooling assembly
US9927187B2 (en) 2012-09-28 2018-03-27 Hewlett Packard Enterprise Development Lp Cooling assembly
US9788452B2 (en) 2012-10-31 2017-10-10 Hewlett Packard Enterprise Development Lp Modular rack system
WO2014074233A1 (fr) * 2012-11-08 2014-05-15 Silicon Graphics International Corp. Serveurs lames jumelles pour système informatique en grappe à haute densité
US9606588B2 (en) 2012-11-08 2017-03-28 Silicon Graphics International Corp. Closed-loop cooling system for high-density clustered computer system
US9128682B2 (en) 2012-11-08 2015-09-08 Silicon Graphics International Corp. Independent removable computer rack power distribution system for high-density clustered computer system
US9811127B2 (en) 2012-11-08 2017-11-07 Hewlett Packard Enterprise Development Lp Twin server blades for high-density clustered computer system
US9229497B2 (en) 2012-11-08 2016-01-05 Silicon Graphics International Corp. On-blade cold sink for high-density clustered computer system
US9803937B2 (en) 2013-01-31 2017-10-31 Hewlett Packard Enterprise Development Lp Liquid cooling
US10330395B2 (en) 2013-01-31 2019-06-25 Hewlett Packard Enterprise Development Lp Liquid cooling
US10458724B2 (en) 2013-01-31 2019-10-29 Hewlett Packard Enterprise Development Lp Liquid cooling
US9693479B2 (en) 2013-03-14 2017-06-27 Hewlett Packard Enterprise Development Lp Support member
US9648784B2 (en) 2013-03-15 2017-05-09 Inertech Ip Llc Systems and assemblies for cooling server racks
US10448539B2 (en) 2013-03-15 2019-10-15 Inertech Ip Llc Systems and assemblies for cooling server racks
US11661936B2 (en) 2013-03-15 2023-05-30 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
US9943014B2 (en) 2013-03-15 2018-04-10 Coolit Systems, Inc. Manifolded heat exchangers and related systems
US10364809B2 (en) 2013-03-15 2019-07-30 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
US11602074B2 (en) 2013-03-15 2023-03-07 Inertech Ip Llc Systems and assemblies for cooling server racks
US9504190B2 (en) 2013-05-06 2016-11-22 Green Revolution Cooling, Inc. System and method of packaging computing resources for space and fire-resistance
US10624242B2 (en) 2013-05-06 2020-04-14 Green Revolution Cooling, Inc. System and method of packaging computing resources for space and fire-resistance
US20140334092A1 (en) * 2013-05-09 2014-11-13 Hon Hai Precision Industry Co., Ltd. Heat dissipation system and rack-mount server using the same
US9320176B2 (en) * 2013-05-09 2016-04-19 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipation system and rack-mount server using the same
US20150070844A1 (en) * 2013-09-06 2015-03-12 Msi Computer (Shenzhen) Co., Ltd. Liquid-cooling module and electronic device using the same
US9215832B2 (en) * 2013-09-06 2015-12-15 Msi Computer (Shenzhen) Co., Ltd. Liquid-cooling module and electronic device using the same
US20170017277A1 (en) * 2014-04-11 2017-01-19 Hewlett Packard Enterprise Development Lp Liquid coolant supply
US9756766B2 (en) 2014-05-13 2017-09-05 Green Revolution Cooling, Inc. System and method for air-cooling hard drives in liquid-cooled server rack
US9398731B1 (en) 2014-09-23 2016-07-19 Google Inc. Cooling electronic devices in a data center
US10185375B2 (en) 2015-02-13 2019-01-22 Hewlett Packard Enterprise Development Lp Thermal bus bar
US10448543B2 (en) 2015-05-04 2019-10-15 Google Llc Cooling electronic devices in a data center
US11109517B2 (en) 2015-05-04 2021-08-31 Google Llc Cooling electronic devices in a data center
US11622474B2 (en) 2015-06-23 2023-04-04 Google Llc Cooling electronic devices in a data center
US10462935B2 (en) 2015-06-23 2019-10-29 Google Llc Cooling electronic devices in a data center
US11419246B2 (en) 2015-06-23 2022-08-16 Google Llc Cooling electronic devices in a data center
US10327358B2 (en) 2015-06-26 2019-06-18 Seagate Technology Llc Fluid connectors for modular cooling systems
US9655281B2 (en) 2015-06-26 2017-05-16 Seagate Technology Llc Modular cooling system
US20170127549A1 (en) * 2015-10-30 2017-05-04 Silicon Graphics International Corp. Configurable node expansion space
US10237999B2 (en) * 2015-10-30 2019-03-19 Hewlett Packard Enterprise Development Lp Configurable node expansion space
US11102915B1 (en) * 2015-12-04 2021-08-24 Nautilus True, Llc Self-sustained, scalable, efficient data center facility and method
US11765869B1 (en) * 2015-12-04 2023-09-19 Nautilus True, Llc Self-sustained, scalable, efficient data center facility and method
US11867426B2 (en) 2016-03-16 2024-01-09 Inertech Ip Llc System and methods utilizing fluid coolers and chillers to perform in-series heat rejection and trim cooling
US11415330B2 (en) 2016-03-16 2022-08-16 Inertech Ip Llc System and methods utilizing fluid coolers and chillers to perform in-sertes heat rejection and trim cooling
US10488061B2 (en) 2016-03-16 2019-11-26 Inertech Ip Llc System and methods utilizing fluid coolers and chillers to perform in-series heat rejection and trim cooling
US10349561B2 (en) 2016-04-15 2019-07-09 Google Llc Cooling electronic devices in a data center
US11083111B2 (en) 2016-10-10 2021-08-03 Bull Sas Compact liquid cooling module for computer server
US11129304B2 (en) * 2016-10-24 2021-09-21 Fujitsu Limited Electronic device
US10433459B2 (en) * 2017-01-20 2019-10-01 Guangdong Hi-1 New Materials Technology Research Institute Co., Ltd Data centre cabinet and gravity spray system thereof
US20180279510A1 (en) * 2017-03-27 2018-09-27 Dell Products, Lp Server Chassis with a Liquid Cooling Enablement Module in an Input/Output Module Bay
US10201115B2 (en) * 2017-03-27 2019-02-05 Dell Products, Lp Server chassis with a liquid cooling enablement module in an input/output module bay
US11832422B2 (en) 2017-07-26 2023-11-28 Sung Kyun Lee Computing rack apparatus using cooling unit
US11452243B2 (en) 2017-10-12 2022-09-20 Coolit Systems, Inc. Cooling system, controllers and methods
US20190281730A1 (en) * 2018-03-10 2019-09-12 Baidu Usa Llc Design for cold plate assembly for server liquid cooling of electronic racks of a data center
US10485143B2 (en) * 2018-03-10 2019-11-19 Baidu Usa Llc Cold plate assembly for server liquid cooling of electronic racks of a data center
US11272642B2 (en) * 2018-04-12 2022-03-08 Baidu Usa Llc Liquid distribution unit design for liquid cooling of electronic racks of a data center
US10667437B2 (en) * 2018-04-12 2020-05-26 Baidu Usa Llc Liquid distribution unit design for liquid cooling of electronic racks of a data center
US10775860B2 (en) * 2018-05-07 2020-09-15 Hewlett Packard Enterprise Development Lp Base management controller interface
US11359865B2 (en) 2018-07-23 2022-06-14 Green Revolution Cooling, Inc. Dual Cooling Tower Time Share Water Treatment System
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US11044832B2 (en) * 2019-02-01 2021-06-22 Taiwan Microloops Corp. Water-cooled distributive heat dissipation system for rack
US11044833B2 (en) * 2019-02-01 2021-06-22 Taiwan Microloops Corp. Water-cooled pressurized distributive heat dissipation system for rack
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
US11725890B2 (en) 2019-04-25 2023-08-15 Coolit Systems, Inc. Cooling module with leak detector and related systems
US10785892B1 (en) * 2019-05-27 2020-09-22 Auras Technology Co., Ltd. Heat dissipation system and coolant distribution module thereof
US10905030B1 (en) * 2019-07-24 2021-01-26 Facebook, Inc. Liquid-cooling within an air-cooled facility
US10925187B1 (en) 2019-08-30 2021-02-16 Dell Products, L.P. Remote heat exchanger arm for direct contact liquid cooling for rack mounted equipment
US20220408608A1 (en) * 2019-11-13 2022-12-22 Nec Platforms, Ltd. Cooling system and electronic device
US11395443B2 (en) 2020-05-11 2022-07-19 Coolit Systems, Inc. Liquid pumping units, and related systems and methods
US20220039296A1 (en) * 2020-07-30 2022-02-03 Calyos Sa System for cooling server boards in a data center
USD998770S1 (en) 2020-10-19 2023-09-12 Green Revolution Cooling, Inc. Cooling system enclosure
USD982145S1 (en) 2020-10-19 2023-03-28 Green Revolution Cooling, Inc. Cooling system enclosure
US11871539B2 (en) 2021-03-18 2024-01-09 Nanning Fulian Fugui Precision Industrial Co., Ltd. Electronic apparatus with cooling system
US20220304190A1 (en) * 2021-03-18 2022-09-22 NANNING FuLian FuGui Precision Industrial Co. Ltd. Electronic apparatus with cooling system
US11503739B2 (en) * 2021-03-18 2022-11-15 Nanning Fulian Fugui Precision Industrial Co., Ltd. Electronic apparatus with cooling system
US20220330459A1 (en) * 2021-04-13 2022-10-13 Dell Products L.P. Modular and highly available cooling distribution unit for information handling systems
US11576283B2 (en) * 2021-04-13 2023-02-07 Dell Products L.P. Modular and highly available cooling distribution unit for information handling systems
US11755084B2 (en) 2021-07-20 2023-09-12 Quanta Computer Inc. Cooling circuits for cooling a computing system and flow control methods thereof
US20230065556A1 (en) * 2021-09-02 2023-03-02 Baidu Usa Llc Two phase system for enclosure systems
US11871547B2 (en) * 2021-09-02 2024-01-09 Baidu Usa Llc Two phase system for enclosure systems
US11910575B2 (en) 2021-09-02 2024-02-20 Baidu Usa Llc Rack systems and packaging for servers
US11805624B2 (en) 2021-09-17 2023-10-31 Green Revolution Cooling, Inc. Coolant shroud
US20230221781A1 (en) * 2022-01-12 2023-07-13 Dell Products L.P. Insert to replace a fan in hybrid liquid cooling of an information handling system
US11925946B2 (en) 2022-03-28 2024-03-12 Green Revolution Cooling, Inc. Fluid delivery wand

Also Published As

Publication number Publication date
EP1448040A2 (fr) 2004-08-18
EP1448040B1 (fr) 2011-01-12
US20040221604A1 (en) 2004-11-11
TWI237174B (en) 2005-08-01
KR100582612B1 (ko) 2006-05-23
TW200417843A (en) 2004-09-16
CN1276326C (zh) 2006-09-20
JP2004246649A (ja) 2004-09-02
KR20040073983A (ko) 2004-08-21
DE602004030965D1 (de) 2011-02-24
CN1521591A (zh) 2004-08-18
JP4199018B2 (ja) 2008-12-17
EP1448040A3 (fr) 2006-04-26

Similar Documents

Publication Publication Date Title
US7318322B2 (en) Liquid cooling system for a rack-mount server system
US10225958B1 (en) Liquid cooling system for a data center
US9743561B2 (en) Liquid-cooled heat sink configured to facilitate drainage
US9282678B2 (en) Field-replaceable bank of immersion-cooled electronic components and separable heat sinks
US8164901B2 (en) High efficiency heat removal system for rack mounted computer equipment
US8208258B2 (en) System and method for facilitating parallel cooling of liquid-cooled electronics racks
US9210830B2 (en) Immersion-cooled and conduction-cooled method for electronic system
US9013872B2 (en) Dry-cooling unit with gravity-assisted coolant flow
US8929080B2 (en) Immersion-cooling of selected electronic component(s) mounted to printed circuit board
US9101078B2 (en) Data center cooling with an air-side economizer and liquid-cooled electronics rack(s)
CN102342192B (zh) 液冷式冷却装置、电子机架及其制造方法
US20050081534A1 (en) Cooling device and electronic apparatus building in the same
KR101906648B1 (ko) 열 방산 시스템
US20050241802A1 (en) Liquid loop with flexible fan assembly
JP2004363308A (ja) ラックマウントサーバシステム
CN112437583A (zh) 用于对搁架进行自主冷却的冷却装置
CN115904037A (zh) 液冷散热装置及服务器

Legal Events

Date Code Title Description
AS Assignment

Owner name: HITACHI, LTD., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:OTA, SHIGEMI;MATSUSHITA, SHINJI;REEL/FRAME:015202/0134

Effective date: 20040329

STCF Information on status: patent grant

Free format text: PATENTED CASE

FEPP Fee payment procedure

Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

FEPP Fee payment procedure

Free format text: PAYER NUMBER DE-ASSIGNED (ORIGINAL EVENT CODE: RMPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

FPAY Fee payment

Year of fee payment: 4

AS Assignment

Owner name: HITACHI CONSUMER ELECTRONICS CO., LTD., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HITACHI, LTD.;REEL/FRAME:030802/0610

Effective date: 20130607

AS Assignment

Owner name: HITACHI MAXELL, LTD., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HITACHI CONSUMER ELECTRONICS CO., LTD.;HITACHI CONSUMER ELECTRONICS CO, LTD.;REEL/FRAME:033694/0745

Effective date: 20140826

FPAY Fee payment

Year of fee payment: 8

AS Assignment

Owner name: MAXELL, LTD., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HITACHI MAXELL, LTD.;REEL/FRAME:045142/0208

Effective date: 20171001

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 12TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1553); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 12

AS Assignment

Owner name: MAXELL HOLDINGS, LTD., JAPAN

Free format text: MERGER;ASSIGNOR:MAXELL, LTD.;REEL/FRAME:058255/0579

Effective date: 20211001

AS Assignment

Owner name: MAXELL, LTD., JAPAN

Free format text: CHANGE OF NAME;ASSIGNOR:MAXELL HOLDINGS, LTD.;REEL/FRAME:058666/0407

Effective date: 20211001