US2785349A - Electric semi-conducting devices - Google Patents
Electric semi-conducting devices Download PDFInfo
- Publication number
- US2785349A US2785349A US292304A US29230452A US2785349A US 2785349 A US2785349 A US 2785349A US 292304 A US292304 A US 292304A US 29230452 A US29230452 A US 29230452A US 2785349 A US2785349 A US 2785349A
- Authority
- US
- United States
- Prior art keywords
- wire
- tube
- sealed
- copper
- semi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 abstract description 15
- 239000002184 metal Substances 0.000 abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 8
- 229910052802 copper Inorganic materials 0.000 abstract description 8
- 239000010949 copper Substances 0.000 abstract description 8
- 239000004065 semiconductor Substances 0.000 abstract description 8
- 238000007789 sealing Methods 0.000 abstract description 7
- 239000007787 solid Substances 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 5
- 238000010276 construction Methods 0.000 abstract description 4
- 230000004048 modification Effects 0.000 abstract description 4
- 238000012986 modification Methods 0.000 abstract description 4
- 229910000831 Steel Inorganic materials 0.000 abstract description 3
- 229910052709 silver Inorganic materials 0.000 abstract description 3
- 239000004332 silver Substances 0.000 abstract description 3
- 239000010959 steel Substances 0.000 abstract description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 2
- 230000008569 process Effects 0.000 abstract description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 2
- 210000005239 tubule Anatomy 0.000 abstract 2
- 238000000429 assembly Methods 0.000 abstract 1
- 239000011324 bead Substances 0.000 abstract 1
- 238000011109 contamination Methods 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- -1 e.g. Substances 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 235000012469 Cleome gynandra Nutrition 0.000 description 12
- 239000013078 crystal Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 239000004568 cement Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 238000005266 casting Methods 0.000 description 5
- 229920003319 Araldite® Polymers 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 241001520655 Canis lupus hattai Species 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 235000019571 color Nutrition 0.000 description 1
- GOECOOJIPSGIIV-UHFFFAOYSA-N copper iron nickel Chemical compound [Fe].[Ni].[Cu] GOECOOJIPSGIIV-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
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- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/26—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with means for mechanically breaking-up or deflecting the jet after discharge, e.g. with fixed deflectors; Breaking-up the discharged liquid or other fluent material by impinging jets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/24—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
- B65D81/26—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators
- B65D81/266—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators for absorbing gases, e.g. oxygen absorbers or desiccants
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- H—ELECTRICITY
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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- H01M4/36—Selection of substances as active materials, active masses, active liquids
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- H01M4/50—Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese
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- H01M6/10—Dry cells, i.e. cells wherein the electrolyte is rendered non-fluid with wound or folded electrodes
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Definitions
- the present invention relates to improvements in small crystal electric rectifiers employing semiconducting materials such as germanium.
- the principal object of the invention is to simplify and cheapen the construction of such rectifiers and to improve the protection of the rectifying contact against the efiects of moisture.
- an electric rectifier comprising a body of semiconducting material and an electrode making rectifying contact therewith, assembled inside a tube of electrically insulating material, the said body and electrode being each secured to a corresponding metal plug, the said plugs being force fits inside the said tube at respectively opposite ends thereof and being spaced apart in such manner that the electrode makes rectifying contact with the semiconducting body.
- Fig. 1 shows a sectional view of a crystal rectifier constructed according to the present invention
- Figs. 2 to 7 show details in the process of constructing the rectifier.
- Fig. 8 shows a side view of a completed rectifier
- Figs, 9 to 12 show details of a modified type of rectifier according to the invention.
- Figs. 13 to 16 show details of another form of rectifier according to the invention in which the plugs on which the electrodes are mounted are solid, instead of being pressed from sheet material.
- Figs. 17 and 18 show details of a modified form of the solid plug type rectifier
- Figs. 19 and 20 show modifications of Figs. 13 and 14 respectively; and Figs. 21 and 22 show details of another modified form of the solid plug type rectifier.
- Fig. 1 shows a section through a rectifier according to the invention, in which the rectifying elements are enclosed in a cylindrical tube 1 of ceramic or other suitable insulating material, the external diameter of which might, for example be about 0.25 inch.
- the crystal 2, which will preferably be of germanium, and the cat whisker electrode 3, are secured to sheet metal cup-shaped plugs 4 and which are forced into opposite ends of the tube 1 in such manner as to be securely held therein.
- Corresponding terminal conductors 6 and 7 are attache-d to the plugs 4 and 5, and the ends of the tube are sealed with blocks 8 and 9 of a suitable thermosetting cement.
- a litharge-glycerine cement could be used.
- the cement blocks may be differently coloured; for example, the block 8 might be red and the block 9 might be white.
- the plug 4 or 5 may be formed from a flat disc 10, of nickel or other suitable metal, shown in Fig. 2.
- This disc may be 0.005 inch thick, and should be slightly larger in diameter than the internal bore of the tube; for example, the diameter of the disc might be about 0.2 inch. It should be provided with a small tag 11 to which will be welded or soldered the corresponding terminal conductor 6 or 7 (Fig. 1).
- Other metals which might be used for the disc 10 are copper, iron, brass, or silver.
- the cat whisker 3 which may consist of .a sharply pointed tungsten wire :bent into the usual 8 shape, is welded or otherwise attached to the centre of the disc 10, and the assembly is arranged concentrically over the end of the tube 1.
- Various other metals and alloys could be used for the cat whiskers.
- a cylindrical ram (not shown) is applied to the centre of the disc which is thereby forced into the tube, forming a cupshaped plug, as shown in Fig. 4.
- the plug 5 should be pushed in leaving the tag 11 protruding as shown.
- the diameter of the ram should preferably be a few thousandths of an inch smaller than the inside diameter of the cup so formed, in order to avoid cracking the tube 1, and to allow the ram to be easily removed.
- the terminal conductor wire 7 is welded or otherwise attached to the tag 11, as shown in Fig. 5.
- This terminal wire should preferably be of copper-clad steel, or of a copper-nickel-iron alloy, but other materials such as pure copper or nickel could be used.
- the wire 7 should preferably be arranged coaxially with the tube 1.
- the cement block 9 is preferably formed from a casting resin sold under the registered trademark Araldite, though other thermosetti-ng or thermoplastic materials or other types of cement could be used.
- the assembly 1 should be heated to a temperature of about 250 C., for example by standing the tube 1 on a heated plate, and the casting resin in the form of a thin stick should be touched on to the upper end of the tube 1 until a sufficient quantity has melted on to fill the plug 5 and to cover the end of the tube.
- the resin polymerises and hardens'in about ten minutes, thereby joining the plug and tube together and efiiciently sealing the end.
- the resin may alternatively be applied as a powder, or in the form of a small disc with a central hole, which is of the right size to form the block 9, and which is slipped over the wire 7.
- the crystal 2 is attached to a second disc similar to that shown in Fig. 2, by soldering, or by means of a suitable conducting medium indicated at 12.
- a conducting cement of the kind described in the specification of co-pending application Serial N0. 278,527, filed March 25, 1952, should be used.
- the terminal wire 6 (not shown in Fig. 7) is then attached to the tag 11, .and the plug 4 is sealed with the casting resin as described with reference to Fig. 5, the completed rectifier appearing as shown in Fig. 8.
- the tube 1 In or' der conveniently to heat the tube 1 in this case, it may be inserted into a hole in a thick metal block which rests on the hot plate.
- the cement used for the cat whisker end of the tube 1 should preferably consist of a mixture of 50% of the Araldite casting resin and 50% alumina, or other white powder or pigment, which forms a white block when p-olymerised, but unfilled Araldite resin or adhesive could be used.
- the block at the crystal end could be formed from alumina-filled resin to which has been added a dye or pigment which might be red, or any other distinctive col-our.
- the rectifier should preferably be further heat treated for 24 hours in an oven at a temperature of C. for finally hardening the sealing plugs 8 and 9.
- Figs. 9 to 12 show an alternative method of attaching the cat whisker and its terminal wire to the corresponding Wish- 349 plug.
- the plug 5 is formed from a plain disc 13 with a central hole 14 instead of a tag.
- the disc is rammed into the end of the tube 1 as previously described, and as shown in Fig. 10.
- v I V The Whisker 3 is welded to the terrninal wire 7 slidwh in Fig. 11, and also a springy wire bent into an obtuse V-shape.
- the wire 7 is then threaded through the hole 14 from the inside of the tube and pulled through as shown in Fig. 12, the wire 15 then holding the whisker 3 centrally inside the tube. In this case it is not neces sa-ry to solder or weld the whisker or terminal wire to the plug 5.
- the sealing block 9 is then applied in the manner already described.
- Figs. 13 to 16 show the preferred form of the construction of a rectifier according to the invention in which the plugs to which the cat whisker and crystal are attached are formed solid from a soft metal instead or" being pressed out of sheet material.
- the plug for the crystal is shown in Fig. 13 and consists of a substantially cylindrical plug 16 of lead or other soft metal or alloy having a central hole into which the terminal wire 6 is fixed.
- the wire should be tinned and the lead plug cast or alloyed thereto forming- .a substantially brazed joint.
- the diameter of the plug should be very slightly larger than the inside diameter of the tube 1 and may be very slightly tapered to enable it to be started in the tube. It is then forced in with suitable ram (not shown) as before described.
- the thickness of the plug might for example be about 0.67 inch.
- the plug 17 for the cat whisker shown in Fig. 14 differs only from the other in that the terminal wire projects right through the lead plug to provide an end 18 to which the cat whisker 3 may be
- Fig. 15 shows the plug 17 with the cat whisker 3 attached, and rammed into the upper end of the tube 1.
- Fig. 16 shows the completed rectifier with the plug 16, hearing the crystal 2, forced into the lower end, the rectiher being sealed with cement blocks 8 and 9 as previously described.
- the crystal 2 may be attached to the plug 16 in the manner already explained.
- the material of the plugs 16 and 17 could alternatively be lead alloyed with calcium or antimony, or with tin and silver.
- Figs; 17 and 18 show a variation 'of the method of fixing the plug for the cat whisker electrode.
- a disc 19 of lea slightly smaller in diameter than the bore of the tube 1 is slipped inside and is pressed between two rams 2i) and 21, which should be perhaps 0.02 inch smaller in diameter thanthe inside of the tube.
- the lead extrudes slightly between the rams and the tube thereby locating the plug firmly in place.
- a small central hole is then drilled through the plug, and a cat whisker assembly similar to that shown in Fig. 11 is threaded through as shown in Fig. 18.
- Figs. 19 and 20 show modifications of Figs. 13 and 14 in which the lead plug consists of two coaxial sectionsor discs, which may be separate, the upper section 22 being. slightly larger, and the lower section 23 being slightly smaller than the internal base of the tube. This facilitates centering the plugs in the tube before they are forcedin.
- FIG. 21 An alternative-method forcen'tering plugs of the type shown in Figs. 13 and 14 is shown in Figs; 21 and 22.
- the inside ends of the tube 1 are slightly enlarged as'indicatedat 24 and 25 in Fig. 21, the diameter of the lead plug being intermediate between the larger and smallerinternal diameters of the tube;
- the plug 17 after having been forced in by a ram, whose diameter is also intermediate between the larger and smaller diameters of the tube, appears as shown in Fig. 22, the lead extruding partly downwards and partly outwards and upwards round the ram (not shown).
- the plug (not shown) which carries the crystal can be forced into the lower end of the tube in the same manner.
- the ends will be sealed with the casting resin as previously described,
- An electric rectifier comprising a body of semi-conduoting material and a wire electrode making rectifying contact therewith assembled inside a hollow tube, said body and electrode each secured to a corresponding plug, said plugs being force fits inside said tube at respectively opposite ends thereof andspaced apart whereby the electrode makes rectifying contact with the semi-conducting body, and said wire electrode connected to a terminal wire passing through a central hole cut through the base of its associated plug, the arrangement being centered by a V-shaped wire of springy material attached to said terminal wire and bearing on the inside surface of said tube.
- An electric rectifier comprising a body of semi-conducting material and' a wire electrode making rectifying" contact therewith, assembled inside a hollow tube, the wall of said tube being under-cut at both ends to form short sections with increased internal diameter, said body and electrode each'secured to a corresponding plug, said plugs being pressed into contact with the corresponding undercut section of larger diameter and against the portion of thetube of smaller diameter, said plugs being spaced apart so that the electrode makes rectifying contact with the semi-conducting body, a terminal wire having a portion extending into the space between saidtwo'plugsandpass ing through an opening provided in one of said plugs, means for connecting said wire electrodeto' said portion of said terminal wire, and means for connecting said semiconducting body to the other of said plugs.
- a rectifier according to claim'2 in whicheach end of the said tube is sealed by a block of thermoplastic or therrriosetting material.
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- Wire Bonding (AREA)
- Battery Electrode And Active Subsutance (AREA)
- Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
- Primary Cells (AREA)
- Hybrid Cells (AREA)
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB13657/51A GB716250A (en) | 1951-06-08 | 1951-06-08 | Improvements in or relating to electric semi-conducting devices |
GB19173/53A GB753488A (en) | 1953-07-10 | 1953-07-10 | Improvements in or relating to electrical couplings to semiconductor elements |
US434865A US2928030A (en) | 1954-06-07 | 1954-06-07 | Semiconductor devices |
GB4261/56A GB797822A (en) | 1951-06-08 | 1956-02-10 | Improvements in or relating to semi-conductor junction diodes |
DEST13682A DE1098102B (de) | 1951-06-08 | 1958-04-23 | Verfahren zur Herstellung einer elektrischen Halbleitervorrichtung |
GB23454/58A GB835865A (en) | 1957-05-21 | 1958-07-22 | Improvements in or relating to crystal rectifiers and methods of manufacture thereof |
DE884824X | 1958-09-30 | ||
DEST15123A DE1255823B (de) | 1951-06-08 | 1959-05-13 | Verfahren zum Herstellen von Kuehlkoerpern fuer elektrische Bauelemente aus auf einem Bolzen senkrecht zur Laengsachse angeordneten Kuehlplatten, insbesondere fuer Halbleiterleistungsgleichrichter und Transistoren |
Publications (1)
Publication Number | Publication Date |
---|---|
US2785349A true US2785349A (en) | 1957-03-12 |
Family
ID=31982807
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US292304A Expired - Lifetime US2785349A (en) | 1951-06-08 | 1952-06-07 | Electric semi-conducting devices |
Country Status (8)
Country | Link |
---|---|
US (1) | US2785349A (fr) |
BE (4) | BE512559A (fr) |
CH (2) | CH342657A (fr) |
DE (6) | DE968077C (fr) |
FR (4) | FR1066148A (fr) |
GB (4) | GB795113A (fr) |
LU (1) | LU37433A1 (fr) |
NL (3) | NL170157B (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2850707A (en) * | 1954-04-15 | 1958-09-02 | Sylvania Electric Prod | Electromagnetic coils |
US20100175753A1 (en) * | 2009-01-13 | 2010-07-15 | Honda Motor Co., Ltd. | Solar cell module |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL236678A (fr) * | 1958-03-04 | 1900-01-01 | ||
NL101704C (fr) * | 1958-07-02 | |||
US2937110A (en) * | 1958-07-17 | 1960-05-17 | Westinghouse Electric Corp | Protective treatment for semiconductor devices |
NL113317C (fr) * | 1958-09-16 | 1900-01-01 | ||
DE1275690B (de) * | 1960-10-01 | 1968-08-22 | Telefunken Patent | Gehaeuse fuer Halbleiterbauelemente |
DE1237695B (de) * | 1961-10-24 | 1967-03-30 | Siemens Ag | Halbleiteranordnung mit einem in ein gasdichtes Gehaeuse eingeschlossenen Halbleiterelement |
DE1229647B (de) * | 1961-12-22 | 1966-12-01 | Walter Brandt G M B H | Verfahren zum Herstellen einer Flaechengleichrichteranordnung |
US3216084A (en) * | 1963-04-10 | 1965-11-09 | Motorola Inc | Semiconductor process control technique |
US3265805A (en) * | 1964-02-03 | 1966-08-09 | Power Components Inc | Semiconductor power device |
DE1514473C3 (de) * | 1965-06-05 | 1981-08-20 | Siemens AG, 1000 Berlin und 8000 München | Halbleiterbauelement |
DE2331106C2 (de) * | 1973-06-19 | 1984-11-22 | Hitachi Maxell, Ltd., Ibaraki, Osaka | Trockenelement |
US3945852A (en) * | 1974-09-06 | 1976-03-23 | P. R. Mallory & Co. Inc. | Current collector for organic electrolyte batteries |
USRE30458E (en) | 1977-12-30 | 1980-12-23 | Hitachi Maxell, Ltd. | Dry cells |
US4574330A (en) * | 1982-12-20 | 1986-03-04 | Burr-Brown Corporation | Heat sink for dissipating heat generated by electronic displays |
DE3421672A1 (de) * | 1984-06-09 | 1985-12-12 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Wechsellastbestaendiges, schaltbares halbleiterbauelement |
DE10128970A1 (de) * | 2001-06-15 | 2002-12-19 | Fortu Bat Batterien Gmbh | Bei Normaltemperatur betreibbare, wiederaufladbare Batteriezelle |
CN109513352B (zh) * | 2019-01-10 | 2024-07-30 | 广东中烟工业有限责任公司 | 一种用于异味处理系统光化学管的防水装置 |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US756676A (en) * | 1902-11-10 | 1904-04-05 | Internat Wireless Telegraph Company | Wave-responsive device. |
US1058210A (en) * | 1910-12-30 | 1913-04-08 | Allie Ray Welch | Method of finishing castings. |
US1704228A (en) * | 1928-01-30 | 1929-03-05 | Packard Motor Car Co | Fastening device |
US1890312A (en) * | 1931-03-30 | 1932-12-06 | Tung Sol Condensers Inc | Condenser |
US2498666A (en) * | 1946-10-10 | 1950-02-28 | Standard Telephones Cables Ltd | Rectifier unit |
US2503837A (en) * | 1945-07-27 | 1950-04-11 | Bell Telephone Labor Inc | Electrical translating device |
US2615965A (en) * | 1948-07-24 | 1952-10-28 | Sylvania Electric Prod | Crystal amplifier device |
US2615857A (en) * | 1949-12-23 | 1952-10-28 | Bell Telephone Labor Inc | Polyethylene-polyisobutylene composition |
US2622133A (en) * | 1950-05-01 | 1952-12-16 | Sprague Electric Co | Sealed electrical circuit components |
US2625592A (en) * | 1948-11-05 | 1953-01-13 | Westinghouse Freins & Signaux | Asymmetrical conductive element |
US2626985A (en) * | 1948-08-25 | 1953-01-27 | Sylvania Electric Prod | Electrical crystal unit |
US2651745A (en) * | 1951-02-08 | 1953-09-08 | Int Standard Electric Corp | Dry rectifier assembly |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE710631C (de) * | 1938-08-06 | 1941-09-18 | Versuchsanstalt Fuer Luftfahrt | Empfangsvorrichtung fuer elektrische Wellen |
DE891404C (de) * | 1941-05-27 | 1953-09-28 | Pertrix Union G M B H | Galvanisches Element, insbesondere mit Luftdepolarisation |
GB572511A (en) * | 1941-11-05 | 1945-10-11 | Gen Electric Co Ltd | Improvements in electric rectifiers |
GB635690A (en) * | 1946-07-31 | 1950-04-12 | Gen Electric Co Ltd | Improvements in and relating to crystal rectifiers |
US2635199A (en) * | 1948-01-08 | 1953-04-14 | John M Wolfskill | Piezoelectric crystal apparatus |
US2513870A (en) * | 1948-01-23 | 1950-07-04 | Reeves Hoffman Corp | Hermetically sealed crystal |
US2631115A (en) * | 1949-08-06 | 1953-03-10 | Manganese Battery Corp | Electrodes for electrochemical cells |
US2595475A (en) * | 1949-12-23 | 1952-05-06 | Rca Corp | Electrode support for semiconductor devices |
US2639392A (en) * | 1949-12-30 | 1953-05-19 | Bell Telephone Labor Inc | Masking device for crystals |
BE534817A (fr) * | 1954-01-14 | 1900-01-01 | ||
US2751528A (en) * | 1954-12-01 | 1956-06-19 | Gen Electric | Rectifier cell mounting |
GB785467A (en) * | 1954-12-23 | 1957-10-30 | Gen Electric Co Ltd | Improvements in or relating to the manufacture of semi-conductor devices |
NL93941C (fr) * | 1955-03-24 | 1959-11-16 | ||
NL207356A (fr) * | 1955-05-23 |
-
0
- NL NL238107D patent/NL238107A/xx unknown
- BE BE538791D patent/BE538791A/xx unknown
- NL NL86185D patent/NL86185C/xx active
- LU LU37433D patent/LU37433A1/xx unknown
- BE BE530249D patent/BE530249A/xx unknown
- DE DENDAT1069726D patent/DE1069726B/de active Pending
- NL NLAANVRAGE7703161,A patent/NL170157B/xx unknown
- BE BE554903D patent/BE554903A/xx unknown
- BE BE512559D patent/BE512559A/xx unknown
-
1952
- 1952-06-06 FR FR1066148D patent/FR1066148A/fr not_active Expired
- 1952-06-07 US US292304A patent/US2785349A/en not_active Expired - Lifetime
- 1952-06-08 DE DEI5966A patent/DE968077C/de not_active Expired
-
1954
- 1954-07-06 FR FR66909D patent/FR66909E/fr not_active Expired
- 1954-07-07 DE DEI8884A patent/DE1060992B/de active Pending
-
1955
- 1955-05-20 DE DEI10229A patent/DE1015934B/de active Pending
- 1955-06-03 GB GB15973/55A patent/GB795113A/en not_active Expired
- 1955-06-06 FR FR69762D patent/FR69762E/fr not_active Expired
- 1955-06-07 CH CH342657D patent/CH342657A/de unknown
-
1957
- 1957-02-08 FR FR71643D patent/FR71643E/fr not_active Expired
-
1958
- 1958-04-23 DE DEST13682A patent/DE1098102B/de active Pending
-
1959
- 1959-04-17 GB GB13142/59A patent/GB914592A/en not_active Expired
- 1959-05-13 DE DEST15123A patent/DE1255823B/de active Pending
- 1959-07-23 GB GB25349/59A patent/GB884824A/en not_active Expired
-
1960
- 1960-05-06 GB GB16156/60A patent/GB877644A/en not_active Expired
- 1960-05-12 CH CH543660A patent/CH384722A/de unknown
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US756676A (en) * | 1902-11-10 | 1904-04-05 | Internat Wireless Telegraph Company | Wave-responsive device. |
US1058210A (en) * | 1910-12-30 | 1913-04-08 | Allie Ray Welch | Method of finishing castings. |
US1704228A (en) * | 1928-01-30 | 1929-03-05 | Packard Motor Car Co | Fastening device |
US1890312A (en) * | 1931-03-30 | 1932-12-06 | Tung Sol Condensers Inc | Condenser |
US2503837A (en) * | 1945-07-27 | 1950-04-11 | Bell Telephone Labor Inc | Electrical translating device |
US2498666A (en) * | 1946-10-10 | 1950-02-28 | Standard Telephones Cables Ltd | Rectifier unit |
US2615965A (en) * | 1948-07-24 | 1952-10-28 | Sylvania Electric Prod | Crystal amplifier device |
US2626985A (en) * | 1948-08-25 | 1953-01-27 | Sylvania Electric Prod | Electrical crystal unit |
US2625592A (en) * | 1948-11-05 | 1953-01-13 | Westinghouse Freins & Signaux | Asymmetrical conductive element |
US2615857A (en) * | 1949-12-23 | 1952-10-28 | Bell Telephone Labor Inc | Polyethylene-polyisobutylene composition |
US2622133A (en) * | 1950-05-01 | 1952-12-16 | Sprague Electric Co | Sealed electrical circuit components |
US2651745A (en) * | 1951-02-08 | 1953-09-08 | Int Standard Electric Corp | Dry rectifier assembly |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2850707A (en) * | 1954-04-15 | 1958-09-02 | Sylvania Electric Prod | Electromagnetic coils |
US20100175753A1 (en) * | 2009-01-13 | 2010-07-15 | Honda Motor Co., Ltd. | Solar cell module |
Also Published As
Publication number | Publication date |
---|---|
DE1015934B (de) | 1957-09-19 |
FR69762E (fr) | 1958-12-30 |
DE968077C (de) | 1958-01-16 |
DE1255823B (de) | 1967-12-07 |
FR71643E (fr) | 1960-01-13 |
GB795113A (en) | 1958-05-14 |
CH342657A (de) | 1959-11-30 |
CH384722A (de) | 1965-02-26 |
BE512559A (fr) | 1900-01-01 |
LU37433A1 (fr) | 1900-01-01 |
BE554903A (fr) | 1900-01-01 |
NL86185C (fr) | 1900-01-01 |
DE1098102B (de) | 1961-01-26 |
DE1069726B (de) | 1959-11-26 |
GB914592A (en) | 1963-01-02 |
NL170157B (nl) | 1900-01-01 |
FR1066148A (fr) | 1954-06-02 |
GB884824A (en) | 1961-12-20 |
FR66909E (fr) | 1957-10-31 |
GB877644A (en) | 1961-09-20 |
BE538791A (fr) | 1900-01-01 |
BE530249A (fr) | 1900-01-01 |
NL238107A (fr) | 1900-01-01 |
DE1060992B (de) | 1959-07-09 |
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